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WO1997013301A1 - Test socket for leadless ic device - Google Patents

Test socket for leadless ic device Download PDF

Info

Publication number
WO1997013301A1
WO1997013301A1 PCT/US1996/016018 US9616018W WO9713301A1 WO 1997013301 A1 WO1997013301 A1 WO 1997013301A1 US 9616018 W US9616018 W US 9616018W WO 9713301 A1 WO9713301 A1 WO 9713301A1
Authority
WO
WIPO (PCT)
Prior art keywords
contacts
socket
contact
conductor pins
mounting
Prior art date
Application number
PCT/US1996/016018
Other languages
French (fr)
Inventor
Nasser Barabi
Original Assignee
Oz Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oz Technologies, Inc. filed Critical Oz Technologies, Inc.
Publication of WO1997013301A1 publication Critical patent/WO1997013301A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance

Definitions

  • the present invention generally relates to the surface mounting of integrated circuit (IC) devices to a printed circuit (PC) board, and more particularly to test sockets for the test and burn-in of IC devices.
  • the invention is particuarly suited to the testing of leadless IC chips, but is not limited to such applications.
  • BGA ball grid array
  • test sockets for leadless IC devices most commonly employ stamped or formed metal contact pins for achieving electrical interconnection between the I/O contacts of the IC device being tested and the PC test board circuits.
  • Such socket designs have a relatively high profile and relatively high capacitance and inductance making them undesirable for high speed applications. They also require soldering of the socket pins to the PC board and do not operate efficiently with IC devices having noncompliant I/O contacts. Sockets having elastomeric contactors which do not require soldering have also been devised.
  • These test sockets utilize flexible wire filaments which extend in a perpendicular relation to the contact points. Such wire filaments are generally not reliable and will not hold up with repetitive use. In addition, they are not likely to withstand the thermal shock while testing an IC device.
  • pogo pins Still another known IC test socket design is a test socket having high profile, spring-loaded pins, called “pogo pins. "
  • pogo pins the use of pogo pins in test sockets have been limited to relatively long, single-ended pogo pins wherein one end of each pogo pin is a fixed end soldered to the PC board and the other end is spring-loaded. Again, the relatively high profile of such test sockets make them unsuitable for high speed test applications. Also, since the fixed ends of the pogo pins are soldered to the
  • the present invention overcomes the disadvantages of conventional test sockets for leadless IC devices by providing a low profile test socket suitable for high frequency test applications which will provide efficient and solderless contacts for both the PC board and the IC devices being tested.
  • the present invention provides for an improved IC socket for surface mounting an IC device having a predetermined array of I/O contacts to a circuit board having a corresponding array of circuit contacts using an array of miniature, double- ended pogo pins which provide an array of resilient contacts for both the circuit contacts of the PC board and the I/O contacts of the IC device.
  • the IC socket has a body portion which includes a contact interface wall having opposed and substantially parallel mounting surfaces, one of the mounting surfaces of the interface wall is an interior mounting surface for receiving an IC device and the other of the mounting surfaces being an exterior surface for mounting the body portion of the socket to the circuit board.
  • a plurality of substantially parallel conductor pins in the form of double-ended pogo pins extend through and are held by the contact interface wall in an array that corresponds to die predetermined array of the I/O contacts of the IC device (as well as to the corresponding circuit contacts of the circuit board).
  • the conductor pins which have contact ends that project beyond the mounting surfaces of the contact interface wall, provide a conductive path between these mounting surfaces.
  • Means for releasably holding an IC device against the interior mounting surface of the contact interface wall of the socket's body portion is provided such that the I/O contacts of the IC device remain in contact with the ends of the conductor pins at all times.
  • the invention's substantially parallel conductor pin provide a conductor pin footprint that is the same on both sides of the socket.
  • the socket receives an IC device having the same contact footprint as the contact footprint on the PC board to which it is mounted. This permits the IC device to be soldered directly to the PC board after the test socket, which is not soldered to the PC board, is removed.
  • a primary object of the present invention is to provide an IC test socket suitable for high frequency applications and which provides efficient electrical contacts to both the I/O contacts of an IC device and the circuit contacts of a PC board.
  • Another object of the invention is to provide a durable test socket that can withstand the thermal shock encountered in test and burn-in applications, and that can further withstand the repeated insertions and extractions of IC devices into and from the test socket.
  • FIG. 1 is an exploded perspective view of an IC test socket in accordance with the invention as it would be mounted to a PC board.
  • FIG. 2 is an exploded side elevational view of the test socket shown in FIG. 1 with the base portion of the socket secured to the PC board.
  • FIG. 2A is a side elevational view of the test socket and PC board shown in FIG. 2 fully assembled.
  • FIG. 3 is an enlarged, fragmentary view in cross-section of the interface wall of the test socket body motion illustrated in FIG. 1 showing double-ended pogo pins held in the interface wall.
  • FIG. 3 A is an enlarged, fragmentary view in cross-section of the contact interface wall of the test socket's body portion showing the contact ends of the double-ended pogo pins depressed by the contacts of an IC device and the contacts of a PC board to which the test socket is mounted.
  • FIG. 4 is an enlarged view of one of the double-ended pogo pins illustrated in FIG. 3.
  • FIG. 4A shows the pogo pin of FIG. 4 with the contact ends of the pogo pin depressed.
  • FIGS. 1, 2 and 2 A illustrates a test socket 11 for surface mounting IC chip 13 to PC board 15.
  • the test socket includes body portion 17 and a latch cover 19 which serves as a means for releaseably holding IC chip 13 in the socket's body portion.
  • the body portion is formed to provide a relatively thin contact interface wall 20 having opposed and substantially parallel mounting surfaces.
  • One of the mounting surfaces is the interior mounting surface 21 which receives IC chip 13, while the other mounting surface of the contact interface wall is an exterior mounting surface 22 against which the IC test socket is mounted to PC board 15.
  • the body portion of the test socket fiirther includes shoulder portions 23 which form an elevated perimeter 24 having a latch cover alignment slots 25.
  • Perimeter 24 further defines an interior region 27 sized to capture and hold IC chip 13 such that its I/O contacts 30 (see FIG. 3) are precisely aligned with the array of parallel conductor pins 29 held in the body's contact interface wall.
  • the sockets latch cover 19 has a cover plate 31 which can suitably be fabricated of aluminum and which can serve as a heat sink for the IC chip.
  • the cover plate includes lateral edge portions 33 and upwardly extending heat fins 35 distributed along die top of the cover plate between the cover plate's two lateral edges.
  • Alignment posts 37 which are shaped to mate with the alignment slots 25 of the socket's body portion 17, are provided to permit the gross alignment of the latch cover over the socket body portion.
  • An additional pressure plate 39 is also provided on the bottom of the cover plate and is centrally located to permit it to bear against the top of IC chip 13 when the socket is assembled.
  • the pressure plate 39 is metal, and suitably integral to cover plate 31, to conduct heat away from the IC chip.
  • pressure plate 39 can suitably be a plastic material such as UlternTM 1000.
  • the alignment ports 37 can be fabricated of a metal or plastic material, depending on the application.
  • Latch cover 19 is releaseably held to the body portion of the socket by means of opposed latch handles 41 pivotally mounted to lateral edges 33 of cover plate 31.
  • the latch handles are spring-loaded by means of compression springs 43 and has a cammed locking ridge 45 which snaps into locking groove 47 on the perimeter of the socket's body portion as shown in FIG. 2 A when the latch cover is placed down over the body portion.
  • FIGS. 3, 3A, 4 and 4A illustrate in greater detail die contact interface wall 20 of the socket body portion and d e conductor pins held d ereby.
  • Conductor pins 29 are held in the contact interface wall 20 in an array of straight and parallel pins that corresponds to the footprint of both the array of I/O contacts 30 on the bottom of IC chip 13 and die circuit contacts or "pads" 32 of PC board 15 to which the IC chip is to be surface mounted.
  • each of the straight conductor pins is in the form of a double ended pogo pin having oppositely extending contact ends 51, 52 which are depressible within pin casing 53 against internal compression spring 55 which exerts a restoring force against the enlarged base ends 57, 58 of each of the contact ends.
  • Body portion 17 of the socket is fabricated from an insulator material, suitably a plastic material, the composition of which will depend on die application.
  • a material such as VespelTM can be used, while for low temperamre applications, a material such as UlternTM can be employed.
  • the body portion can suitably be provided with a separate bottom cover plate 61 which fits onto the bottom of the body portion 17 after the conductor pins have been inserted into predrilled holes in the interface wall.
  • Enlarged collar portions 63 on the outside diameter of the conductor pin casing 53 will fit into a counterboard portion of the pin holes and will fix the pins in the wall when bottom cover plate 61 is installed.
  • Bottom cover plate 61 can be secured to the body portion by mechanical means, such as screws, or a suitable adhesive, or both.
  • the socket's body portion 17 is first secured to PC board 15 by means of any suitable attachment means such as attachment screws 65 which extend dirough aligned attachment screw openings 67, 68 in, respectively, the socket's body portion and die PC board. Attachment nuts thread onto the attachment screw 65 from the back side of die PC board. Locator pins 71 and corresponding locator holes 73 are provided to precisely locate the socket body 17 over the PC board circuit contacts 32.
  • FIG. 3 The operation of the double-ended pogo pin type conductor pins is best illustrated in reference to FIG. 3.
  • the bottom contact ends 51 of conductor pins 29 contact and are depressed slightly when the contact ends meet die circuit contacts 32 of PC board 15 when die socket's body portion is mounted to the PC board as above described.
  • the IC chip 13 is pressed against the top of the interface wall 20 by means of pressure plate 39 of the socket's latch cover 19, the I/O contacts on the bottom of the IC chip are pressed against the upper contact ends 51 of conductor pins 29 to slightly depress these ends.
  • Conductor pins 29 while be miniature conductor pins capable of providing a low profile contact between PC board and the IC chip.
  • the conductor pins can suitably have an overall length, including the contact ends, of approximately 0.220 inches, a casing outside diameter of approximately 0.025 inches, and a contact end diameter of approximately 0.0120 inches.
  • the overall length of die conductor pins will be less than approximately 0.250 inches.
  • the length of the conductor pin casing 53 can suitably have a dimension of approximately 0.160 inches with the overall thickness of die contact interface wall 20 being slightly larger than this dimension. Such dimensions will be consistent with a low profile contact suitable for high frequency test applications.
  • the present invention provides a test socket for efficiently surface mounting a leadless IC chip to a circuit board involving solderless connections and small insertion forces.
  • the test socket of the invention has a relatively low profile and is suitable for use in high frequency test and burn-in applications.
  • the test socket of the invention also provides a uniform contact footprint from one side of die socket to the other which permits the socket to be removed and die IC device soldered directly to the PC board. While the invention has been described in considerable detail in the foregoing specification, it is understood that it is not intended diat die invention be limited to such detail, except as necessitated by die following claims.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)

Abstract

A test socket (11) for an IC device (13) has relatively thin contact interface wall (20) having an array of double-ended pogo pins (29). The double-ended pogo pins (29) provide resilient spring-loaded contacts for the I/O contacts (30) of an IC device (13) held in the socket as well as for the circuit contacts (32) of a PC board (15) to which the socket is mounted.

Description

TITLE OF THE INVENTION
Test Socket for Leadless IC Device
TECHNICAL FIELD The present invention generally relates to the surface mounting of integrated circuit (IC) devices to a printed circuit (PC) board, and more particularly to test sockets for the test and burn-in of IC devices. The invention is particuarly suited to the testing of leadless IC chips, but is not limited to such applications.
BACKGROUND ART
The increased capabilities of IC chips have led to increased input/output (I/O) densities and alternative techniques for mounting IC chips to printed circuit (PC) boards involving leadless IC chips. For example, ball grid array (BGA) mounting techniques have been developed to replace pin grid array (PGA) mounting approaches in order to achieve more densely packed contacts and smaller contact dimensions (in the order of
25 mils.). To facilitate the testing and burn-in of leadless IC devices, special test sockets have been devised to hold these devices and to temporarily connect them to a PC test board. Test sockets for leadless IC devices most commonly employ stamped or formed metal contact pins for achieving electrical interconnection between the I/O contacts of the IC device being tested and the PC test board circuits. Such socket designs have a relatively high profile and relatively high capacitance and inductance making them undesirable for high speed applications. They also require soldering of the socket pins to the PC board and do not operate efficiently with IC devices having noncompliant I/O contacts. Sockets having elastomeric contactors which do not require soldering have also been devised. These test sockets utilize flexible wire filaments which extend in a perpendicular relation to the contact points. Such wire filaments are generally not reliable and will not hold up with repetitive use. In addition, they are not likely to withstand the thermal shock while testing an IC device.
Still another known IC test socket design is a test socket having high profile, spring-loaded pins, called "pogo pins. " Heretofore, the use of pogo pins in test sockets have been limited to relatively long, single-ended pogo pins wherein one end of each pogo pin is a fixed end soldered to the PC board and the other end is spring-loaded. Again, the relatively high profile of such test sockets make them unsuitable for high speed test applications. Also, since the fixed ends of the pogo pins are soldered to the
PC board, such sockets are relatively difficult to remove.
The present invention overcomes the disadvantages of conventional test sockets for leadless IC devices by providing a low profile test socket suitable for high frequency test applications which will provide efficient and solderless contacts for both the PC board and the IC devices being tested.
DISCLOSURE OF THE INVENTION
Briefly, the present invention provides for an improved IC socket for surface mounting an IC device having a predetermined array of I/O contacts to a circuit board having a corresponding array of circuit contacts using an array of miniature, double- ended pogo pins which provide an array of resilient contacts for both the circuit contacts of the PC board and the I/O contacts of the IC device. More specifically, the IC socket has a body portion which includes a contact interface wall having opposed and substantially parallel mounting surfaces, one of the mounting surfaces of the interface wall is an interior mounting surface for receiving an IC device and the other of the mounting surfaces being an exterior surface for mounting the body portion of the socket to the circuit board. A plurality of substantially parallel conductor pins in the form of double-ended pogo pins extend through and are held by the contact interface wall in an array that corresponds to die predetermined array of the I/O contacts of the IC device (as well as to the corresponding circuit contacts of the circuit board). The conductor pins, which have contact ends that project beyond the mounting surfaces of the contact interface wall, provide a conductive path between these mounting surfaces. By using double-ended pogo pins, both contact ends of the pins will be resiliently depressible to provide spring-loaded contacts for both the IC device held in the socket and the circuit board to which the socket is mounted. Means for releasably holding an IC device against the interior mounting surface of the contact interface wall of the socket's body portion is provided such that the I/O contacts of the IC device remain in contact with the ends of the conductor pins at all times. It is noted that the invention's substantially parallel conductor pin provide a conductor pin footprint that is the same on both sides of the socket. Thus, the socket receives an IC device having the same contact footprint as the contact footprint on the PC board to which it is mounted. This permits the IC device to be soldered directly to the PC board after the test socket, which is not soldered to the PC board, is removed.
Therefore, it can be seen that a primary object of the present invention is to provide an IC test socket suitable for high frequency applications and which provides efficient electrical contacts to both the I/O contacts of an IC device and the circuit contacts of a PC board. Another object of the invention is to provide a durable test socket that can withstand the thermal shock encountered in test and burn-in applications, and that can further withstand the repeated insertions and extractions of IC devices into and from the test socket. It is still another object of the invention to provide a test socket for an IC device having the same I/O contact footprint as the footprint of the circuit contacts (also called "pads") of die PC board to which it is mounted. Yet other objects of the invention will be apparent from the following specification and claims.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded perspective view of an IC test socket in accordance with the invention as it would be mounted to a PC board. FIG. 2 is an exploded side elevational view of the test socket shown in FIG. 1 with the base portion of the socket secured to the PC board.
FIG. 2A is a side elevational view of the test socket and PC board shown in FIG. 2 fully assembled.
FIG. 3 is an enlarged, fragmentary view in cross-section of the interface wall of the test socket body motion illustrated in FIG. 1 showing double-ended pogo pins held in the interface wall. FIG. 3 A is an enlarged, fragmentary view in cross-section of the contact interface wall of the test socket's body portion showing the contact ends of the double-ended pogo pins depressed by the contacts of an IC device and the contacts of a PC board to which the test socket is mounted.
FIG. 4 is an enlarged view of one of the double-ended pogo pins illustrated in FIG. 3.
FIG. 4A shows the pogo pin of FIG. 4 with the contact ends of the pogo pin depressed.
BEST MODE FOR CARRYING OUT THE INVENTION
Referring now to the drawings, FIGS. 1, 2 and 2 A illustrates a test socket 11 for surface mounting IC chip 13 to PC board 15. The test socket includes body portion 17 and a latch cover 19 which serves as a means for releaseably holding IC chip 13 in the socket's body portion. Referring to FIG. 3, it can be seen that the body portion is formed to provide a relatively thin contact interface wall 20 having opposed and substantially parallel mounting surfaces. One of the mounting surfaces is the interior mounting surface 21 which receives IC chip 13, while the other mounting surface of the contact interface wall is an exterior mounting surface 22 against which the IC test socket is mounted to PC board 15. The body portion of the test socket fiirther includes shoulder portions 23 which form an elevated perimeter 24 having a latch cover alignment slots 25. Perimeter 24 further defines an interior region 27 sized to capture and hold IC chip 13 such that its I/O contacts 30 (see FIG. 3) are precisely aligned with the array of parallel conductor pins 29 held in the body's contact interface wall. Further referring to FIGS. 1, 2 and 2A, the sockets latch cover 19 has a cover plate 31 which can suitably be fabricated of aluminum and which can serve as a heat sink for the IC chip. The cover plate includes lateral edge portions 33 and upwardly extending heat fins 35 distributed along die top of the cover plate between the cover plate's two lateral edges. Alignment posts 37, which are shaped to mate with the alignment slots 25 of the socket's body portion 17, are provided to permit the gross alignment of the latch cover over the socket body portion. An additional pressure plate 39 is also provided on the bottom of the cover plate and is centrally located to permit it to bear against the top of IC chip 13 when the socket is assembled. In applications where the latch cover is to act as a heat sink, the pressure plate 39 is metal, and suitably integral to cover plate 31, to conduct heat away from the IC chip. In applications where the latch cover is not intended to act as a heat sink, pressure plate 39 can suitably be a plastic material such as Ultern™ 1000. Similarly, the alignment ports 37 can be fabricated of a metal or plastic material, depending on the application. Latch cover 19 is releaseably held to the body portion of the socket by means of opposed latch handles 41 pivotally mounted to lateral edges 33 of cover plate 31. The latch handles are spring-loaded by means of compression springs 43 and has a cammed locking ridge 45 which snaps into locking groove 47 on the perimeter of the socket's body portion as shown in FIG. 2 A when the latch cover is placed down over the body portion.
FIGS. 3, 3A, 4 and 4A illustrate in greater detail die contact interface wall 20 of the socket body portion and d e conductor pins held d ereby. Conductor pins 29 are held in the contact interface wall 20 in an array of straight and parallel pins that corresponds to the footprint of both the array of I/O contacts 30 on the bottom of IC chip 13 and die circuit contacts or "pads" 32 of PC board 15 to which the IC chip is to be surface mounted. Referring to FIG. 4, it can be seen that each of the straight conductor pins is in the form of a double ended pogo pin having oppositely extending contact ends 51, 52 which are depressible within pin casing 53 against internal compression spring 55 which exerts a restoring force against the enlarged base ends 57, 58 of each of the contact ends.
Body portion 17 of the socket is fabricated from an insulator material, suitably a plastic material, the composition of which will depend on die application. For high temperature applications, a material such as Vespel™ can be used, while for low temperamre applications, a material such as Ultern™ can be employed. To permit insertion and retention of the conductor pins in the contact interface wall of the body portion, the body portion can suitably be provided with a separate bottom cover plate 61 which fits onto the bottom of the body portion 17 after the conductor pins have been inserted into predrilled holes in the interface wall. Enlarged collar portions 63 on the outside diameter of the conductor pin casing 53 will fit into a counterboard portion of the pin holes and will fix the pins in the wall when bottom cover plate 61 is installed. Bottom cover plate 61 can be secured to the body portion by mechanical means, such as screws, or a suitable adhesive, or both.
To use the test socket of the invention, the socket's body portion 17 is first secured to PC board 15 by means of any suitable attachment means such as attachment screws 65 which extend dirough aligned attachment screw openings 67, 68 in, respectively, the socket's body portion and die PC board. Attachment nuts thread onto the attachment screw 65 from the back side of die PC board. Locator pins 71 and corresponding locator holes 73 are provided to precisely locate the socket body 17 over the PC board circuit contacts 32.
The operation of the double-ended pogo pin type conductor pins is best illustrated in reference to FIG. 3. In FIG. 3, the bottom contact ends 51 of conductor pins 29 contact and are depressed slightly when the contact ends meet die circuit contacts 32 of PC board 15 when die socket's body portion is mounted to the PC board as above described. Similarly, as the IC chip 13 is pressed against the top of the interface wall 20 by means of pressure plate 39 of the socket's latch cover 19, the I/O contacts on the bottom of the IC chip are pressed against the upper contact ends 51 of conductor pins 29 to slightly depress these ends. Because bodi contact ends of die conductor pins are resiliently depressible, they will exert a spring-like force against the contacts of the IC chip and circuit board and will account for any lack of coplanarity in these contact points. Such contacts can be made with minimal insertion force, that is, only that force required to slightly depress the contact ends of die conductor pins. It is noted diat the tips 75 of the contact ends of die conductor pins have a recessed V- shape shape to increase the area of the conductor pin diat actually comes into contact with die ball-shaped contact points of the PC board, which are well suited to provide good electrical contact with die ball-shaped contacts of the IC device and d e surface pad contacts of the PC board.
Conductor pins 29 while be miniature conductor pins capable of providing a low profile contact between PC board and the IC chip. The conductor pins can suitably have an overall length, including the contact ends, of approximately 0.220 inches, a casing outside diameter of approximately 0.025 inches, and a contact end diameter of approximately 0.0120 inches. Preferably the overall length of die conductor pins will be less than approximately 0.250 inches. The length of the conductor pin casing 53 can suitably have a dimension of approximately 0.160 inches with the overall thickness of die contact interface wall 20 being slightly larger than this dimension. Such dimensions will be consistent with a low profile contact suitable for high frequency test applications.
Therefore, it can be seen that the present invention provides a test socket for efficiently surface mounting a leadless IC chip to a circuit board involving solderless connections and small insertion forces. At the same time, the test socket of the invention has a relatively low profile and is suitable for use in high frequency test and burn-in applications. The test socket of the invention also provides a uniform contact footprint from one side of die socket to the other which permits the socket to be removed and die IC device soldered directly to the PC board. While the invention has been described in considerable detail in the foregoing specification, it is understood that it is not intended diat die invention be limited to such detail, except as necessitated by die following claims.

Claims

CLAIMS:
1. An IC socket for surface mounting an IC device having a predetermined array of I/O contacts to a circuit board having a corresponding array of circuit contacts, said IC socket comprising a body portion which includes a contact interface wall having opposed and substantially parallel mounting surfaces, one of said mounting surfaces being an interior mounting surface for receiving an IC device and the other of said mounting surfaces being an exterior mounting surface for mounting the body portion to a circuit board, a plurality of conductor pins extending through and held by said contact interface wall in a array corresponding to a predetermined array of I/O contacts of an IC device, said conductor pins having contact ends projecting beyond d e mounting surfaces of said contact interface wall to provide a conductive padi therebetween, and each of the contact ends of said conductor pins being resiliently depressible to provide spring loaded contacts for both die I/O contacts of an IC device and d e circuit contacts of a circuit board contacted tiiereby, and means for releaseably holding an IC device against the interior mounting surface of the contact interface wall of said body portion such that the I/O contacts of the IC device remain in contact widi the contact ends of the conductor pins projecting from said interior mounting surface.
2. The IC socket of claim 1 wherein the thickness of said contact interface wall and die lengdi of said conductor pins are relatively small to provide a low profile
interface between the IC device and the circuit board.
3. The IC socket of claim 2 wherein the lengdi of said conductor pins is less
than approximately .250 inches.
4. The IC socket of claim 1 wherein said conductor pins are straight conductor pins held in parallel relation in said contact interface wall to provide an array of conductor pins that has the same footprint at each of said interior and exterior
mounting surfaces.
5. An IC socket for surface mounting an IC device having a predetermined
array of I/O contacts to a circuit board having a corresponding array of circuit contacts,
said IC socket comprising a body portion which includes a relatively thin contact interface wall having opposed and substantially parallel mounting surfaces, one of said mounting surfaces being an interior mounting surface for receiving an IC device and die other of said mounting surfaces being an exterior mounting surface for mounting the body portion
to a circuit board, a plurality of straight, parallel and relatively short conductor pins extending dirough and held by said contact interface wall in a array corresponding to a predetermined array of I/O contacts of an IC device, said conductor pins having contact 97/13301 PC17US96/16018
10 ends projecting beyond the mounting surfaces of said contact interface wall to provide a conductive padi tiierebetween, and each of die contact ends of said conductor pins being resiliently depressible to provide spring loaded contacts for both die I/O contacts of an IC device and d e circuit contacts of a circuit board contacted tiiereby, and means for releaseably holding an IC device against die interior mounting surface of die contact interface wall of said body portion such that the I/O contacts of the IC device remain in contact with the contact ends of the conductor pins projecting from said interior mounting surface.
PCT/US1996/016018 1995-10-04 1996-10-04 Test socket for leadless ic device WO1997013301A1 (en)

Applications Claiming Priority (2)

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US08/538,956 US6046597A (en) 1995-10-04 1995-10-04 Test socket for an IC device
US08/538,956 1995-10-04

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999023730A1 (en) * 1997-11-03 1999-05-14 Advanced Interconnections Corporation Converter socket terminal
US6256202B1 (en) 2000-02-18 2001-07-03 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
FR2958756A1 (en) * 2010-04-09 2011-10-14 Eads Europ Aeronautic Defence System for high frequency testing of integrated circuit to form surface mount electronic component, has extension set assuring variable length electrical connections between balls and system, and deformable to compensate unevenness of balls
JP2021519928A (en) * 2018-04-24 2021-08-12 テラダイン、 インコーポレイテッド Thermal control in test system
US20220155343A1 (en) * 2020-11-17 2022-05-19 Yamaichi Electronics Co., Ltd Socket for inspection

Families Citing this family (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6033935A (en) * 1997-06-30 2000-03-07 Formfactor, Inc. Sockets for "springed" semiconductor devices
US6483328B1 (en) 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
JP4060919B2 (en) * 1997-11-28 2008-03-12 富士通株式会社 Electrical connection device, contact manufacturing method, and semiconductor test method
US6288559B1 (en) * 1998-03-30 2001-09-11 International Business Machines Corporation Semiconductor testing using electrically conductive adhesives
US6300781B1 (en) * 1998-10-30 2001-10-09 St Assembly Test Services Pte Ltd Reliable method and apparatus for interfacing between a ball grid array handler and a ball grid array testing system
US6785148B1 (en) * 1998-12-21 2004-08-31 Intel Corporation Easy mount socket
US6204676B1 (en) * 1999-05-10 2001-03-20 Silicon Integrated Systems Corp. Testing apparatus for testing a ball grid array device
US6316952B1 (en) * 1999-05-12 2001-11-13 Micron Technology, Inc. Flexible conductive structures and method
US6468098B1 (en) * 1999-08-17 2002-10-22 Formfactor, Inc. Electrical contactor especially wafer level contactor using fluid pressure
US6392887B1 (en) * 1999-12-14 2002-05-21 Intel Corporation PLGA-BGA socket using elastomer connectors
US6529027B1 (en) * 2000-03-23 2003-03-04 Micron Technology, Inc. Interposer and methods for fabricating same
JP2002008807A (en) * 2000-06-22 2002-01-11 Mitsubishi Electric Corp Inspection device for semiconductor device and inspection method therefor
US6424166B1 (en) * 2000-07-14 2002-07-23 David W. Henry Probe and test socket assembly
US6331836B1 (en) * 2000-08-24 2001-12-18 Fast Location.Net, Llc Method and apparatus for rapidly estimating the doppler-error and other receiver frequency errors of global positioning system satellite signals weakened by obstructions in the signal path
JP4521106B2 (en) * 2000-09-28 2010-08-11 日本発條株式会社 Conductive contact with movable guide plate
AU2001296373A1 (en) * 2000-09-29 2002-04-08 Intel Corporation A method and an apparatus for testing electronic devices
US6597190B2 (en) 2000-09-29 2003-07-22 Intel Corporation Method and apparatus for testing electronic devices
ATE381124T1 (en) * 2000-10-26 2007-12-15 Shinetsu Polymer Co PRESS CONNECTOR AND CORRESPONDING CONNECTION STRUCTURE
US6512389B1 (en) * 2000-11-17 2003-01-28 Aql Manufacturing Services, Inc. Apparatus for use in an electronic component test interface having multiple printed circuit boards
US6846115B1 (en) 2001-01-29 2005-01-25 Jds Uniphase Corporation Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor
JP3443687B2 (en) * 2001-02-19 2003-09-08 株式会社エンプラス Socket for electrical components
US7396236B2 (en) * 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
JP2002329540A (en) * 2001-05-01 2002-11-15 Shin Etsu Polymer Co Ltd Press contact type connector for portable telephone and its connection structure
JP3706333B2 (en) * 2001-11-12 2005-10-12 山一電機株式会社 Latch lock mechanism of KGD carrier
US6685492B2 (en) * 2001-12-27 2004-02-03 Rika Electronics International, Inc. Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition
DE60317638T2 (en) * 2002-02-07 2008-10-30 Yokowo Co., Ltd. PROBE FROM CAPACITY LOAD TYPE AND TEST DEVICE CONTAINING THIS PROBE
KR20040087341A (en) * 2002-03-05 2004-10-13 리카 일렉트로닉스 인터내셔널, 인크. Apparatus for interfacing electronic packages and test equipment
US6667628B2 (en) * 2002-04-02 2003-12-23 Agilent Technologies, Inc. Method and apparatus for the management of forces in a wireless fixture
KR100477526B1 (en) * 2002-05-03 2005-03-17 동부아남반도체 주식회사 Semiconductor testing device of pogo pin
US6844749B2 (en) * 2002-07-18 2005-01-18 Aries Electronics, Inc. Integrated circuit test probe
US7361844B2 (en) * 2002-11-25 2008-04-22 Vlt, Inc. Power converter package and thermal management
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
TW563929U (en) * 2002-12-24 2003-11-21 Molex Inc Press connection terminal
TWI233489B (en) * 2003-01-21 2005-06-01 Leeno Ind Inc Contact apparatus and test PCB including the contact apparatus used for testing microwave device, and manufacturing method of the test PCB
US6846184B2 (en) * 2003-01-24 2005-01-25 High Connection Density Inc. Low inductance electrical contacts and LGA connector system
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US20050176285A1 (en) * 2003-02-04 2005-08-11 Microfabrica Inc. Pin-type probes for contacting electronic circuits and methods for making such probes
TWI234257B (en) * 2003-06-30 2005-06-11 Advanced Semiconductor Eng Heat sink structure and chip package structure thereof
US7109732B2 (en) * 2003-07-31 2006-09-19 Endicott Interconnect Technologies, Inc. Electronic component test apparatus
TWI226735B (en) * 2003-10-03 2005-01-11 Asustek Comp Inc Adaption board
DE20316645U1 (en) * 2003-10-29 2005-03-10 Fan, Wei-Fang, Jwu Beei Modular elastic contact pin group device for integrated circuit testing, has elastic contact pins whose position is defined by holes in upper and lower lids
DE20316644U1 (en) * 2003-10-29 2005-03-10 Fan, Wei-Fang, Jwu Beei Test socket for modular integrated circuit, has adapting device fixed to contact pin group device on intermediate plate arranged on base
JP4493981B2 (en) * 2003-10-31 2010-06-30 エスペック株式会社 Semiconductor device mounting member, semiconductor device mounting structure, and semiconductor device driving apparatus
US7137827B2 (en) * 2003-11-17 2006-11-21 International Business Machines Corporation Interposer with electrical contact button and method
CN2682641Y (en) * 2003-11-20 2005-03-02 上海莫仕连接器有限公司 Crimp connected conductive terminal
CN2686135Y (en) * 2003-11-20 2005-03-16 上海莫仕连接器有限公司 Crimp type conductive terminal
US6956392B2 (en) * 2003-12-30 2005-10-18 Texas Instruments Incorporated Heat transfer apparatus for burn-in board
JP4262099B2 (en) * 2004-01-07 2009-05-13 ユニテクノ株式会社 Inspection jig for semiconductor integrated circuits
FR2865856B1 (en) * 2004-02-04 2006-05-12 Composants Electr Soc D CONNECTING PART BETWEEN THE AIR AND THE ELECTRONIC CIRCUIT OF A ROOF ANTENNA FOR A MOTOR VEHICLE, AND ANTENNA PROVIDED WITH SUCH A CONNECTING PART
DE102004007696B4 (en) * 2004-02-16 2009-01-02 Infineon Technologies Ag Test device for testing a semiconductor device with contact surfaces on its top and bottom and method for testing the semiconductor device
US7046020B2 (en) * 2004-02-17 2006-05-16 Agilent Technologies, Inc. Probes with perpendicularly disposed spring pins, and methods of making and using same
US20050253602A1 (en) * 2004-04-28 2005-11-17 Cram Daniel P Resilient contact probe apparatus, methods of using and making, and resilient contact probes
JP2005339894A (en) 2004-05-25 2005-12-08 Three M Innovative Properties Co Socket for testing ball grid array integrated circuit
US7918671B2 (en) * 2004-07-13 2011-04-05 Research In Motion Limited Mounting structure with springs biasing towards a latching edge
US7189092B2 (en) * 2004-07-14 2007-03-13 Antares Contech, Inc. Modular semiconductor package testing contactor system
US7151388B2 (en) * 2004-09-30 2006-12-19 Kes Systems, Inc. Method for testing semiconductor devices and an apparatus therefor
KR100688507B1 (en) * 2004-12-08 2007-03-02 삼성전자주식회사 Semiconductor chip inspection device and semiconductor chip inspection method using the same
US20060245150A1 (en) * 2005-04-29 2006-11-02 Tingbao Chen Interconnect Cartridge
JP4598614B2 (en) * 2005-06-30 2010-12-15 富士通株式会社 Socket and electronic equipment
US7385408B1 (en) * 2005-07-12 2008-06-10 Amkor Technology, Inc. Apparatus and method for testing integrated circuit devices having contacts on multiple surfaces
US20070018666A1 (en) * 2005-07-22 2007-01-25 Nasser Barabi Spring contact pin for an IC chip tester
JP2007033215A (en) * 2005-07-26 2007-02-08 Ricoh Co Ltd Device for inspecting electronic component package
US20070176618A1 (en) * 2005-08-12 2007-08-02 Amkor Technology, Inc. Universal contactor for use with multiple handlers and method therefor
US7118385B1 (en) 2005-09-22 2006-10-10 International Business Machines Corporation Apparatus for implementing a self-centering land grid array socket
EP1788622A1 (en) * 2005-11-21 2007-05-23 Lih Duo International Co., Ltd. Memory module comprising one or more embedding seats with a sliding cover and a body with one or more IC containers having an array of conducting elastic pin units
EP1788623A1 (en) * 2005-11-21 2007-05-23 Lih Duo International Co., Ltd. Embedding seat comprising a sliding cover and a body with one or more IC containers having an array of conducting elastic pin units
US7583097B2 (en) * 2005-12-23 2009-09-01 Essai, Inc. Contactor nest for an IC device and method
US7800391B2 (en) * 2005-12-30 2010-09-21 Mediatek Inc. Apparatus for testing a chip and methods of making and using the same
WO2007125974A1 (en) * 2006-04-28 2007-11-08 Nhk Spring Co., Ltd. Conductive contact holder
US7601009B2 (en) * 2006-05-18 2009-10-13 Centipede Systems, Inc. Socket for an electronic device
TWM307751U (en) * 2006-06-05 2007-03-11 Hon Hai Prec Ind Co Ltd Pogo pin
US7323892B1 (en) * 2006-06-07 2008-01-29 Agilent Technologies, Inc. Probe having a frame to align spring pins perpendicularly to a printed circuit board, and method of making same
JP5095964B2 (en) * 2006-07-03 2012-12-12 スリーエム イノベイティブ プロパティズ カンパニー Attachment for socket and semiconductor device test apparatus having the same
US7195493B1 (en) * 2006-07-03 2007-03-27 Hon Hai Precision Ind. Co., Ltd. Land grid array socket connector with location members
US20080009148A1 (en) * 2006-07-07 2008-01-10 Glenn Goodman Guided pin and plunger
US20080036484A1 (en) * 2006-08-10 2008-02-14 Leeno Industrial Inc. Test probe and manufacturing method thereof
US7656179B2 (en) * 2006-11-10 2010-02-02 Yokowo Co., Ltd. Relay connector having a pin block and a floating guide with guide hole
US9766268B2 (en) * 2006-12-21 2017-09-19 Essai, Inc. Contactor with angled spring probes
US11378588B2 (en) 2006-12-21 2022-07-05 Essai, Inc. Contactor with angled depressible probes in shifted bores
US7651340B2 (en) * 2007-02-23 2010-01-26 Essai, Inc. Chip actuator cover assembly
US7858269B2 (en) * 2007-03-16 2010-12-28 International Business Machines Corporation Structure and method for sub-resolution dummy clear shapes for improved gate dimensional control
US7663388B2 (en) * 2007-03-30 2010-02-16 Essai, Inc. Active thermal control unit for maintaining the set point temperature of a DUT
CN101315392A (en) * 2007-05-31 2008-12-03 佛山普立华科技有限公司 Probe positioning device
US7683648B1 (en) * 2007-06-11 2010-03-23 Nvidia Corporation Integrated circuit socket and method of use for providing adjustable contact pitch
US7576551B2 (en) * 2007-09-20 2009-08-18 Visera Technologies Company Limited Test socket and test board for wafer level semiconductor testing
EP2058867A3 (en) * 2007-11-12 2009-07-22 Multi-Holding AG Junction box for a photovoltaic solar panel
CN101241143B (en) * 2008-02-20 2010-09-08 日月光半导体制造股份有限公司 Integrated circuit test socket and its test interface
US20090284266A1 (en) * 2008-05-16 2009-11-19 Kuan-Hsing Li Test method and device for land grid array components
TWI367330B (en) * 2008-05-22 2012-07-01 King Yuan Electronics Co Ltd Probe socket, and probe card
KR101099501B1 (en) * 2008-06-20 2011-12-27 주식회사 아이에스시테크놀러지 Test socket, and fabrication method thereof and electrical connection apparatus
TWM359860U (en) * 2008-11-25 2009-06-21 Hon Hai Prec Ind Co Ltd Electrical connector
CN101813711B (en) * 2009-02-20 2012-07-25 京元电子股份有限公司 Test Probes and Probe Holders
US9046568B2 (en) * 2009-03-27 2015-06-02 Essai, Inc. Universal spring contact pin and IC test socket therefor
US8269516B1 (en) * 2009-04-03 2012-09-18 Xilinx, Inc. High-speed contactor interconnect with circuitry
US10078101B2 (en) 2009-04-21 2018-09-18 Johnstech International Corporation Wafer level integrated circuit probe array and method of construction
US8506307B2 (en) 2010-12-02 2013-08-13 Interconnect Devices, Inc. Electrical connector with embedded shell layer
JP5847530B2 (en) * 2011-10-19 2016-01-27 株式会社エンプラス Socket for electrical parts
US9182440B1 (en) * 2012-01-30 2015-11-10 Marvell International Ltd. Pressure activated high density switch array
WO2013175824A1 (en) * 2012-05-22 2013-11-28 日本発條株式会社 Socket attachment structure and spring member
US20130335110A1 (en) * 2012-06-15 2013-12-19 Polyvalor, Limited Partnership Planar circuit test fixture
JP6175498B2 (en) 2012-06-20 2017-08-09 ジョンズテック インターナショナル コーポレイション Wafer level integrated circuit contactor and manufacturing method
KR101443980B1 (en) * 2012-11-27 2014-09-23 삼성전기주식회사 Contact pin and power module package having the same
TWI543451B (en) * 2013-07-30 2016-07-21 鴻海精密工業股份有限公司 Electrical connector and assembly thereof
TWI651539B (en) 2014-03-10 2019-02-21 美商瓊斯科技國際公司 Wafer-level integrated circuit probe array and construction method
US20160178663A1 (en) * 2014-12-23 2016-06-23 Intel Corporation Formed wire probe interconnect for test die contactor
JP2016212040A (en) * 2015-05-13 2016-12-15 富士通コンポーネント株式会社 contact
US9590333B1 (en) 2016-01-04 2017-03-07 Incavo Otax, Inc. Low profile, integrated circuit test socket
CN107770956A (en) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 Board structure of circuit
KR101828547B1 (en) * 2016-08-25 2018-02-12 한화테크윈 주식회사 Apparatus for testing electronic component
US10698001B2 (en) * 2017-11-28 2020-06-30 Silicon Laboratories Inc. Integrated modular integrated circuit test fixture and handler interface
US11047878B2 (en) 2018-04-30 2021-06-29 GITech Inc. Electrical connector
US11067603B2 (en) 2018-04-30 2021-07-20 GITech Inc. Connector having contact members
US10985480B2 (en) 2018-04-30 2021-04-20 GITech Inc. Transformation connector
JP7281250B2 (en) 2018-05-11 2023-05-25 株式会社アドバンテスト test carrier
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US11821918B1 (en) 2020-04-24 2023-11-21 Microfabrica Inc. Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
US11828775B1 (en) 2020-05-13 2023-11-28 Microfabrica Inc. Vertical probe arrays and improved methods for making using temporary or permanent alignment structures for setting or maintaining probe-to-probe relationships
US11043484B1 (en) * 2019-03-22 2021-06-22 Xilinx, Inc. Method and apparatus of package enabled ESD protection
US11293976B1 (en) * 2020-09-25 2022-04-05 Essai, Inc. Integrated circuit device test tooling with dual angle cavities
EP4151101A1 (en) * 2021-09-15 2023-03-22 Nerudia Limited Aerosol delivery device/system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443756A (en) * 1980-11-25 1984-04-17 Lightbody James D Apparatus and method for testing circuit boards
US4508405A (en) * 1982-04-29 1985-04-02 Augat Inc. Electronic socket having spring probe contacts
US5215472A (en) * 1991-08-22 1993-06-01 Augat Inc. High density grid array socket

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2853656A (en) * 1953-08-07 1958-09-23 Burroughs Corp Printed circuit panel assembly
US4029375A (en) * 1976-06-14 1977-06-14 Electronic Engineering Company Of California Miniature electrical connector
US4089575A (en) * 1976-09-27 1978-05-16 Amp Incorporated Connector for connecting a circuit element to the surface of a substrate
US4199209A (en) * 1978-08-18 1980-04-22 Amp Incorporated Electrical interconnecting device
US4161346A (en) * 1978-08-22 1979-07-17 Amp Incorporated Connecting element for surface to surface connectors
US4351580A (en) * 1980-05-15 1982-09-28 Augat Inc. Carrier socket for leadless integrated circuit devices
US4528500A (en) * 1980-11-25 1985-07-09 Lightbody James D Apparatus and method for testing circuit boards
US4574236A (en) * 1983-10-27 1986-03-04 At&T Technologies, Inc. High frequency test fixture
JPS60129147U (en) * 1984-02-09 1985-08-30 野中　良眞 IC socket with no-load attachment/detachment mechanism
US4837507A (en) * 1984-06-08 1989-06-06 American Telephone And Telegraph Company At&T Technologies, Inc. High frequency in-circuit test fixture
DK291184D0 (en) * 1984-06-13 1984-06-13 Boeegh Petersen Allan METHOD AND DEVICE FOR TESTING CIRCUIT PLATES
US4747784A (en) * 1986-05-16 1988-05-31 Daymarc Corporation Contactor for integrated circuits
US4593961A (en) * 1984-12-20 1986-06-10 Amp Incorporated Electrical compression connector
US4583806A (en) * 1985-01-11 1986-04-22 Bourns, Inc. Low insertion-force socket for IC device
US4700132A (en) * 1985-05-06 1987-10-13 Motorola, Inc. Integrated circuit test site
US4789345A (en) * 1987-05-15 1988-12-06 Wells Electronics, Inc. Socket device for fine pitch lead and leadless integrated circuit package
JP2784570B2 (en) * 1987-06-09 1998-08-06 日本テキサス・インスツルメンツ 株式会社 Socket
US5440240A (en) * 1991-06-04 1995-08-08 Micron Technology, Inc. Z-axis interconnect for discrete die burn-in for nonpackaged die
US4954088A (en) * 1989-02-23 1990-09-04 Matsushita Electric Works, Ltd. Socket for mounting an IC chip package on a printed circuit board
US5127837A (en) * 1989-06-09 1992-07-07 Labinal Components And Systems, Inc. Electrical connectors and IC chip tester embodying same
US5062802A (en) * 1990-11-01 1991-11-05 Amp Incorporated Contact module for a low height multi-chip carrier socket
US5163834A (en) * 1990-12-17 1992-11-17 International Business Machines Corporation High density connector
US5157325A (en) * 1991-02-15 1992-10-20 Compaq Computer Corporation Compact, wireless apparatus for electrically testing printed circuit boards
US5158467A (en) * 1991-11-01 1992-10-27 Amp Incorporated High speed bare chip test socket
US5199889A (en) * 1991-11-12 1993-04-06 Jem Tech Leadless grid array socket
US5247250A (en) * 1992-03-27 1993-09-21 Minnesota Mining And Manufacturing Company Integrated circuit test socket
US5273440A (en) * 1992-05-19 1993-12-28 Elco Corporation Pad array socket
US5395249A (en) * 1993-06-01 1995-03-07 Westinghouse Electric Corporation Solder-free backplane connector
JP3442137B2 (en) * 1993-12-17 2003-09-02 日本発条株式会社 Conductive contact unit
US5376010A (en) * 1994-02-08 1994-12-27 Minnesota Mining And Manufacturing Company Burn-in socket
US5800184A (en) * 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4443756A (en) * 1980-11-25 1984-04-17 Lightbody James D Apparatus and method for testing circuit boards
US4508405A (en) * 1982-04-29 1985-04-02 Augat Inc. Electronic socket having spring probe contacts
US5215472A (en) * 1991-08-22 1993-06-01 Augat Inc. High density grid array socket

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999023730A1 (en) * 1997-11-03 1999-05-14 Advanced Interconnections Corporation Converter socket terminal
US6256202B1 (en) 2000-02-18 2001-07-03 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
FR2958756A1 (en) * 2010-04-09 2011-10-14 Eads Europ Aeronautic Defence System for high frequency testing of integrated circuit to form surface mount electronic component, has extension set assuring variable length electrical connections between balls and system, and deformable to compensate unevenness of balls
JP2021519928A (en) * 2018-04-24 2021-08-12 テラダイン、 インコーポレイテッド Thermal control in test system
JP7320527B2 (en) 2018-04-24 2023-08-03 テラダイン、 インコーポレイテッド test system
US20220155343A1 (en) * 2020-11-17 2022-05-19 Yamaichi Electronics Co., Ltd Socket for inspection
US11821915B2 (en) * 2020-11-17 2023-11-21 Yamaichi Electronics Co., Ltd. Socket for inspection

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