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WO1996036065A1 - Appareil de pulverisation avec un fluide de refroidissement isole et cible de pulverisation associee - Google Patents

Appareil de pulverisation avec un fluide de refroidissement isole et cible de pulverisation associee Download PDF

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Publication number
WO1996036065A1
WO1996036065A1 PCT/US1995/015422 US9515422W WO9636065A1 WO 1996036065 A1 WO1996036065 A1 WO 1996036065A1 US 9515422 W US9515422 W US 9515422W WO 9636065 A1 WO9636065 A1 WO 9636065A1
Authority
WO
WIPO (PCT)
Prior art keywords
target
sputtering
cooling
target unit
assembly
Prior art date
Application number
PCT/US1995/015422
Other languages
English (en)
Inventor
Steven D. Hurwitt
Original Assignee
Materials Research Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/439,490 external-priority patent/US6689254B1/en
Application filed by Materials Research Corporation filed Critical Materials Research Corporation
Priority to AU45036/96A priority Critical patent/AU4503696A/en
Priority to JP8534031A priority patent/JPH11504986A/ja
Priority to EP95943608A priority patent/EP0824760A1/fr
Publication of WO1996036065A1 publication Critical patent/WO1996036065A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3497—Temperature of target

Definitions

  • This invention relates to cathode sputtering and more particularly to the configuring, utilizing and cooling of sputtering targets used in sputter deposition processes and to the cooling of such targets in an assembly in a sputtering cathode of a sputtering machine.
  • substrates are placed adjacent to a sputtering target in a processing chamber and the pressure in the chamber is reduced to a high vacuum pressure level.
  • a negative voltage is applied to the target to produce a plasma discharge, which is often intensified and confined over the target surface by the application of a magnetic field.
  • the plasma production creates large quantities of positive ions in the sparse gas within the chamber that bombard the target and thereby dislodge atoms or small particles of target material from the surface of the target.
  • the ionic bombardment of the target surface transfers energy to the target, only a small percentage of which is imparted to the dislodged atoms or particles. Generally, about ninety percent of the electrical power applied to the plasma is converted to a heating of the target. With commonly used power densities in the area of 30,000 watts per square foot of target surface area, aggressive cooling of the target is required to prevent the melting or cracking of the target and to protect the target supporting cathode assembly and adjacent structures from overheating.
  • the cooling technique typically used in the prior art for removing heat from the target employs a flow of water against the back face of the target or against the backing plate to which the target is bonded in a thermally conductive manner.
  • the target supporting structure of the cathode assembly is water cooled, to indirectly cool the target, which is thermally attached in the cathode assembly, by conduction.
  • a thick target periphery or edge allows some degree of target cooling by heat flow at the periphery of the target.
  • magnet structures are located behind the target rear face to shape and intensify the sputtering plasma.
  • the magnet structure includes rotating magnets and associated structure that occupy much of the area of the rear target face. Examples of rotating magnet cathode assemblies are disclosed in U.S. patents nos. 5, 1 30,005, 5,252, 1 94 and 5,242,566.
  • Such target and cathode assemblies can be eroded in a controlled manner over the entire front face of the target providing improved coating of microscopic three dimensional features on the substrate surface.
  • the provision of such magnet assemblies results in design compromises between the magnet structure and the cooling capabilities, which limit the performance or reliability of the cathode and target as a unit.
  • cooling water has been made to flow in an inlet into a cavity behind the target and across the rear face of the target to an outlet.
  • the cooling of the target may be enhanced by the motion of the cooling water imparted by the rotary motion of a magnet carrier that rotates fully emersed in the cooling fluid in the cavity.
  • the desired shape of target erosion is controlled by complexly shaped magnet structure which is rotated in bearings driven by drive gears, an input shaft, a drive belt and a motor.
  • This immersion of components in cooling water can, over time, result in corrosion and degradation of the performance of the apparatus and a shortened life.
  • replacement of the depleted target can result in exposure of the cooling water cavity, as the target or backing plate is detached from the assembly. Such exposure can result in the introduction of small amounts of water, a primary contaminant of sputtered films, into the sputtering chamber.
  • a sputtering target particularly a target that is relatively thin in relation to the size of its sputtering front face, that is provided with a rear face that is adapted for contact by flowing cooling fluid maintained in a cavity behind the target, when the target is mounted in a sputtering cathode assembly.
  • the preferred embodiment of the target is provided with an annular outwardly projecting target rim, which has a forward facing front edge having a vacuum-sealing surface that is adapted to form a vacuum tight seal with the sputtering chamber, and which has a rearward facing rear edge having a cooling fluid-sealing surface that is adapted to form a seal that surrounds the cooling fluid cavity.
  • the target which is preferably circular, is formed of an integral 'single piece of sputtering grade material, the rear face of which is adapted to be maintained in direct contact with the cooling fluid.
  • the surface that is in direct contact with the fluid is preferably coated or otherwise sealed from contamination by the fluid, where the target is of a material that may absorb or otherwise interact with the fluid in a disadvantageous way.
  • the target rim is preferably formed integrally of the single piece of sputtering grade material with the front and rear edges thereof adapted to support or form the seals.
  • the center of the rear face of the target be provided with structure by which the center of the target can be supported, so that the target is supported at both the center and the rim thereof to prevent distortion or deformation of the target during use.
  • the supporting structure at the center of the target is a center hub extension formed integrally of the single piece of target material.
  • a sputtering cathode assembly in which a sputtering target, either formed of an integral piece of sputtering material, or formed of a sputtering material bonded to a backing plate to provide the rear face thereof, is adapted to lie in contact with cooling fluid in a cavity, which is formed by sealing the target at the rear edge of its rim to a rim of the cathode assembly target mounting structure.
  • the cathode assembly target mounting structure includes a cavity wall segment in the form of a cooling jacket that is removably mountable onto the cathode assembly and to which the target can be sealably secured, with the target back face forming an opposing wall to the cavity.
  • the cooling jacket structurally connects the target to the cathode assembly and is removable as a target assembly with the target when the target is removed from the chamber for replacement.
  • the cooling fluid cavity is removable with the assembled target and cooling jacket, leaving the inlet and outlet port structure of the cathode assembly remaining with the cathode unit when a target is removed or replaced.
  • seals between the cooling fluid ports in the cathode unit and cooling ducts in the removed cooling jacket automatically disconnect from each other and, preferably, seal against leakage of cooling fluid therefrom.
  • the magnet assembly, and particularly the drive linkage by which an assembly of rotating or otherwise moveable magnets may be used in complete isolation from the cooling fluid, which has potentially corrosive effects.
  • distortion and deformation of the target is prevented by a structural support at the center of the target that cooperates with the mounting of the target around the target rim to hold the target firmly in a plane.
  • the center support is preferably threaded into the target material or threaded into a central hub that is rigidly secured to the rear of the target material at the center of the target.
  • the central support which may also serve as a central axis about which a rotating magnet assembly may rotate, is further mounted at the back end thereof to structure that is rigid relative to the frame of the sputtering apparatus and to the chamber opening rim against which the target rim is sealed.
  • This rigid attachment of the central support resists deformation of the target into the cavity due in part to the pressure gradient from the cooling fluid toward the vacuum of the processing chamber and in part to thermal distortion of the target due to expansion of the hot sputtering surface of the target relative to the cooled rear face of the target.
  • the present invention provides the advantages of effectively cooling a sputtering target, particularly where such cooling must be carried out across the rear face of the target.
  • the cooling allows access to the rear face of the target for such magnet assemblies as are desired to shape and intensify the plasma on the front side of the target.
  • the present invention further provides the advantages of allowing effective rear face target cooling with cooling fluid while allowing for the use of magnet assemblies, particularly rotating or other moving magnet assemblies, that may remain isolated from the cooling fluid.
  • a target that can be operated with its rear face in direct contact with cooling fluid, while the surface of the target material that is in contact with the fluid is protected from a disadvantageous interaction with or contamination by the fluid.
  • a separate backing plate may be eliminated in some embodiments of the invention by the provision of a target rim that utilizes only a small amount of sputtering grade material but seals directly against the sputtering chamber wall and the cooling fluid cavity.
  • the invention provides the advantage of allowing removal of a sputtering target for replacement, where the target is cooled by direct contact with the cooling fluid, without allowing leakage of the fluid that can cause contamination of the sputtering chamber.
  • the present invention provides the further advantages of rigidly supporting a relatively thin target against pressure gradient and thermal deformation, which is particularly advantageous with the trend to targets of larger and larger diameter.
  • Fig. 1 is a cross-sectional view of a portion of a sputtering apparatus illustrating particularly a sputtering target and cathode assembly according to a preferred embodiment of the present invention.
  • Fig. 2 is an enlarged cross-sectional view illustrating a sputtering target and cooling fluid cavity of the cathode assembly of Fig. 1 .
  • Fig. 3 is an enlarged partial cross-sectional view of a portion of Fig. 2 illustrating fluid ducts or ports to the fluid cavity and protective insulator shield.
  • Fig. 3A is a view similar to Fig. 3 illustrating a shield in the form of the prior art.
  • Fig. 4 is a view similar to Fig. 3 of an alternative embodiment in which the projecting target unit rim also performs the function of a clamping ring.
  • a portion of a sputtering apparatus 10 is illustrated showing an apparatus frame 1 1 having fixed thereto structure that forms part of the wall 1 2 of a vacuum processing chamber 1 3 of the apparatus 10.
  • a target access door or other removable panel 14 is hinged or by hinge 14a otherwise removably connected to the frame 1 1 at an opening 1 5 to the chamber 1 3.
  • the door 14, when closed, forms a vacuum tight seal to the frame 1 1 through a seal 1 6.
  • Welded to the side of the door 14 opposite the chamber 13 is a door frame member
  • a sputtering cathode assembly 21 Removably mounted to the adapter flange 20 is a sputtering cathode assembly 21 , which includes a cathode unit and target support 22 and a target assembly 23, which contains a replaceable expendable sputtering target 25.
  • the cathode assembly 21 is held to the flange 20 by a set of electrically insulated clamping members 26 spaced around the opening 1 5 and secured to the frame 1 1 .
  • the clamping members 26 urge the assembly 21 against the flange 20.
  • an electrically insulating ring 27 formed of a non-electrically conductive material such as TeflonTM.
  • a pair of O-ring seals 28 and 29 that maintain a vacuum tight seal with the intervening insulator 27 between the flange 20 and the cathode assembly 21 . Removal of the cathode assembly 21 from the adapter flange 20 is carried out by releasing the clamps 26 and separating the cathode assembly 21 from the flange 20 at the insulator 27.
  • the target assembly includes the target 25 which, for materials that are reasonably machinable such as titanium and aluminum alloys, is preferably formed of a single integral piece of sputtering material that has a generally circular periphery 31 , a sputtering surface or target face 32, a coolant fluid impermeable and preferably corrosion resisting rear face 33, an annular lip or rim 34 extending outwardly from the periphery 31 and spaced rearwardly from the target face 32 proximate the rear face 33 of the target 25, and a central rearwardly projecting hub 35, all preferably formed integrally from the same piece of sputtering material.
  • the target 25 which, for materials that are reasonably machinable such as titanium and aluminum alloys, is preferably formed of a single integral piece of sputtering material that has a generally circular periphery 31 , a sputtering surface or target face 32, a coolant fluid impermeable and preferably corrosion resisting rear face 33, an annular lip or rim
  • the rim 34 has a forward facing face or surface 34a, recessed rearwardly from the target face 32, which is polished, coated or otherwise processed in a manner that will effectively support a vacuum seal. Similarly, the rim 34 has a rearwardly facing rear face or surface 34b that is polished, coated or otherwise processed in a manner that will effectively support a fluid tight seal.
  • a target 25 is preferably formed of a disc 25a of sputtering material bonded by soldering or some other conventional technique to a backing plate 25b at a bonding surface 25c, as illustrated as the straight phantom line to the left in Fig. 2. With such a bonded target, the rim 34 is formed on the backing plate portion 25b.
  • the central hub 35 may be formed of a separate piece of material and fastened to the rear face 33 of the target 25, but is preferably integral with the target material or backing plate of the target 25.
  • the central hub 35 of the target 25 should be formed of a material that will support threads 38 in a central bore 39 therein, or that will support a threaded insert.
  • the water impermeable and corrosion resisting rear face 33 is easily provided for targets 25 that incorporate a backing plate 25b by selection of the material and service finish of the rear face of the backing plate.
  • targets 25 that are formed of an integral piece of sputtering material on which the rear face is formed, certain materials such as titanium and some alloys of aluminum have sufficient intrinsic water impermeability and non-corrosive properties to form the cooling surface on the rear face to directly contact cooling fluid.
  • the corrosive effects of water on some target materials can be prevented by chemical treatment of the rear surface of the target, by treatment such as anodizing on aluminum targets, or by the application of coating films or layers of, for example, organic materials on porous targets, such as those of sintered titanium-tungsten.
  • sputtering materials such as silicon
  • a protective backing plate will prevent water contamination of a more serious nature, such as a total flooding of the processing chamber that could be caused if a brittle silicon target, without a backing plate, were to structurally fail.
  • the target assembly 23 further includes a cooling jacket 40, which is preferably a non-expendable reusable part of the target, assembly 23 that is removable from the target 25 for connection to a replacement target.
  • the cooling jacket 40 may be expendable along with the target 25 and replaced as part of the new replacement target.
  • the cooling jacket 40 has formed thereon a central lip 4 1 and a peripheral lip 42 that seat against the back face 33 of the target 25, each lip 41 ,42 having an O-ring seal 44 and 43 respectively seated therein. When so connected, the jacket 40 encloses a space between it and the back face 33 of the target 25 that defines a cooling channel 45.
  • the cooling channel 45 may have the shape of an annular disc as illustrated, or some other configuration such as a pattern of grooves in the jacket 40, or a plurality of vanes spaced by upstanding ribs in the cooling jacket 40.
  • the cooling channel 45 is configured so as to cooperate with the differential pressure of cooling fluid to and from the channel 45 to cause a high velocity of cooling fluid through the channel 45 along the back face 33 of the target 25, thereby enhancing the flow of heat from the target 25 to the fluid.
  • the cooling jacket 40 may also be provided with ducts that include impingement jets directed toward the target back face 33, or such other conductivity enhancing features as are more particularly disclosed in the copending commonly assigned U.S. patent application serial no. 08/398,743, filed February 1 5, 1 995, and expressly incorporated herein by reference.
  • the target assembly 23 also includes, in one embodiment, an annular clamp ring 47 that surrounds the outer periphery 31 of the target 25 and overlies the outer lip or rim 34 of the target 25 opposite the jacket outer lip 42, to which it is held by a plurality of approximately twelve screws 48 spaced around the cooling jacket outer rim 42.
  • the screws 48 are accessible from the back of the jacket 40 and thread into threads in the clamp ring 47.
  • the clamp ring 47 has an O-ring seal 49 seated in an annular groove in the back thereof to seal to the outer rim 34 of the target 25.
  • the clamp ring 47 also carries the seal 29 in an annular groove in the front thereof.
  • the cooling jacket 40 contains a pair of ducts, or arrays of ducts, 50 for communicating cooling fluid between the channel 45 and inlet and outlet ports 51 and 52, respectively, in a cathode body 53 (Fig. 1 ) of the cathode unit and target support 22 of the cathode and target assembly 21 .
  • the ports 51 and 52 are arranged in a cathode body 53 (Fig. 1 ) of the cathode unit and target support 22 of the cathode and target assembly 21 .
  • the cathode body 53 is the main structural frame of the cathode unit 22 against which the clamps 26 bear to urge the cathode assembly 21 against the insulator 27.
  • the target assembly 23 is secured to the cathode body 53 by a set of screws 55, approximately four in number, which also serve in place of some of the screws 48 in clamping the clamp ring 47 to the cooling jacket 40.
  • the screws 55 are accessible when the cathode assembly 21 is undamped from the adapter bracket 20 of the door 14.
  • the ducts 50 automatically disconnect.
  • automated is meant that the disconnection of the ducts 50 does not require additional operator action, such as the separate disconnection of tubing leading to the ports 51 ,52, or other step to disconnect the cooperating parts of structure surrounding the ducts 50.
  • the ducts 50 automatically reconnect.
  • each of the ducts 50 may be provided with a spring biased or other type of valve element 57, 58, in the cooling jacket 40 and cathode body 53 to close off the ducts 50 when the target assembly 23 is removed from the cathode unit 22 by removal of the screws 55, as illustrated in Fig. 3.
  • the cathode body 53 is structurally rigid. Fixed to the back thereof is a spindle housing 60 which is also structurally rigid.
  • the spindle housing 60 has a bore 61 therethrough in which are carried two sets of bearings 62 and 63 on which is rotatably supported a spindle shaft 65.
  • the magnet assembly 70 includes a magnet pack 71 , preferably formed of a specially configured loop of permanent magnets that is designed to produce desired erosion profile 37 on the target 25. Details of the preferred configuration of the magnet assembly 70 are set forth in U.S. patent no. 5, 1 30,005, expressly incorporated herein by reference.
  • the magnet assembly 70 rotates, the magnets 71 are maintained out of contact with the body 53 and the back of the cooling jacket 40. Because the coolant, however, is maintained in channel 45 out of communication with the magnet assembly 70, the corrosive effect of the cooling fluid, which is usually water, on the magnet assembly 70 and the magnet rotating components is avoided, thus easing the corrosion resistance requirements on their design.
  • Additional support at the center hub 35 of the target 25 is provided by a central support rod 75 that has threads 76 at its front end that directly thread into the threads 38 in the central bore 39 in the hub 35 of the target 25.
  • the rod 75 is secured at its back end by a threaded nut 77 which draws snugly against a cap plate 78 that is bolted to the back end of the spindle 60.
  • the shaft 75 so installed provides a tension force that resists the deformation of the target center into the processing chamber 1 3 due to forces caused by the pressure of the cooling fluid in the cavity 45 and by the thermal stresses in the target 25 during sputtering.
  • Precise registration of the position of the center of the target 25 is achieved by provision of a shoulder 81 on the forward end of a cylindrical spacer 82 that abuts with the rearward surface 83 of inner rim 41 of the cooling jacket 40.
  • the shoulder 81 is drawn against the surface 83 of the jacket 40 by the tension on the shaft 75
  • a shield 85 which secured to the adapter 20 by screws 86 spaced around the shield 85.
  • the shield 85 is provided with a rearwardly projecting lip 87, shaped and positioned so as to face the outer periphery 31 of the target 25 in close proximity thereto, spaced only by a gap 88 that is wide enough to avoid arcing between the target 25 and the shield 85.
  • the inner lip 87 of the shield 85 protects the electrical insulator 27 against material sputtered from the target 25 passing through the gap 88 and lighting upon, and thus providing a possibly conductive path across, the insulator 27, which would cause arcing across the path.
  • shields 85a of the prior art as illustrated in Fig. 3A, a small portion of the material sputtered from the target 25 will bounce from sputtered gas molecules, such as indicated at 89, and enter the gap 88a, contributing to the eventual buildup of deposits on the insulator 27.
  • the shield 85 with the lip 87 interrupts the path of such particles 89 and protects the insulator 27 from such buildup.
  • Fig. 4 illustrates an alternative embodiment of the target assembly 23 and cathode assembly 22 in which the clamping ring 47 is formed integrally with the outer rim 34 of the target 25, illustrated as rim 34c in Fig. 4.
  • the threads of the bolts 48 are threaded directly into the back of the target 25, and the seal 29 is set in a groove in the front face 34a of the rim 34.
  • Fig. 3 is unnecessary.
  • the rim 34c is illustrated a peripheral extension of backing plate portion 25b of the target 25. Where no backing plate 25b is employed with the target material portion 25a bonded thereto at the surface 25c, and the target 25 is formed of an integral piece of sputtering material, the rim 34c is formed entirely integrally of such sputtering material. Such arrangement is acceptable where the target 25 is formed of a structurally sound material such as aluminum or certain metallic alloys.
  • the embodiment of Fig. 4 allows the sputtering face 32 of the target 25 to be maintained closer to the magnets 71 , which is particularly helpful where the sputtering material of the target is a magnetically soft or high permeability material.
  • the effective cooling of the target 25 is provided while allowing removal and replacement of the target 25 without the release of cooling fluid into the chamber 1 3 or otherwise onto the machine 10 or the vicinity of the machine 10. Removal of a spent target 25 is achieved by loosening of the clamps 26 and releasing of the entire cathode assembly 21 into a space behind the chamber 1 3. With many types of cathode assembly structures, particularly large ones, the loosened assembly 21 remains supported on hinged brackets or on slides (not shown) mounted on the frame 1 1 of the machine 10. Otherwise, the target 25 may be placed on a support surface. With such removal of the cathode assembly 21 , the electrical connections that consist of wires to the motor 69 and power leads (not shown) to the target assembly 23, need not be disconnected.
  • cooling fluid tubes that connect to the inlet and outlet ports 51 ,52 respectively to a cooling water supply and drain (not shown) may remain connected also. It is desirable, nonetheless, to purge cooling fluid from the ducts 50 and the channel 45 by flowing air through the inlet port 51 to the outlet port 52.
  • the target assembly 23 is disconnected from the cathode unit 22 by removal of the screws 55 that hold the clamp ring 47 and cooling jacket 40 to the cathode body 53, and by loosening the nut 77 that holds the shaft 75 in the spindle 60. Due to the screws 48, which remain in place on the target assembly 25, the target assembly 25 remains intact.
  • the shaft 75 generally remains with the target assembly 23, but it might loosen from the target at the threads 76 at its threaded forward end rather than at the nut 77, in which case it must be later removed from the threads 38 at the bore 39 at the target central hub
  • the target assembly When the target assembly 25 has been removed from the cathode unit 22, the target assembly may be moved to a remote location where the target 25 may be disconnected from the cooling jacket 40 and replaced with another target 25.
  • This replacement process is carried out by removal of the screws 48 from the target assembly 23 to release the clamp ring 47 and to permit removal of the target 25.
  • the screws 48 With a new target 25 in place of the old expended target 25, the screws 48 are replaced and the clamp ring 47 is resecured, and the assembled target assembly 23 is then reconnected to the cathode unit 22 by replacement of the screws 55.
  • valves 58 which will be extended beyond the surfaces of the jacket 40 and body 53 by their springs, will be forced by the engagement with the surfaces of the opposite one of the body 53 and jacket 40, to cause the ducts 50 to reopen to the free passage of cooling fluid therethrough.
  • the shaft 75 is then replaced and the nut 77 tightened, completing the reassembly of the cathode assembly 21 , which can then be resecured to the door 14 by tightening of the clamps 26.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

L'invention concerne un appareil de pulvérisation (10) comprenant un ensemble cathode (21) constitué d'une unité de cathode (22) présentant un ensemble aimant mobile et une source d'eau de refroidissement, ainsi qu'un ensemble cible amovible (23) comprenant une unité de cible remplaçable (25) et une chemise de refroidissement (40) amovible et de préférence réutilisable s'appliquant d'une manière étanche sur la face arrière (33) de l'unité de cible et entourant une cavité de refroidissement (45) intermédiaire. Des conduits (50) sont réalisés pour déconnecter et reconnecter automatiquement la cavité de refroidissement et la source d'eau quand le système de cible est détaché et reconnecté à l'ensemble cathode. L'unité de cible comprend un certain volume de matériau à pulvériser avec une face de pulvérisation frontale (32) et un bord (34) avec un creux entourant la face de pulvérisation. Le bord forme un joint étanche au vide avec la paroi de la chambre de pulvérisation et un joint étanche à l'eau avec la chemise de refroidissement. Ainsi, l'ensemble aimant est protégé de tout contact avec le liquide de refroidissement. Un système de fixation central, de préférence sous la forme d'un moyeu saillant (35), est centré à l'arrière de l'unité de cible et relié à un arbre (65) dans l'ensemble cathode pour tenir le matériau de la cible et lui éviter de subir des distorsions sous l'effet de variations de pression et de température, tendant généralement à pousser le centre de la cible à l'intérieur de la chambre de traitement (13). De préférence, la cible (25) est formée d'une seule pièce d'un matériau de pulvérisation lorsque ce matériau le permet; sinon, le bord et le moyeu peuvent faire partie d'une plaque de support (25b) fixée au matériau de la cible pour former l'unité de cible. Dans les deux cas, l'arrière de l'unité de cible est intrinsèquement imperméable ou il est traité pour être imperméable à une contamination par l'eau de refroidissement.
PCT/US1995/015422 1995-05-11 1995-11-27 Appareil de pulverisation avec un fluide de refroidissement isole et cible de pulverisation associee WO1996036065A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU45036/96A AU4503696A (en) 1995-05-11 1995-11-27 Sputtering apparatus with isolated coolant and sputtering ta rget therefor
JP8534031A JPH11504986A (ja) 1995-05-11 1995-11-27 冷却液を隔離したスパッタリング装置及びそのスパッタリングターゲット
EP95943608A EP0824760A1 (fr) 1995-05-11 1995-11-27 Appareil de pulverisation avec un fluide de refroidissement isole et cible de pulverisation associee

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/439,490 1995-05-11
US08/439,490 US6689254B1 (en) 1990-10-31 1995-05-11 Sputtering apparatus with isolated coolant and sputtering target therefor

Publications (1)

Publication Number Publication Date
WO1996036065A1 true WO1996036065A1 (fr) 1996-11-14

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PCT/US1995/015422 WO1996036065A1 (fr) 1995-05-11 1995-11-27 Appareil de pulverisation avec un fluide de refroidissement isole et cible de pulverisation associee

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Country Link
EP (1) EP0824760A1 (fr)
JP (1) JPH11504986A (fr)
AU (1) AU4503696A (fr)
CA (1) CA2218736A1 (fr)
WO (1) WO1996036065A1 (fr)

Cited By (4)

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Publication number Priority date Publication date Assignee Title
WO2004084588A1 (fr) * 2003-03-21 2004-09-30 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co. Kg Magnetron muni d'une protection vis-a-vis d'agents de refroidissement
WO2003097894A3 (fr) * 2002-05-14 2005-01-13 Tokyo Electron Ltd Ensemble adaptateur pour cathode de pulverisation et procede correspondant
WO2005007924A1 (fr) * 2003-07-07 2005-01-27 Honeywell International Inc. Systemes de cibles de pulverisation
WO2005074640A3 (fr) * 2004-02-03 2006-03-09 Honeywell Int Inc Structures de cibles de depot physique en phase vapeur

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007051337A (ja) * 2005-08-18 2007-03-01 Ulvac Japan Ltd スパッタ電極及びスパッタ電極を備えたスパッタリング装置
JP5364455B2 (ja) * 2009-06-08 2013-12-11 昭和電工株式会社 マグネトロンスパッタ装置及びインライン式成膜装置
US9580795B2 (en) * 2013-03-05 2017-02-28 Applied Materials, Inc. Sputter source for use in a semiconductor process chamber
JP6100189B2 (ja) * 2014-03-12 2017-03-22 住友重機械工業株式会社 成膜装置
US10435783B2 (en) 2014-12-03 2019-10-08 Ulvac, Inc. Target assembly
JP7005896B2 (ja) * 2016-12-28 2022-01-24 Ｊｘ金属株式会社 ガスフロースパッタリング装置及びスパッタリングターゲット原料の製造方法
KR102674265B1 (ko) * 2017-06-01 2024-06-11 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘 취성 재료의 안전하고 경제적인 증발을 위한 타깃 조립체

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GB2173217A (en) * 1985-04-03 1986-10-08 Balzers Hochvakuum Target holder for cathodic sputtering
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GB2278368A (en) * 1993-05-04 1994-11-30 Balzers Hochvakuum Magnetic field enhanced sputtering arrangement

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US3945911A (en) * 1974-08-28 1976-03-23 Shatterproof Glass Corporation Cathodes for sputter-coating glass sheets or other substrates
GB2173217A (en) * 1985-04-03 1986-10-08 Balzers Hochvakuum Target holder for cathodic sputtering
WO1992007970A1 (fr) * 1990-10-31 1992-05-14 Materials Research Corporation Procede de revetement par pulverisation par magnetron et appareil avec cathode a aimant rotatif
GB2278368A (en) * 1993-05-04 1994-11-30 Balzers Hochvakuum Magnetic field enhanced sputtering arrangement

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WO2003097894A3 (fr) * 2002-05-14 2005-01-13 Tokyo Electron Ltd Ensemble adaptateur pour cathode de pulverisation et procede correspondant
US6998033B2 (en) 2002-05-14 2006-02-14 Tokyo Electron Limited Sputtering cathode adapter assembly and method
KR101009813B1 (ko) * 2002-05-14 2011-01-19 도쿄엘렉트론가부시키가이샤 스퍼터링 캐소드 어댑터 조립체 및 방법
WO2004084588A1 (fr) * 2003-03-21 2004-09-30 Interpane Entwicklungs- Und Beratungsgesellschaft Mbh & Co. Kg Magnetron muni d'une protection vis-a-vis d'agents de refroidissement
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WO2005074640A3 (fr) * 2004-02-03 2006-03-09 Honeywell Int Inc Structures de cibles de depot physique en phase vapeur
EP1711646A4 (fr) * 2004-02-03 2008-05-28 Honeywell Int Inc Structures de cibles de depot physique en phase vapeur
US7618520B2 (en) 2004-02-03 2009-11-17 Honeywell International Inc. Physical vapor deposition target constructions
JP2012255218A (ja) * 2004-02-03 2012-12-27 Honeywell Internatl Inc 物理蒸着用ターゲット構造物
TWI381061B (zh) * 2004-02-03 2013-01-01 Honeywell Int Inc 物理氣相沉積靶材結構

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EP0824760A1 (fr) 1998-02-25
JPH11504986A (ja) 1999-05-11
CA2218736A1 (fr) 1996-11-14
AU4503696A (en) 1996-11-29

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