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WO1993015594A1 - Procede de formation d'un dispositif de circuit imprime et appareil en resultant - Google Patents

Procede de formation d'un dispositif de circuit imprime et appareil en resultant Download PDF

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Publication number
WO1993015594A1
WO1993015594A1 PCT/US1992/008681 US9208681W WO9315594A1 WO 1993015594 A1 WO1993015594 A1 WO 1993015594A1 US 9208681 W US9208681 W US 9208681W WO 9315594 A1 WO9315594 A1 WO 9315594A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conductive material
metallic conductive
further characterized
printed circuit
Prior art date
Application number
PCT/US1992/008681
Other languages
English (en)
Inventor
Dominic R. Errichiello
Original Assignee
Motorola, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola, Inc. filed Critical Motorola, Inc.
Publication of WO1993015594A1 publication Critical patent/WO1993015594A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/89—Coating or impregnation for obtaining at least two superposed coatings having different compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/01—Selective coating, e.g. pattern coating, without pre-treatment of the material to be coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1344—Spraying small metal particles or droplets of molten metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Definitions

  • This invention relates generally to printed circuit board technology.
  • Printed circuit boards are well understood in the art.
  • sheet stock of non-conductive material such as FR-4 plastic
  • a conductive layer such as copper
  • an etch resistant chemical is disposed on the conductive layer in a shape corresponding to a desired electrical circuit.
  • the resultant board is then placed in a chemical bath that removes all conductive material that had not been so chemically treated.
  • a circuit board resulting from the above described process while satisfactory for many applications, is not without certain drawbacks.
  • the copper pattern can be removed from the substrate by various physical forces (including adhesive forces) thereby ruining the circuit. Consequently, care must be taken that the conductive paths formed on the resulting circuit board are not so narrow as to unduly challenge the durability of the copper bond itself.
  • Another problem involves cost. The copper bonding process itself will only function reliably with certain plastic materials. As a result, other plastics costing less will not yield a satisfactory circuit board when using these prior art fabrication techniques.
  • the non-conductive substrate rather than being sheet stock, comprises plastic as molded into a desired shape.
  • the desired shape can be planar like sheet stock circuit boards, a molded circuit board can also have three dimensional features (for example, a pin-out connector can conveniently be molded as part of the board itself).
  • conductive paths including conductive paths that conform to the three dimensional features
  • this approach has the additional advantage of allowing use of less expensive plastic material.
  • This otherwise desirable alternative suffers from at least one particularly significant drawback; copper must be bonded to the substrate in the first instance through use of a chemical electroplating process.
  • Chemical electroplating suffers from a variety of problems. The process requires many hours to prepare a board before the resist and etching processes can occur. This process also requires a significant amount of space in a fabrication facility (yards and yards of tanks of various chemicals are usually required). The process is relatively inefficient, since only 75% of available copper is eventually applied to the board or otherwise utilized in some useful manner; the rest is lost as waste. And finally, the process is environmentally questionable. A wide variety of liquid chemicals are required in the process, and these chemicals all require proper handling prior to use, during use, and after use. Many legal jurisdictions are seriously considering an outright ban on such electroplating processes because of these environmental concerns.
  • a substrate comprised of non-metallic material has a metallic conductive material sprayed thereon. Subsequently, portions of the metallic conductive material can be selectively removed to form a circuit path.
  • the spraying is achieved through use of a thermal spraying method.
  • the substrate can be sprayed on one or both sides of a substantially planar substrate, or on one or many sides of a three dimensional substrate as provided through use of a molded substrate.
  • FIG. 1 comprises a side elevational, sectioned view of a substrate
  • FIG. 2 comprises a side elevational, sectioned view of the substrate having a conductive material sprayed thereon;
  • FIG. 3 comprises a side elevational, sectioned view of a second metallic conductor being sprayed toward the substrate;
  • FIG. 4 comprises a top plan, detailed view of a resulting circuit pattern
  • FIG. 5 comprises a side elevational view of an alternative embodiment
  • FIG. 6 comprises a side elevational, sectioned view of another alternative embodiment
  • FIG. 7 comprises a side elevational view of another alternative embodiment in a subsequent processing step
  • FIG. 8 comprises a perspective detailed view of another embodiment
  • FIG. 9 comprises a side elevational view of yet another embodiment
  • FIG. 10 comprises a side elevational, sectioned view of yet another alternative embodiment
  • FIG. 11 comprises a top plan view of the alternative embodiment depicted in FIG. 10.
  • FIG. 12 comprises a block diagram of a radio.
  • a substrate (100) (FIG. 1) comprised of non-metallic material is provided.
  • This substrate (100) may be comprised of, for example, sheet stock, such as FR-4 or CEM plastic, or the substrate (100) can comprise a molded substrate, in which case the material could be, for example, Hoechst Celenese- Fortron (PPS-resin) or even Amoco-Amodel (PPA-resin).
  • PPS-resin Hoechst Celenese- Fortron
  • PA-resin Amoco-Amodel
  • the substrate (100) can have one or more holes (101) C formed therethrough in accordance with well understood printed circuit board techniques.
  • a thermal spray gun 200 (FIG. 2) (such as a DJ Diamond Jet gun as manufactured by Metco Perkin Elmer), a metallic conductive material is thermal (flame) sprayed (201 ) on to the substrate (100), thereby providing a layer (203) of the metallic conductive
  • the metallic conductive material comprises copper (in a preferred embodiment, this copper is at least 98.5% pure).
  • This flame spraying technique constitutes a
  • the spray gun (200) is positioned between 25.4 and 50.8 centimeters from the substrate (100) during this process. The length of time the gun (200) is maintained in any one position depends upon how much copper build-up is needed in any
  • the bond between the copper and the substrate is considerably stronger than that attained by normal prior art methodology. Also, the process is more efficient; with available unused-material recovery systems known to those skilled in the art of thermal
  • the spray booth requires much less space than does the counterpart equipment in a chemical electroplating process. Also, no dangerous liquid chemicals are required, and hence the process constitutes a significantly more environmentally friendly one. Further, the applicant has determined that this process works successfully with a variety of plastic materials, including significantly less expensive moldable plastic materials. As a result, the cost of the substrate itself can be reduced by as much as 50% to 75% or more as compared to typical prior art sheet stock materials. Lastly, the applicant has determined that the process will also provide a satisfactory conductive coating on the interior walls of holes (101) formed through the substrate (100), a feature often required when constructing a printed circuit device. if desired, a second flame spray step can be included (FIG.
  • the copper can also be tinned in a convenient, efficient, rapid, environmentally friendly manner.
  • a circuit pattern is then chemically imaged on the upper surface, in accordance with well understood prior art technique, with untreated areas then being chemically removed to thereby form a resultant pattern of conductive material (FIG. 4).
  • the conductive patterns (401 , 402, and 404) can be made quite narrow if desired. Such may be desired when current handling requirements are low and space on a circuit board is at a premium.
  • conductive paths that are at least half the width of conductive paths that are safely obtainable with present day techniques can be readily provided.
  • both sides of a substantially planar substrate (100) can be thermally treated as above to provide for a copper layer (203 and 500) and a tin layer (301 and 501) on both sides of the substrate (100).
  • the substrate (100) need only be reversed following thermal spraying of the first side to allow thermal spraying of the second side.
  • opposing spray guns can be utilized to accomplish simultaneous spraying of both sides. So configured, a two-sided circuit board having a two dimensional circuit pattern formed on each side thereof can be attained.
  • the thermal spraying process for the copper material (203) (FIG.
  • FIG. 6 can be selectively controlled to provide for a greater deposition of material at some locations on the substrate (100) than on others.
  • Such an increased deposition appears in FIG. 6 as denoted by reference numeral 600.
  • This may be desired, for example, when imparting a particular desired thermal performance characteristic to a printed circuit device.
  • this area of increased thickness of conductive material (600) could serve, for example, as a small heat sink for a corresponding circuit component that is mounted thereon.
  • such an area of increased thickness could be utilized to handle circuit needs where current densities would be higher than in other areas of the circuit.
  • an illustrative three dimensional figure comprises a four sided box (800) integrally formed, via the molding process, with the substrate (100).
  • the exterior surfaces of this substrate (100), including the three dimensional feature (800) will have a conductive layer bonded thereto.
  • conductive circuit patterns (801 and 802) that conform to the surface characteristics of the substrate (100), including the three dimensional feature (800) itself, thereby yielding a three dimensional circuit pattern on one side of the substrate (100).
  • a particular substrate (100) may have three dimensional features on more than one side thereof.
  • a four sided box may appear on both sides of an otherwise substantially planar substrate (100).
  • three dimensional circuit patterns (801 and 901) can be readily formed on both sides of the substrate (100) in conformance with the contours of the three dimensional features themselves.
  • the above described process can also be used to fabricate multi-layer circuit devices.
  • the circuit patterns (1000 and 1001) that comprise the first circuit layer in this example are formed as described above by thermal spraying copper (203) onto a substrate (100).
  • an insulating layer is formed as described above by thermal spraying copper (203) onto a substrate (100).
  • the printed circuit devices that result from the above described process have a wide variety of industrial applicability.
  • an existing two-way radio (1200) (FIG. 12).
  • the cost of the printed circuit board substrates can be readily reduced by 25% to 75%.
  • the quality of the boards increases significantly.
  • the existing radio (1200) can likely be readily redesigned, from a physical standpoint, to substantially benefit from various three dimensional features that can be readily introduced through use of a molded printed circuit device.
  • thermal spraying to accomplish electroplating with a non-conductive substrate presents significant benefits and freedoms to printed circuit device designers.
  • Significant cost savings, space savings, and freedom of design is significantly enhanced. Concurrent with these gains, the process imposes considerably less stress on the environment.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Un dispositif de circuit imprimé comprend un substrat non conducteur (100) doté d'un matériau métallique conducteur (203) fixé par métallisation à chaud sur au moins une de ses surfaces. Dans un mode de réalisation, les deux faces du substrat (100) sont ainsi traités. Dans un autre mode de réalisation, une seconde couche de matériau conducteur (301), tel que de l'étain, est également appliquée par métallisation à chaud sur la première couche conductrice. Cette technique de métallisation à chaud s'adapte facilement aux profils de surface tridimensionnels rencontrés lorsque l'on utilise des plaquettes moulées.
PCT/US1992/008681 1992-01-30 1992-10-14 Procede de formation d'un dispositif de circuit imprime et appareil en resultant WO1993015594A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82843592A 1992-01-30 1992-01-30
US828,435 1992-01-30

Publications (1)

Publication Number Publication Date
WO1993015594A1 true WO1993015594A1 (fr) 1993-08-05

Family

ID=25251798

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1992/008681 WO1993015594A1 (fr) 1992-01-30 1992-10-14 Procede de formation d'un dispositif de circuit imprime et appareil en resultant

Country Status (5)

Country Link
CN (1) CN1075589A (fr)
IL (1) IL103439A0 (fr)
MX (1) MX9300505A (fr)
TW (1) TW218430B (fr)
WO (1) WO1993015594A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003004261A1 (fr) * 2001-07-03 2003-01-16 N.V. Bekaert S.A. Structure en couches conferant des caracteristiques de protection
US7709766B2 (en) 2002-08-05 2010-05-04 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
EP2273182B1 (fr) * 2009-07-07 2018-12-19 Siteco Beleuchtungstechnik GmbH Elément de support à DEL tridimensionnel doté d'une conductivité thermique

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4477359B2 (ja) * 2002-03-04 2010-06-09 プリンター リミティド プリント回路板に対しソルダーマスクを塗布する方法
CN111263529A (zh) * 2020-01-20 2020-06-09 安捷利（番禺）电子实业有限公司 高频柔性电路板的制备方法、高频柔性电路板及电子设备

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1237098A (fr) * 1959-01-08 1960-07-22 Photocircuits Corp Procédé de formation de circuits imprimés
US3425864A (en) * 1965-07-21 1969-02-04 Templeton Coal Co Method for making electric resistance heaters
JPS5534415A (en) * 1978-09-01 1980-03-11 Sumitomo Bakelite Co Method of manufacturing printed circuit board
US4424408A (en) * 1979-11-21 1984-01-03 Elarde Vito D High temperature circuit board
US4532152A (en) * 1982-03-05 1985-07-30 Elarde Vito D Fabrication of a printed circuit board with metal-filled channels
DD247467A1 (de) * 1986-03-31 1987-07-08 Forschungszentrum Des Werkzeugmaschinenbaues,Dd Verfahren zur beschichtung der oberflaeche/teiloberflaeche von plastsubstraten
US4940623A (en) * 1988-08-09 1990-07-10 Bosna Alexander A Printed circuit board and method using thermal spray techniques
JPH02222593A (ja) * 1989-02-23 1990-09-05 Fuji Xerox Co Ltd 配線基板及びその製造法
DE3928434A1 (de) * 1989-08-24 1991-02-28 Schering Ag Verfahren zur direkten metallisierung eines nicht leitenden substrats

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1237098A (fr) * 1959-01-08 1960-07-22 Photocircuits Corp Procédé de formation de circuits imprimés
US3425864A (en) * 1965-07-21 1969-02-04 Templeton Coal Co Method for making electric resistance heaters
JPS5534415A (en) * 1978-09-01 1980-03-11 Sumitomo Bakelite Co Method of manufacturing printed circuit board
US4424408A (en) * 1979-11-21 1984-01-03 Elarde Vito D High temperature circuit board
US4532152A (en) * 1982-03-05 1985-07-30 Elarde Vito D Fabrication of a printed circuit board with metal-filled channels
DD247467A1 (de) * 1986-03-31 1987-07-08 Forschungszentrum Des Werkzeugmaschinenbaues,Dd Verfahren zur beschichtung der oberflaeche/teiloberflaeche von plastsubstraten
US4940623A (en) * 1988-08-09 1990-07-10 Bosna Alexander A Printed circuit board and method using thermal spray techniques
JPH02222593A (ja) * 1989-02-23 1990-09-05 Fuji Xerox Co Ltd 配線基板及びその製造法
DE3928434A1 (de) * 1989-08-24 1991-02-28 Schering Ag Verfahren zur direkten metallisierung eines nicht leitenden substrats

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PROC. INT. MICROELECTRONICS SYMPOS, F. DITTRICH, SMYTH & WEIR, "Production of Electronic Coatings by Thermal Spraying", pages 274-276. *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003004261A1 (fr) * 2001-07-03 2003-01-16 N.V. Bekaert S.A. Structure en couches conferant des caracteristiques de protection
US7026060B2 (en) 2001-07-03 2006-04-11 N.V. Bekaert S.A. Layered structure providing shielding characteristics
US7709766B2 (en) 2002-08-05 2010-05-04 Research Foundation Of The State University Of New York System and method for manufacturing embedded conformal electronics
EP2273182B1 (fr) * 2009-07-07 2018-12-19 Siteco Beleuchtungstechnik GmbH Elément de support à DEL tridimensionnel doté d'une conductivité thermique

Also Published As

Publication number Publication date
IL103439A0 (en) 1993-03-15
TW218430B (fr) 1994-01-01
MX9300505A (es) 1993-07-01
CN1075589A (zh) 1993-08-25

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