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WO1998011765A2 - Ameliorations concernant les assemblages inducteurs de circuits electroniques - Google Patents

Ameliorations concernant les assemblages inducteurs de circuits electroniques Download PDF

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Publication number
WO1998011765A2
WO1998011765A2 PCT/NZ1997/000114 NZ9700114W WO9811765A2 WO 1998011765 A2 WO1998011765 A2 WO 1998011765A2 NZ 9700114 W NZ9700114 W NZ 9700114W WO 9811765 A2 WO9811765 A2 WO 9811765A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrates
substrate
windings
winding
assembly
Prior art date
Application number
PCT/NZ1997/000114
Other languages
English (en)
Other versions
WO1998011765A3 (fr
Inventor
Arthur Johannes Hein De Beun
Terence Leslie Given
Original Assignee
Pdl Electronics Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pdl Electronics Limited filed Critical Pdl Electronics Limited
Priority to DE19782008T priority Critical patent/DE19782008T1/de
Priority to AU44037/97A priority patent/AU720276B2/en
Publication of WO1998011765A2 publication Critical patent/WO1998011765A2/fr
Publication of WO1998011765A3 publication Critical patent/WO1998011765A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other

Definitions

  • This invention relates to inductive assemblies for electronic circuits, and particularly but not solely to assemblies having multiple windings, such as transformers and common mode chokes, which are formed on printed circuit boards (PCBs).
  • PCBs printed circuit boards
  • Transformers are widely used in power control circuits for devices such as motor speed controllers, heating and incandescent lighting controls, and computer equipment
  • the size, cost and electrical performance of transformer assemblies and their associated drive components are a significant consideration when designing electronic circuits of this kind
  • the efficiency of manufacturing these circuits using through-hole and surface-mount components on suitable PCB substrates must also be considered.
  • two-piece magnetic structures incorporate an airgap which reduces their inductance factor, and creates an appreciable disadvantage in noise suppression devices such as common mode chokes.
  • One-piece structures such as toroids on the other hand, can provide near ideal magnetic shapes, are cheaper and easier to insulate, but must normally be mechanically wound and are not readily used in planar designs.
  • Existing transformer assemblies which incorporate a toroidal core also generally require a separate base for mounting on a PCB.
  • the invention may broadly be said to consist in an inductive assembly for an electronic circuit wherein at least one electrical winding is formed on a combination of two substrates which are joined together at substantially right angles.
  • the substrates are preferably soldered together to provide electrical connections between parts of each winding which are formed on respective substrates.
  • Each turn of each winding is preferably formed to lie partly on each substrate.
  • the invention may be said to consist in an inductive assembly for an electronic circuit wherein at least one winding of the assembly is formed on a combination of two substrates which are soldered together to provide electrical connections bewteen parts of the winding
  • a magnetically susceptible magnetic structure such as a toroid is preferably mounted on one substrate to form a core for the winding.
  • the other substrate preferably includes a slot or otherwise generally U shaped portion which straddles the magnetic structure.
  • Some example assemblies according to the invention include high frequency DC-DC converter transformers, pulse transformers, and single or three-phase common mode chokes, operating at around 1-2 MHz.
  • the invention is less useful for relatively low frequency devices requiring large magnetising inductances.
  • the invention may broadly be said to consist in an inductive assembly for an electronic circuit wherein two or more electrical windings are formed on a combination of three or more substrates with one of the substrates providing a base to which the other substrates are joined at substantially right angles.
  • One or more magnetic core structures are preferably mounted on the base substrate.
  • Each core preferably links at least two windings.
  • Each winding of any core is preferably formed on a respective substrate which straddles the core, in combination with the base substrate.
  • Each substrate may include parts of several windings which have respective cores.
  • Each substrate which is mounted on the base substrate is preferably parallel to the other substrates which are mounted on the base substrate.
  • the invention may broadly be said to consist in a transformer assembly for an electronic circuit including three substrates, two windings and a core structure. wherein the core is mounted on a main one of the substrates and encompassed by each of the other substrates, which are each joined to the main substrate, and wherein each winding includes one or more turns which are formed partly on the main substrate and partly on a respective other substrate.
  • the core preferably has a toroidal shape which is straddled by the other substrates on the main substrate.
  • the other substrates preferably have an approximately U shaped portion through which the core passes to create a magnetic link with respective windings.
  • each winding includes a plurality of turns which are formed partly on the main substrate and partly on a respective other substrate with a soldered connection between those parts of each of each turn which are on separate substrates.
  • the invention may be said to consist in a method of forming an inductive assembly, comprising: forming base parts for one or more electrical windings on a first substrate, forming complementary parts of each electrical winding on one or more second substrates, arranging a magnetic core structure on one of the substrates proximate to the respective parts of the windings, and forming the electrical windings by bringing the first and second substrates into electrical contact around the core structure.
  • each part of the winding comprises forming a respective set of tracks on PCB substrates.
  • the core structure is a one-piece toroid which is glued onto the base PCB.
  • forming the winding comprises fitting lugs on the first substrate into apertures on the second substrate, and forming a solder connection between the base and complementary parts of the winding.
  • Figures la, lb, lc and Id are respectively top plan, side elevation, end elevation and bottom plan views of an example transformer assembly formed on PCBs,
  • Figure 2 is a perspective view showing an arrangement of windings for the assembly in Figure 1 with the underlying PCBs having been omitted,
  • Figure 3 schematically shows how some geometrical characteristics of the simple transformer assembly in Figure 1 may be calculated
  • Figures 4a, 4b and 4c are respectively top plan, side elevation and bottom plan views of a multiple transformer assembly
  • Figures 5a, 5b and 5c are respectively top plan, side elevation and bottom plan views of a multiple output transformer assembly
  • Figures 6a, 6b and 6c are respectively top plan, side elevation and bottom plan views of a common mode choke assembly
  • Figure 7 is a side elevation showing how circuitry associated with an inductive assembly according to the invention may be positioned on the assembly.
  • Figures la-d show a simple transformer assembly 10 in various views without accompanying circuitry.
  • the transformer is formed on a base substrate 9 which may be a separate piece of single or double sided printed circuit board, or a small portion of a much larger board containing other circuits.
  • a base substrate 9 which may be a separate piece of single or double sided printed circuit board, or a small portion of a much larger board containing other circuits.
  • One and usually two additional substrates 11 and 12, also generally pieces of PCB, are fixed to the base substrate.
  • Primary and secondary windings 21 and 22, shown fiilly in Figure 2 are formed on the substrates and inductively/magnetically linked by a core structure 13.
  • the core is toroidal in shape although a wide range of one-piece and possibly multiple-piece core shapes could be used if required.
  • the additional substrates 1 1 and 12 are typically cut in U-shapes and straddle or otherwise fit over the core structure 13 into the base substrate 9.
  • a wide range of shapes might be considered to achieve this purpose provided the core structure can be effectively encompassed by each additional substrate and the base substrate. They each have two lugs or extensions 15 and 16 which fit securely into suitably sized apertures or slots on the base substrate.
  • the additional substrates are also placed at right angles or at least approximately perpendicular to the base substrate, and generally spaced apart parallel to each other as can be seen. Other means of fixing the additional substrates to the base substrate in other acceptable configurations can be envisaged, although lugs and apertures are preferred.
  • the primary and secondary windings 21 and 22 typically have between 1 and 10 turns each, and possibly up to several dozen turns, formed by metallic (copper) track patterns 17 on the substrates.
  • metallic (copper) track patterns 17 on the substrates.
  • Four si ilar turns have been shown for each winding in the figures, as part of a DC-DC converter which is mentioned below, although the number of turns will differ depending on the nature of the transformer requirements.
  • the turns form a generally spiral winding having a shape which roughly follows the cross section of the core structure 13, although various track patterns can be envisaged in this regard.
  • the windings have generally similar metallic terminals 24 and 25 for input and output of current. These are formed on an appropriate substrate, in this case the base substrate, although terminals on the other substrates could be more convenient in some cases.
  • Each of the windings 21 and 22 has a track pattern formed partly on the base substrate 9 and partly on a respective additional substrate 11 or 12.
  • Those parts 26 and 27 of the patterns which he on respective additional substrates 11 and 12 will usually be positioned as far from each other as possible, typically though not necessarily facing outwards as shown, to maximise creepage distances.
  • those parts 28 and 29 of the patterns which preferably he on the underside of base substrate 9 to provide appropriate creepage distances between the respective turns and terminals.
  • An electrostatic shield can be created from each additional substrate using double sided PCB, with one side containing the tracks, and the other a solid copper area.
  • the shapes and tracks of the substrates 9, 11, 12 are readily formed by conventional PCB techniques. Different PCB material may be used for different substrates if required.
  • the core 13 and additional substrates 11 and 12 are at present attached manually to the base substrate 9 using an appropriate bonding agent. Expanded end portions 23 of the tracks enable adequate electrical connections between those parts of the windings which lie on different substrates. The end portions are readily soldered together with other circuit components also by conventional techniques.
  • Track patterns forming base parts for each winding are first formed on one side of a substrate which may be part of a much larger circuit board supporting other components. These are tracks 17 on substrate 9 in Figure lc or 4c for example, with appropriate end points 23 and terminals 24 and 25.
  • One or more magnetic core structures such as toroid 13 may then be arranged on the substrate where required, proximate to and generally though not necessarily on the other side from the tracks 17.
  • Complementary tracks for the windings are formed on one or more second substrates, such as tracks 17 on substrates 1 1 and 12 in Figure lb, or 41 and 42 in Figure 4b, once again with appropriate end points 23. It is possible to arrange the core structure on one or more of the second substrates rather than on the base substrate at this stage. The second substrates are then brought into contact with the first substrate, to create electrical connections between end points 23 of respective parts of the windings.
  • end points 23 of tracks on the first or base substrate are preferably formed to lie at or adjacent apertures or other means at which corresponding end points on the second or additional substrates will be fixed.
  • end points of tracks on the second substrates need to be formed at or near lugs or other means which will pass through apertures in the first substrate.
  • the end points on respective substrates make contact when lugs 15 and 16 on the second substrates the pass through apertures on the first substrate.
  • Figure 7 indicates how additional substrates 71 and 72 may be extended in height, or possibly width, to create space for circuitry which can be connected directly to the windings. This is particularly useful when mixing through-hole and surface-mount components in a particular device, as they may be placed on different substrates.
  • surface-mount components may be placed on one of the additional substrates 71 or 72 having a fine pitch copper track pattern and thin copper layer.
  • Leaded components may be placed on the base substrate 9 having a coarse pattern and thick copper layer designed for higher current.
  • toroidal core provides substantial advantages over two-piece structures such as used in planar systems. Multiple pieces must be clamped together firmly to provide satisfactorily closed structures and even so, an air gap will generally exist between each pair of pieces, allowing magnetic flux to escape, and thereby lowering the overall inductance. A toroid is nearly ideal in this respect. Further, most commercially available planar cores are uncoated and require extra work to be galvanically isolated from the windings. Toroids in contrast, are cheaply available already coated with insulating material, and for the present purposes do not require special mounting or winding.
  • Figure 3 indicates a simple geometrical relationship between the dimensions of an assembly as shown in Figure 1.
  • a minimum inner diameter ID and maximum width of winding w may be calculated from a creepage distance d required by output power and operating frequency of a proposed assembly. The calculation is made by iteratively solving the following equation:
  • a DC-DC converter transformer according to Figure 1 was thereby constructed for operation at 600Vrms and 2 MHz, and a creepage distance d of 5.5mm, using a 14.5mm
  • the transformer was successfully used in both forward and flyback converters, and a 2 MHz modulated IGBT/MOSFET gate drive pulse transformer.
  • Figures 4a-c show a system of three gate drive pulse transformers 40 which have been used for a three-phase inverter, by way of further example.
  • a pair of single sided PCBs served as the primary and secondary substrates 41 and 42 for each transformer.
  • extended substrates 71 and 72 were used to support three driver and receiver circuits respectively, implemented with surface mount technology.
  • Figures 5a-c show a transformer system 50 having a primary winding 51 and centre- tapped secondary winding 52 which has been used in a 3W resonant DC-DC converter, also by way of example. This employed 14.5 OD cores and 5.5mm creepage distances as before.
  • Figures 6a-c show a low voltage common mode choke 60 in which the windings are connected in a flux cancelling fashion around a lossy high permeability core. Reduced creepage requirements permit a double sided PCB substrate 61 to provide both windings, increasing the number of turns possible on the core and maximising the common mode inductance. Multiple phase chokes can be constructed using multiple winding concepts as shown in Figures 5a-c.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Cette invention concerne un assemblage inducteur formé à l'aide de plusieurs substrats qui sont joints les uns aux autres autour d'un noyau magnétique. Chaque enroulement électrique de l'assemblage est formé en partie sur un substrat et en partie sur un autre, et comprend un conducteur dont les spires se terminent lorsque les substrats sont amenés à angle droit. Ce système permet d'obtenir un noyau possédant une structure d'une seule pièce qui est globalement moins chère et plus pratique que les structures à pièces multiples traditionnelles. Plusieurs assemblages peuvent également être formés à l'aide d'un seul substrat de base auquel sont fixés un certain nombre de noyau et de substrats secondaires.
PCT/NZ1997/000114 1996-09-16 1997-09-16 Ameliorations concernant les assemblages inducteurs de circuits electroniques WO1998011765A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE19782008T DE19782008T1 (de) 1996-09-16 1997-09-16 Induktive Anordnung für eine elektronische Schaltung
AU44037/97A AU720276B2 (en) 1996-09-16 1997-09-16 Improvements relating to inductive assemblies in electronic circuits

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NZ299391 1996-09-16
NZ29939196 1996-09-16

Publications (2)

Publication Number Publication Date
WO1998011765A2 true WO1998011765A2 (fr) 1998-03-19
WO1998011765A3 WO1998011765A3 (fr) 1998-07-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NZ1997/000114 WO1998011765A2 (fr) 1996-09-16 1997-09-16 Ameliorations concernant les assemblages inducteurs de circuits electroniques

Country Status (3)

Country Link
AU (1) AU720276B2 (fr)
DE (1) DE19782008T1 (fr)
WO (1) WO1998011765A2 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1971193A1 (fr) * 2007-03-16 2008-09-17 HÜTTINGER Elektronik GmbH + Co. KG Composant de plaque conductrice destiné à la fabrication d'inductances planaires à formage de noyau fermé
EP2117285A1 (fr) * 2008-04-29 2009-11-11 Siemens Aktiengesellschaft Österreich Support de commutation destiné à la réception d'un composant en ferrite
EP3067903A4 (fr) * 2013-11-08 2017-07-12 Mitsubishi Electric Corporation Appareil à induction électromagnétique
WO2018228736A1 (fr) * 2017-06-14 2018-12-20 Sma Solar Technology Ag Bobine et appareil électrique ou électronique avec une telle bobine

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103267A (en) * 1977-06-13 1978-07-25 Burr-Brown Research Corporation Hybrid transformer device
EP0126169B1 (fr) * 1983-05-19 1986-08-27 ANT Nachrichtentechnik GmbH Distributeur pour énergie de haute fréquence
US4799119A (en) * 1986-09-10 1989-01-17 International Business Machines Corporation Flexible circuit magnetic core winding for a core member
US4833436A (en) * 1986-09-12 1989-05-23 Kuhlman Corporation Formed metal core blocking
US4806895A (en) * 1987-10-08 1989-02-21 Zenith Electronics Corporation Toroidal coil mount
US4967175A (en) * 1989-11-13 1990-10-30 Tektronix, Inc. Inductor and carrier suitable for attaching to a hybrid substrate or the like
JPH0746664B2 (ja) * 1992-06-19 1995-05-17 日本▲まき▼線工業株式会社 トロイダル・トランスの磁気遮蔽構造
GB2285892B (en) * 1994-01-07 1997-05-14 Advanced Power Conversion Ltd A transformer assembly

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1971193A1 (fr) * 2007-03-16 2008-09-17 HÜTTINGER Elektronik GmbH + Co. KG Composant de plaque conductrice destiné à la fabrication d'inductances planaires à formage de noyau fermé
EP2117285A1 (fr) * 2008-04-29 2009-11-11 Siemens Aktiengesellschaft Österreich Support de commutation destiné à la réception d'un composant en ferrite
EP3067903A4 (fr) * 2013-11-08 2017-07-12 Mitsubishi Electric Corporation Appareil à induction électromagnétique
WO2018228736A1 (fr) * 2017-06-14 2018-12-20 Sma Solar Technology Ag Bobine et appareil électrique ou électronique avec une telle bobine

Also Published As

Publication number Publication date
AU720276B2 (en) 2000-05-25
DE19782008T1 (de) 1999-09-23
WO1998011765A3 (fr) 1998-07-02
AU4403797A (en) 1998-04-02

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