WO1994015720A1 - Magnetic recording media on non-metallic substrates and methods for their production - Google Patents
Magnetic recording media on non-metallic substrates and methods for their production Download PDFInfo
- Publication number
- WO1994015720A1 WO1994015720A1 PCT/US1994/000328 US9400328W WO9415720A1 WO 1994015720 A1 WO1994015720 A1 WO 1994015720A1 US 9400328 W US9400328 W US 9400328W WO 9415720 A1 WO9415720 A1 WO 9415720A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- magnetic
- magnetic recording
- recording media
- over
- Prior art date
Links
- 230000005291 magnetic effect Effects 0.000 title claims abstract description 77
- 239000000758 substrate Substances 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims description 26
- 238000004519 manufacturing process Methods 0.000 title description 7
- 239000010410 layer Substances 0.000 claims abstract description 156
- 238000007747 plating Methods 0.000 claims abstract description 34
- 239000011651 chromium Substances 0.000 claims abstract description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 14
- 239000011241 protective layer Substances 0.000 claims abstract description 11
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 6
- 230000001050 lubricating effect Effects 0.000 claims description 6
- -1 VIB metals Chemical class 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005299 abrasion Methods 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 12
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052759 nickel Inorganic materials 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 10
- 239000010409 thin film Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 229910001004 magnetic alloy Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical group [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910000599 Cr alloy Inorganic materials 0.000 description 1
- 229910019974 CrSi Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- DTJAVSFDAWLDHQ-UHFFFAOYSA-N [Cr].[Co].[Pt] Chemical compound [Cr].[Co].[Pt] DTJAVSFDAWLDHQ-UHFFFAOYSA-N 0.000 description 1
- TZVJRPRFJIXRGV-UHFFFAOYSA-N [Cr].[Co].[Ta] Chemical compound [Cr].[Co].[Ta] TZVJRPRFJIXRGV-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000788 chromium alloy Substances 0.000 description 1
- RYTYSMSQNNBZDP-UHFFFAOYSA-N cobalt copper Chemical compound [Co].[Cu] RYTYSMSQNNBZDP-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 239000006058 strengthened glass Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/7368—Non-polymeric layer under the lowermost magnetic recording layer
- G11B5/7369—Two or more non-magnetic underlayers, e.g. seed layers or barrier layers
- G11B5/737—Physical structure of underlayer, e.g. texture
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73911—Inorganic substrates
- G11B5/73921—Glass or ceramic substrates
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/73—Base layers, i.e. all non-magnetic layers lying under a lowermost magnetic recording layer, e.g. including any non-magnetic layer in between a first magnetic recording layer and either an underlying substrate or a soft magnetic underlayer
- G11B5/739—Magnetic recording media substrates
- G11B5/73923—Organic polymer substrates
Definitions
- the present invention relates generally to magnetic recording media, and more particularly to magnetic recording disks formed on non-metallic substrates and methods for their production.
- Thin film magnetic recording disks generally comprise a disk substrate having a magnetic layer and a number of underlayers and overlayers deposited thereon. The nature and composition of each layer is selected to provide desired magnetic recording characteristics as generally recognized in the industry.
- An exemplary present day thin film disk is illustrated in Fig. 1 and comprises a non-magnetic disk substrate 10, typically composed of an aluminum alloy.
- An amorphous nickel- phosphorous (Ni-P) layer 12 is formed over each surface of the disk substrate 10, typically by plating.
- the Ni-P layer is hard, and imparts rigidity to the aluminum alloy substrate.
- a chromium ground layer 14 is formed over the Ni-P layer 12, typically by sputtering, and a magnetic layer 16 is formed over the ground layer 14.
- the magnetic layer 16 comprises a thin film of a ferromagnetic material, such as a magnetic oxide or magnetic alloy.
- a protective layer 18, such as a carbon film, is formed over the magnetic layer 16, and a lubricating layer 20 is formed over the protective layer.
- the presence of the Ni-P layer 12 and the chromium ground layer 14 has been found to improve the recording characteristics of the magnetic layer 16.
- a chromium ground layer formed over a Ni-P layer has been found to provide enhanced coercivity and reduced noise characteristics. Such improvements are further enhanced when the Ni-P layer is treated by mechanical texturing to create a roughened surface prior to formation of the chromium ground layer.
- the texturing may be circumferential or crosswise, with the preferred geometry depending on the particular composition of the cobalt-containing magnetic layer.
- Such non-metallic disk substrate materials suffer from their own disadvantages. In particular, it is difficult to texture many of these materials directly because of their surface hardness.
- any texturing or other surface treatments of such strengthened glass substrates can therefore compromise the improved mechanical characteristics.
- the methods should provide for texturing of the surfaces underlying the magnetic layers, should allow for the deposition of underlayers by sputtering and/or plating, and should permit the production of magnetic recording disks on glass and other substrates without mechanical degradation of the substrate surface.
- U.S. Patent No. 4,876,117 describes the use of nickel-phosphorous (Ni-P) underlayers on magnetic recording disks, and suggests that a wide variety of disk substrates may be employed, including aluminum, ceramics, glass, plastics, ceramic-metal composites, and glass- ceramic composites. No process description for applying Ni-P to substrates other than aluminum is provided.
- the use of a tin-nickel underlayer on an aluminum substrate is described in U.S. Patent No. 4,029,541.
- a Ni-P underlayer applied over a zincate layer on an aluminum disk substrate is described in U.S. Patent No. 4,929,499.
- Other underlayers for aluminum disk substrates are described in U.S. Patent No. 5,047,274.
- magnetic recording media are formed over non-metallic substrates by applying an electrically conductive plating base layer over the substrate surface.
- the electrically conductive plating base layer permits electrical biasing of the disk structure to facilitate application of subsequent layers by sputtering or plating.
- an adhesion layer is deposited directly over the non- metallic substrate surface prior to application of the electrically conductive plating base layer, where the adhesion layer helps anchor subsequently applied layers and further enhances electrical conductivity of the disk structure.
- Suitable adhesion layers are composed of Group IVB, VB, and VIB transition metals which may be deposited by methods which do not require electrical biasing, e.g. vacuum deposition.
- the electrically conductive plating base layer When using such metallic adhesion layers, the electrically conductive plating base layer will typically be sputtered nickel phosphorous (Ni-P) applied in a thin layer over the adhesion layer.
- the electrically conductive plating base layer acts as a base for subsequent application of a relatively thick Ni-P layer, which is typically deposited by electroless plating.
- the thick Ni-P layer can then be textured in a conventional manner to provide improved recording characteristics previously associated with the use of aluminum and other metallic substrates.
- the underlying electrically conductive plating base layer and optional adhesion layer further enhance recording characteristics and provide for the desired adhesion which anchors the Ni-P layer in place during texturing.
- Magnetic recording media will comprise a non-metallic substrate, an electrically conductive plating base layer formed over a surface of the substrate, an electroless plated Ni-P layer formed over the plating base layer, and a magnetic layer formed over the Ni-P layer, where the Ni-P layer has been textured prior to deposition of the magnetic layer.
- the non-metallic substrate may be composed of a variety of materials, including glass, ceramics, carbon, silicon, silicon carbide, and the like.
- the magnetic recording media will include an adhesion layer, such as a vacuum-deposited Group IVB, VB, or VIB metal, formed under the electrically conductive plating base layer.
- FIG. 1 is a cross-sectional view of an exemplary prior art magnetic recording disk having an aluminum disk substrate, as described in the Background section hereinabove.
- Fig. 2 is a cross-sectional view of a magnetic recording disk having a non-metallic disk substrate according to the present invention.
- Figs. 3-5 show experimental data, as described in detail in the Experimental section.
- magnetic recording media will usually be in the form of a magnetic recording disk 28 comprising a non-metallic substrate 30, an adhesion layer 32, an electrically conductive plating base layer 34, a thick nickel phosphorous (Ni-P) layer 36, a ground layer 38, a magnetic layer 40, a protective layer 42, and a lubricating layer 44.
- the various layers will be formed over at least one surface of the substrate 30, and preferably over both surfaces of the substrate 30, in the order illustrated.
- the non-metallic substrate 10 comprises a disk having a diameter suitable for formation of a conventional hard magnetic recording disk.
- the substrate 30 will be composed of glass, ceramic, carbon, glass-ceramic composites, glass-carbon composites, silicon, silicon carbide, and the like.
- a glass substrate such as the those available from Pilkington Micronics.
- the adhesion layer 32 will typically be a vacuum-deposited metal layer, with suitable metals being selected from Group IVB, VB, and VIB of the Periodic Table. Particularly suitable metals include chromium, titanium, tantalum, vanadium, molybdenum, and the like. Vacuum deposition may be performed by conventional techniques using conventional equipment and has the advantage that it does not require electrical biasing of the non-metallic substrate 30.
- the thickness of the adhesion layer is not critical, typically being in the range from about 250 A to 2500 A, preferably being about 500 A.
- the presence of the adhesion layer is optional, although preferred.
- Other measures can be taken for assuring that the overlying electrically conductive plating base layer adhered to the substrate.
- the substrate could be impregnated or seeded with certain salts, such as tin chloride and palladium chloride, as described by Vossen and Kein, Thin Film Processes , Academic Press, New York 1978, at page 221.
- Such impregnation has the disadvantage that treated glass surfaces may be degraded, resulting in poor film adhesion.
- a metal adhesion layer could be applied by screen pressing and subsequently melted to obtain a conductive layer.
- the electrically conductive plating base layer 34 is next formed over the adhesion layer 32 (or alternatively over the adhesion-treated surface of the substrate 30) .
- the electrically conductive plating base layer 34 will generally be a metal and will provide an electrically conductive surface for subsequent fabrication steps. Suitable metals and alloys include Ni-P, aluminum, platinum, copper, and the like.
- Ni-P will be sputtered over the adhesion layer 32 to a thickness in the range from about 250 A to 2500 A, by conventional techniques.
- the electrically conductive plating base layer 34 provides a plating base for the deposition of an electroless Ni-P layer 36.
- the electroless Ni-P layer is generally the equivalent of the underlying Ni-P layers found on conventional aluminum substrate recording disks of the prior art.
- the Ni-P will be deposited by conventional electroless techniques to a thickness generally in the range from 500 A to 5000 A.
- chromium is used as the adhesion layer 32, it is necessary to control the temperature of the plating bath used to plate the Ni-P layer 36. It has been found that plating of Ni-P results in the evolution of hydrogen, which can cause incorporation of hydrogen in the chromium adhesion layer 32. Such chromium incorporation is undesirable since it interferes with adhesion between the chromium layer and the underlying non-metallic substrate 30. It has been found that bath temperatures below 100° C, preferably at or below 80°C, will generally avoid hydrogen evolution.
- the Ni-P layer 34 can be mechanically textured in a conventional manner, such as by tape or slurry abrasion.
- the type of texturing will depend on part, on the nature of the magnetic alloy which is to be applied over the Ni-P layer 36.
- some magnetic alloys such as cobalt-chromium- tantalum, require circumferential texturing to achieve optimum coercivity and magnetic anisotropy.
- Other magnetic alloys such as cobalt-platinum-chromium, require other types of texturing.
- Specific texturing techniques are well known in the art and described in the technical literature. See, for example, Simpson et al. (1987) IEEE Trans. Magnetics, 23:3405, and Mirzamaannii et al. (1990) J. Appl. Phys. 67:4695, the disclosures of which are incorporated herein by reference.
- a ground layer 38 is applied over the textured Ni-P layer 36.
- the ground layer will typically be chromium or a chromium alloy such as CrB, or CrSi, which is deposited by sputtering onto the textured Ni-P layer.
- the ground layer will typically have a thickness in the range from about 500 A to 2500 A.
- the ground layer 38 further enhances the magnetic properties of the subsequently applied magnetic layer 40 by creating grain separation in the magnetic alloy.
- the magnetic layer 40 is next applied over the ground layer 38, again typically by sputtering in a conventional manner.
- the magnetic layer will be composed of a cobalt-containing alloy, such as CoCrTa, CoPtCr, CoNiCr, core, and the like.
- the magnetic layer 38 may be a single layer or may comprise two or more layers formed over one another.
- the thickness of the magnetic layer 38 is not critical, typically being in the range from about 400 A to 800 A.
- the magnetic properties of layer 40 have been found to be dependent on thickness of the plated Ni-P layer 34, with thicker layers 34 producing more highly oriented magnetic films.
- a protective layer 40 is next formed over the magnetic layer, typically being composed of carbon and having a thickness in the range from about 150 A to 400 A.
- the protective layer 40 will usually be coated with a lubricant layer 44, for example a fluorinated polyether or the like, typically having a thickness in the range from about 10 A to 50 A.
- Polished soda lime glass disks (65 mm in diameter and 0.889 mm thick) were cleaned. A 1000 A thick Cr adhesion film and 300 A Ni-17 pct.P plating base film were sputter deposited. Then, a Ni-P film was electroless plated to a thickness of about 1000 A. The plated film was found to have good adhesion and excellent surface quality.
- the plated glass substrate was textured using tape texturing process routinely used in thin film media manufacturing. The topography of the processed glass disks was very similar to the standard 10 micron Ni-P plated on aluminum substrates, as shown in Fig. 3.
- a magnetic layer was deposited on the processed glass substrates by sputter depositing a 500 A Cr underlayer, a 500 A Co-Cr-Ta magnetic film, and a 250 A carbon overlayer film.
- the magnetic layer had a 1500 Oe coercivity and an orientation ratio of 1.7 (Fig. 4).
- the electrical performance of processed glass disks was comparable to the disks synthesized on aluminum substrates.
- the durability of the glass media was evaluated using contact-start-stop-testing in a disk drive with thin film heads. The glass media did not show any wear after 5OK contact-start-stops.
- Magnetic disks were prepared as just described with plated Ni-P film thicknesses from 0 to 1 ⁇ m. It was found that thicker Ni-P layers provided enhanced magnetic orientation ratios. See Fig. 5.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Record Carriers (AREA)
Abstract
Magnetic recording media (28) which comprise non-metallic substrates (30) which are coated with an electrically conductive plating base layer (34) and optionally an adhesion layer (32). The base layer (34) and adhesion layer (32) permit deposition of an electroless nickel phosphorous layer (36) which is analogous to the nickel phosphorous layer on conventional aluminum magnetic recording discs. The nickel phosphorous layer may be textured and conventional ground (38), magnetic (40) and protective layers (42) formed thereover. In the exemplary embodiment, the adhesion layer (32) is a vacuum deposited chromium layer formed directly over the non-metallic substrate (30), and the electrically conductive plating base layer (34) is nickel phosphorous sputtered over the adhesion layer (32).
Description
MAGNETIC RECORDING MEDIA ON NON-METALLIC SUBSTRATES AND METHODS FOR THEIR PRODUCTION BACKGROUND OF THE INVENTION l. Field of the Invention
The present invention relates generally to magnetic recording media, and more particularly to magnetic recording disks formed on non-metallic substrates and methods for their production. Thin film magnetic recording disks generally comprise a disk substrate having a magnetic layer and a number of underlayers and overlayers deposited thereon. The nature and composition of each layer is selected to provide desired magnetic recording characteristics as generally recognized in the industry. An exemplary present day thin film disk is illustrated in Fig. 1 and comprises a non-magnetic disk substrate 10, typically composed of an aluminum alloy. An amorphous nickel- phosphorous (Ni-P) layer 12 is formed over each surface of the disk substrate 10, typically by plating. The Ni-P layer is hard, and imparts rigidity to the aluminum alloy substrate. A chromium ground layer 14 is formed over the Ni-P layer 12, typically by sputtering, and a magnetic layer 16 is formed over the ground layer 14. The magnetic layer 16 comprises a thin film of a ferromagnetic material, such as a magnetic oxide or magnetic alloy. Usually, a protective layer 18, such as a carbon film, is formed over the magnetic layer 16, and a lubricating layer 20 is formed over the protective layer.
The presence of the Ni-P layer 12 and the chromium ground layer 14 has been found to improve the recording characteristics of the magnetic layer 16. In particular, a chromium ground layer formed over a Ni-P layer has been found to provide enhanced coercivity and reduced noise characteristics. Such improvements are further enhanced when the Ni-P layer is treated by
mechanical texturing to create a roughened surface prior to formation of the chromium ground layer. The texturing may be circumferential or crosswise, with the preferred geometry depending on the particular composition of the cobalt-containing magnetic layer.
Such magnetic recording disk constructions have been very successful and allow for high recording densities. As with all such successes, however, it is presently desired to provide magnetic recording disks having even higher recording densities. For reasons best explained elsewhere, recording densities can be improved by reducing the spacing between the recording transducer (read/write head) and the magnetic disk surface while the disk is rotating. Such closer spacing, in turn, requires magnetic recording disks which have very flat surfaces and which are dimensionally stable so that the surfaces remain flat during use. To this end, the use of dimensionally stable non-metallic disk substrate materials has been proposed, such as glass, ceramics, glass-ceramic composites, carbon, carbon-ceramic composites, and the like.
Such non-metallic disk substrate materials, however, suffer from their own disadvantages. In particular, it is difficult to texture many of these materials directly because of their surface hardness.
While certain methods have been proposed for etching such hard surfaces, these methods generally result in isotropic etching which is less desirable than anisotropic etching for recording purposes. While it is theoretically possible to texture the surface of an Ni-P layer formed over a non-metallic substrate, such Ni-P layers have generally poor adhesion characteristics and therefore will not withstand many forms of texturing. Another disadvantage of non-metallic disk substrate materials is their poor electrical conductivity. Such poor conductivity makes the sputtering or plating of subsequent layers, both of which
require electrical biasing, difficult. Additionally, glass substrates used for magnetic recording disks must be chemically strengthened so that they can withstand manufacturing and use. For example, glass surfaces may be subjected to potassium-sodium ion exchange process to strengthen the outer surfaces. Any texturing or other surface treatments of such strengthened glass substrates can therefore compromise the improved mechanical characteristics. For these reasons, it would be desirable to provide improved methods for forming magnetic layers over non-metallic disk substrates in order to provide improved magnetic recording disks. It would be particularly desirable if such methods would provide magnetic recording disks having the improved mechanical characteristics derived from the non-metallic substrates while maintaining the enhanced magnetic properties available with aluminum and other metallic disk substrates. The methods should provide for texturing of the surfaces underlying the magnetic layers, should allow for the deposition of underlayers by sputtering and/or plating, and should permit the production of magnetic recording disks on glass and other substrates without mechanical degradation of the substrate surface. 2. Description of the Background Art
U.S. Patent No. 4,876,117, describes the use of nickel-phosphorous (Ni-P) underlayers on magnetic recording disks, and suggests that a wide variety of disk substrates may be employed, including aluminum, ceramics, glass, plastics, ceramic-metal composites, and glass- ceramic composites. No process description for applying Ni-P to substrates other than aluminum is provided. The use of a tin-nickel underlayer on an aluminum substrate is described in U.S. Patent No. 4,029,541. A Ni-P underlayer applied over a zincate layer on an aluminum disk substrate is described in U.S. Patent No. 4,929,499. Other underlayers for aluminum disk substrates are
described in U.S. Patent No. 5,047,274. U.S. Patent Nos. 4,598,017 and 4,376,963, describe composite disk substrates having polymeric cores. U.S. Patent No. 3,625,849, describes the use of cobalt-copper magnetic layers in hard disks. U.S. Patent No. 4,895,762, is of general interest.
SUMMARY OF THE INVENTION According to the present invention, magnetic recording media are formed over non-metallic substrates by applying an electrically conductive plating base layer over the substrate surface. The electrically conductive plating base layer permits electrical biasing of the disk structure to facilitate application of subsequent layers by sputtering or plating. In a preferred embodiment, an adhesion layer is deposited directly over the non- metallic substrate surface prior to application of the electrically conductive plating base layer, where the adhesion layer helps anchor subsequently applied layers and further enhances electrical conductivity of the disk structure. Suitable adhesion layers are composed of Group IVB, VB, and VIB transition metals which may be deposited by methods which do not require electrical biasing, e.g. vacuum deposition. When using such metallic adhesion layers, the electrically conductive plating base layer will typically be sputtered nickel phosphorous (Ni-P) applied in a thin layer over the adhesion layer. The electrically conductive plating base layer acts as a base for subsequent application of a relatively thick Ni-P layer, which is typically deposited by electroless plating. The thick Ni-P layer can then be textured in a conventional manner to provide improved recording characteristics previously associated with the use of aluminum and other metallic substrates. The underlying electrically conductive plating base layer and optional adhesion layer further enhance recording characteristics and provide for the desired adhesion which anchors the Ni-P layer in place during texturing.
The remaining steps in forming the magnetic recording media include deposition of a magnetic layer, a protective layer, and a lubricating layer, in a generally conventional manner. The present invention further provides magnetic recording media produced by the methods just described. Magnetic recording media according to the present invention will comprise a non-metallic substrate, an electrically conductive plating base layer formed over a surface of the substrate, an electroless plated Ni-P layer formed over the plating base layer, and a magnetic layer formed over the Ni-P layer, where the Ni-P layer has been textured prior to deposition of the magnetic layer. The non-metallic substrate may be composed of a variety of materials, including glass, ceramics, carbon, silicon, silicon carbide, and the like. In a preferred embodiment, the magnetic recording media will include an adhesion layer, such as a vacuum-deposited Group IVB, VB, or VIB metal, formed under the electrically conductive plating base layer.
BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view of an exemplary prior art magnetic recording disk having an aluminum disk substrate, as described in the Background section hereinabove.
Fig. 2 is a cross-sectional view of a magnetic recording disk having a non-metallic disk substrate according to the present invention.
Figs. 3-5 show experimental data, as described in detail in the Experimental section.
DESCRIPTION OF SPECIFIC EMBODIMENTS Referring now to Fig. 2, magnetic recording media according to the present invention will usually be in the form of a magnetic recording disk 28 comprising a non-metallic substrate 30, an adhesion layer 32, an electrically conductive plating base layer 34, a thick nickel phosphorous (Ni-P) layer 36, a ground layer 38, a
magnetic layer 40, a protective layer 42, and a lubricating layer 44. The various layers will be formed over at least one surface of the substrate 30, and preferably over both surfaces of the substrate 30, in the order illustrated. The non-metallic substrate 10 comprises a disk having a diameter suitable for formation of a conventional hard magnetic recording disk. Typically, the substrate 30 will be composed of glass, ceramic, carbon, glass-ceramic composites, glass-carbon composites, silicon, silicon carbide, and the like.
Particularly preferred for use in the present invention is a glass substrate, such as the those available from Pilkington Micronics.
The adhesion layer 32 will typically be a vacuum-deposited metal layer, with suitable metals being selected from Group IVB, VB, and VIB of the Periodic Table. Particularly suitable metals include chromium, titanium, tantalum, vanadium, molybdenum, and the like. Vacuum deposition may be performed by conventional techniques using conventional equipment and has the advantage that it does not require electrical biasing of the non-metallic substrate 30. The thickness of the adhesion layer is not critical, typically being in the range from about 250 A to 2500 A, preferably being about 500 A.
The presence of the adhesion layer is optional, although preferred. Other measures can be taken for assuring that the overlying electrically conductive plating base layer adhered to the substrate. For example, the substrate could be impregnated or seeded with certain salts, such as tin chloride and palladium chloride, as described by Vossen and Kein, Thin Film Processes , Academic Press, New York 1978, at page 221. Such impregnation, however, has the disadvantage that treated glass surfaces may be degraded, resulting in poor film adhesion. Alternatively, a metal adhesion layer
could be applied by screen pressing and subsequently melted to obtain a conductive layer.
The electrically conductive plating base layer 34 is next formed over the adhesion layer 32 (or alternatively over the adhesion-treated surface of the substrate 30) . The electrically conductive plating base layer 34 will generally be a metal and will provide an electrically conductive surface for subsequent fabrication steps. Suitable metals and alloys include Ni-P, aluminum, platinum, copper, and the like.
Preferably, Ni-P will be sputtered over the adhesion layer 32 to a thickness in the range from about 250 A to 2500 A, by conventional techniques.
The electrically conductive plating base layer 34 provides a plating base for the deposition of an electroless Ni-P layer 36. The electroless Ni-P layer is generally the equivalent of the underlying Ni-P layers found on conventional aluminum substrate recording disks of the prior art. The Ni-P will be deposited by conventional electroless techniques to a thickness generally in the range from 500 A to 5000 A. When chromium is used as the adhesion layer 32, it is necessary to control the temperature of the plating bath used to plate the Ni-P layer 36. It has been found that plating of Ni-P results in the evolution of hydrogen, which can cause incorporation of hydrogen in the chromium adhesion layer 32. Such chromium incorporation is undesirable since it interferes with adhesion between the chromium layer and the underlying non-metallic substrate 30. It has been found that bath temperatures below 100° C, preferably at or below 80°C, will generally avoid hydrogen evolution.
Once the Ni-P layer 34 has been plated, it can be mechanically textured in a conventional manner, such as by tape or slurry abrasion. The type of texturing will depend on part, on the nature of the magnetic alloy which is to be applied over the Ni-P layer 36. For
example, some magnetic alloys, such as cobalt-chromium- tantalum, require circumferential texturing to achieve optimum coercivity and magnetic anisotropy. Other magnetic alloys, such as cobalt-platinum-chromium, require other types of texturing. Specific texturing techniques are well known in the art and described in the technical literature. See, for example, Simpson et al. (1987) IEEE Trans. Magnetics, 23:3405, and Mirzamaannii et al. (1990) J. Appl. Phys. 67:4695, the disclosures of which are incorporated herein by reference.
Optionally, a ground layer 38 is applied over the textured Ni-P layer 36. The ground layer will typically be chromium or a chromium alloy such as CrB, or CrSi, which is deposited by sputtering onto the textured Ni-P layer. The ground layer will typically have a thickness in the range from about 500 A to 2500 A. The ground layer 38 further enhances the magnetic properties of the subsequently applied magnetic layer 40 by creating grain separation in the magnetic alloy. The magnetic layer 40 is next applied over the ground layer 38, again typically by sputtering in a conventional manner. The magnetic layer will be composed of a cobalt-containing alloy, such as CoCrTa, CoPtCr, CoNiCr, core, and the like. The magnetic layer 38 may be a single layer or may comprise two or more layers formed over one another. The thickness of the magnetic layer 38 is not critical, typically being in the range from about 400 A to 800 A. The magnetic properties of layer 40 have been found to be dependent on thickness of the plated Ni-P layer 34, with thicker layers 34 producing more highly oriented magnetic films.
A protective layer 40 is next formed over the magnetic layer, typically being composed of carbon and having a thickness in the range from about 150 A to 400 A. The protective layer 40 will usually be coated with a lubricant layer 44, for example a fluorinated
polyether or the like, typically having a thickness in the range from about 10 A to 50 A.
The following example is offered by way of illustration, not by way of limitation. EXPERIMENTAL
Polished soda lime glass disks (65 mm in diameter and 0.889 mm thick) were cleaned. A 1000 A thick Cr adhesion film and 300 A Ni-17 pct.P plating base film were sputter deposited. Then, a Ni-P film was electroless plated to a thickness of about 1000 A. The plated film was found to have good adhesion and excellent surface quality. The plated glass substrate was textured using tape texturing process routinely used in thin film media manufacturing. The topography of the processed glass disks was very similar to the standard 10 micron Ni-P plated on aluminum substrates, as shown in Fig. 3.
A magnetic layer was deposited on the processed glass substrates by sputter depositing a 500 A Cr underlayer, a 500 A Co-Cr-Ta magnetic film, and a 250 A carbon overlayer film. The magnetic layer had a 1500 Oe coercivity and an orientation ratio of 1.7 (Fig. 4). The electrical performance of processed glass disks was comparable to the disks synthesized on aluminum substrates. The durability of the glass media was evaluated using contact-start-stop-testing in a disk drive with thin film heads. The glass media did not show any wear after 5OK contact-start-stops.
Magnetic disks were prepared as just described with plated Ni-P film thicknesses from 0 to 1 μm. It was found that thicker Ni-P layers provided enhanced magnetic orientation ratios. See Fig. 5.
Although the foregoing invention has been described in some detail by way of illustration and example, for purposes of clarity of understanding, it will be obvious that certain changes and modifications may be practiced within the scope of the appended claims.
Claims
1. A method for applying a magnetic layer on a non-metallic substrate, said method comprising: applying an electrically conductive plating base layer over a surface of the substrate; electroless plating of a nickel-phosphorous (Ni-P) layer over the plating base layer; mechanically texturing the Ni-P layer; and applying a magnetic layer over the textured nickel-phosphorous layer.
2. A method as in claim 1, further comprising applying an adhesion layer on the surface of the substrate prior to applying the electrically conductive plating base layer.
3. A method as in claim 2, wherein the adhesion layer is composed of a material selected from the group consisting of Group IVB, VB, and VIB metals.
4. A method as in claim 3, wherein the adhesion layer metals are applied by sputtering to a thickness in the range from 250 A to 2500 A.
5. A method as in claim 4, wherein the metal comprises chromium sputtered to a thickness in the range from 500 A to 1500 A.
6. A method as in claim 2, wherein the electrically conductive plating base layer is composed of a material selected from the group consisting of Ni-P, aluminum, platinum, and copper.
7. A method as in claim 6, wherein the base layer material is Ni-P applied by sputtering to a thickness in the range from 250 A to 2500 A.
8. A method as in claim 2, wherein the electroless Ni-P layer is plated to a thickness in the range from 500 A to 5000 A.
9. A method as in claim 2, wherein the electroless Ni-P layer is mechanically textured by tape or slurry abrasion.
10. A method as in claim 2, further comprising applying a protective layer and a lubricating layer over the magnetic layer.
11. Magnetic recording media comprising a non- metallic substrate; an electrically conductive plating base layer formed over a surface of the substrate, and electroless plated nickel-phosphorous (Ni-P) layer formed over the plating base; and a magnetic layer over the Ni-P layer, wherein the Ni-P layer has been textured prior to deposition of the magnetic layer thereover.
12. Magnetic recording media as in claim 11, wherein the non-metallic substrate is composed of a material selected from the group consisting of glass, ceramic, carbon, silicon, and silicon carbide.
13. Magnetic recording media as in claim 11, further comprising an adhesion layer formed over the substrate surface below the plating base layer.
14. Magnetic recording media as in claim 13, wherein the adhesion layer is composed of a material selected from the group consisting of Group IVB, VB, and VIB metals.
15. Magnetic recording media as in claim 14, wherein the adhesion layer is sputtered chromium having a thickness in the range from 500 A to 1500 A.
16. Magnetic recording media as in claim 13, wherein the electrically conductive plating base layer is sputtered Ni-P having a thickness in the range from 250 A to 2500 A.
17. Magnetic recording media as in claim 13, wherein the electroless Ni-P layer has a thickness in the range from 500 A to 5000 A.
18. Magnetic recording media as in claim 13, wherein the electroless Ni-P layer is circumferentially textured.
19. Magnetic recording media as in claim 13, further comprising a protective layer and a lubricating layer over the magnetic layer.
20. Magnetic recording media comprising a glass substrate, a sputtered chromium adhesion layer over a surface of the glass substrate having a thickness in the range from 500 A to 1500 A, a sputtered nickel- phosphorous (Ni-P) electrically conductive plating base layer over the adhesion layer having a thickness in the range from 250 A to 2500 A, a circumferentially textured electroless Ni-P layer plated over the plating base layer having a thickness in the range from 500 A to 5000 A, a magnetic layer formed over the electroless Ni-P layer, a protective layer over the magnetic layer, and a lubricating layer over the protective layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US137993A | 1993-01-07 | 1993-01-07 | |
US08/001,379 | 1993-01-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1994015720A1 true WO1994015720A1 (en) | 1994-07-21 |
Family
ID=21695748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1994/000328 WO1994015720A1 (en) | 1993-01-07 | 1994-01-06 | Magnetic recording media on non-metallic substrates and methods for their production |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO1994015720A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0704838A1 (en) * | 1994-09-27 | 1996-04-03 | Komag, Inc. | Method of fabricating a textured magnetic storage disk |
WO2002042511A3 (en) * | 2000-11-21 | 2002-09-06 | Leonard Nanis | Method of coating smooth electroless nickel on magnetic memory disks and related memory devices |
CN1329887C (en) * | 2004-03-25 | 2007-08-01 | 株式会社东芝 | Magnetic recording medium, method for manufacturing recording medium and magnetic recording apparatus |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5718029A (en) * | 1980-07-04 | 1982-01-29 | Hitachi Ltd | Production of magnetic disk of high recording density |
US4786564A (en) * | 1987-02-25 | 1988-11-22 | Komag, Inc. | Method for manufacturing a magnetic disk having reduced bit shift, minimized noise, increased resolution and uniform magnetic characteristics, and the resulting disk |
US4876117A (en) * | 1988-02-04 | 1989-10-24 | Domain Technology | Method and coating transition metal oxide on thin film magnetic disks |
-
1994
- 1994-01-06 WO PCT/US1994/000328 patent/WO1994015720A1/en active Search and Examination
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5718029A (en) * | 1980-07-04 | 1982-01-29 | Hitachi Ltd | Production of magnetic disk of high recording density |
US4786564A (en) * | 1987-02-25 | 1988-11-22 | Komag, Inc. | Method for manufacturing a magnetic disk having reduced bit shift, minimized noise, increased resolution and uniform magnetic characteristics, and the resulting disk |
US4876117A (en) * | 1988-02-04 | 1989-10-24 | Domain Technology | Method and coating transition metal oxide on thin film magnetic disks |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0704838A1 (en) * | 1994-09-27 | 1996-04-03 | Komag, Inc. | Method of fabricating a textured magnetic storage disk |
WO2002042511A3 (en) * | 2000-11-21 | 2002-09-06 | Leonard Nanis | Method of coating smooth electroless nickel on magnetic memory disks and related memory devices |
GB2384788A (en) * | 2000-11-21 | 2003-08-06 | Leonard Nanis | Method of coating smooth electroless nickel on magnetic memory disks and related memory devices |
GB2384788B (en) * | 2000-11-21 | 2004-10-20 | Leonard Nanis | Method of coating smooth electroless nickel on magnetic memory disks and related memory devices |
US6977030B2 (en) | 2000-11-21 | 2005-12-20 | Leonard Nanis | Method of coating smooth electroless nickel on magnetic memory disks and related memory devices |
US6986956B2 (en) | 2000-11-21 | 2006-01-17 | Leonard Nanis | Method of coating smooth electroless nickel on magnetic memory disks and related memory devices |
CN1329887C (en) * | 2004-03-25 | 2007-08-01 | 株式会社东芝 | Magnetic recording medium, method for manufacturing recording medium and magnetic recording apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2834380B2 (en) | Metal thin film magnetic recording media | |
KR910006150B1 (en) | Magnetic recording medium and manufacturing method thereof | |
US5569533A (en) | Thin-film medium with sublayer | |
US5252367A (en) | Method of manufacturing a magnetic recording medium | |
US5250339A (en) | Magnetic recording medium | |
US5494722A (en) | Magnetic recording medium and method for its production | |
US5427867A (en) | Substrate used for magnetic disk and magnetic recording medium using the substrate | |
US5800863A (en) | Carbon seedlayer on non-metallic substrates for magnetic recording media | |
WO1994015720A1 (en) | Magnetic recording media on non-metallic substrates and methods for their production | |
JPH05143972A (en) | Metal thin film magnetic recording medium and its production | |
JP2697227B2 (en) | Magnetic recording medium and method of manufacturing the same | |
US6183860B1 (en) | Magnetic recording media having CrMo underlayers | |
EP0399747B1 (en) | Substrate used for magnetic disk and magnetic recording medium using the substrate | |
US5466524A (en) | Barium hexaferrite-silicon nitride-carbon magnetic recording medium | |
JP2811167B2 (en) | Substrate for magnetic disk | |
JP3652616B2 (en) | Magnetic recording medium, manufacturing method thereof, magnetic recording / reproducing apparatus, and sputtering target | |
KR920010488B1 (en) | Fixed magnetic disk and the magnetic manufacturing method | |
JPS6151619A (en) | Magnetic recording medium | |
EP0422547B1 (en) | Magnetic recording medium | |
JPH0719372B2 (en) | Method of manufacturing magnetic recording medium | |
JPH09134518A (en) | Magnetic recording medium | |
JPH08329442A (en) | Magnetic recording media | |
JPH09147357A (en) | Manufacturing method of magnetic recording medium | |
JP2834391B2 (en) | Method of manufacturing magnetic recording medium substrate and method of manufacturing magnetic recording medium using the substrate | |
JP2527616B2 (en) | Metal thin film magnetic recording medium |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): JP |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) |