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WO1993020537A1 - Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction - Google Patents

Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction Download PDF

Info

Publication number
WO1993020537A1
WO1993020537A1 PCT/FI1993/000138 FI9300138W WO9320537A1 WO 1993020537 A1 WO1993020537 A1 WO 1993020537A1 FI 9300138 W FI9300138 W FI 9300138W WO 9320537 A1 WO9320537 A1 WO 9320537A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
microcircuit
socket
smart card
open recess
Prior art date
Application number
PCT/FI1993/000138
Other languages
English (en)
Inventor
Ahti Aintila
Original Assignee
Picopak Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Picopak Oy filed Critical Picopak Oy
Priority to EP93907879A priority Critical patent/EP0746826A1/fr
Publication of WO1993020537A1 publication Critical patent/WO1993020537A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07781—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being fabricated in a winding process

Definitions

  • the present invention is related to a method according to the preamble of claim 1 for connecting a microcircuit to the inductive coupling coil of a smart card.
  • the invention also concerns an assembly for an inductively coupled smart card.
  • Inductively coupled smart cards are employed for instance as pay tokens in bus traffic, whereby a card of the same size as a credit card can be loaded with the value of prepaid tokens that can be paid off at card reader terminals of busses.
  • the card communicates with the external world via a coupling coil connected to a microcircuit provided with memory, thus requiring no mechanical contact between the card and the card reader as is necessary with the use of convention- al magnetic stripe cards.
  • the coil is advantageously designed for maximum possible diameter, and in practice the coil is conformant with the outer rim of the card.
  • Such coils are fabricated through automated production methods, and coils of desired design are commercially available with a desired number of turns from customer-specified conductor material. The coils are delivered with unterminated conductor ends.
  • WO publication 91/16718 discloses a method for connecting a coil of the above- described kind to a printed-circuit board, which has a microcircuit comprised of memory and control circuits bonded to it.
  • the embodiment according to the publication necessitates multiple time-consuming work phases: printed-circuit manufacturing, placement of the microcircuit onto the printed-circuit board, forming of bonding areas for the microcircuit onto the printed-circuit board, and finally connecting the printed-circuit board with the coil.
  • all these work phases can be automated as such, the great number of required operations causes a long product throughput time in the manufacturing process. It is an object of the present invention to overcome the above-described disad ⁇ vantages of prior-art technology and to achieve an entirely novel method for connecting a microcircuit with the inductive coupling coil of a smart card.
  • the invention is based on the concept of providing the coil already at its manu ⁇ facturing phase with a mounting socket for the microcircuit and then attaching • the conductor ends of the coil to predetermined positions in the socket. Further ⁇ more, the socket incorporates a mounting recess for the microcircuit permitting direct connection of the microcircuit from its contact areas to the coil conductor ends which are located at predetermined positions in the socket.
  • the invention provides significant benefits.
  • the attachment of the socket to the coil is integrated into the manufacturing process of the coil, and by virtue of the socket, the mounting of the microcircuit is simplified, whereby several work phases are obviated in respect to conven ⁇ tional techniques.
  • the reduction of work phases attains undeniable benefits in shortened work throughput time, and quality control is improved, since the number of work phases to be verified is reduced.
  • the product related to the invention namely the smart card
  • any production rate improvements associated with the manufacturing techniques of such a product will have a most significant economical value.
  • Figure 2 shows another inductively coupled smart card embodiment according to the invention in a top view.
  • the shape of the coil 1 is essentially conformant to the outside dimensions of a smart card.
  • the left lower corner of the coil 1 is in this embodiment wound in a slanted manner closer to the center of the coil 1.
  • the indented area left free in this manner is provided with, e.g., a plastic socket 3 which is appropriately coated with similar thermosetting adhesive as is also applied onto the conductor of the coil.
  • the first end 7 of the coil conductor is attached to the socket 3, and the winding of the coil is then continued until the other end 4 of the conductor of the coil 1 can be at ⁇ tached to the socket 3.
  • both the conductor of the coil 1 and the socket 3 are coated with a compatible thermosetting adhesive, these elements will firmly adhere to each other during a heating phase.
  • the heating phase is implemented by applying external heat onto the coil, or alternatively, applying a current pulse on the coil 1 , or using a combination of these two operations. Conse ⁇ quently, the end result of the winding operation is a semifabricated product comprising the coil 1 and, attached thereto, a socket 3 with the ends of the conductor of the coil 1 connected to said socket.
  • the socket 3 is designed so as to permit the routing of the coil conductor ends 4 and 7 crosswise over an unoccupied space 15, whereby the microcircuit 2 can be readily mounted in said socket 3 so that contact areas 5 of the microcircuit 2 are directly aligned over said coil conductor ends 4 and 5 in this unoccupied space 15.
  • this concept is implemented by providing the socket 3 with an open recess 15 over which the conductors 4 and 7 are routed crosswise.
  • the open recess 15 is designed to perform the alignment of the microcircuit 2 in place so that the contact areas 5 of the microcircuit 2 will be located at the conductor ends 4 and 7.
  • the dimensions of the open recess 15 must be essentially conformant to the outer dimensions of the microcircuit 2.
  • the conductor ends 4 and 7 are bonded to the contact areas 5 by soldering or weld ⁇ ing. After the bonding phase, excess material from the socket 3 and the conductor ends 4 and 7 are trimmed away along the marked line 9.
  • the coil 1 and the microcircuit 2 are protected with a suitable encapsulation structure by, e.g., laminating the structure from both sides with a suitable plastic material.
  • the encapsulating structure can also be formed by casting the coil 1 and the microcircuit 2 into a polymer resin.
  • the coil 11 in this embodiment is essentially conformant to the outer shape of the smart card, while the socket 10 is U- shaped.
  • the bonding of the coil conductors 4 and 7 is assured in this embodi- ment by routing the conductor ends crosswise over the U-shaped slot, thereby permitting direct alignment of the microcircuit 2, and in particular, its contact areas 5 under the conductor ends 4 and 7.
  • the U-shaped slot 13 has a width equal to that of the microcircuit 2. Correct insertion of the microcircuit into the U-shaped slot 13 is assured by firmly pushing the microcircuit 2 fully home to the bottom of the slot. Gravity assisted placement is also possible by tilting the combination coil 11/socket 10 so as to permit dropping the microcircuit in place. Removal of excess material is performed in the same manner along the marked line 9 as illustrated in the diagram of Fig. 1.
  • the microcircuit 2 is inserted into the socket 3 or 10 from, e.g., a carrier film, or alternatively, using a robot with machine vision.
  • a further characterizing requirement in the implementation of the invention is that at least one external dimension of the recess or slot arrangement 15, 13 is designed to be essentially conformant with an outer dimension of the microcircuit 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

Procédé de raccordement d'un circuit intégré (2) à la bobine de couplage par induction (1, 11) d'une carte à mémoire, et ensemble pour carte à mémoire à couplage par induction. Selon le procédé, pendant la phase de fabrication de ladite bobine (1), on intègre à cette dernière une douille (3) comprenant un ensemble à concavité/fente ouverte (15, 13), à laquelle douille sont fixées les extrémités des conducteurs (4, 7) de la bobine (1, 11) de manière qu'elles passent sur l'ensemble à concavité/fente ouverte (13, 15) de la douille, et on relie les zones de contact (5) du circuit intégré (2) aux sections desdits conducteurs (4, 7) qui passent sur l'ensemble à concavité/fente ouverte (13, 15).
PCT/FI1993/000138 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction WO1993020537A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP93907879A EP0746826A1 (fr) 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI921420A FI89752C (fi) 1992-04-01 1992-04-01 Foerfarande foer anslutning av en mikrokrets till en induktiv spole i ett smartkort samt anordning vid ett induktivt smartkort
FI921420 1992-04-01

Publications (1)

Publication Number Publication Date
WO1993020537A1 true WO1993020537A1 (fr) 1993-10-14

Family

ID=8535015

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FI1993/000138 WO1993020537A1 (fr) 1992-04-01 1993-04-01 Procede de raccordement d'un circuit integre a la bobine de couplage par induction d'une carte a memoire, et ensemble pour carte a memoire a couplage par induction

Country Status (3)

Country Link
EP (1) EP0746826A1 (fr)
FI (1) FI89752C (fr)
WO (1) WO1993020537A1 (fr)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281A1 (fr) * 1994-02-14 1995-08-18 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
WO1995026538A1 (fr) * 1994-03-28 1995-10-05 David Finn Procede de production d'une carte a puce et carte a puce ainsi realisee
FR2721733A1 (fr) * 1994-06-22 1995-12-29 Gemplus Card Int Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé.
WO1996007984A1 (fr) * 1994-09-05 1996-03-14 Siemens Aktiengesellschaft Procede de fabrication d'un module de carte a puce pour cartes a puce sans contact
WO1997004415A1 (fr) * 1995-07-17 1997-02-06 David Finn Module pour carte a circuits imprimes, ainsi que procede et dispositif pour sa fabrication
US5606488A (en) * 1990-04-19 1997-02-25 Sokymat Sa Miniaturized printed circuit and coil assembly
DE19616424A1 (de) * 1996-04-25 1997-10-30 Manfred Dr Michalk Elektrisch isolierendes Material mit einem elektronischen Modul
DE19620242A1 (de) * 1996-05-20 1997-11-27 David Finn Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters
US5946198A (en) * 1994-10-21 1999-08-31 Giesecke & Devrient Gmbh Contactless electronic module with self-supporting metal coil
EP0786357A4 (fr) * 1994-09-22 2000-04-05 Rohm Co Ltd Carte de ci du type sans contact et procede de fabrication de cette carte
US6233818B1 (en) 1996-02-12 2001-05-22 David Finn Method and device for bonding a wire conductor
WO2006108289A1 (fr) * 2005-04-12 2006-10-19 Sierra Wireless, Inc. Antenne d'encapsulation dielectrique
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof
US8090407B2 (en) 2007-06-27 2012-01-03 On Track Innovations Ltd. Contactless smart SIM

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987002806A1 (fr) * 1985-11-04 1987-05-07 Dalson Artacho Element portatif de memorisation de donnees et dispositif d'enregistrement et de lecture de donnees
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
US4960983A (en) * 1987-09-28 1990-10-02 Mitsubishi Denki Kabushiki Kaisha Noncontact type IC card and system for noncontact transfer of information using the same
US4999742A (en) * 1988-12-27 1991-03-12 Eta Sa Fabriques D'ebauches Electronic module for a small portable object such as a card or a key incorporating an integrated circuit
WO1991016718A1 (fr) * 1990-04-19 1991-10-31 Ake Gustafson Procede d'assemblage d'une bobine sur un circuit imprime

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1987002806A1 (fr) * 1985-11-04 1987-05-07 Dalson Artacho Element portatif de memorisation de donnees et dispositif d'enregistrement et de lecture de donnees
DE3721822C1 (en) * 1987-07-02 1988-11-10 Philips Patentverwaltung Chip card
US4960983A (en) * 1987-09-28 1990-10-02 Mitsubishi Denki Kabushiki Kaisha Noncontact type IC card and system for noncontact transfer of information using the same
US4999742A (en) * 1988-12-27 1991-03-12 Eta Sa Fabriques D'ebauches Electronic module for a small portable object such as a card or a key incorporating an integrated circuit
WO1991016718A1 (fr) * 1990-04-19 1991-10-31 Ake Gustafson Procede d'assemblage d'une bobine sur un circuit imprime

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5606488A (en) * 1990-04-19 1997-02-25 Sokymat Sa Miniaturized printed circuit and coil assembly
EP0671705A3 (fr) * 1994-02-14 1998-06-17 Gemplus Card International Procédé de fabrication d'une carte sans contact et carte sans contact
FR2716281A1 (fr) * 1994-02-14 1995-08-18 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5598032A (en) * 1994-02-14 1997-01-28 Gemplus Card International Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module
WO1995026538A1 (fr) * 1994-03-28 1995-10-05 David Finn Procede de production d'une carte a puce et carte a puce ainsi realisee
FR2721733A1 (fr) * 1994-06-22 1995-12-29 Gemplus Card Int Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé.
EP0692770A1 (fr) * 1994-06-22 1996-01-17 Gemplus Card International Procédé de fabrication d'une carte sans contact par surmoulage et carte sans contact obtenue par un tel procédé
WO1996007984A1 (fr) * 1994-09-05 1996-03-14 Siemens Aktiengesellschaft Procede de fabrication d'un module de carte a puce pour cartes a puce sans contact
US5809633A (en) * 1994-09-05 1998-09-22 Siemens Aktiengesellschaft Method for producing a smart card module for contactless smart cards
EP0786357A4 (fr) * 1994-09-22 2000-04-05 Rohm Co Ltd Carte de ci du type sans contact et procede de fabrication de cette carte
US5946198A (en) * 1994-10-21 1999-08-31 Giesecke & Devrient Gmbh Contactless electronic module with self-supporting metal coil
WO1997004415A1 (fr) * 1995-07-17 1997-02-06 David Finn Module pour carte a circuits imprimes, ainsi que procede et dispositif pour sa fabrication
US6233818B1 (en) 1996-02-12 2001-05-22 David Finn Method and device for bonding a wire conductor
DE19616424A1 (de) * 1996-04-25 1997-10-30 Manfred Dr Michalk Elektrisch isolierendes Material mit einem elektronischen Modul
DE19620242C2 (de) * 1996-05-20 1999-11-04 David Finn Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters bei der Herstellung einer Transpondereinheit
DE19620242A1 (de) * 1996-05-20 1997-11-27 David Finn Verfahren und Vorrichtung zur Kontaktierung eines Drahtleiters
WO2006108289A1 (fr) * 2005-04-12 2006-10-19 Sierra Wireless, Inc. Antenne d'encapsulation dielectrique
US7345636B2 (en) 2005-04-12 2008-03-18 Sierra Wireless, Inc. Dielectric encapsulating antenna
US8090407B2 (en) 2007-06-27 2012-01-03 On Track Innovations Ltd. Contactless smart SIM
US8028923B2 (en) 2007-11-14 2011-10-04 Smartrac Ip B.V. Electronic inlay structure and method of manufacture thereof

Also Published As

Publication number Publication date
FI921420A0 (fi) 1992-04-01
FI89752C (fi) 1993-11-10
EP0746826A1 (fr) 1996-12-11
FI89752B (fi) 1993-07-30

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