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WO1998006889A3 - Superheated vapor dryer system - Google Patents

Superheated vapor dryer system Download PDF

Info

Publication number
WO1998006889A3
WO1998006889A3 PCT/US1997/014274 US9714274W WO9806889A3 WO 1998006889 A3 WO1998006889 A3 WO 1998006889A3 US 9714274 W US9714274 W US 9714274W WO 9806889 A3 WO9806889 A3 WO 9806889A3
Authority
WO
WIPO (PCT)
Prior art keywords
parts
vapor
zone
drying
temperature
Prior art date
Application number
PCT/US1997/014274
Other languages
French (fr)
Other versions
WO1998006889A2 (en
Inventor
Robert H Clark
Anthony K Green
Steven E Sykes
Original Assignee
Forward Technology Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Forward Technology Ind Inc filed Critical Forward Technology Ind Inc
Priority to JP51000498A priority Critical patent/JP3896164B2/en
Publication of WO1998006889A2 publication Critical patent/WO1998006889A2/en
Publication of WO1998006889A3 publication Critical patent/WO1998006889A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B3/00—Drying solid materials or objects by processes involving the application of heat

Landscapes

  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Microbiology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

In a vapor drying system, solvents such as isopropyl alcohol (IPA) are boiled and condensed to provide a means of removing water and other contamination from process parts loaded into the equipment. The parts enter the apparatus via an automated lift assembly (185). Upon entering the vapor zone (145), solvent condenses on the parts and fixtures due to a temperature differential, displacing the contaminants. This condensate/contaminant waste stream gravity drains to a buffer tank (125) below via a sloped, temperature-controlled drip tray (121). After vapor condensation on the parts ceases, drying is accomplished using superheated vapors formed in a stabilized zone generated by one or more offset boil sumps (106, 108) and separate vapor heat exchangers (112). Any liquid solvent remaining on the parts is flash-dried in the vapor zone, so that parts emerge clean and dry. The invention incorporates a computer-implemented PLC to control process parameters, cover mechanism (234), transport mechanism (236), safety features during operation (238), idle and standby conditions (240).
PCT/US1997/014274 1996-08-16 1997-08-14 Superheated vapor dryer system WO1998006889A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51000498A JP3896164B2 (en) 1996-08-16 1997-08-14 Superheated steam dryer system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2368696P 1996-08-16 1996-08-16
US60/023,686 1996-08-16

Publications (2)

Publication Number Publication Date
WO1998006889A2 WO1998006889A2 (en) 1998-02-19
WO1998006889A3 true WO1998006889A3 (en) 1998-07-02

Family

ID=21816607

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1997/014274 WO1998006889A2 (en) 1996-08-16 1997-08-14 Superheated vapor dryer system

Country Status (6)

Country Link
JP (1) JP3896164B2 (en)
KR (1) KR100492026B1 (en)
ID (1) ID18031A (en)
MY (1) MY121614A (en)
TW (1) TW413725B (en)
WO (1) WO1998006889A2 (en)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6846516B2 (en) 2002-04-08 2005-01-25 Applied Materials, Inc. Multiple precursor cyclical deposition system
US6855368B1 (en) 2000-06-28 2005-02-15 Applied Materials, Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US6875271B2 (en) 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
US7022948B2 (en) 2000-12-29 2006-04-04 Applied Materials, Inc. Chamber for uniform substrate heating
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US7115499B2 (en) 2002-02-26 2006-10-03 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7201803B2 (en) 2001-03-07 2007-04-10 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7208413B2 (en) 2000-06-27 2007-04-24 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US7595263B2 (en) 2003-06-18 2009-09-29 Applied Materials, Inc. Atomic layer deposition of barrier materials

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6368183B1 (en) 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
JP2007152231A (en) * 2005-12-05 2007-06-21 Nidec Sankyo Corp Cleaning device
CN101360965B (en) 2006-05-18 2010-12-22 富士胶片株式会社 Method and apparatus for drying substance to be dried
JP2011073211A (en) 2009-09-29 2011-04-14 Fujifilm Corp Method of manufacturing original planographic printing plate
JP5366324B2 (en) 2010-03-03 2013-12-11 富士フイルム株式会社 Planographic printing plate manufacturing method and manufacturing apparatus
CN102641859A (en) * 2012-05-07 2012-08-22 江苏合海机械制造有限公司 Stepping cycling auto-cleaning machine for work pieces
KR101554006B1 (en) 2013-05-27 2015-09-17 (주) 나인테크 The drying apparatus using superheated steam
CN108062990B (en) * 2018-01-11 2024-06-07 航天晨光股份有限公司 Radioactive waste liquid crystallization drying system and method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5085238A (en) * 1991-03-04 1992-02-04 Branson Ultrasonics Corporation Vapor degreasing apparatus
US5371950A (en) * 1990-02-23 1994-12-13 S & K Products International, Inc. Isopropyl alcohol vapor dryer system

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5371950A (en) * 1990-02-23 1994-12-13 S & K Products International, Inc. Isopropyl alcohol vapor dryer system
US5085238A (en) * 1991-03-04 1992-02-04 Branson Ultrasonics Corporation Vapor degreasing apparatus

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7501344B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7501343B2 (en) 2000-06-27 2009-03-10 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7208413B2 (en) 2000-06-27 2007-04-24 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US6855368B1 (en) 2000-06-28 2005-02-15 Applied Materials, Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US7465666B2 (en) 2000-06-28 2008-12-16 Applied Materials, Inc. Method for forming tungsten materials during vapor deposition processes
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7235486B2 (en) 2000-06-28 2007-06-26 Applied Materials, Inc. Method for forming tungsten materials during vapor deposition processes
US7115494B2 (en) 2000-06-28 2006-10-03 Applied Materials, Inc. Method and system for controlling the presence of fluorine in refractory metal layers
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US7022948B2 (en) 2000-12-29 2006-04-04 Applied Materials, Inc. Chamber for uniform substrate heating
US7094680B2 (en) 2001-02-02 2006-08-22 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US7201803B2 (en) 2001-03-07 2007-04-10 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US7352048B2 (en) 2001-09-26 2008-04-01 Applied Materials, Inc. Integration of barrier layer and seed layer
US7049226B2 (en) 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US7494908B2 (en) 2001-09-26 2009-02-24 Applied Materials, Inc. Apparatus for integration of barrier layer and seed layer
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6998014B2 (en) 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US7473638B2 (en) 2002-01-26 2009-01-06 Applied Materials, Inc. Plasma-enhanced cyclic layer deposition process for barrier layers
US7094685B2 (en) 2002-01-26 2006-08-22 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US7429516B2 (en) 2002-02-26 2008-09-30 Applied Materials, Inc. Tungsten nitride atomic layer deposition processes
US7115499B2 (en) 2002-02-26 2006-10-03 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US6846516B2 (en) 2002-04-08 2005-01-25 Applied Materials, Inc. Multiple precursor cyclical deposition system
US6875271B2 (en) 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
US7595263B2 (en) 2003-06-18 2009-09-29 Applied Materials, Inc. Atomic layer deposition of barrier materials

Also Published As

Publication number Publication date
ID18031A (en) 1998-02-19
JP2000516334A (en) 2000-12-05
MY121614A (en) 2006-02-28
KR100492026B1 (en) 2005-05-31
KR20000030012A (en) 2000-05-25
WO1998006889A2 (en) 1998-02-19
JP3896164B2 (en) 2007-03-22
TW413725B (en) 2000-12-01

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