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WO1998009145A1 - Procede de fabrication de capteurs de pression - Google Patents

Procede de fabrication de capteurs de pression Download PDF

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Publication number
WO1998009145A1
WO1998009145A1 PCT/DE1997/001800 DE9701800W WO9809145A1 WO 1998009145 A1 WO1998009145 A1 WO 1998009145A1 DE 9701800 W DE9701800 W DE 9701800W WO 9809145 A1 WO9809145 A1 WO 9809145A1
Authority
WO
WIPO (PCT)
Prior art keywords
pressure sensor
sensor elements
thin layer
resistive thin
benefit
Prior art date
Application number
PCT/DE1997/001800
Other languages
German (de)
English (en)
Inventor
Thomas MÖLKNER
Martin Mast
Jörg WOLF
Horst MÜNZEL
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7803794&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO1998009145(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to JP10511159A priority Critical patent/JP2000517052A/ja
Priority to US09/254,112 priority patent/US6189205B1/en
Publication of WO1998009145A1 publication Critical patent/WO1998009145A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
    • G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
    • G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base

Definitions

  • the invention relates to a method for producing pressure sensor elements according to the preamble of claim 1.
  • pressure sensor elements are known. Because of their diverse possible uses and their suitability for a wide pressure range from, for example, 10 to 2000 bar, pressure sensor elements with a metal membrane and a resistive thin layer arranged thereon have proven to be particularly suitable. In the following we speak of a resistive thin layer, it being clear that this consists of a plurality of individual layers with different functions, which together form the resistive thin layer.
  • These pressure sensor elements have a base body that has a measuring opening that extends from the metal membrane (bottom of the measuring Opening) is spanned. By applying a pressure to the measuring opening, the metal membrane and thus the resistive thin layer applied to the metal membrane undergoes a deflection that can be detected by suitable evaluation means.
  • the pressure sensor elements In order to enable a more effective production of the pressure sensor elements, it is known to process a larger number of pressure sensor elements, for example 50 to 70 pieces, using the so-called carrier technology.
  • the previously individually rotated and polished base bodies having the bag openings are inserted into a carrier structure, for example a perforated plate, and these are subsequently provided with the resistive thin layer.
  • the support element is simultaneously contaminated by the layer deposition processes for applying the resistive thin layer, so that the carrier element must be subjected to extensive cleaning before it can be used again.
  • the carrier elements have to be equipped with the base bodies and then the finished processed pressure sensor elements are removed from the carrier element again Need to become.
  • Another disadvantage is that different carrier systems are also required for the different processes, such as coating and photolithography. The accuracy of the carriers goes directly into the geometric accuracy of the individual element.
  • the method according to the invention with the features mentioned in claim 1 offers the advantage that a large number of pressure sensors can be produced simultaneously in a simple manner.
  • a large number of pressure sensor elements are produced in one panel (multiple panels) of base bodies and that this is separated into the base body resulting from the application of the resistive thin layer in the pressure sensor elements makes it advantageously possible to produce the pressure sensor elements with high accuracy without complex additional aids . Additional work steps such as the insertion into and removal from a carrier element are completely eliminated.
  • the deposition processes of the resistive thin film can be mastered much more easily in terms of process technology, which is then separated into the pressure sensor elements.
  • the finished processed pressure sensor elements can be separated using highly precise techniques, preferably using laser cutting, water jet cutting or wire EDM, so that after the separation, Further processing of the pressure sensor elements is not necessary.
  • pressure sensor elements By optimizing the arrangement of the pressure sensor elements on the common use, the available space can be used as much as possible, so that only a minimal drop remains after separating the pressure sensor elements. Overall, pressure sensor elements can thus be produced very advantageously in a large number with a consistently high quality in a manner suitable for mass production.
  • Figure 1 is a plan view and a sectional view through a single pressure sensor element
  • FIG. 2 shows a plan view and a sectional illustration through a use for producing the pressure sensor elements according to the invention
  • FIG. 3 is a plan view of a benefit in a further embodiment and FIG. 4 shows a sectional view through a pressure sensor (pressure sensor element on pressure connection).
  • FIG. 1 shows a pressure sensor element 10 in a plan view and a sectional view.
  • the pressure sensor element 10 has a base body 12, which is circular, for example. According to other exemplary embodiments (not shown), the base body 12 can also have other geometrical shapes on it.
  • the base body 12 has a measuring opening 14 which is delimited on one side by a measuring membrane 16, so that there is a blind opening.
  • the measuring membrane 16 is formed by the bottom of the measuring opening 14, so that the base body 12 and the measuring membrane 16 are formed in one piece.
  • a resistive thin layer in the form of a Wheatstone bridge 18 is formed on the measuring membrane 16, the description of the layer deposition process to be carried out in order to achieve the resistive thin layer not to be discussed in more detail in the present description.
  • the base body 12 usually consist of a high-strength stainless steel.
  • the structure and mode of operation of the pressure sensor element 10 shown in FIG. 1 are generally known.
  • a pressure sensor element 10 is illustrated by way of example in FIG. This is arranged on a pressure connection 20, which has a through opening 24 in a housing 22, which with a medium to be measured, for example a gaseous or liquid medium.
  • the through opening 24 is closed by the pressure sensor element 10, the base body 12 being fastened on a mounting flange 26 of the housing 22.
  • the base body 12 can be glued, welded, soldered, etc. to the flange 22, the joining technology being based on the quality requirements of the measurement result obtained with the pressure sensor 10.
  • the measuring opening 14 is acted upon by a pressure or negative pressure via the passage opening 24, so that the measuring membrane 16 is deflected.
  • This deflection of the measuring membrane 16 can be evaluated using known methods, for example resistively (Wheatstone bridge).
  • the deflection of the measuring diaphragm 16 is proportional to the pressure conditions which arise in the measuring opening 14, so that it can be concluded that the pressure or negative pressure is present.
  • a square panel 28 is shown for this purpose in FIG. 3, which has an edge length a. having .
  • the panel 28 can of course also have a different geometric shape, for example a rectangular shape, circular shape, trapezoidal shape, etc.
  • the edge length a is chosen to be larger than ten times the diameter d of a pressure sensor element 10. This provides space for a total of 100 pressure sensor elements 10 on the panel 28.
  • the panel 28 is in the form of a flat plate 30 made of stainless steel with a thickness * ⁇ .
  • the plate 30 has 32 blind openings 34 (measuring openings 14) in a predetermined grid, so that the plate 30 is present as a one-sided perforated plate.
  • the grid 32 of the blind openings 34 is selected such that the distance between the center line of adjacent blind openings 34 is selected to be slightly larger than the diameter d of the later pressure sensor elements 10.
  • the process steps known per se for structuring a resistive thin layer 18 are subsequently carried out.
  • the surface 36 is optionally polished, the subsequent deposition of an insulation layer (in thin-film or thick-film technology), the deposition of a resistive thin layer, for example sputtering of polysilicon or metals, a photolithographic structuring, a deposition of a contact layer, a possible structuring of the contact layer and the subsequent application of a passivation layer.
  • the invention provides that the layer system is generated over the entire surface 36 of the panel 28.
  • the deposition of a resistive thin layer 18 on a single pressure sensor element 10 since, above all, only one exact adjustment per benefit 28, not per sensor element 10 as ⁇ on ⁇ t, has to be carried out.
  • the deposition of the individual layers on a larger, continuous panel 28, each with a uniform thickness is possible in a simple manner, so that tolerance differences between the individual pressure sensor elements 10 are reduced.
  • the position of the individual pressure sensor elements 10 is indicated in the plan view shown in FIG. 2.
  • a separation from the panel 28 then takes place.
  • high-precision cutting techniques for example laser cutting, wire EDM or water jet cutting, can be used.
  • a better utilization of the area of the benefit 28 can be achieved.
  • a benefit 28 with the same edge length a and pressure sensor elements 10 with the same diameter can be used d achieve an approximately 5% higher product yield due to the higher packing density.
  • the benefit 28 can be produced very advantageously, for example by means of a metal injection molding process or a sintering process. As a result, the benefit 28 can be produced without complex secondary processes, such as machining.
  • FIGS. 5 and 6 A round steel rod 100 is shown in FIG. 5, the diameter of which essentially corresponds to the size of the required benefit. It is essential to the round steel rod 100 that it was only rolled in the longitudinal direction during manufacture, as indicated by arrow 101. Such rolling is required to shape the round steel rod 100 and can also be used to influence the properties of the steel material.
  • the material for the round steel ang 100 is thought in particular of a stainless steel with spring properties. For example, a high-alloy stainless steel X 5 CrNiCuNb 17 4 with the DIN material number 1.4542 or 1.4548 is suitable. Such stainless steel materials have proven themselves for the production of pressure sensors.
  • Individual steel substrates 103 are then produced by sawing perpendicular to the longitudinal direction of the round steel rod 100, as is shown in FIG. 6. These individual steel substrates have a thickness of 5 mm, for example.
  • the individual stainless steel substrates are then ground, lapped and polished to achieve a high surface quality. For example, roughness depths of less than half a ⁇ m are achieved.
  • Usual dimensions of the semiconductor technology for example 4 inches or 6 inches, are expediently chosen as the diameter for the stainless steel substrates 103, so that the stainless steel substrates 103 can also be processed with the usual devices for silicon wafer processing.
  • blind openings 34 are then made on the back, as shown in cross-section, for example, in FIG.
  • the further processing then takes place in conventional devices for semiconductor processing.
  • a thin insulation layer for example silicon oxide, Silicon nitride or the like applied.
  • a resistive thin film for example polysilicon or metal thin films.
  • a photoresist layer is then applied and structured through a mask.
  • the photoresist layer structured in this way then serves as a mask for structuring the resistive thin layer.
  • the photoresist layer is then removed and a metal layer for contacting the resistive thin layer is applied.
  • This metal layer is then structured by a further structuring step using a photoresist layer.
  • a passivation layer is applied.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

Procédé de fabrication d'éléments capteurs de pression qui possèdent une membrane métallique et une couche mince résistive placée sur ladite membrane. Un trou borgne est ménagé dans un corps et la couche mince résistive est appliquée sur une face dudit corps opposée au trou borgne. Selon la présente invention, une pluralité d'éléments capteurs de pression (10) sont fabriqués simultanément dans un panneau (28) et après application de la couche mince résistive (18) sur ledit panneau (28), ce dernier est divisé en éléments capteurs de pression (10) séparés.
PCT/DE1997/001800 1996-08-27 1997-08-21 Procede de fabrication de capteurs de pression WO1998009145A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP10511159A JP2000517052A (ja) 1996-08-27 1997-08-21 圧力センサの製法
US09/254,112 US6189205B1 (en) 1996-08-27 1997-08-21 Process for producing pressure sensors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19634561.8 1996-08-27
DE19634561 1996-08-27

Publications (1)

Publication Number Publication Date
WO1998009145A1 true WO1998009145A1 (fr) 1998-03-05

Family

ID=7803794

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1997/001800 WO1998009145A1 (fr) 1996-08-27 1997-08-21 Procede de fabrication de capteurs de pression

Country Status (5)

Country Link
US (1) US6189205B1 (fr)
JP (1) JP2000517052A (fr)
KR (1) KR100487685B1 (fr)
DE (1) DE19736306C5 (fr)
WO (1) WO1998009145A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003044479A1 (fr) * 2001-11-23 2003-05-30 Hydac Electronic Gmbh Capteurs de pression formes a partir d'un disque d'acier inoxydable par retreinte rotative et recuit de detensionnement
EP1681544A1 (fr) * 2005-01-14 2006-07-19 Trafag AG Capteur de pression avec corps de déformation fabriqué par moulage par injection de poudre métallique
EP1881314A2 (fr) * 2006-07-18 2008-01-23 Trafag AG Composant profilé en métal pour enveloppes de liquides et procédé destiné à prévoir un capteur de pression dessus

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999063316A1 (fr) * 1998-06-05 1999-12-09 Georgia Tech Research Corporation Micro-usinage de detecteurs et d'actionneurs realises sur des substrats solides
DE19952106A1 (de) * 1999-10-29 2001-05-03 Bosch Gmbh Robert Sensoranordnung
DE10144367C2 (de) 2001-09-10 2003-10-30 First Sensor Technology Gmbh Druckmesskörper einer Druckmesseinrichtung
DE10361769B4 (de) * 2003-12-29 2014-10-23 Robert Bosch Gmbh Druckaufnehmer mit einteiligem Gehäuse
DE102004013073A1 (de) * 2004-03-11 2005-09-29 Ab Elektronik Sachsen Gmbh Verfahren zur Herstellung von Druckmesselementen und Druckmesselemente
DE102004024919A1 (de) * 2004-05-19 2005-12-15 Trafag Ag Drucksensor
DE102006010804A1 (de) * 2006-03-07 2007-09-20 Eads Deutschland Gmbh Hochtemperatur-Drucksensorelement, insbesondere zur Messung von Drücken innerhalb von Triebwerken, Verfahren zu dessen Herstellung und Bauteil für Triebwerke
DE102008041704A1 (de) 2008-08-29 2010-03-04 Robert Bosch Gmbh Verfahren zur Herstellung von Drucksensorelementen
JP6797649B2 (ja) * 2016-11-29 2020-12-09 セイコーインスツル株式会社 ダイヤフラムの製造方法
KR101837999B1 (ko) * 2016-12-21 2018-03-14 재단법인 포항산업과학연구원 압력센서 및 그 제조방법
KR101927046B1 (ko) * 2017-10-11 2018-12-10 재단법인 포항산업과학연구원 압력센서 및 그 제조방법
CN112775619A (zh) * 2019-11-11 2021-05-11 太原市精微测控技术有限公司 一种溅射薄膜压力传感器弹性膜片加工方法

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DE3108300A1 (de) * 1980-03-06 1982-03-04 Robert Bosch Gmbh, 7000 Stuttgart Druckmessdose
JPS59132327A (ja) * 1983-01-18 1984-07-30 Aisin Seiki Co Ltd 圧力センサ
GB2174241A (en) * 1985-04-25 1986-10-29 Transamerica Delaval Inc Transducer devices
JPS61269033A (ja) * 1985-05-23 1986-11-28 Tokai Rika Co Ltd ダイヤフラム
DE4028376A1 (de) * 1990-09-07 1992-03-12 Bosch Gmbh Robert Verfahren zur herstellung von duennschicht-dehnmessstreifenanordnungen

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US4357848A (en) * 1979-05-30 1982-11-09 Amada Company, Limited Method and apparatus for controlling the feeding of a bandsaw blade of horizontal bandsaw machines
JPH01187426A (ja) * 1988-01-22 1989-07-26 Yokogawa Electric Corp 半導体圧力センサの製造方法
DE3874884T2 (de) * 1988-04-21 1993-04-29 Marelli Autronica Elektrischer kraft- und/oder verformungsmessfuehler, insbesondere zum gebrauch als druckmessfuehler.
JPH01299432A (ja) * 1988-05-27 1989-12-04 Komatsu Ltd 薄膜庄力センサ
EP0381775B1 (fr) * 1988-07-26 1994-11-23 Hitachi Construction Machinery Co., Ltd. Capteur de pression
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DE3108300A1 (de) * 1980-03-06 1982-03-04 Robert Bosch Gmbh, 7000 Stuttgart Druckmessdose
JPS59132327A (ja) * 1983-01-18 1984-07-30 Aisin Seiki Co Ltd 圧力センサ
GB2174241A (en) * 1985-04-25 1986-10-29 Transamerica Delaval Inc Transducer devices
JPS61269033A (ja) * 1985-05-23 1986-11-28 Tokai Rika Co Ltd ダイヤフラム
DE4028376A1 (de) * 1990-09-07 1992-03-12 Bosch Gmbh Robert Verfahren zur herstellung von duennschicht-dehnmessstreifenanordnungen

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003044479A1 (fr) * 2001-11-23 2003-05-30 Hydac Electronic Gmbh Capteurs de pression formes a partir d'un disque d'acier inoxydable par retreinte rotative et recuit de detensionnement
DE10157592A1 (de) * 2001-11-23 2003-06-12 Hydac Electronic Gmbh Verfahren zum Herstellen einer Vielzahl von Drucksensoren
EP1681544A1 (fr) * 2005-01-14 2006-07-19 Trafag AG Capteur de pression avec corps de déformation fabriqué par moulage par injection de poudre métallique
EP1881314A2 (fr) * 2006-07-18 2008-01-23 Trafag AG Composant profilé en métal pour enveloppes de liquides et procédé destiné à prévoir un capteur de pression dessus
EP1881314A3 (fr) * 2006-07-18 2010-10-06 Trafag AG Composant profilé en métal pour enveloppes de liquides et procédé destiné à prévoir un capteur de pression dessus

Also Published As

Publication number Publication date
DE19736306A1 (de) 1998-03-05
DE19736306C2 (de) 2001-05-17
KR100487685B1 (ko) 2005-05-09
JP2000517052A (ja) 2000-12-19
KR20000035791A (ko) 2000-06-26
DE19736306C5 (de) 2010-02-25
US6189205B1 (en) 2001-02-20

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