WO1993014618A1 - Apparatus for moulding a lead frame and chips arranged thereon - Google Patents
Apparatus for moulding a lead frame and chips arranged thereon Download PDFInfo
- Publication number
- WO1993014618A1 WO1993014618A1 PCT/EP1993/000073 EP9300073W WO9314618A1 WO 1993014618 A1 WO1993014618 A1 WO 1993014618A1 EP 9300073 W EP9300073 W EP 9300073W WO 9314618 A1 WO9314618 A1 WO 9314618A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lead frame
- mould
- pins
- moulding
- ejecting
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C45/14073—Positioning or centering articles in the mould using means being retractable during injection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
Definitions
- the invention relates to an apparatus for moulding with an encapsulating material, for instance plastic, a lead frame and chips arranged thereon, comprising mould halves enclosing a mould cavity, a feed runner for liquid moulding material, means for respectively opening and closing the mould halves and pins oriented to the lead frame, connected to the mould halves and movable in relation to the relevant mould half for exerting an ejecting force on the lead frame after moulding.
- an apparatus lead frames and the chips arranged thereon are encapsulated with plastic. To this end the lead frame is clamped between both mould halves and the mould cavity is injected full of liquid plastic. After hardening the frame encapsulated with plastic is released from the mould by means of the ejecting pins.
- the mould is opened in the known manner and the ejecting pins fulfil their original function, that is, releasing the moulded lead frame from the mould.
- Such ejecting pins are preferably arranged on each of the mould halves.
- the displacing means can be formed by an actuating member connected to a slide piece receiving the ejecting pins and standing under bias.
- the bias can be derived from a coil spring.
- the position of the ejecting pins on the lead frame is defined by a stop member.
- This stop may be arranged on the mould half remote from the relevant mould half.
- Fig. 1 shows a perspective view of the apparatus according to the invention
- fig. 2 shows a cross sectional view of the apparatus along the line II-II in fig. 1
- fig. 3 shows in perspective view a part of a lead frame already partially encapsulated in the apparatus according to fig. 1 and 2
- fig. 4-7 show schematically the successive process steps of the apparatus according to the invention.
- the apparatus 1 comprises mould halves 2 and 3 which enclose the mould cavity 4. Mould half 2 is stationary and mould half 3 is movable in relation to mould 2 as according to arrow PI and is guided therein by the guide rods 5 and 6. Mould half 3 is connected for this purpose to the pressure plate 7 using connecting pieces 8. Displaceable relative to each of the mould halves is an ejecting pin bed 9 respectively 18 which carries the ejecting pins 11, 12, respectively 13, 14 and 15.
- the slide piece 9 for instance stands under bias of the coil spring 16 which confers on the slide piece 9 a bias force directed toward the mould space 4. Liquid moulding material is introduced via the runner 20
- the mould half 3 opens the cavity space 4 because this mould half is moved downward according to arrow PI in the drawing as in fig. 1 and 2, the slide piece 9 is released whereby it is likewise moved down ⁇ ward relative to the mould half 2 under the influence of the bias force exerted by the spring 16, wherein the pins 11 and 12 fulfil their ejecting function by applying a force to the moulded lead frame.
- the pins 11 and 12 fulfil their ejecting function by applying a force to the moulded lead frame.
- the same function is subsequently fulfilled by the ejecting pins 13 and 15 in the other mould half.
- the slide piece 9 is connected to the displacing means in the form of an actuating rod 17.
- the actuating rod is designated here with the reference numeral 19.
- the slide piece 9 is displaced in the direction of the mould cavity 4 such that the ejecting pins 11 and 12 come to lie against the lead frame.
- the movement is bounded by a stop member (not drawn) on the other mould half 3. This is shown in fig. 3.
- the lead frame is thus supported because it is clamped on the side edges by the mould halves 2 , 3 and because it is further centered by the ejecting pins referred to in the foregoing.
- the liquid plastic which serves as encapsulating material is then supplied (fig. 4) through the runner 20.
- the pins and the runner 14 are retracted in order to enable filling with plastic of the space formerly occupied thereby. This displacement takes place through operation of the actuating rods 17 and 19 (fig. 1) .
- the movable mould half 3 is subsequently moved to the right in fig. 6 whereby the mould cavity is opened.
- the slide piece 9 is also released, whereby it moves to the right under influence of the bias provided by spring 16, and the ejecting pins 11 and 12 can perform their releasing action.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
In an apparatus for moulding with encapsulating material a lead frame and chips arranged thereon, the lead frame is not only supported in the mould cavity defined by the mould halves by clamping of the edge zones of the lead frame but also centered by means of ejecting pins. Ejecting pins have the function of ejecting the lead frame out of the mould cavity after completion of the moulding cycle. An additional support is obtained by placing the pins onto the led frame during moulding. Shortly before the end of the moulding cycle the pins are retracted from the frame in order to enable filling with plastic of the space formerly occupied by the ejecting pins.
Description
APPARATUS FOR MOULDING A LEAD FRAME AND CHIPS ARRANGED THEREON
The invention relates to an apparatus for moulding with an encapsulating material, for instance plastic, a lead frame and chips arranged thereon, comprising mould halves enclosing a mould cavity, a feed runner for liquid moulding material, means for respectively opening and closing the mould halves and pins oriented to the lead frame, connected to the mould halves and movable in relation to the relevant mould half for exerting an ejecting force on the lead frame after moulding. With such an apparatus lead frames and the chips arranged thereon are encapsulated with plastic. To this end the lead frame is clamped between both mould halves and the mould cavity is injected full of liquid plastic. After hardening the frame encapsulated with plastic is released from the mould by means of the ejecting pins.
In addition to clamping the side edges of the lead frame between the mould halves, it is desirable during moulding to additionally centre the unattached portion of the lead frame on which the chip is also mounted. There is the danger that under pressure of the liquid moulding material the frame will be bent or otherwise damaged by forces exerted thereon.
It is therefore the object of the invention to provide means to additionally support the lead frame with the chip mounted thereon. This is achieved by displacing means for displacing the pins between a position on the lead frame and a position at a distance from the lead frame.
By moving the ejecting pins onto the frame during moulding an additional support of the lead frame with the chip mounted thereon is obtained using the pins. Shortly before the end of the moulding process the pins are
retracted from the frame in order to ensure that the plastic also fills up the space formerly occupied by the ejecting pins.
After the moulding cycle the mould is opened in the known manner and the ejecting pins fulfil their original function, that is, releasing the moulded lead frame from the mould.
Such ejecting pins are preferably arranged on each of the mould halves. The displacing means can be formed by an actuating member connected to a slide piece receiving the ejecting pins and standing under bias.
The bias can be derived from a coil spring.
The position of the ejecting pins on the lead frame is defined by a stop member. This stop may be arranged on the mould half remote from the relevant mould half.
The invention will be further elucidated with reference to the annexed drawings.
In the drawings: Fig. 1 shows a perspective view of the apparatus according to the invention, fig. 2 shows a cross sectional view of the apparatus along the line II-II in fig. 1; fig. 3 shows in perspective view a part of a lead frame already partially encapsulated in the apparatus according to fig. 1 and 2, fig. 4-7 show schematically the successive process steps of the apparatus according to the invention.
The apparatus 1 comprises mould halves 2 and 3 which enclose the mould cavity 4. Mould half 2 is stationary and mould half 3 is movable in relation to mould 2 as according to arrow PI and is guided therein by the guide rods 5 and 6. Mould half 3 is connected for this purpose to the pressure plate 7 using connecting pieces 8. Displaceable relative to each of the mould halves is an ejecting pin bed 9 respectively 18 which carries the ejecting pins 11, 12, respectively 13, 14 and 15. The slide piece 9 for instance stands under bias of the coil spring 16
which confers on the slide piece 9 a bias force directed toward the mould space 4. Liquid moulding material is introduced via the runner 20
When, after moulding, the mould half 3 opens the cavity space 4 because this mould half is moved downward according to arrow PI in the drawing as in fig. 1 and 2, the slide piece 9 is released whereby it is likewise moved down¬ ward relative to the mould half 2 under the influence of the bias force exerted by the spring 16, wherein the pins 11 and 12 fulfil their ejecting function by applying a force to the moulded lead frame. The same function is subsequently fulfilled by the ejecting pins 13 and 15 in the other mould half.
According to the invention the slide piece 9 is connected to the displacing means in the form of an actuating rod 17. The same provision is likewise arranged vice-versa in respect of the slide piece 18 in the other mould half. The actuating rod is designated here with the reference numeral 19. Using the actuating rod 17 the slide piece 9 is displaced in the direction of the mould cavity 4 such that the ejecting pins 11 and 12 come to lie against the lead frame. The movement is bounded by a stop member (not drawn) on the other mould half 3. This is shown in fig. 3. The same applies for the pins 12 and 15, this being brought about by the slide piece 19. The lead frame is thus supported because it is clamped on the side edges by the mould halves 2 , 3 and because it is further centered by the ejecting pins referred to in the foregoing. The liquid plastic which serves as encapsulating material is then supplied (fig. 4) through the runner 20. At the end of the injection operation the pins and the runner 14 are retracted in order to enable filling with plastic of the space formerly occupied thereby. This displacement takes place through operation of the actuating rods 17 and 19 (fig. 1) .
The movable mould half 3 is subsequently moved to the right in fig. 6 whereby the mould cavity is opened. The slide piece 9 is also released, whereby it moves to the
right under influence of the bias provided by spring 16, and the ejecting pins 11 and 12 can perform their releasing action.
After the mould half 3 has moved completely to the right the ejecting pins 13 and 15 are released whereby the moulded lead frame is also released from the other mould half 3. The moulding cycle is then completed.
Claims
1. Apparatus for moulding with an encapsulating material, for instance plastic, a lead frame and chips arranged thereon, comprising mould halves enclosing a mould cavity, a feed runner for liquid moulding material, means for respectively opening and closing the mould halves and pins oriented toward the lead frame, connected to the mould halves and movable in relation to the relevant mould half for exerting an ejecting force on the lead frame after moulding, characterized by displacing means for displacing the pins between a position on the lead frame and a position at a distance from the lead frame.
2. Apparatus as claimed in claim l, characterized in that ejecting pins are arranged on each of the mould halves.
3. Apparatus as claimed in claim l, characterized in that the displacing means are formed by an actuating member connected to a slide piece receiving the ejecting pins and standing under bias.
4. Apparatus as claimed in claim 3, characterized in that the bias is derived from a coil spring.
5. Apparatus as claimed in claim 1, characterized in that the position on the lead frame is defined by a stop member.
6. Apparatus as claimed in claim 5, characterized in that the stop member for defining the position on the lead frame is arranged on the mould half remote from the relevant mould half.
*****
AMENDED CLAIMS
[received by the international Bureau on 13 May 1993 (13.05.93); original claims 1-6 replacedby amended claims 1-4 (1 page)]
1. Apparatus for moulding with an encapsulating material, for instance plastic, a lead frame and chips arranged thereon, comprising mould halves enclosing a mould cavity, a feed runner for liquid moulding material, means for respectively opening and closing the mould halves and pins oriented toward the lead frame, connected to the mould halves and- movable in relation to the relevant mould half for exerting an ejecting force on the lead frame after moulding and displacing means for displacing the pins between a position on the lead frame and a position at a distance from the lead frame, characterized in that the displacing means are formed by an actuating member connected to a slide piece receiving the ejecting pins and standing under bias. 2. Apparatus as claimed in claim 1, characterized in that the bias is derived from a coil spring.
3. Apparatus as claimed in claim 1, characterized in that the position on the lead frame is defined by a stop member. 4. Apparatus as claimed in claim 3, characterized in that the stop member for defining the position on the lead frame is arranged on the mould half remote from the relevant mould half.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE9200028 | 1992-01-13 | ||
| BE9200028 | 1992-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1993014618A1 true WO1993014618A1 (en) | 1993-07-22 |
Family
ID=3886090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP1993/000073 WO1993014618A1 (en) | 1992-01-13 | 1993-01-11 | Apparatus for moulding a lead frame and chips arranged thereon |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO1993014618A1 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2287214A (en) * | 1994-02-23 | 1995-09-13 | Matsushita Electric Works Ltd | Injection molding-in method of embedding a workpiece |
| WO1996000645A1 (en) * | 1994-06-29 | 1996-01-11 | Itt Automotive Europe Gmbh | Process for the thin-walled potting of an electronic circuit precisely aligned with the cast wall and electronic circuit therefor |
| GB2401479A (en) * | 2003-03-12 | 2004-11-10 | Samsung Electronics Co Ltd | Method of encapsulating semiconductor devices on a printed circuit board |
| WO2005104306A1 (en) * | 2004-04-24 | 2005-11-03 | Robert Bosch Gmbh | Method for producing an extruded pressed screen and corresponding screen |
| WO2008113312A1 (en) * | 2007-03-19 | 2008-09-25 | Conti Temic Microelectronic Gmbh | Sensor arrangement |
| CH703121A1 (en) * | 2010-05-10 | 2011-11-15 | Weidmann Plastics Tech Ag | A method for producing a prepared a sheet-like electronic element having plastic container, plastic container according to this method, as well as injection molding tool for carrying out the method. |
| CN109955431A (en) * | 2017-12-22 | 2019-07-02 | 汉达精密电子(昆山)有限公司 | The positioning placing structure of inserts |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2103534A (en) * | 1981-07-28 | 1983-02-23 | Omron Tateisi Electronics Co | Locating inserts during mould filling |
| EP0257681A2 (en) * | 1986-08-27 | 1988-03-02 | STMicroelectronics S.r.l. | Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby |
-
1993
- 1993-01-11 WO PCT/EP1993/000073 patent/WO1993014618A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2103534A (en) * | 1981-07-28 | 1983-02-23 | Omron Tateisi Electronics Co | Locating inserts during mould filling |
| EP0257681A2 (en) * | 1986-08-27 | 1988-03-02 | STMicroelectronics S.r.l. | Method for manufacturing plastic encapsulated semiconductor devices and devices obtained thereby |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2287214A (en) * | 1994-02-23 | 1995-09-13 | Matsushita Electric Works Ltd | Injection molding-in method of embedding a workpiece |
| US5639403A (en) * | 1994-02-23 | 1997-06-17 | Matsushita Electric Works, Ltd. | Method of molding a resin article with an embedded workpiece |
| GB2287214B (en) * | 1994-02-23 | 1998-04-01 | Matsushita Electric Works Ltd | Injection molding-in method of embedding a workpiece |
| WO1996000645A1 (en) * | 1994-06-29 | 1996-01-11 | Itt Automotive Europe Gmbh | Process for the thin-walled potting of an electronic circuit precisely aligned with the cast wall and electronic circuit therefor |
| US6056909A (en) * | 1994-06-29 | 2000-05-02 | Itt Manufacturing Enterprises Inc. | Casting mold for precisely aligning an electronic circuit with a cast wall and method of using same |
| GB2401479A (en) * | 2003-03-12 | 2004-11-10 | Samsung Electronics Co Ltd | Method of encapsulating semiconductor devices on a printed circuit board |
| GB2401479B (en) * | 2003-03-12 | 2005-09-28 | Samsung Electronics Co Ltd | Method of encapsulating semiconductor devices on a printed circuit board, and a printed circuit board for use in the method |
| WO2005104306A1 (en) * | 2004-04-24 | 2005-11-03 | Robert Bosch Gmbh | Method for producing an extruded pressed screen and corresponding screen |
| WO2008113312A1 (en) * | 2007-03-19 | 2008-09-25 | Conti Temic Microelectronic Gmbh | Sensor arrangement |
| US8286469B2 (en) | 2007-03-19 | 2012-10-16 | Conti Temic Microelectronic Gmbh | Insert molded electrical contact |
| CH703121A1 (en) * | 2010-05-10 | 2011-11-15 | Weidmann Plastics Tech Ag | A method for producing a prepared a sheet-like electronic element having plastic container, plastic container according to this method, as well as injection molding tool for carrying out the method. |
| WO2011140666A1 (en) * | 2010-05-10 | 2011-11-17 | Weidmann Plastics Technology Ag | Method for producing a plastic container having a planar electronic element, plastic container produced according to said method, and injection mold for carrying out the method |
| US9211665B2 (en) | 2010-05-10 | 2015-12-15 | Weidmann Medical Technology Ag | Method for producing a plastic container having a planar electronic element, plastic container produced according to said method, and injection mold for carrying out the method |
| US9908271B2 (en) | 2010-05-10 | 2018-03-06 | Weidman Medical Technology AG | Method for producing a plastic container having a two-dimensionally extending electronic element, plastic container produced according to said method and injection mold for carrying out the method |
| CN109955431A (en) * | 2017-12-22 | 2019-07-02 | 汉达精密电子(昆山)有限公司 | The positioning placing structure of inserts |
| CN109955431B (en) * | 2017-12-22 | 2021-09-14 | 汉达精密电子(昆山)有限公司 | Positioning and placing structure of insert |
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