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WO1997016866A3 - Support d'interconnexion pour microplaquette et procedes pour monter des contacts a ressorts sur des dispositifs semi-conducteurs - Google Patents

Support d'interconnexion pour microplaquette et procedes pour monter des contacts a ressorts sur des dispositifs semi-conducteurs Download PDF

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Publication number
WO1997016866A3
WO1997016866A3 PCT/US1996/008328 US9608328W WO9716866A3 WO 1997016866 A3 WO1997016866 A3 WO 1997016866A3 US 9608328 W US9608328 W US 9608328W WO 9716866 A3 WO9716866 A3 WO 9716866A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier substrate
semiconductor device
spring elements
semiconductor devices
methods
Prior art date
Application number
PCT/US1996/008328
Other languages
English (en)
Other versions
WO1997016866A2 (fr
Inventor
Igor Y Khandros
Sung Chul Chang
William D Smith
Original Assignee
Formfactor Inc
Igor Y Khandros
Sung Chul Chang
William D Smith
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/452,255 external-priority patent/US6336269B1/en
Priority claimed from US08/533,584 external-priority patent/US5772451A/en
Priority claimed from US08/554,902 external-priority patent/US5974662A/en
Priority claimed from PCT/US1995/014909 external-priority patent/WO1996017378A1/fr
Priority claimed from US08/558,332 external-priority patent/US5829128A/en
Application filed by Formfactor Inc, Igor Y Khandros, Sung Chul Chang, William D Smith filed Critical Formfactor Inc
Priority to JP51454797A priority Critical patent/JP2968051B2/ja
Priority to KR1019970708468A priority patent/KR100299465B1/ko
Priority to AU59657/96A priority patent/AU5965796A/en
Publication of WO1997016866A2 publication Critical patent/WO1997016866A2/fr
Publication of WO1997016866A3 publication Critical patent/WO1997016866A3/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4885—Wire-like parts or pins
    • H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
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    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Metallurgy (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Wire Bonding (AREA)

Abstract

Plusieurs ressorts (512) sont montés sans support sur une surface (510a) d'un substrat de support (510). Le substrat de support (510) est monté sur une surface (502a) d'un dispositif semi-conducteur (502). Des pastilles de connexion (504) du dispositif semi-conducteur sont connectées aux ressorts (512) par des fils métalliques (520) s'étendant entre les pastilles (504) et les bornes (516) des ressorts. Egalement, le support peut être un flip-chip brasé par fusion au dispositif semi-conducteur. Le substrat de support (510) est monté, d'une manière avantageuse, à un ou plusieurs dispositifs semi-conducteurs (532, 534) avant que les dispositifs semi-conducteurs ne soient séparés de la tranche de semi-conducteur sur laquelle ils sont formés. L'élasticité et la déformation permettant des connexions sous pression au dispositif semi-conducteur (502) sont assurées par les ressorts (512), partant du substrat de support (510). Dans ces conditions, le substrat de support (510) reste, d'une manière avantageuse, rigide par rapport au dispositif semi-conducteur (502). Le substrat de support (510) est, d'une manière avantageuse, préfabriqué et on obtient en montant les ressorts (512) sur ce substrat avant de monter le substrat de support sur le ou les dispositifs semi-conducteurs.
PCT/US1996/008328 1995-05-26 1996-05-28 Support d'interconnexion pour microplaquette et procedes pour monter des contacts a ressorts sur des dispositifs semi-conducteurs WO1997016866A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP51454797A JP2968051B2 (ja) 1995-05-26 1996-05-28 半導体素子にばね接触子を実装するチップ相互接続キャリア及び方法
KR1019970708468A KR100299465B1 (ko) 1995-05-26 1996-05-28 칩상호접속캐리어와,스프링접촉자를반도체장치에장착하는방법
AU59657/96A AU5965796A (en) 1995-05-26 1996-05-28 Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices

Applications Claiming Priority (14)

Application Number Priority Date Filing Date Title
US08/452,255 1995-05-26
US08/452,255 US6336269B1 (en) 1993-11-16 1995-05-26 Method of fabricating an interconnection element
US52624695A 1995-09-21 1995-09-21
US08/526,246 1995-09-21
US08/533,584 US5772451A (en) 1993-11-16 1995-10-18 Sockets for electronic components and methods of connecting to electronic components
US08/533,584 1995-10-18
US08/554,902 US5974662A (en) 1993-11-16 1995-11-09 Method of planarizing tips of probe elements of a probe card assembly
US08/554,902 1995-11-09
USPCT/US95/14909 1995-11-13
PCT/US1995/014909 WO1996017378A1 (fr) 1994-11-15 1995-11-13 Structures de contact electrique obtenues par configuration d'un fil souple
US08/558,332 US5829128A (en) 1993-11-16 1995-11-15 Method of mounting resilient contact structures to semiconductor devices
US08/558,332 1995-11-15
US60217996A 1996-02-15 1996-02-15
US08/602,179 1996-02-15

Publications (2)

Publication Number Publication Date
WO1997016866A2 WO1997016866A2 (fr) 1997-05-09
WO1997016866A3 true WO1997016866A3 (fr) 1997-06-19

Family

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Application Number Title Priority Date Filing Date
PCT/US1996/008328 WO1997016866A2 (fr) 1995-05-26 1996-05-28 Support d'interconnexion pour microplaquette et procedes pour monter des contacts a ressorts sur des dispositifs semi-conducteurs

Country Status (4)

Country Link
JP (1) JP2968051B2 (fr)
KR (1) KR100299465B1 (fr)
AU (1) AU5965796A (fr)
WO (1) WO1997016866A2 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6705876B2 (en) 1998-07-13 2004-03-16 Formfactor, Inc. Electrical interconnect assemblies and methods
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6799976B1 (en) 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7247035B2 (en) 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US7579848B2 (en) 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
JP4050732B2 (ja) 2004-08-30 2008-02-20 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP4711800B2 (ja) * 2005-10-07 2011-06-29 日本電子材料株式会社 プローブカードの製作方法
JP2013024824A (ja) * 2011-07-26 2013-02-04 Denso Corp センサ装置の製造方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US5346861A (en) * 1990-09-24 1994-09-13 Tessera, Inc. Semiconductor chip assemblies and methods of making same
US5414298A (en) * 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US5346861A (en) * 1990-09-24 1994-09-13 Tessera, Inc. Semiconductor chip assemblies and methods of making same
US5230632A (en) * 1991-12-19 1993-07-27 International Business Machines Corporation Dual element electrical contact and connector assembly utilizing same
US5414298A (en) * 1993-03-26 1995-05-09 Tessera, Inc. Semiconductor chip assemblies and components with pressure contact

Also Published As

Publication number Publication date
AU5965796A (en) 1997-05-22
KR100299465B1 (ko) 2001-10-27
KR19990021993A (ko) 1999-03-25
JPH10510107A (ja) 1998-09-29
WO1997016866A2 (fr) 1997-05-09
JP2968051B2 (ja) 1999-10-25

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