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WO1993016667A9 - Sonde cryogenique - Google Patents

Sonde cryogenique

Info

Publication number
WO1993016667A9
WO1993016667A9 PCT/US1993/001782 US9301782W WO9316667A9 WO 1993016667 A9 WO1993016667 A9 WO 1993016667A9 US 9301782 W US9301782 W US 9301782W WO 9316667 A9 WO9316667 A9 WO 9316667A9
Authority
WO
WIPO (PCT)
Prior art keywords
cryogenic probe
charging stand
probe
cryogenic
heat
Prior art date
Application number
PCT/US1993/001782
Other languages
English (en)
Other versions
WO1993016667A1 (fr
Filing date
Publication date
Application filed filed Critical
Publication of WO1993016667A1 publication Critical patent/WO1993016667A1/fr
Publication of WO1993016667A9 publication Critical patent/WO1993016667A9/fr

Links

Definitions

  • the invention relates to the field of medical instruments and more particularly to the field of cryogenic medical instruments.
  • One method of treating of papilloma and other body surface lesions involves placing a cryogenic probe on the portion of the body surface to be treated and allowing the surface layer of cells to freeze.
  • the act of freezing the papilloma or lesion results in the death of the surface layer of cells, similar to that which occurs in blistering.
  • the dead cells are sloughed away leaving a new surface layer.
  • such treatment is performed using a cotton swab which is first dipped in liquid nitrogen.
  • the swab is then applied to the body surface to be treated.
  • the liquid nitrogen cools the swab, which in turn cools the body surface. Once the temperature of the swab is raised above the freezing point of water, the swab is removed from the body surface.
  • the present invention relates to a portable cryogenic probe having an internal power source and a reservoir of a phase change material which may be precooled and is capable of absorbing a large amount of heat from the tip of the probe.
  • the cryogenic probe includes a thermoelectric heat pump and portable power source and actively pumps heat from a probe tip to the reservoir by means of a thermoelectric heat pump.
  • This embodiment may be used in conjunction with a charging stand which, in one embodiment, includes a power supply for electrically charging the portable power source of the cryogenic probe and a thermoelectric heat pump for thermally charging the reservoir of the cryogenic probe.
  • cryogenic probe includes a second thermoelectric heat pump in which, in conjunction with the first thermoelectric heat pump aids in pumping heat from the probe tip to the reservoir.
  • the embodiment of the charging stand used with this embodiment includes a power supply to electrically charge the portable power source of the cryogenic probe and a heat sink to aid in dissipating heat absorbed by the reservoir during use.
  • cryogenic probe includes a reservoir without a thermoelectric heat pump.
  • This embodiment may be used in conjunction with an embodiment of a charging stand that includes two adjacent thermoelectric heat pumps and which is used to precool the reservoir prior to use.
  • This embodiment of the cryogenic probe may also be used in conjunction with an embodiment of a charging stand that includes two thermoelectric heat pumps in conjunction with a second reservoir of phase change material located in the charging stand. Heat is pumped from the reservoir of the charging stand by both thermoelectric heat pumps, while the cryogenic probe is being used, so as to precool the reservoir of the charging stand. Heat is pumped from the reservoir of the cryogenic probe to the reservoir of the charging stand when the cryogenic probe is position in the charging stand.
  • Fig. 1 is a block diagram of an embodiment of the invention
  • Fig. la is a perspective view of an embodiment of an active cryogenic probe of the invention
  • Fig. lb is a perspective view of an embodiment of a passive cryogenic probe of the invention.
  • Fig. 2 is a block diagram of an embodiment of the invention including the active cryogenic probe shown in Fig. la and a charging stand;
  • Fig. 3 is a diagram of an embodiment of one end of the cold reservoir of the invention.
  • Fig. 3a is a diagram of another embodiment of one end of the cold reservoir of the invention.
  • Fig. 4 is a block diagram of another embodiment of the invention including the cryogenic probe shown in Fig. la and a charging stand;
  • Fig. 4a is a block diagram of an embodiment of the invention including the passive cryogenic probe shown in Fig. lb and a charging stand;
  • Fig. 4b is a schematic diagram of another embodiment of the invention including the passive cryogenic probe shown in Fig. lb and a charging stand. DESCRIPTION OF THE PREFERRED EMBODIMENTS Structure:
  • a cryogenic probe 10 of the invention includes a probe tip 16 and a cold reservoir 18.
  • the probe tip 16 transfers heat from a body 8, in contact with the probe tip 16, to the cold reservoir 18, thereby cooling the body 8.
  • the cryogenic probe 10 may be constructed as an active cryogenic probe or a passive cryogenic probe.
  • An active cryogenic probe actively pumps heat from the probe tip 16 to the cold reservoir 18.
  • heat is transferred from the probe tip 16 to the cold reservoir 18 simply by conduction.
  • an embodiment of an active cryogenic probe 10 ' constructed in accordance with the invention includes a housing 12 having a switch 14, an external electrical connector 20 and a removable, disposable or sterilizable, probe tip 16.
  • the cryogenic probe 10' is of a size and shape which permits it to be held comfortably in the hand of an operator, such as a clinician.
  • the switch 14 controls the active pumping of heat relative to the probe tip 16.
  • the position and orientation of the switch 14 on the housing 12 permits the operator to control the direction of the active pumping of heat using a finger or thumb of the hand holding the active cryogenic probe 10'.
  • the external electrical connector 20 permits the power source of the active cryogenic probe 10' to be charged when the probe is not being used.
  • Fig. lb is a perspective diagram'of an embodiment of a passive cryogenic probe 10" constructed in accordance with the invention.
  • this embodiment includes a housing 12 and a removable, disposable or sterilizable, probe tip 16.
  • this embodiment does not actively pump heat from the probe tip 16, it does not include a switch 14 or external electrical connector 20.
  • this passive cryogenic probe 10" does not include the components of the active cryogenic probe 10' required to actively pump heat from the probe tip 16, the passive cryogenic probe 10" may be made smaller than the active cryogenic probe 10'.
  • the probe tip 16 is made of a material which has good thermal conductance, such as aluminum.
  • the probe tip 16 is removably attachable to either the active or passive cryogenic probe 10', 10" by any number of attachment means known to the art. These include, but are not limited to screw threads or snap-lock connectors.
  • attachment means known to the art. These include, but are not limited to screw threads or snap-lock connectors.
  • the use of a removable probe tip 16 permits the probe tip 16 to be changed between patients to lessen the danger of contamination.
  • the removable probe tip 16 also permits for more rapid recharging of the cold reservoir 18 as will be discussed below.
  • Fig. 2 depicts a block diagram of an embodiment of the active cryogenic probe 10' shown in Fig. la, with the probe tip 16 removed and the active cryogenic probe 10' positioned in a charging stand 20.
  • a semiconductor thermoelectric heat pump 30 is located adjacent the end of the housing 12 to which is attached the probe tip 16.
  • the base 17 of the probe tip 16 is in thermal contact with one surface of the semiconductor thermoelectric heat pump 30.
  • the opposite surface of the semiconductor thermoelectric heat pump 30 is in thermal contact with the cold reservoir 18.
  • the semiconductor thermoelectric heat pump 30 is capable of pumping heat from the probe tip 16 into the cold reservoir 18 when current flows through the semiconductor thermoelectric heat pump 30 in one predetermined direction and is capable of pumping heat from the cold reservoir 18 into the probe tip 16 when the flow of current through the semiconductor thermoelectric heat pump 30 is reversed.
  • the material of the cold reservoir 18 changes phase as heat is pumped into or out of it. As heat is pumped from the cold reservoir 18, the material of the cold reservoir 18 changes phase and "stores cold". In this phase, the material of the cold reservoir 18 is capable of acting as a heat sink for the semiconductor thermoelectric heat pump 18.
  • Some of the phase change materials which are suitable for the application shown include water and ethylene glycol, water and alcohol and water and glycerine. These materials undergo a solid/liquid phase transition in the range of temperatures desired. That is, a cold reservoir 18 containing 5 to 15 grams of any of these materials is capable of reaching temperatures of 0°C to less than -35°C.
  • the cold reservoir 18 in one embodiment, is constructed with a bellows 32 at the end of the cold reservoir 18 opposite the end to which the probe tip 16 is attached. As the phase material expands (arrow E) , the bellows 32 expand to accommodate the increased volume.
  • incorporating flexible and resilient end materials 34 may be used to permit the end of the cold reservoir 18 to expand, without rupturing, when cooled.
  • the semiconductor thermoelectric heat pump 30 is powered by a power source 40, such as a high energy density battery, located within the housing 12.
  • a power source 40 such as a high energy density battery
  • This power source is capable of producing relatively high current (for example 1.5 amps) at a low voltage (for example 2 volts) .
  • Probe electronics 42 which will be discussed in detail below, are also located within the housing 12.
  • the switch 14 connects the power source 40 with the semiconductor thermoelectric heat pump 30.
  • the switch 14 permits current to flow from the power source 40 through the semiconductor thermoelectric heat pump 30 in the direction required for the semiconductor thermoelectric heat pump 30 to pump heat from the probe tip 16 into the cold reservoir 18.
  • the switch 14 permits current to flow from « the power source 40 through the semiconductor thermoelectric heat pump 30 in the opposite direction, permitting heat to 5 be pumped from the cold reservoir 18 to the probe tip 18.
  • the semiconductor thermoelectric heat pump 30 is disconnected from the power source 40.
  • the charging stand 22 is
  • one surface of the semiconductor thermoelectric pump 30 is in thermal contact with a surface 24 of the charging stand 22. Additionally, the external electrical connector 20 of the active cryogenic probe 10' engages an electrical contact 23 in the charging stand 22. Power from an AC source is
  • base electronics 26 determines the level of charge of the
  • the base electronics 26 detects the presence of the active cryogenic probe 10' in the charging stand 22, either by virtue of the current being drawn to
  • the base electronics 26 detects the presence of the active cryogenic probe 10' in the charging stand 22, the base
  • 35 electronics 26 acts also to thermally charge the cold reservoir 18. Specifically, the base electronics 26 energizes a second semiconductor thermoelectric heat pump 44 located within the charging stand 22 to pump heat from the surface 24 of the charging stand 22 to a heat sink 46. Because the surface 24 is in thermal contact with the semiconductor thermoelectric heat pump 30 of active cryogenic probe 10' heat is drawn from the semiconductor thermoelectric heat pump 30. The base electronics 26 also energizes a fan 48 to help dissipate the heat absorbed by the heat sink 46.
  • This arrangement of components provides a cold surface 24 which is capable of absorbing heat from the cold reservoir 18 of the active cryogenic probe 10' by way of the semiconductor thermoelectric heat pump 30 as follows.
  • the probe electronics 42 of the active cryogenic probe 10' detects when the active cryogenic probe 10' is positioned in the charging stand 22 and acts to thermally charge the cold reservoir 18.
  • the probe electronics 42 does this by passing current through the semiconductor thermoelectric heat pump 30, such that the semiconductor thermoelectric heat pump 30 pumps heat from the cold reservoir 18 to the surface 24 of the charging stand 22.
  • heat is pumped from the cold reservoir 18 by the semiconductor thermoelectric heat pump 30 to the surface 24 of the charging stand and out through the heat sink 46 by means of a second semiconductor thermoelectric heat pump 44.
  • the probe electronics 42 uses a temperature probe 50 located in the cold reservoir 18 to determine when the cold reservoir 18 is at the desired temperature. When this predetermined temperature is reached, the probe electronics 42 disconnects power to the semiconductor thermoelectric heat pump 30. Power supplied to the semiconductor thermoelectric heat pump 30 either may be drawn from the power source 40, which is being recharged by the base electronics 26 or power may be drawn directly from the base electronics 26 by way of the current path including electrical contact 23, the external electrical contact 20 and the probe electronics 42.
  • Fig. 4 depicts another embodiment of an active cryogenic probe 10'. In this embodiment, to compensate for the fact that the charging stand 22' does not include a semiconductor thermoelectric heat pump 44 to help cool the surface 24 and thereby draw heat from the cold reservoir 18, a second semiconductor thermoelectric heat pump 30' has been added.
  • This second semiconductor thermoelectric heat pump 30' is connected such that when the active cryogenic probe 10' is in the charging stand 22', both semiconductor thermoelectric heat pumps 30, 30' are energized.
  • the semiconductor thermoelectric heat pumps 30, 30' are arranged such that heat pumped from the cold reservoir 18, by the first semiconductor thermoelectric heat pump 30 is then pumped from the first semiconductor thermoelectric heat pump 30 by the second semiconductor thermoelectric heat pump 30'. The heat is then pumped into the surface 24 of the charging stand 22' and out through the heat sink 46.
  • the base electronics 26 of the charging stand 22' again detects the presence of the active cryogenic probe 10' and activates a fan 48 to help cool the heat sink 46.
  • This arrangement is capable of rapidly cooling a cold reservoir 18 containing 30 grams of phase change material from a starting temperature of +35° C. In this embodiment, the cold reservoir 18 is not precooled prior to use.
  • the semiconductor thermoelectric heat pumps are used to pump heat from the cold reservoir 18 after use to reduce the temperature of the cold reservoir 18 to about ambient prior to its next use.
  • Fig. 4a depicts an embodiment of the passive cryogenic probe 10" shown in Fig. lb.
  • no electrical components are located in the housing 12 of the passive cryogenic probe 10".
  • a microswitch 60 detects the presence of the passive cryogenic probe 10" in the charging stand 22a and signals the base electronics 26 to reduce the temperature of the cold reservoir 18, by energizing two semiconductor thermoelectric heat pumps 44', 44".
  • the semiconductor thermoelectric heat pumps 44', 44" are arranged such that heat pumped from the surface 24 by the first semiconductor thermoelectric heat pump 44" is then pumped from the first semiconductor thermoelectric heat pump 44" by the second semiconductor thermoelectric heat pump 44'.
  • the heat is then pumped into the heat sink 46 which is cooled by a fan 48 controlled by the base electronics 26 of the charging stand 22a.
  • heat diffuses to the surface 24 of the charging stand 22a from the cold reservoir 18, thereby reducing the temperature of the cold reservoir.
  • the embodiment shown is capable of reducing a cold reservoir 18 containing 1 to 5 grams of phase change material to -35°C.
  • Fig. 4b depicts yet another embodiment of a charging stand 22a' which may be used in conjunction with the passive cryogenic probe 10".
  • the charging stand 22a' includes two semiconductor thermoelectric heat pumps 44', 44".
  • the charging stand 22a' also includes a second cold reservoir 70.
  • the two semiconductor thermoelectric heat pumps 44', 44" are disposed on either side of the second cold reservoir 70 with one semiconductor thermoelectric heat pump 44" in contact with surface 24 and the second semiconductor thermoelectric heat pump 44' in contact with the heat sink 46.
  • each semiconductor thermoelectric heat pump 44', 44" When the passive cryogenic probe 10" is not present in the charging stand 22a' current is passed through each semiconductor thermoelectric heat pump 44', 44" in such a direction that heat is pumped from the second cold reservoir 72 through the surface 24 by one semiconductor thermoelectric heat pump 44” and through the heat sink 46 by the second semiconductor thermoelectric heat pump 44'. However, when the passive cryogenic probe 10" is present in the charging stand 22a' current is passed through each semiconductor thermoelectric heat pump 44', 44” in such a way that heat is pumped from the surface 24 into the second cold reservoir 70 by one semiconductor thermoelectric heat pump 44" and from - li ⁇ the second cold reservoir 70 out through the heat sink 46 by the second semiconductor thermoelectric heat pump 44'.
  • This arrangement provides a precooled second cold reservoir 70 which is capable of rapidly cooling the cold reservoir 18 of the passive cryogenic probe 10".
  • the arrangement has the added benefit that when the passive cryogenic probe 10" is not in contact with the charging stand 22a', the surface 24 of the charging stand 22a' is warmed by the heat pumped out of the second cold reservoir 70 thereby preventing frost from forming on the surface 24.
  • This arrangement is capable of cooling the cold reservoir 18 to -35°C. Operation:
  • the active cryogenic probe 10' is removed from its charging stand 22 (or 22') and the probe tip 16 attached.
  • the switch 14 is placed in the on position and the probe tip 16 allowed to cool by heat being drawn into the cold reservoir 18.
  • the probe tip 16 is touched to the papilloma to be treated and the skin allowed to freeze.
  • the switch 14 is placed in the reverse position and the probe tip 16 permitted to heat by heat being pumped from the cold reservoir 18.
  • the passive cryogenic probe 10 is removed from its charging stand 22a (or 22a') and the probe tip 16 attached. Once the probe tip 16 is on the passive cryogenic probe 10" it is allowed to cool by the conduction of heat to the cold reservoir 18. Once the probe tip 16 is at the desired temperature, the probe tip 16 is touched to the papilloma to be treated and the skin allowed to freeze. Unlike the previous embodiment, once the desired degree of freezing has taken place, the probe tip 16 permitted to heat only by the heat generated by the body in contact with the probe tip 16. It is for this reason that the cold reservoir 18 contains much less material than in the case of the active cryogenic probe 10'. When the probe tip 16 is warm enough to be removed from the skin, the probe tip 16 is withdrawn from the skin surface, the probe tip 16 removed from the passive cryogenic probe, and the passive cryogenic probe 10" replaced in the charging stand 22a (or 22a') to recharge.
  • the probe electronics 42 may include an indicator, such as a light emitting diode visible on the housing, which may indicate when the cold reservoir is at the desired temperature.
  • the cryogenic probe 10 may include infra-red or ultrasonic transducers which are capable of measuring the depth to which tissue freezing is occurring.

Abstract

Une sonde cryogénique (10') comporte un réservoir de froid (18) possédant un matériau de changement de phase et un embout amovible se trouvant en communication thermique avec ledit réservoir de froid (18). La sonde cryogénique (10') peut être utilisée avec une base de charge thermique possédant au moins un dissipateur de chaleur (46), lequel peut prérefroidir le réservoir de froid (18) avant utilisation. La chaleur est pompée entre la sonde cryogénique (10') et la base de charge thermique (22) par des pompes à chaleur thermoélectriques (30, 44).
PCT/US1993/001782 1992-02-26 1993-02-25 Sonde cryogenique WO1993016667A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US84288592A 1992-02-26 1992-02-26
US842,885 1992-02-26
US97493992A 1992-11-12 1992-11-12
US974,939 1992-11-12

Publications (2)

Publication Number Publication Date
WO1993016667A1 WO1993016667A1 (fr) 1993-09-02
WO1993016667A9 true WO1993016667A9 (fr) 1994-02-03

Family

ID=27126372

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1993/001782 WO1993016667A1 (fr) 1992-02-26 1993-02-25 Sonde cryogenique

Country Status (2)

Country Link
AU (1) AU3735593A (fr)
WO (1) WO1993016667A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1010730A7 (nl) * 1996-11-04 1998-12-01 Pira Luc Louis Marie Francis Cryoprobe op basis van peltier module.
DE19752282A1 (de) * 1997-11-26 1999-06-02 Bembenek Peter Dr Med Dent Gerät zur Diagnose und Therapie durch Wärmezufuhr und Wärmeentzug an Körperflächen mittels eines steuerbaren, von einer Spannungsversorgung gespeisten Peltier-Elementes
WO2009057779A1 (fr) * 2007-11-02 2009-05-07 National University Corporation Hamamatsu University School Of Medicine Dispositif de cryothérapie et sonde de cryothérapie
WO2010129993A1 (fr) * 2009-05-11 2010-11-18 The University Of Queensland Dispositif thermo-électrique
GB201318405D0 (en) * 2013-10-17 2013-12-04 Gray David A portable temperature controlled container
WO2023009550A1 (fr) * 2021-07-30 2023-02-02 Ohio State Innovation Foundation Dispositif et procédé pour porte-échantillon à basse température sans vibration destiné aux microscopes électroniques à entrée latérale

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3133539A (en) * 1962-08-06 1964-05-19 Eidus William Thermoelectric medical instrument
US3533397A (en) * 1966-05-04 1970-10-13 Jordan M Scher Diagnostic instrument used in testing patient response to heat,cold and electrical stimuli
US3939842A (en) * 1974-09-05 1976-02-24 Key Pharmaceuticals, Inc. Hemorrhoidal device
US4891483A (en) * 1985-06-29 1990-01-02 Tokyo Keiki Co. Ltd. Heating apparatus for hyperthermia
FR2624956B1 (fr) * 1987-12-18 1990-06-22 Sodern Dispositif de sur-refroidissement temporaire d'un detecteur refroidi
US4841970A (en) * 1988-01-26 1989-06-27 Herbert Rand Cryogenic rectal insert
US5042258A (en) * 1989-08-07 1991-08-27 Sundhar Shaam P Drinking container
IL92209A (en) * 1989-11-03 1994-01-25 Afikim Kvutzat Poalim Lehiyash Thermoelectric device for heating or cooling food and drink containers

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