WO1996004591A1 - Molded parts used for photographic sensitive materials and resin compositions used to make thereof - Google Patents
Molded parts used for photographic sensitive materials and resin compositions used to make thereof Download PDFInfo
- Publication number
- WO1996004591A1 WO1996004591A1 PCT/US1995/009798 US9509798W WO9604591A1 WO 1996004591 A1 WO1996004591 A1 WO 1996004591A1 US 9509798 W US9509798 W US 9509798W WO 9604591 A1 WO9604591 A1 WO 9604591A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- sensitive materials
- photographic sensitive
- weight
- additive
- resin compositions
- Prior art date
Links
- 239000000463 material Substances 0.000 title claims abstract description 56
- 239000011342 resin composition Substances 0.000 title claims abstract description 30
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims abstract description 111
- 229920006324 polyoxymethylene Polymers 0.000 claims abstract description 42
- 229930182556 Polyacetal Natural products 0.000 claims abstract description 39
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 43
- 239000011347 resin Substances 0.000 description 43
- 239000000654 additive Substances 0.000 description 23
- 230000000996 additive effect Effects 0.000 description 20
- -1 silver halide Chemical class 0.000 description 19
- 239000006229 carbon black Substances 0.000 description 16
- 239000000126 substance Substances 0.000 description 14
- 239000000314 lubricant Substances 0.000 description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 12
- 239000000194 fatty acid Substances 0.000 description 11
- 235000014113 dietary fatty acids Nutrition 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 229930195729 fatty acid Natural products 0.000 description 9
- 238000000465 moulding Methods 0.000 description 9
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 8
- 150000004665 fatty acids Chemical class 0.000 description 7
- 239000000835 fiber Substances 0.000 description 7
- 125000001841 imino group Chemical group [H]N=* 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 5
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 5
- 229920004943 Delrin® Polymers 0.000 description 5
- 238000005452 bending Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- 239000004594 Masterbatch (MB) Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011354 acetal resin Substances 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000012760 heat stabilizer Substances 0.000 description 3
- 229940091173 hydantoin Drugs 0.000 description 3
- 150000001469 hydantoins Chemical class 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920001897 terpolymer Polymers 0.000 description 3
- HNURKXXMYARGAY-UHFFFAOYSA-N 2,6-Di-tert-butyl-4-hydroxymethylphenol Chemical compound CC(C)(C)C1=CC(CO)=CC(C(C)(C)C)=C1O HNURKXXMYARGAY-UHFFFAOYSA-N 0.000 description 2
- PFANXOISJYKQRP-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(CCC)C1=CC(C(C)(C)C)=C(O)C=C1C PFANXOISJYKQRP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 229920002302 Nylon 6,6 Polymers 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 2
- 235000011613 Pinus brutia Nutrition 0.000 description 2
- 241000018646 Pinus brutia Species 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229920006322 acrylamide copolymer Polymers 0.000 description 2
- POJWUDADGALRAB-UHFFFAOYSA-N allantoin Chemical compound NC(=O)NC1NC(=O)NC1=O POJWUDADGALRAB-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 235000008504 concentrate Nutrition 0.000 description 2
- 150000001923 cyclic compounds Chemical class 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 2
- FTQWRYSLUYAIRQ-UHFFFAOYSA-N n-[(octadecanoylamino)methyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCNC(=O)CCCCCCCCCCCCCCCCC FTQWRYSLUYAIRQ-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000008262 pumice Substances 0.000 description 2
- 239000000779 smoke Substances 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052712 strontium Inorganic materials 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- UYVWNPAMKCDKRB-UHFFFAOYSA-N 1,2,4,5-tetraoxane Chemical compound C1OOCOO1 UYVWNPAMKCDKRB-UHFFFAOYSA-N 0.000 description 1
- FQERLIOIVXPZKH-UHFFFAOYSA-N 1,2,4-trioxane Chemical compound C1COOCO1 FQERLIOIVXPZKH-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- YFHKLSPMRRWLKI-UHFFFAOYSA-N 2-tert-butyl-4-(3-tert-butyl-4-hydroxy-5-methylphenyl)sulfanyl-6-methylphenol Chemical compound CC(C)(C)C1=C(O)C(C)=CC(SC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 YFHKLSPMRRWLKI-UHFFFAOYSA-N 0.000 description 1
- MQWCQFCZUNBTCM-UHFFFAOYSA-N 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylphenyl)sulfanyl-4-methylphenol Chemical compound CC(C)(C)C1=CC(C)=CC(SC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O MQWCQFCZUNBTCM-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- HNNQYHFROJDYHQ-UHFFFAOYSA-N 3-(4-ethylcyclohexyl)propanoic acid 3-(3-ethylcyclopentyl)propanoic acid Chemical compound CCC1CCC(CCC(O)=O)C1.CCC1CCC(CCC(O)=O)CC1 HNNQYHFROJDYHQ-UHFFFAOYSA-N 0.000 description 1
- UDBVWWVWSXSLAX-UHFFFAOYSA-N 4-[2,3-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butyl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)C(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)CC1=CC(C(C)(C)C)=C(O)C=C1C UDBVWWVWSXSLAX-UHFFFAOYSA-N 0.000 description 1
- WTWGHNZAQVTLSQ-UHFFFAOYSA-N 4-butyl-2,6-ditert-butylphenol Chemical compound CCCCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 WTWGHNZAQVTLSQ-UHFFFAOYSA-N 0.000 description 1
- ALEBYBVYXQTORU-UHFFFAOYSA-N 6-hydrazinyl-6-oxohexanoic acid Chemical compound NNC(=O)CCCCC(O)=O ALEBYBVYXQTORU-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- POJWUDADGALRAB-PVQJCKRUSA-N Allantoin Natural products NC(=O)N[C@@H]1NC(=O)NC1=O POJWUDADGALRAB-PVQJCKRUSA-N 0.000 description 1
- 244000144725 Amygdalus communis Species 0.000 description 1
- 235000011437 Amygdalus communis Nutrition 0.000 description 1
- 244000105624 Arachis hypogaea Species 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 240000000491 Corchorus aestuans Species 0.000 description 1
- 235000011777 Corchorus aestuans Nutrition 0.000 description 1
- 235000010862 Corchorus capsularis Nutrition 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 240000004244 Cucurbita moschata Species 0.000 description 1
- 235000009854 Cucurbita moschata Nutrition 0.000 description 1
- 235000009852 Cucurbita pepo Nutrition 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 239000011837 N,N-methylenebisacrylamide Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000572 Nylon 6/12 Polymers 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- CXOFVDLJLONNDW-UHFFFAOYSA-N Phenytoin Chemical compound N1C(=O)NC(=O)C1(C=1C=CC=CC=1)C1=CC=CC=C1 CXOFVDLJLONNDW-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229960000458 allantoin Drugs 0.000 description 1
- 235000020224 almond Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- QBLDFAIABQKINO-UHFFFAOYSA-N barium borate Chemical compound [Ba+2].[O-]B=O.[O-]B=O QBLDFAIABQKINO-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- VBICKXHEKHSIBG-UHFFFAOYSA-N beta-monoglyceryl stearate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(O)CO VBICKXHEKHSIBG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000006267 biphenyl group Chemical group 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 150000005323 carbonate salts Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000006231 channel black Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000004292 cyclic ethers Chemical class 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000010903 husk Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- CBOIHMRHGLHBPB-UHFFFAOYSA-N hydroxymethyl Chemical compound O[CH2] CBOIHMRHGLHBPB-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 235000013980 iron oxide Nutrition 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000006233 lamp black Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 235000012054 meals Nutrition 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000004200 microcrystalline wax Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052901 montmorillonite Inorganic materials 0.000 description 1
- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 238000007344 nucleophilic reaction Methods 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- SSDSCDGVMJFTEQ-UHFFFAOYSA-N octadecyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 SSDSCDGVMJFTEQ-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- AJCDFVKYMIUXCR-UHFFFAOYSA-N oxobarium;oxo(oxoferriooxy)iron Chemical compound [Ba]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O.O=[Fe]O[Fe]=O AJCDFVKYMIUXCR-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 235000020232 peanut Nutrition 0.000 description 1
- 239000011049 pearl Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 229920001522 polyglycol ester Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- WBHHMMIMDMUBKC-QJWNTBNXSA-N ricinoleic acid Chemical compound CCCCCC[C@@H](O)C\C=C/CCCCCCCC(O)=O WBHHMMIMDMUBKC-QJWNTBNXSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 235000020354 squash Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- VLCLHFYFMCKBRP-UHFFFAOYSA-N tricalcium;diborate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]B([O-])[O-].[O-]B([O-])[O-] VLCLHFYFMCKBRP-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 239000011782 vitamin Substances 0.000 description 1
- 229940088594 vitamin Drugs 0.000 description 1
- 229930003231 vitamin Natural products 0.000 description 1
- 235000013343 vitamin Nutrition 0.000 description 1
- 150000003722 vitamin derivatives Chemical class 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C3/00—Packages of films for inserting into cameras, e.g. roll-films, film-packs; Wrapping materials for light-sensitive plates, films or papers, e.g. materials characterised by the use of special dyes, printing inks, adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
Definitions
- This invention pertains to molded parts used for photographic sensitive materials and resin compositions used to make such parts as magazines which house photographic sensitive materials like photo-film and printing paper or springs and rollers that are used around the photographic sensitive materials.
- Polyacetal resin which is a thermoplastic resin is used as a molding composition for machine bearings, gear wheels, rollers, cams, clips and plate springs because of its excellent mechanical properties, heat resistance, friction resistant and anti-abrasion properties and fatigue resistance property.
- a small amount of the monomer formaldehyde is dissolved in molded parts made of the polyacetal resin and its slow release into the air causes deterioration of work environment and compromized work efficiency and, in some cases, may lead to harmful result to the end use objective.
- the polyacetal resin causes some concern to be used as food and medical packaging material.
- formaldehyde has detrimental effect on photographic sensitive materials such as photographic film and printing paper. While a silver halide emulsion is used in these photographic sensitive materials, formaldehyde has the ability to reduce silver halides, resulting in chemical fogging. Therefore, polyacetal resins, in general, cannot be used as a resin composition of magazines that receive photographic sensitive materials and various molded parts that are used around them. Consequently, metals are often used to make parts that require sufficient elasticity such as a film pressing board.
- Japanese Kokai 1992- 34548 describes hydrazide compounds to be used as an additive
- Japanese Kokai 1994-107900 describes the use of fatty acid ester of polyvalent alcohol compound as an additive.
- compositions used to make parts for photographic sensitive materials which are polyacetal resin compositions and are characterized by the concentration of formaldehyde generated from a formed object of the said composition in a closed environment being less than 20 ppm and by not compromizing with their photographic properties.
- This invention is to solve the problems described above and aims at making polyacetal resins that possess excellent characteristics in mechanical properties, heat resistance and fatigue resistance suitable to be a resin composition material to make molded parts used for photographic sensitive materials.
- Figure 1 is a schematic perspective view of an instant film pack used in the invention.
- Figure 2 is a graph showing a correlation of formaldehyde concentration and fogging concentration. Abscissa, left and right ordinates are for the amounts of Additive-2 (weight %), the formaldehyde concentration (ppm) and the fogging concentration (Dmin), respectively. The top solid plot is for the fogging concentration at blue and the lower broke line plot is for the residual formaldehyde concentration.
- Figure 3 is a graph showing a correlation between the amount of added 5,5-dimethylhydantoin and the bending elasticity.
- the abscissa is the amount of Additive 2 (weight %) and the ordinate is the bending elasticity (x 10 kg/cm).
- this invention is to use polyacetal resin, as a resin composition to make molded parts for photographic sensitive materials, which is prepared in such a way that the concentration of formaldehyde formed from the molded parts remain below 20 ppm in a sealed vessel, without negatively affecting the photographic quality.
- Concentration of formaldehyde gas generated from molded parts made of this type of polyacetal resins is extremely small and no chemical fogging due to reduction of silver halide emulsions can be seen.
- it since it is designed not to produce harmful chemicals that may negatively affect the photography, it is ideally suited to be used as a resin composition used to make molded parts for photographic sensitive materials.
- a hindered phenol type antioxidant may be used in the range of 0.001 ⁇ 1.0 weight % to effectively suppress the generation of formaldehyde gas. Whereas below 0.001 weight % little effect is observed, above 1.0 weight % not only photography is negatively affected but physical properties also deteriorate. Also, the addition of a light-shielding material in the range of 0.5 ⁇ 25 weight % improves the shading ability necessary for the molded parts to be used around photographic sensitive materials, without compromising the chemical and physical properties of the polyacetal resin. Below 0.05 weight %, light-shielding power cannot be secured and the objective to add the additive cannot be met, but also it means an operating loss. Above 25 weight %, the physical strength deteriorates and the appearance also suffers.
- the pack main-body consists of a box-shape casement 3 forming an exposure opening 2 and a bottom lid 5 to which a plate spring 4 is attached.
- a light-shielding sheet 6 and about 10 sheets of mono-sheet type instant film units 7.
- the polyacetal resin of this invention can be used as the composition material for the casement 3, the plate spring 4, the bottom lid 5 and the light-shielding sheet 6, some appropriate parts of these may be made of a polystyrene resin and other resins.
- the casement 3 has an exit slot 8 and a notch 9 through which a raking claw inserts.
- a plate spring 4 pushes up the instant film units 7 and shade sheet 6 stored in the pack main body so that the shade sheet 6 covers the exposure opening 2 from the inside of the casement 3.
- the instant film units 7 in the pack main body can be kept from the light.
- the exit slot 8 is covered by flexible shade film.
- the instant film unit 7 is fitted with a developer pod 7 in which a developing solution is enclosed.
- a film pack is loaded into a camera and photographing is ready once the shade sheet 6 is ejected.
- a raking claw mounted in the camera insert itself through the notch 9 to scrape out the instant film unit 7, that has been just exposed through the exposure opening 2, through the exit slot 8.
- developer rollers located inside the camera rotate as they squeeze the exposed instant film unit 7 coming out of the exit slot 8 and squash the developer pod 7a as the film unit is ejected.
- the plate spring 4 is to press the top unit of the instant film units 7 stored in the pack main body against the internal side of the exposure opening 2 and to position the instant film unit 7 to be used for the next photographing in the exposure position. Therefore, especially if the plate spring is to be made of a resin, the resin must have sufficient elasticity as well as such characteristics that the elasticity is not lost after prolonged storage.
- Resin compositions of this invention even if used as a molding composition to make the plate springs described above, have enough elasticity as well as a characteristic that gives rise to little creep deformation.
- the polyacetal resins herein used are tcommonly used polyacetal resins which are polymers or copolymers of aldehydes, for example, formaldehyde and formaldehyde cyclic oligomers such as trioxane, tetraoxane etc., or polymers prepared by copolymerization of these aldehydes with cyclic ethers or cyclic acetals, for example, ethylene oxide, propylene oxide, 1,3-dioxolane etc.
- the polyacetal resin has the main chain consisting of -(CH2 ⁇ ) n - unit (n is a natural number) and/or -(CHR-0) n - unit ( R is alkyl: n is a natural number) and is a linear polymer with end groups either unprotected or protected by groups such as -OCOCH3, -OCH3, -OCH2-OH and with the number averaged molecular weight of 10,000 - 100,000, preferably 18,000 ⁇ 70,000.
- polyacetal resin In order to lower the concentration of formaldehyde gas liberated from polyacetal resins, it is preferred to add to 100 weight parts of polyacetal resin 0.05 - 3.0 weight parts, preferably 0.06 -2.0 weight %, more preferably 0.067 ⁇ 1.0 weight % of organic cyclic compound with active imino group shown in a general formula (I).
- Rl, R2, R3 in the general formula (I) represent divalent organic radicals forming through their covalent bondings a cyclic organic compound.
- the active imino compound has its imino group highly reactive so that, during and even after the polyacetal resin has crystallized and solidified, it can still react with formaldehyde to form the methylol group as shown in the reaction formula (II).
- organic radicals directly linked to the imino group by a chemical bond must be of electron withdrawing.
- Such organic radicals should preferably possess, at the position linked to the imino group, -CO-, -COO-, -NH-, -NH2, phenyl group, biphenyl group, naphthalene group etc.
- hydantoins and imidazole derivatives may be good examples of compounds represented by the formula (I).
- hydantoin type compounds are preferred.
- Hydantoin compounds may include but not necessarily be limited to hydantoin, 5,5-dimethylhydantoin, 5,5-diphenylhydantoin and allantoin.
- a lubricant e.g., a lubricant, a light-shielding material, an antioxidant, a heat stabilizer, appropriate plasticizers and fillers, if necessary, within the range not to negate the effects of this invention.
- Armoslip CP Lion-Akzo
- Neutron Nahon Seika
- Neutron E-l 8 Nahon Seika
- Amide O Nahon Chem.
- AlfroF 10 (Nihon Yushi)
- Metal Soap Compounds of higher fatty acids such as lauric acid, stearic acid, ricinolic acid, naphthenic acid, oleic acid, etc. with metals such as Li, Mg, Ca, Sr, Ba, Zn, Cd, Al, Sn, Pb, or another metal.
- shading compounds to be added to secure the light-shielding property the followings may be cited.
- Oxides silica, diatomaceous earth, alumina, Titanium oxide, iron oxides, zinc oxide, magnesium oxide, antimony oxide, barium ferrite, strontium ferrite, beryllium oxide, pumice, pumice balloon, alumina fiber
- Carbonate Salts calcium carbonate, magnesium carbonate, dolomite
- Silicate Salts talc, clay, mica, asbestos, glass fiber, glass balloon, glass beads, calcium silicate, montmorillonite, bentonite, etc.
- Carbon carbon black, graphite, carbon fiber, carbon hollow balls, etc.
- Wood meal pine, oak, saw-dust, etc.
- husk fiber almond, peanuts, chaff, etc.
- colored various fiber such as cotton, jute, paper piece, cellophane piece, nylon fiber, propylene fiber, starch, aromatic polyamide fiber, etc.
- carbon black is preferred because the bleed-out amount can be reduced.
- the following classes of carbon black are especially preferred, gas black, furnace black, channel black, anthracene black, acetylene black, Ketchen carbon black, lamp black, lamp smoke, pine smoke, animal black, vegetable black, etc.
- furnace carbon black is preferred for reasons of shading power, the cost and improvement of physical properties, whereas as for shading material with the ability to prevent electric charge build-up acetylene carbon black and modified synthetic carbon black such as Ketchen carbon black are preferred. Depending upon the requirement, it may be desirable to mix the former with the latter to obtain desired characteristics.
- Japanese Kokai 1964-26196 describes a method to prepare a master batch of polymer-carbon black by dispersing carbon black into a solution of polymer dissolved in organic solvent
- Japanese Kokai 1968-10362 describes a method to prepare a master batch by dispersing carbon black into polyethylene.
- carbon black of pH 6.0 ⁇ 9.0 with average powder diameter of 10 - 120 mm is preferred because little fogging shows up on photographic sensitive materials, because photosensitivity does not change much and because lumps of carbon black as well as pinholes due to fish-eyes hardly appear even when it is added to the resin composition of this invention.
- furnace carbon black having especially volatile components less than 2.0 % and oil absorption greater than 50 ml/ 100 g is preferred.
- Channel carbon black in addition to being expensive, often produces fogs on photographic sensitive materials and, therefore, is not preferred. Even if it must be used for some reason, effects onto the photography should be investigated before it is selected.
- the following carbon black on the market may be preferred; Mitsubishi Kasei Carbon Black #20 (B), #30 (B), #33 (B), #40 (B), #44 (B), #45 (B), #50, #55, #100, #600, #2200 (B), #2400 (B), MA 8, MA 11, MA 100.
- the amount of shading material to be added should be in the range of 0.05 - 25 weight %, preferably 0.1 - 15 weight %, more preferably 0.5 - 10 weight %, and most preferably 1.0 - 7.0 weigh %.
- antioxidant it is desirable to add antioxidant to prevent thermal deterioration of the resin and to suppress the formation of fish-eyes and lumps (non-homogeneous lump breakdown).
- Hindered phenol type antioxidants are most preferred in this invention and are listed below.
- 0.001 - 1.0 weight % is the range, preferably 0.005 - 0.8 weight %, more preferably 0.01 - 0.5 weight %, and most preferably 0.02 - 0.4 weight %.
- the heat stabilizer to be added to the resin composition of this invention there are polyamide compounds, especially nylon terpolymers, hydroxy containing polymers such as those described in U. S. Patent 4776168 and 4814397, and nonmelting nitrogen or hydroxy containing compounds described in Europe Patent Publication 0388809. More concretely, these are polyamide 6, polyamide 6/12 copolymer, polyamide 6/66/610 terpolymer, polyamide 6/66/612 terpolymer, ethylene-vinyl alcohol copolymer, acrylamide (co)polymer, acrylamide/N,N-methylenebis-acrylamide copolymer.
- the total amount of heat stabilizers to be added to the polyacetal resin composition is 0.5 - 5.0 weight parts to 100 weight parts of acetal resin, preferably 0.05 - 1.50 weight parts.
- Molded parts of these polyacetal resin compositions may be formed by any molding method including compressed molding, ejection molding, extrusion molding, blow molding, rotary molding, melt spinning, and heat molding.
- Especially preferred for obtaining parts pertaining to this invention is ejection molding.
- Polyacetal resins used in the following Practical Examples are DuPont's high flow grade polyacetal-homopolymers, Delrin® 900 PNC 10 (Trade Name: Melt Index 1 1.5 g/min) and Delrin® 1700 PNC 10 (Trade Name: Melt Index 18.0 g/min).
- the followings are prepared for additives to be added to prevent oxidation during resin heating and for the purpose of reducing evolution of formaldehyde gas.
- Additive 2 5,5-dimethylhydantoin (Mitsui Toatsu)
- Additive 3 Adipic acid hydrazide (Nihon Hydrazine Ind.)
- Additive 4 Stearic acid monoglyceride (Riken Vitamin)
- Delrin® 900 PNC 10 (5000 g) and Delrin 900 PNC 10 (5000 g) mixed with 25 g of one of the above listed Additives 1 - 4 are fed to a 35 mm biaxial screw ejection molder to melt mix and cut to obtain 5 different kinds of resins in the form of pellets.
- the resin temperature was 195 - 198 °C and the feed rate was about 30 kg/hr.
- Each resin pellet is molded using a 75 Ton Sumitomo Nestal Ejection Molder to obtain 5 kinds of cylindrical test pieces A-l - A-5. During the molding the resin temperature and mold temperature was 250 °C and 75 °C , respectively.
- test pieces A-l - A-5 thus prepared are placed and sealed, 5 pieces together (the total weight about 5 g), in a 1 L polyethylene container and allowed to stand at room temperature for 24 hours. Concentration of formaldehyde in the container was measured using Formalde Meter - Markll (Lion Co. England) to the ppm level. Results are shown in Table 1.
- Additive-2 concentrate in the form of pellets (a master batch). During this process, the resin temperature was 200 °C and the feed rate was 25 kg/hr.
- the Additive-2 concentrate thus obtained is called Additive-A.
- test pieces B-l - B-7 were prepared using mixtures prepared from High Flow Delrin® D1700 PNC 10 pellets and Additive-A in different ratios.
- Test Piece B-l is a sample which does not contain Additive-A.
- formaldehyde concentrations were measured under the conditions identical with those used in Practical Example A. Results are shown in Table 2.
- Additive-2 must be added more than 0.05 weight % in order to reduce the formaldehyde concentration in molded parts below such a level that no fogging shows up on photographic sensitive materials.
- concentration of hydrazine in Additive-2 becomes too high, it functions as a reducing agent to photographic sensitive materials and becomes, also, harmful to human body.
- the amount of Additive-2 to be added should be maintained in the range of 0.05 - 3.0 weight %, preferably 0.06 - 2.0 weight % and most preferably 0.067 - 1.0 weight %.
- concentration of Additive-2 exceeds 0.5 weight %, it may be problematic to use molded parts made of this resin as the material for springs.
- plate spring 4 shown in Figure 1 was ejection molded using the composition identical with that used in Test Piece B-l - B-6 in Practical Example B.
- Various plate springs thus obtained were stored and sealed together with photographic sensitive materials in a dump-proof bag (humidity permeability: 0.5 g/m 2 /24 hr) at 50 ⁇ >C for 3 days in a dry atmosphere.
- FUJICOLOR NC-160 was used as photographic sensitive material.
- the fogging concentration Dmin represents the concentration difference relative to the concentration on a standard photographic sensitive material when the photographic sensitive material alone is allowed to stand for 3 days under the conditions identical with those described above.
- Table 3 summarizes the observed values and Figure 2 shows the correlation with formaldehyde concentration measured in Practical Example B.
- Graph in Figure 2 shows that the concentration of chemical fogging caused by formaldehyde converges to the standard fogging concentration Dmin 0.8 +/- 0.2 in blank tests as long as the amount of Additive-2, which has the ability to trap formaldehyde, exceeds 0.067 weight %. Since, with this quantity range of the additive, the formaldehyde concentration can be maintained below 5 ppm and the fogging concentration can also be suppressed below 1.0, there should be no problem to use this material in the vicinity of photographic sensitive materials.
- Figure 3 shows the correlation between the amount of added Additive-2 and the bending elasticity of molded parts. As the graph shows, the bending elasticity significantly diminishes if Additive-2 is added more than 0.5 weight %. If the plate spring 4 shown in Figure 1 is to be made of the polyacetal resin in this invention, it is desirable to use Additive-2 in the range lower than 0.5 weight %.
- Additive-2 is added to the polyacetal resin to the extent of 0.05 - 3.0 weight %, preferably 0.06 - 2.0 weight %, the residual formaldehyde concentration can be greatly reduced, and even if it is used together with photographic sensitive materials, there is no danger that fogging on the photographic sensitive material becomes problematic. If Additive-2 is added in the range of 0.067 - 1.0 weight %, the bending elasticity of molded parts hardly diminishes and no problem should be encountered even if it is used to make springs.
- the polyacetal resin of this invention with the characteristics described above can be used not only for magazines which store photographic sensitive materials like the film packs mentioned earlier, but also as various types of parts such as those used in production lines of photosensitive materials as well as sheet material, conveyer rollers and gears which may be used in cameras or near films and printing paper.
- Resin compositions used for making molded parts for photographic sensitive materials described in Claim 1 comprising polyacetal resins and polyacetal resin compositions containing at least an organic cyclic compound bearing an active imino group.
- Resin compositions used for making molded parts for photographic sensitive materials described in Claim 1 comprising polyacetal resins and polyacetal resin compositions containing at least a hydantoin compound.
- the polyacetal resin of this invention is prepared not to spoil photographic quality by maintaining concentration of formaldehyde generated in a closed vessel below 20 ppm, no chemical fogging takes place even if molded parts are used in the vicinity of photographic sensitive materials.
- hindered phenol type compounds can be used as antioxidants to be added to the polyacetal resin and, by adjusting the amount to the 0.001 - 1.0 weight % range, fogging on photographic sensitive materials can be prevented.
- suitable shading material may be added in the 0.5 - 25 weight % range, therby chemical fogging can be avoided with certainty.
- molded parts made of the resins prepared above cause neither chemical nor optical fogging on photographic sensitive materials, they can be used in various shapes such as magazines, sheets and rollers. Since sufficiently elastic parts, also, can be easily made, they may be used as materials to prepare springs.
- the object of the invention is to provide a resin composition that reduces the concentration of formaldehyde generated from polyacetal resins and which does not bring about chemical fogging when it is used as parts for photographic sensitive materials.
- composition 5,5-Dimethylhydantoin is added to polyacetal resin to trap formaldehyde generated from the polyacetal resin, thereby reducing the generation concentration of formaldehyde.
- the amount of 5,5-dimethylhydantoin to be added is 0.05 - 3.0 weight %, preferably 0.06 - 2.0 weight %, and most preferably
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Abstract
Resin compositions used to make parts for photographic sensitive materials, which are polyacetal resin compositions and are characterized by the concentration of formaldehyde generated from a formed object of the said composition in a closed environment being less than 20 ppm and by not compromizing with their photographic properties.
Description
TITLE
Molded Parts Used for Photographic Sensitive Materials and Resin Compositions Used to Make Thereof
BACKGROUND OF THE INVENTION
Industrial Use Field
This invention pertains to molded parts used for photographic sensitive materials and resin compositions used to make such parts as magazines which house photographic sensitive materials like photo-film and printing paper or springs and rollers that are used around the photographic sensitive materials.
Existing Technology Polyacetal resin which is a thermoplastic resin is used as a molding composition for machine bearings, gear wheels, rollers, cams, clips and plate springs because of its excellent mechanical properties, heat resistance, friction resistant and anti-abrasion properties and fatigue resistance property. However, a small amount of the monomer formaldehyde is dissolved in molded parts made of the polyacetal resin and its slow release into the air causes deterioration of work environment and compromized work efficiency and, in some cases, may lead to harmful result to the end use objective. For example, because chemically active formaldehyde is present, the polyacetal resin causes some concern to be used as food and medical packaging material.
Also, it is known that formaldehyde has detrimental effect on photographic sensitive materials such as photographic film and printing paper. While a silver halide emulsion is used in these photographic sensitive materials, formaldehyde has the ability to reduce silver halides, resulting in chemical fogging. Therefore, polyacetal resins, in general, cannot be used as a resin composition of magazines that receive photographic sensitive materials and various molded parts that are used around them. Consequently, metals are often used to make parts that require sufficient elasticity such as a film pressing board.
Considering these situations and in order to reduce concentrations of formaldehyde gas in the molded parts made of acetal resin, Japanese Kokai 1992- 34548 describes hydrazide compounds to be used as an additive, and Japanese
Kokai 1994-107900 describes the use of fatty acid ester of polyvalent alcohol compound as an additive.
Problems that Invention Attempts to Solve
But, when a hydrazide compound is added as an additive to polyacetal resin, there is a certain danger of its byproduct, hydrazine itself, functioning as a reducing agent of photographic sensitive materials. Also, when a fatty acid ester of polyvalent alcohol compound is used as an additive, its effect to suppress formaldehyde is not sufficiently and practical problems persist for its use as a resin composition to make molded parts for photographic sensitive materials.
SUMMARY OF THE INVENTION Resin compositions used to make parts for photographic sensitive materials, which are polyacetal resin compositions and are characterized by the concentration of formaldehyde generated from a formed object of the said composition in a closed environment being less than 20 ppm and by not compromizing with their photographic properties.
This invention is to solve the problems described above and aims at making polyacetal resins that possess excellent characteristics in mechanical properties, heat resistance and fatigue resistance suitable to be a resin composition material to make molded parts used for photographic sensitive materials.
BRIEF DESCRIPTION OF FIGURES
Figure 1 is a schematic perspective view of an instant film pack used in the invention.
Figure 2 is a graph showing a correlation of formaldehyde concentration and fogging concentration. Abscissa, left and right ordinates are for the amounts of Additive-2 (weight %), the formaldehyde concentration (ppm) and the fogging concentration (Dmin), respectively. The top solid plot is for the fogging concentration at blue and the lower broke line plot is for the residual formaldehyde concentration.
Figure 3 is a graph showing a correlation between the amount of added 5,5-dimethylhydantoin and the bending elasticity. The abscissa is the amount of Additive 2 (weight %) and the ordinate is the bending elasticity (x 10 kg/cm).
DETAILED DESCRIPTION
Method to Solve Problems In order to achieve the above objective, this invention is to use polyacetal resin, as a resin composition to make molded parts for photographic sensitive materials, which is prepared in such a way that the concentration of formaldehyde formed from the molded parts remain below 20 ppm in a sealed vessel, without negatively affecting the photographic quality. Concentration of formaldehyde gas generated from molded parts made of this type of polyacetal resins is extremely small and no chemical fogging due to reduction of silver halide emulsions can be seen. Also, since it is designed not to produce harmful chemicals that may negatively affect the photography, it is ideally suited to be used as a resin composition used to make molded parts for photographic sensitive materials.
Furthermore, in cases that an antioxidant is to be added to the above polyacetal resin in order to prevent thermal deformation due to oxidation during heating, a hindered phenol type antioxidant may be used in the range of 0.001 ~ 1.0 weight % to effectively suppress the generation of formaldehyde gas. Whereas below 0.001 weight % little effect is observed, above 1.0 weight % not only photography is negatively affected but physical properties also deteriorate. Also, the addition of a light-shielding material in the range of 0.5 ~ 25 weight % improves the shading ability necessary for the molded parts to be used around photographic sensitive materials, without compromising the chemical and physical properties of the polyacetal resin. Below 0.05 weight %, light-shielding power cannot be secured and the objective to add the additive cannot be met, but also it means an operating loss. Above 25 weight %, the physical strength deteriorates and the appearance also suffers.
In Figure 1, a film pack made of the polyacetal resin composition of this invention is briefly described. The pack main-body consists of a box-shape casement 3 forming an exposure opening 2 and a bottom lid 5 to which a plate spring 4 is attached. In the casement are stored a light-shielding sheet 6 and about 10 sheets of mono-sheet type instant film units 7. Whereas the polyacetal resin of this invention can be used as the composition material for the casement 3, the plate spring 4, the bottom lid 5 and the light-shielding sheet 6, some appropriate parts of these may be made of a polystyrene resin and other resins.
In addition to the exposure opening 2, the casement 3 has an exit slot 8 and a notch 9 through which a raking claw inserts. As a bottom lid 5 is fastened to the bottom of the casement 3, a plate spring 4 pushes up the instant film units 7 and shade sheet 6 stored in the pack main body so that the shade sheet 6 covers the exposure opening 2 from the inside of the casement 3. Hereby, the instant film units 7 in the pack main body can be kept from the light. Further, the exit slot 8 is covered by flexible shade film.
The instant film unit 7 is fitted with a developer pod 7 in which a developing solution is enclosed. A film pack is loaded into a camera and photographing is ready once the shade sheet 6 is ejected. When a picture is taken, a raking claw mounted in the camera insert itself through the notch 9 to scrape out the instant film unit 7, that has been just exposed through the exposure opening 2, through the exit slot 8. After this, developer rollers located inside the camera rotate as they squeeze the exposed instant film unit 7 coming out of the exit slot 8 and squash the developer pod 7a as the film unit is ejected.
The plate spring 4 is to press the top unit of the instant film units 7 stored in the pack main body against the internal side of the exposure opening 2 and to position the instant film unit 7 to be used for the next photographing in the exposure position. Therefore, especially if the plate spring is to be made of a resin, the resin must have sufficient elasticity as well as such characteristics that the elasticity is not lost after prolonged storage.
Resin compositions of this invention, even if used as a molding composition to make the plate springs described above, have enough elasticity as well as a characteristic that gives rise to little creep deformation. Although resin compositions of this invention use a polyacetal resin as monomersic, the polyacetal resins herein used are tcommonly used polyacetal resins which are polymers or copolymers of aldehydes, for example, formaldehyde and formaldehyde cyclic oligomers such as trioxane, tetraoxane etc., or polymers prepared by copolymerization of these aldehydes with cyclic ethers or cyclic acetals, for example, ethylene oxide, propylene oxide, 1,3-dioxolane etc.
The polyacetal resin has the main chain consisting of -(CH2θ)n- unit (n is a natural number) and/or -(CHR-0)n- unit ( R is alkyl: n is a natural number) and is a linear polymer with end groups either unprotected or protected by groups such
as -OCOCH3, -OCH3, -OCH2-OH and with the number averaged molecular weight of 10,000 - 100,000, preferably 18,000 ~ 70,000.
In order to lower the concentration of formaldehyde gas liberated from polyacetal resins, it is preferred to add to 100 weight parts of polyacetal resin 0.05 - 3.0 weight parts, preferably 0.06 -2.0 weight %, more preferably 0.067 ~ 1.0 weight % of organic cyclic compound with active imino group shown in a general formula (I). Here, Rl, R2, R3 in the general formula (I) represent divalent organic radicals forming through their covalent bondings a cyclic organic compound.
Chem. 1
General Formula (I)
It is desirable that the active imino compound has its imino group highly reactive so that, during and even after the polyacetal resin has crystallized and solidified, it can still react with formaldehyde to form the methylol group as shown in the reaction formula (II).
Chem. 2 Reaction Formula (II)
R-NH-R' + HCHO > R-N(CH2OH)-R
(R-, R'- represent monovalent organic radicals)
In order for the imino group to possess such reactivity, the electron density at the imino group must be sufficiently low sic to fulfill the conditions to induce nucleophilic reactions. Accordingly, organic radicals directly linked to the imino group by a chemical bond must be of electron withdrawing. Such organic radicals, namely organic radicals Rl , R2, R3 in the above formula (I), should preferably possess, at the position linked to the imino group, -CO-, -COO-, -NH-, -NH2, phenyl group, biphenyl group, naphthalene group etc.
Furthermore, if a chemical is to be added to polyacetal resin, it is essential that such a chemical does not separate out by melt mixing or thermally
decompose. Thus, hydantoins and imidazole derivatives may be good examples of compounds represented by the formula (I). In this invention, hydantoin type compounds are preferred. Hydantoin compounds may include but not necessarily be limited to hydantoin, 5,5-dimethylhydantoin, 5,5-diphenylhydantoin and allantoin.
To the acetal resin composition used in this invention, one may add a lubricant, a light-shielding material, an antioxidant, a heat stabilizer, appropriate plasticizers and fillers, if necessary, within the range not to negate the effects of this invention.
Representative lubricants that may be used for the acetal compositions of this invention will be listed below together with their makers.
(1) Silicone Type Lubricants
Various grade dimethylpolysiloxanes and their modifications (Shin-etsu Silicone, Toray Silicone)
(2) Oleic Acid Amide Lubricants
Armoslip CP (Lion-Akzo), Neutron (Nihon Seika), Neutron E-l 8 (Nihon Seika), Amide O (Nitto Chem.), AlfroF: 10 (Nihon Yushi), DaiyamidC-
200(Nihon asei) etc.
(3) Elka Acid Amide Type Lubricants
Alfro-F-10 (Nihon Yushi) etc.
(4) Stearic Acid Amide Type Lubricants Alfro— S- 10 (Nihon Yushi), Neutron2 (Nihon Seika), Diyamid200 (Nihon
Kasei) etc.
(5) Bis-Fatty Acid Amide Type Lubricants
Bisamide (Nihon Kasei), Diyamide200Bis (Nihon Kasei), Armowax BBS
(Lion-Akzo) etc. (6) Non-ionic Surfactant Type Lubricants
Electro-Stripper-TS-2, Electro-Stripper-TS-8 (Kao Soap) etc. (7) Hydrocarbon Type Lubricants
Liquid Paraffin , Natural Paraffin, Microwax, Synthetic Paraffin,
Polyethylene Wax, Polypropylene Wax, Chlorohydrocarbons, Fluorocarbons
(8) Fatty Acid Type Lubricants
High Fatty Acids (Preferably higher than C sic), Oxy-Fatty Acid
(9) Ester Type Lubricants
Lower Alcohol Esters of Fatty Acids, Polyvalent Alcohol Esters of Fatty Acids, Polyglycol Esters of Fatty Acids, Fatty Alcohol Esters of Fatty
Acids
(10) Alcohol Type Lubricants
Polyvalent Alcohols, Polyglycols, Polyglycerols
(1 1) Metal Soap Compounds of higher fatty acids such as lauric acid, stearic acid, ricinolic acid, naphthenic acid, oleic acid, etc. with metals such as Li, Mg, Ca, Sr, Ba, Zn, Cd, Al, Sn, Pb, or another metal.
Also, as shading compounds to be added to secure the light-shielding property the followings may be cited.
(1) Inorganic Compounds
A. Oxides: silica, diatomaceous earth, alumina, Titanium oxide, iron oxides, zinc oxide, magnesium oxide, antimony oxide, barium ferrite, strontium ferrite, beryllium oxide, pumice, pumice balloon, alumina fiber
B. Carbonate Salts: calcium carbonate, magnesium carbonate, dolomite
C. Silicate Salts: talc, clay, mica, asbestos, glass fiber, glass balloon, glass beads, calcium silicate, montmorillonite, bentonite, etc.
D. Carbon: carbon black, graphite, carbon fiber, carbon hollow balls, etc.
E. Others: iron powder, copper powder, lead powder, tin powder, stainless steel powder, pearl pigment, aluminum powder, molybdenum sulfide, boron fiber, silicon carbon fiber, brass fiber, potassium titanate, lead titanate zirconate, zinc borate, barium metaborate, calcium borate, sodium borate, aluminum paste, talc, etc.
(2) Organic compounds
Wood meal (pine, oak, saw-dust, etc.), husk fiber (almond, peanuts, chaff, etc.), colored various fiber such as cotton, jute, paper piece, cellophane piece, nylon fiber, propylene fiber, starch, aromatic polyamide fiber, etc.
Among these shading materials, carbon black is preferred because the bleed-out amount can be reduced. The following classes of carbon black are especially preferred, gas black, furnace black, channel black, anthracene black, acetylene black, Ketchen carbon black, lamp black, lamp smoke, pine smoke, animal black, vegetable black, etc.
In this invention, furnace carbon black is preferred for reasons of shading power, the cost and improvement of physical properties, whereas as for shading material with the ability to prevent electric charge build-up acetylene carbon black and modified synthetic carbon black such as Ketchen carbon black are preferred. Depending upon the requirement, it may be desirable to mix the former with the latter to obtain desired characteristics.
Whereas there are various modes to mix shading substance, a master batch method is preferred because of the cost, pollution prevention, etc. Japanese Kokai 1965-26196 describes a method to prepare a master batch of polymer-carbon black by dispersing carbon black into a solution of polymer dissolved in organic solvent, and Japanese Kokai 1968-10362 describes a method to prepare a master batch by dispersing carbon black into polyethylene.
To be used to make molded parts for photographic sensitive materials in this invention, carbon black of pH 6.0~ 9.0 with average powder diameter of 10 - 120 mm is preferred because little fogging shows up on photographic sensitive materials, because photosensitivity does not change much and because lumps of carbon black as well as pinholes due to fish-eyes hardly appear even when it is added to the resin composition of this invention. Among the carbon black, furnace carbon black having especially volatile components less than 2.0 % and oil absorption greater than 50 ml/ 100 g is preferred. Channel carbon black, in addition to being expensive, often produces fogs on photographic sensitive materials and, therefore, is not preferred. Even if it must be used for some reason, effects onto the photography should be investigated before it is selected.
The following carbon black on the market may be preferred; Mitsubishi Kasei Carbon Black #20 (B), #30 (B), #33 (B), #40 (B), #44 (B), #45 (B), #50, #55, #100, #600, #2200 (B), #2400 (B), MA 8, MA 11, MA 100.
As imported products may be cited, for example, Cabot Co.'s Black Pearls
2, 46, 70, 71, 74, 80, 81, 607, etc., Regal 300, 330, 400, 660, 991, SRF-S, etc., Vulcan 3, 6, etc., Sterling 10, SO, V, S, FT-FF, MT-FF, etc. Further cited may be Ashland Chemicals' United R, BB, 15, 102, 3001, 3004, 3006, 3007, 3008, 3009, 301 1, 3012, XC-3016, XC-3017, 3020; but not limited to the ones listed above.
The amount of shading material to be added should be in the range of 0.05 - 25 weight %, preferably 0.1 - 15 weight %, more preferably 0.5 - 10 weight %, and most preferably 1.0 - 7.0 weigh %.
Also, it is desirable to add antioxidant to prevent thermal deterioration of the resin and to suppress the formation of fish-eyes and lumps (non-homogeneous lump breakdown). Hindered phenol type antioxidants are most preferred in this invention and are listed below.
l,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, tetrakismethylene-3-(3', 5'-di-tert-butyl-4'-hydroxyphenyl)propionate methane, octadecyl-3,5-di-tert-butyl-4-hydroxy-hydrocinnamate, 2,2',2'-tris(3,5-di-tert- butyl-4-hydroxyphenyl)propionyloxyethyl isocyanurate, 1 ,3,5-tris(4-tert-butyl-3- hydroxy-2,6-di-methylbenzyl)isocyanurate, tetrakis(2,4-di-tert-butylpheny 1) 4,4'- biphenylene diphosphite ester.
4,4'-Thio-bis(6-tert-butyl-O-cresol), 2,2'-thio-bis(6-tert-butyl-4- methylphenol), tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, 2,2'- methylene-bis(4-methyl-6-tert-butyl-phenol), 4,4'-methylene-bis(2,8-di-tert- butylphenol), 4,4'-butylidene-bis(3-methyl-6-tert-butyl-phenol), 2,6-di-tert-butyl- 4-methylphenol, 4-hydroxymethyl-2,6-di-tert-butylphenol, 2,6-di-tert-butyl-4-n- butylphenol.
2,6~Bis(2-2'-hydroxy-3'-tert-butyl-5'-methylbenzyl)-4-methylphenol, 4,4'- methylene-bis(6-tert-butyl-O-cresolsic, 4,4'-butylidene-bis(6-tert-butyl-m-cresol), 3,9-bis{ 1 ,2-dimethy-2b-(3-tert-butyl-4-hydroxy-5- methylphenyl)propionyloxyethyl} 2,4,8, 10-tetraoxaspiro5,5undecane may be listed. Among these, those with melting point higher than 100 °C, especially
above 120 °C, are preferred. As to the amount of these hindered phenol type antioxidants to be added, 0.001 - 1.0 weight % is the range, preferably 0.005 - 0.8 weight %, more preferably 0.01 - 0.5 weight %, and most preferably 0.02 - 0.4 weight %.
Further, as for the heat stabilizer to be added to the resin composition of this invention there are polyamide compounds, especially nylon terpolymers, hydroxy containing polymers such as those described in U. S. Patent 4776168 and 4814397, and nonmelting nitrogen or hydroxy containing compounds described in Europe Patent Publication 0388809. More concretely, these are polyamide 6, polyamide 6/12 copolymer, polyamide 6/66/610 terpolymer, polyamide 6/66/612 terpolymer, ethylene-vinyl alcohol copolymer, acrylamide (co)polymer, acrylamide/N,N-methylenebis-acrylamide copolymer. In general, the total amount of heat stabilizers to be added to the polyacetal resin composition is 0.5 - 5.0 weight parts to 100 weight parts of acetal resin, preferably 0.05 - 1.50 weight parts.
Molded parts of these polyacetal resin compositions may be formed by any molding method including compressed molding, ejection molding, extrusion molding, blow molding, rotary molding, melt spinning, and heat molding.
Especially preferred for obtaining parts pertaining to this invention is ejection molding.
EXAMPLES
Below, concrete examples of this invention are described together with comparative examples, but this invention is not limited to those examples mentioned here.
Polyacetal resins used in the following Practical Examples are DuPont's high flow grade polyacetal-homopolymers, Delrin® 900 PNC 10 (Trade Name: Melt Index 1 1.5 g/min) and Delrin® 1700 PNC 10 (Trade Name: Melt Index 18.0 g/min). The followings are prepared for additives to be added to prevent oxidation during resin heating and for the purpose of reducing evolution of formaldehyde gas.
Additive 1 : Hydantoin (Mitsui Toatsu)
Additive 2: 5,5-dimethylhydantoin (Mitsui Toatsu)
Additive 3: Adipic acid hydrazide (Nihon Hydrazine Ind.) Additive 4: Stearic acid monoglyceride (Riken Vitamin)
(1) Practical Example A
Delrin® 900 PNC 10 (5000 g) and Delrin 900 PNC 10 (5000 g) mixed with 25 g of one of the above listed Additives 1 - 4 are fed to a 35 mm biaxial screw ejection molder to melt mix and cut to obtain 5 different kinds of resins in the form of pellets. In this process, the resin temperature was 195 - 198 °C and the feed rate was about 30 kg/hr. Each resin pellet is molded using a 75 Ton Sumitomo Nestal Ejection Molder to obtain 5 kinds of cylindrical test pieces A-l - A-5. During the molding the resin temperature and mold temperature was 250 °C and 75 °C , respectively.
The test pieces A-l - A-5 thus prepared are placed and sealed, 5 pieces together (the total weight about 5 g), in a 1 L polyethylene container and allowed to stand at room temperature for 24 hours. Concentration of formaldehyde in the container was measured using Formalde Meter - Markll (Lion Co. England) to the ppm level. Results are shown in Table 1.
TABLE 1
TEST PIECE ADDITIVE ADDED FORMALDEHYDE HYDRAZIDE HALATION AMOUNT CONCENTRATION EVALUATION EVALUATION
(WT %)
A-l Additive 1 0.06 15.8 O O
A-2 Additive 2 0.06 10.0 o o
A-3 Additive 3 0.06 13.4 Δ Δ
A-4 Additive 4 0.06 23.7 O X - Δ
A-5 none - 69.8 o X
As Table 1 shows, all the additives exhibited observable effects in reducing the formaldehyde concentration in the molded parts. Among them, the most effective was Additive-2. Observable but insufficient effects can be seen with a fatty acid type additive, Additive-4. With Additive-3, formaldehyde concentration can be suppressed to the level below 15 ppm but hydrazine is slowly released, which reduces photographic sensitive materials and negatively affects the quality of photography, in addition to being harmful to human body. Thus, the column of Hydrazide Rating shows the degrees of effects that the hydrazide compound included in those test pieces exerts. Also, on the basis of concentrations of formaldehyde, the extent of fogging on photographic sensitive
materials are shown in the column of Fogging Rating. The marks in these rating columns indicate: Open circle: good. Filled circle: practical possible uses. Filled triangle: improvement required. X: not suitable for practical uses.
(2) Practical Example B
To Delrin® 900 PNC 10 (9,800 g) is added 200 g of Additive-2, melt mixed through a 35 mm biaxial screw extrusion molder (Toshiba TEM 35) and cut to prepare Additive-2 concentrate in the form of pellets (a master batch). During this process, the resin temperature was 200 °C and the feed rate was 25 kg/hr. The Additive-2 concentrate thus obtained is called Additive-A.
In the manner similar to that used in Practical Example (1), cylindrical test pieces B-l - B-7 were prepared using mixtures prepared from High Flow Delrin® D1700 PNC 10 pellets and Additive-A in different ratios. Here, Test Piece B-l is a sample which does not contain Additive-A. Using these test pieces B-l - B-7, formaldehyde concentrations were measured under the conditions identical with those used in Practical Example A. Results are shown in Table 2.
TABLE 2
TEST PIECE D1700P ADDITIVE A CONCENTRATION OF HYDRAZIDE HALATION
(WT %) (WT %) ADDITIVE 2 (WT %) EVALUATION EVALUATIO
B-l 100 0 0 00 0 00 69 8 X
B-2 98 0 2 00 0 04 35 6 X - Δ
B-3 97 5 2 50 0 05 18 6 Θ
B-4 97 0 3 00 0 06 10 0 O
B-5 96 7 3 33 0067 4 2 O
B-6 95 0 5 00 0 10 4 6 o
B-7 90 0 1000 0 20 4 3 o
As Table 2 shows, it is clear that Additive-2 must be added more than 0.05 weight % in order to reduce the formaldehyde concentration in molded parts below such a level that no fogging shows up on photographic sensitive materials. However, if concentration of hydrazine in Additive-2 becomes too high, it functions as a reducing agent to photographic sensitive materials and becomes, also, harmful to human body. Thus, the amount of Additive-2 to be added should be maintained in the range of 0.05 - 3.0 weight %, preferably 0.06 - 2.0 weight % and most preferably 0.067 - 1.0 weight %. Furthermore, since the elasticity of molded parts is considerably reduced if concentration of Additive-2 exceeds 0.5
weight %, it may be problematic to use molded parts made of this resin as the material for springs. (3) Practical Example C
Next, plate spring 4 shown in Figure 1 was ejection molded using the composition identical with that used in Test Piece B-l - B-6 in Practical Example B. Various plate springs thus obtained were stored and sealed together with photographic sensitive materials in a dump-proof bag (humidity permeability: 0.5 g/m2/24 hr) at 50 <>C for 3 days in a dry atmosphere. Here, FUJICOLOR NC-160 was used as photographic sensitive material.
Then, the photographic sensitive materials were removed and developed to measure the fogging concentration, Dmin, at blue color where fogging is most pronounced. The fogging concentration Dmin represents the concentration difference relative to the concentration on a standard photographic sensitive material when the photographic sensitive material alone is allowed to stand for 3 days under the conditions identical with those described above. Table 3 summarizes the observed values and Figure 2 shows the correlation with formaldehyde concentration measured in Practical Example B.
TABLE 3
ADDED AMOUNT OF ADDITIVE 2 (WT %) 0.00 0.04 0.05 0.06 0.067 0.10 0.20
FORMALDEHYDE CONCENTRATION (ppm) 69.8 25.6 18.6 10.0 5.00 4.60 4.20
HALATION DENSITY (Dmin) 1.5 1.2 1.0 0.99 0.97 0.93 0.85
Graph in Figure 2 shows that the concentration of chemical fogging caused by formaldehyde converges to the standard fogging concentration Dmin 0.8 +/- 0.2 in blank tests as long as the amount of Additive-2, which has the ability to trap formaldehyde, exceeds 0.067 weight %. Since, with this quantity range of the additive, the formaldehyde concentration can be maintained below 5 ppm and the fogging concentration can also be suppressed below 1.0, there should be no problem to use this material in the vicinity of photographic sensitive materials.
As described above, the effect of lowering formaldehyde concentrations by increasing the amount of Additive-2 has been confirmed, but the elasticity of molded parts decreases if too much is added. Figure 3 shows the correlation between the amount of added Additive-2 and the bending elasticity of molded parts. As the graph shows, the bending elasticity significantly diminishes if Additive-2 is added more than 0.5 weight %. If the plate spring 4 shown in
Figure 1 is to be made of the polyacetal resin in this invention, it is desirable to use Additive-2 in the range lower than 0.5 weight %.
As shown above, if Additive-2 is added to the polyacetal resin to the extent of 0.05 - 3.0 weight %, preferably 0.06 - 2.0 weight %, the residual formaldehyde concentration can be greatly reduced, and even if it is used together with photographic sensitive materials, there is no danger that fogging on the photographic sensitive material becomes problematic. If Additive-2 is added in the range of 0.067 - 1.0 weight %, the bending elasticity of molded parts hardly diminishes and no problem should be encountered even if it is used to make springs.
The polyacetal resin of this invention with the characteristics described above can be used not only for magazines which store photographic sensitive materials like the film packs mentioned earlier, but also as various types of parts such as those used in production lines of photosensitive materials as well as sheet material, conveyer rollers and gears which may be used in cameras or near films and printing paper.
Further, the followings may represent suitable practicable modes to be included in this invention.
(1) Resin compositions used for making molded parts for photographic sensitive materials described in Claim 1 , comprising polyacetal resins and polyacetal resin compositions containing at least an organic cyclic compound bearing an active imino group.
(2) Resin compositions used for making molded parts for photographic sensitive materials described in Claim 1 , comprising polyacetal resins and polyacetal resin compositions containing at least a hydantoin compound.
(3) Resin compositions used for making molded parts for photographic sensitive materials described in Claims 1 - 3 containing lubricant in 0.01 - 10 weight % or in one of the above mentioned practicable mode (1) or (2).
Effect of Invention As explained above, since the polyacetal resin of this invention is prepared not to spoil photographic quality by maintaining concentration of formaldehyde generated in a closed vessel below 20 ppm, no chemical fogging takes place even if molded parts are used in the vicinity of photographic sensitive materials. In
order to effectively reduce the concentration of formaldehyde generated from polyacetal resins, hindered phenol type compounds can be used as antioxidants to be added to the polyacetal resin and, by adjusting the amount to the 0.001 - 1.0 weight % range, fogging on photographic sensitive materials can be prevented. Further, suitable shading material may be added in the 0.5 - 25 weight % range, therby chemical fogging can be avoided with certainty.
Furthermore, since molded parts made of the resins prepared above cause neither chemical nor optical fogging on photographic sensitive materials, they can be used in various shapes such as magazines, sheets and rollers. Since sufficiently elastic parts, also, can be easily made, they may be used as materials to prepare springs.
The object of the invention is to provide a resin composition that reduces the concentration of formaldehyde generated from polyacetal resins and which does not bring about chemical fogging when it is used as parts for photographic sensitive materials.
Composition 5,5-Dimethylhydantoin is added to polyacetal resin to trap formaldehyde generated from the polyacetal resin, thereby reducing the generation concentration of formaldehyde. The amount of 5,5-dimethylhydantoin to be added is 0.05 - 3.0 weight %, preferably 0.06 - 2.0 weight %, and most preferably
0.067 - 1.0 weight %.
Claims
1. Resin compositions used to make parts for photographic sensitive materials, which are polyacetal resin compositions and are characterized by the concentration of formaldehyde generated from a formed object of the said composition in a closed environment being less than 20 ppm and by not compromizing with their photographic properties.
2. Resin compositions used to make parts for photographic sensitive materials described in Claim 1 , which are characterized by a hindered phenol type antioxidant being included in 0.001 - 1.0 weight %.
3. Resin compositions used to make parts for photographic sensitive materials described in Claim 1 or 2, which are characterized by a light-shielding material being included in 0.05 - 25 weight %.
4. Formed parts used for photographic sensitive materials characterized by having been made of a resin composition described in one of the Claims 1 through 3.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US08/776,420 US5866671A (en) | 1994-08-01 | 1995-08-01 | Molded parts used for photographic sensitive materials and resin compositions used to make thereof |
AU32104/95A AU3210495A (en) | 1994-08-01 | 1995-08-01 | Molded parts used for photographic sensitive materials and resin compositions used to make thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP17990894A JP3310467B2 (en) | 1994-08-01 | 1994-08-01 | Molded product for photographic photosensitive material and resin composition used for the same |
JP6/179908 | 1994-08-01 |
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WO1996004591A1 true WO1996004591A1 (en) | 1996-02-15 |
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PCT/US1995/009798 WO1996004591A1 (en) | 1994-08-01 | 1995-08-01 | Molded parts used for photographic sensitive materials and resin compositions used to make thereof |
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JP (1) | JP3310467B2 (en) |
AU (1) | AU3210495A (en) |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001051561A1 (en) * | 2000-01-07 | 2001-07-19 | E.I. Du Pont De Nemours And Company | Polyacetal resin composition and fragrance-emitting shaped article |
RU2246979C2 (en) * | 1997-10-01 | 2005-02-27 | Миннесота Майнинг Энд Мэнюфекчуринг Компани | Method of production of electret items and filters with heightened resistance to the oil mist |
RU2301909C2 (en) * | 2005-05-14 | 2007-06-27 | Общество с ограниченной ответственностью "Айна" | Method of and device for manufacture of air cleaner |
WO2008115458A1 (en) * | 2007-03-20 | 2008-09-25 | E. I. Du Pont De Nemours And Company | Polyacetal resin composition |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998029510A1 (en) * | 1996-12-27 | 1998-07-09 | Polyplastics Co., Ltd. | Polyacetal resin composition and moldings |
DE60008232T2 (en) * | 1999-04-07 | 2005-01-13 | E.I. Du Pont De Nemours And Co., Wilmington | POLYACETAL RESINS WITH REDUCED FORMALDEHYDEGERUCH |
US7086529B2 (en) | 2002-02-26 | 2006-08-08 | Fuji Photo Film Co., Ltd. | Packaging material for photographic light-sensitive material and photographic light-sensitive material package using same |
DE112004002005B4 (en) | 2003-10-24 | 2008-11-06 | Asahi Kasei Chemicals Corp. | A polyacetal resin composition and articles thereof |
JP2007051205A (en) * | 2005-08-17 | 2007-03-01 | Polyplastics Co | Polyacetal resin composition and resin-molded article |
JP2010265438A (en) * | 2009-04-15 | 2010-11-25 | Polyplastics Co | Cellulose fiber-reinforced polyacetal resin composition |
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GB996252A (en) * | 1962-07-31 | 1965-06-23 | Asahi Chemical Ind | A process for stabilising polyoxymethylene |
US3333520A (en) * | 1962-10-23 | 1967-08-01 | Celanese Corp | Polymer product |
GB1320452A (en) * | 1971-02-26 | 1973-06-13 | Kodak Ltd | Formaldehyde contamination reducing varnish |
EP0244245A2 (en) * | 1986-05-01 | 1987-11-04 | Toray Industries, Inc. | Process for producing oxymethylene copolymer and resinous composition |
EP0583778A2 (en) * | 1992-08-17 | 1994-02-23 | Fuji Photo Film Co., Ltd. | Packaging material for photographic photosensitive materials and package |
EP0658809A1 (en) * | 1993-12-17 | 1995-06-21 | Agfa-Gevaert N.V. | Method for making lithographic printing plates according to the silver salt diffusion transfer process |
-
1994
- 1994-08-01 JP JP17990894A patent/JP3310467B2/en not_active Expired - Fee Related
-
1995
- 1995-08-01 WO PCT/US1995/009798 patent/WO1996004591A1/en active Application Filing
- 1995-08-01 AU AU32104/95A patent/AU3210495A/en not_active Abandoned
Patent Citations (6)
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GB996252A (en) * | 1962-07-31 | 1965-06-23 | Asahi Chemical Ind | A process for stabilising polyoxymethylene |
US3333520A (en) * | 1962-10-23 | 1967-08-01 | Celanese Corp | Polymer product |
GB1320452A (en) * | 1971-02-26 | 1973-06-13 | Kodak Ltd | Formaldehyde contamination reducing varnish |
EP0244245A2 (en) * | 1986-05-01 | 1987-11-04 | Toray Industries, Inc. | Process for producing oxymethylene copolymer and resinous composition |
EP0583778A2 (en) * | 1992-08-17 | 1994-02-23 | Fuji Photo Film Co., Ltd. | Packaging material for photographic photosensitive materials and package |
EP0658809A1 (en) * | 1993-12-17 | 1995-06-21 | Agfa-Gevaert N.V. | Method for making lithographic printing plates according to the silver salt diffusion transfer process |
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G.DERAEDT: "Methods of abating residual formaldehyde in industrial resins", 1988, PERGAMON PRESS, OXFORD GB, 176 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
RU2246979C2 (en) * | 1997-10-01 | 2005-02-27 | Миннесота Майнинг Энд Мэнюфекчуринг Компани | Method of production of electret items and filters with heightened resistance to the oil mist |
WO2001051561A1 (en) * | 2000-01-07 | 2001-07-19 | E.I. Du Pont De Nemours And Company | Polyacetal resin composition and fragrance-emitting shaped article |
RU2301909C2 (en) * | 2005-05-14 | 2007-06-27 | Общество с ограниченной ответственностью "Айна" | Method of and device for manufacture of air cleaner |
WO2008115458A1 (en) * | 2007-03-20 | 2008-09-25 | E. I. Du Pont De Nemours And Company | Polyacetal resin composition |
Also Published As
Publication number | Publication date |
---|---|
AU3210495A (en) | 1996-03-04 |
JPH0841288A (en) | 1996-02-13 |
JP3310467B2 (en) | 2002-08-05 |
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