WO1993012757A1 - Composition adhesive chargee de metal et procede - Google Patents
Composition adhesive chargee de metal et procede Download PDFInfo
- Publication number
- WO1993012757A1 WO1993012757A1 PCT/US1992/010371 US9210371W WO9312757A1 WO 1993012757 A1 WO1993012757 A1 WO 1993012757A1 US 9210371 W US9210371 W US 9210371W WO 9312757 A1 WO9312757 A1 WO 9312757A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- amalgam
- ethylenically unsaturated
- composition
- unsaturated compound
- composition according
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 77
- 239000000853 adhesive Substances 0.000 title claims abstract description 32
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 title description 15
- 239000002184 metal Substances 0.000 title description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 66
- 229910000497 Amalgam Inorganic materials 0.000 claims abstract description 58
- 239000000945 filler Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 5
- 239000002253 acid Substances 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 150000002148 esters Chemical class 0.000 claims description 8
- AMFGWXWBFGVCKG-UHFFFAOYSA-N Panavia opaque Chemical compound C1=CC(OCC(O)COC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OCC(O)COC(=O)C(C)=C)C=C1 AMFGWXWBFGVCKG-UHFFFAOYSA-N 0.000 claims description 6
- 239000000448 dental amalgam Substances 0.000 claims description 6
- 229910001312 Amalgam (dentistry) Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- OKSUCCKLAIZTQH-UHFFFAOYSA-N Cl[P] Chemical compound Cl[P] OKSUCCKLAIZTQH-UHFFFAOYSA-N 0.000 claims description 2
- 210000003298 dental enamel Anatomy 0.000 abstract description 18
- 210000004268 dentin Anatomy 0.000 abstract description 8
- 239000003479 dental cement Substances 0.000 description 23
- 239000003505 polymerization initiator Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 11
- 230000009977 dual effect Effects 0.000 description 9
- 239000000654 additive Substances 0.000 description 8
- -1 polysiloxane Polymers 0.000 description 7
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000007767 bonding agent Substances 0.000 description 6
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 6
- 229910052698 phosphorus Inorganic materials 0.000 description 6
- 239000011574 phosphorus Substances 0.000 description 6
- 210000001519 tissue Anatomy 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 239000003638 chemical reducing agent Substances 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 239000007800 oxidant agent Substances 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 4
- 229920006223 adhesive resin Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001002 functional polymer Polymers 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000012766 organic filler Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- CMHHITPYCHHOGT-UHFFFAOYSA-N tributylborane Chemical compound CCCCB(CCCC)CCCC CMHHITPYCHHOGT-UHFFFAOYSA-N 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- RMCCONIRBZIDTH-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxy)ethyl 1,3-dioxo-2-benzofuran-5-carboxylate Chemical compound CC(=C)C(=O)OCCOC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 RMCCONIRBZIDTH-UHFFFAOYSA-N 0.000 description 2
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000003926 acrylamides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000004982 aromatic amines Chemical class 0.000 description 2
- 238000009412 basement excavation Methods 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 210000000988 bone and bone Anatomy 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 208000002925 dental caries Diseases 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- DOUHZFSGSXMPIE-UHFFFAOYSA-N hydroxidooxidosulfur(.) Chemical class [O]SO DOUHZFSGSXMPIE-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 125000004437 phosphorous atom Chemical group 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 125000003011 styrenyl group Chemical class [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 2
- BUUPQKDIAURBJP-UHFFFAOYSA-N sulfinic acid Chemical compound OS=O BUUPQKDIAURBJP-UHFFFAOYSA-N 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- CFKBCVIYTWDYRP-UHFFFAOYSA-N 10-phosphonooxydecyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCCCCCOP(O)(O)=O CFKBCVIYTWDYRP-UHFFFAOYSA-N 0.000 description 1
- VDMLVOIDGSOUTA-UHFFFAOYSA-N 2-(4-methylanilino)ethane-1,1-diol Chemical compound CC1=CC=C(NCC(O)O)C=C1 VDMLVOIDGSOUTA-UHFFFAOYSA-N 0.000 description 1
- LTHJXDSHSVNJKG-UHFFFAOYSA-N 2-[2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOCCOC(=O)C(C)=C LTHJXDSHSVNJKG-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- DXYMHGRYYDZAPO-UHFFFAOYSA-L 2-methylprop-2-enoate;zirconium(2+) Chemical compound [Zr+2].CC(=C)C([O-])=O.CC(=C)C([O-])=O DXYMHGRYYDZAPO-UHFFFAOYSA-L 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 241000283690 Bos taurus Species 0.000 description 1
- 240000004160 Capsicum annuum Species 0.000 description 1
- 235000008534 Capsicum annuum var annuum Nutrition 0.000 description 1
- 241000122205 Chamaeleonidae Species 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical group [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 206010061218 Inflammation Diseases 0.000 description 1
- 208000030984 MIRAGE syndrome Diseases 0.000 description 1
- 229910020667 PBr3 Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000004480 active ingredient Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002998 adhesive polymer Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- AWUCVROLDVIAJX-UHFFFAOYSA-N alpha-glycerophosphate Natural products OCC(O)COP(O)(O)=O AWUCVROLDVIAJX-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Chemical group BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Chemical group 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229920003086 cellulose ether Polymers 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000805 composite resin Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005115 demineralization Methods 0.000 description 1
- 230000002328 demineralizing effect Effects 0.000 description 1
- 239000002810 dentin bonding agent Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- FGBJXOREULPLGL-UHFFFAOYSA-N ethyl cyanoacrylate Chemical compound CCOC(=O)C(=C)C#N FGBJXOREULPLGL-UHFFFAOYSA-N 0.000 description 1
- 229940053009 ethyl cyanoacrylate Drugs 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000004054 inflammatory process Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- DZBOAIYHPIPCBP-UHFFFAOYSA-L magnesium;2-methylprop-2-enoate Chemical compound [Mg+2].CC(=C)C([O-])=O.CC(=C)C([O-])=O DZBOAIYHPIPCBP-UHFFFAOYSA-L 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 150000002895 organic esters Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- TWSRVQVEYJNFKQ-UHFFFAOYSA-N pentyl propanoate Chemical compound CCCCCOC(=O)CC TWSRVQVEYJNFKQ-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- IPNPIHIZVLFAFP-UHFFFAOYSA-N phosphorus tribromide Chemical compound BrP(Br)Br IPNPIHIZVLFAFP-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000012763 reinforcing filler Substances 0.000 description 1
- 210000003296 saliva Anatomy 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- PQCHENNROHVIHO-UHFFFAOYSA-M silver;2-methylprop-2-enoate Chemical compound [Ag+].CC(=C)C([O-])=O PQCHENNROHVIHO-UHFFFAOYSA-M 0.000 description 1
- AWUCVROLDVIAJX-GSVOUGTGSA-N sn-glycerol 3-phosphate Chemical compound OC[C@@H](O)COP(O)(O)=O AWUCVROLDVIAJX-GSVOUGTGSA-N 0.000 description 1
- MKWYFZFMAMBPQK-UHFFFAOYSA-J sodium feredetate Chemical compound [Na+].[Fe+3].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O MKWYFZFMAMBPQK-UHFFFAOYSA-J 0.000 description 1
- SONHXMAHPHADTF-UHFFFAOYSA-M sodium;2-methylprop-2-enoate Chemical compound [Na+].CC(=C)C([O-])=O SONHXMAHPHADTF-UHFFFAOYSA-M 0.000 description 1
- CHLCPTJLUJHDBO-UHFFFAOYSA-M sodium;benzenesulfinate Chemical compound [Na+].[O-]S(=O)C1=CC=CC=C1 CHLCPTJLUJHDBO-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- PIMBTRGLTHJJRV-UHFFFAOYSA-L zinc;2-methylprop-2-enoate Chemical compound [Zn+2].CC(=C)C([O-])=O.CC(=C)C([O-])=O PIMBTRGLTHJJRV-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/30—Compositions for temporarily or permanently fixing teeth or palates, e.g. primers for dental adhesives
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/80—Preparations for artificial teeth, for filling teeth or for capping teeth
- A61K6/84—Preparations for artificial teeth, for filling teeth or for capping teeth comprising metals or alloys
- A61K6/847—Amalgams
Definitions
- This invention relates to adhesive compositions comprising an ethylenically unsaturated compound. In another aspect, this invention relates to adhesive compositions comprising a particulate metallic filler. This invention also relates to methods of adhering a restorative material to a substrate, and in another aspect to methods of adhering a dental restorative such as amalgam to hard tissue such as dentin or enamel.
- Dental amalgams and restorative composites are used extensively for intracoronal and extracoronal restorations.
- Amalgam does not adhere to tooth structure and the dentist must prepare the tooth cavity with dovetails and various cutout grooves that mechanically lock the amalgam into the cavity.
- Such preparation results in excavation of more tooth structure than would otherwise be necessary if there was good adhesion between the tooth structure and the amalgam.
- leakage at the interface of the amalgam and cavity wall (known as "microleakage”) tends to occur. This microleakage allows penetration of bacteria, soluble salts, and saliva into any space between the amalgam and tooth structure. This can lead to inflammation, pulp irritation, demineralization of the tooth, corrosion of the amalgam, and other attendant complications.
- An adhesive seal between amalgam and tooth structure could minimize and/or prevent microleakage and allow for a stronger restoration due to excavation of less tooth material.
- Products claiming to make amalgam adhesive to tooth structure are available.
- One such product is sold in a kit under the trademark AMALGAMBONDTM (Parkell Co.).
- AMALGAMBONDTM Parkell Co.
- This product is a liquid adhesive to be coated directly onto tooth structure.
- the active ingredients in the adhesive include 4-META (4-methacryloxyethyl trimellitic anhydride) and TBB (tri-n butyl borane) .
- Articles that describe bonding of amalgam to tooth structure by precoating the tooth with ethylenically unsaturated adhesive resin include M. Staninec and M. Holt, Journal of Prosthetic Dentistry (1988), Vol. 59, pp. 397-402, A. Lacey and M. Staninec, Quintessence International (1989), Vol. 20, pp. 521-524, Y. Aboush and C. Jenkins, Br. Dent. J. (1989), Vol. 166, pp. 255- 257, Y. Aboush and R. Elderton, Br. Dent. J. (1991), Vol. 170, pp. 219-222, and Y. Aboush and R. Elderton, Dent. Mater. (1991), Vol.
- Adhesive compositions that employ phosphorus- containing free-radically polymerizable compounds have been reported, see, e.g., M. Buonocore, . ileman, and F. Brudevold, J. Dent. Res.. 35. 846 (1956), M. Buonocore and M. Quigley, J. Amer. Dent. Assoc.. 57, 807 (1958), M. Anbar and E. Farley, J. Dent. Res.. 53. 879 (1974) , E. Farley, R. Jones, and M. Anbar, . Den . Res.. 56. 1943 (1977), U.S. Pat Nos. 3,882,600,
- U.S. Pat. No. 3,513,123 (Saffir) describes a curable epoxy composition that can be added to amalgam in order to make the amalgam adhere to tooth structure.
- the curable epoxy composition contains a glycidyl ether type resin and a polyamine hardening agent.
- U.S. Pat. No. 4,064,629 (Stoner) describes a method for applying amalgam restorations. The method involves precoating the surfaces of a cavity within a carious tooth with a layer of an "adhesive-met l" lining composition. The metal of the lining composition is amalgamated by diffusion of the mercury from the subsequently applied conventional dental amalgam filling. The "adhesive-metal" lining composition is said to improve corrosion resistance of the dental amalgam filling and also to promote bonding between the amalgam restoration and the cavity surfaces.
- U.S. Pat. No. 4,001,483 (Lee, Jr. et al.) describes dental compositions for sealing margins between tooth structures and amalgam restorations therein, the compositions containing (a) an alkylene glycol di ethacrylate and/or its oligomer, (b) a polymerization initiator, (c) a polymerization accelerator and (d) a secondary monomer additive.
- U.S. Pat. No. 3,574,943 (Stark) describes a method of restoring a carious tooth whereby the cavity is excavated, lined with a layer of a polysiloxane pressure sensitive adhesive polymer dissolved in a fluorocarbon, and filled with amalgam.
- the polysiloxane layer is said to act as a barrier to leakage.
- Japanese Kokai 63-175085 describes an adhesive composition comprising an acid functional monomer, polymer, or copolymer, a vinyl monomer in which the acid functional component is soluble, an organic peroxide, and an aromatic amine or sulfinate salt.
- the composition is said to bond living tooth tissue to composites and amalgams.
- French Patent 2,561,521 describes an intermediate adhesive composition for sealing dental cavities and chemically securing amalgams, comprising a metal powder dispersed in an adhesive varnish.
- the composition contains metal powder, cellulosic varnish, ethyl acetate, amyl propionate, fluoride, and oil of pimento leaf.
- Japanese Kokai 63-250310 describes dental adhesive compositions containing (a) cellulose ether, (b) a vinyl monomer, (c) an organic peroxide, and (d) an aromatic amine or a sulfinate.
- the composition is said to be applicable to a wide variety of restorative materials, including composite resins, amalgam, alumina, gold, alloys, polymethyl methacrylate, polycarbonate, and the like.
- This invention provides an adhesive composition, comprising: (i) an ethylenically unsaturated compound; (ii) a particulate metallic filler that does not interfere with the cure of the ethylenically unsaturated compound, in an amount effective to increase adhesion of amalgam to tooth structure when the composition is used as an intermediate layer between the amalgam and the tooth structure, compared to the adhesion obtained using a like composition absent the particulate metallic filler; and
- This invention also provides an adhesive composition, comprising:
- an ethylenically unsaturated compound (i) an ethylenically unsaturated compound; (ii) a particulate metallic filler that does not interfere with the cure of the ethylenically unsaturated compound, in an amount of about 50 to about 4000 parts by weight based on 100 parts by weight of the ethylenically unsaturated compound; and
- This invention also provides a method of adhering a restorative material to a substrate, comprising the steps of:
- Materials suitable for use as the ethylenically unsaturated compound in a composition of the invention include such materials known to those skilled in the art to be capable of bonding to hard tissue such as dentin, enamel, bone, or the like.
- This compound is a monomer, oligomer, or polymer (or mixture thereof) , preferably suitable for use in the oral environment both in its unpolymerized and polymerized state. Both phosphorylated and phosphorus-free ethylenically unsaturated compounds as well as mixtures thereof are suitable.
- Suitable phosphorus-free ethylenically unsaturated compounds include mono- or poly- (e.g., di-, tri- or tetra- unctional) acrylates and methacrylates such as methyl acrylate, 2-hydroxyethyl acrylate, triethylene- glycol diacrylate, neopentylglycol diacrylate, hexamethyleneglycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, polyalkylene glycol mono- and di-acrylates, urethane mono- or poly-functional acrylates, Bisphenol A diacrylates, and the corresponding methacrylates of the above compounds, as well as acrylamides and methacrylamides, vinyl compounds, styrene compounds, and other olefinically unsaturated compounds suitable for use in the oral environment.
- Representative phosphorus-free ethylenically unsaturated dental adhesives include "SCOTCHBOND 2TM” Dental Adhesive (3M) , “CONCISETM” Enamel Bond (3M) , “TENURETM” Solution Dentin Bonding System (Den-Mat Corp.), “GLUMATM” Bonding System (Columbus Dental Miles, Inc.) and “MIRAGE-BONDTM” Dentin-Enamel Bonding System (Chameleon Dental Products, Inc., see U.S. Pat. Nos. 4,514,527, 4,521,550, 4,588,756, and 4,659,751) .
- Suitable ethylenically unsaturated phosphorylated compounds comprise one or more phosphorus atoms bonded through a carbon, nitrogen, oxygen, or sulfur atom to a radical containing one or more ethylenically unsaturated groups.
- Preferred ethylenically unsaturated groups are ethenyl and 2-propenyl as found, respectively, in acrylate and methacrylate groups.
- One or more of the phosphorus atoms can be bonded to one or more halogen atoms, active hydrogen atoms, or substituted or unsubstituted hydrocarbyl groups (e.g., an alkyl, aryl, alkaryl, or aryalkyl group) .
- Suitable phosphorylated compounds include those comprising an organic ester of one or more acids of phosphorus, the organic radical of said ester containing at least one ethylenically unsaturated group, wherein said ester has chlorine or bromine bonded directly to the phosphorus (hereinafter "halophosphorus acid esters").
- halophosphorus acid esters include halophosphorus acid esters of diglycidyl methacrylate of Bisphenol A (“Bis-GMA") prepared by reacting Bis-GMA with a phosphorus acid halide.
- Phosphorus acid halides that can be reacted with Bis-GMA include P0C1 3 , PC1 3 , PBr 3 , R'0P(0)C1 2 , (R'0) 2 P(0)C1 where R' is a hydrocarbyl radical, preferably one derived from removal of one or more hydroxyl groups from a hydroxyl-containing compound such as 2-hydroxyethyl methacrylate, ethylene glycol, polyethylene glycol, pentaerythritol, and the like, as would result from a reaction of the hydroxyl-containing compound and the phosphorus acid halide.
- R' is a hydrocarbyl radical, preferably one derived from removal of one or more hydroxyl groups from a hydroxyl-containing compound such as 2-hydroxyethyl methacrylate, ethylene glycol, polyethylene glycol, pentaerythritol, and the like, as would result from a reaction of the hydroxyl-containing compound and the phosphorus acid halide
- a particularly preferred class of phosphorylated compounds includes chlorophosphorus acid esters of Bis-GMA.
- An additional suitable class of phosphorylated compounds includes the phosphorus acid esters described in U.S. Pat. Nos. 3,882,600, 3,997,504, 4,222,780, 4,235,633, 4,259,075, 4,259,117, 4,368,043, 4,442,239, 4,499,251, 4,514,342, 4,537,940, 4,539,382 and Japanese published patent application (Koho) No. 85-17235.
- Exemplary members of this class are the compounds 2-methacryloyloxyethyl phenyl phosphate and 10-methacryloyloxydecyl dihydrogen phosphate.
- a further suitable class of phosphorylated compounds includes the pyrophosphate ester derivatives described in U.S. Pat. Nos. 4,383,052 and 4,404,150 and in Japanese Kokai 57-143372 and 57-167364.
- Glycerophosphate dimethacrylate, described in the above-mentioned Buonocore, ileman, and Brudevold publication is also suitable.
- dental adhesives suitable for use as the ethylenically unsaturated compound include those that contain phosphorylated compounds and/or acrylate- or methacrylate-functional polymers. In such dental adhesives either a single phosphorylated compound or a mixture of phosphorylated compounds can be used. Suitable dental adhesives include "SCOTCHBONDTM” Dual Cure Dental Adhesive (3M) , “ALL-B0ND2TM” Universal Dental Adhesive System (Bisco, Inc.), "CLEARFILTM” Photo Bond Light-Cured Dental Bonding Agent (Kuraray Co.,
- compositions of the invention also comprise a particulate metallic filler that does not interfere with the cure of the ethylenically unsaturated compound.
- suitable metallic fillers can be selected by those skilled in the art based on chemical compatibility with the particular ethylenically unsaturated compound and the particular polymerization initiator present in the composition.
- Interference with the cure of the ethylenically unsaturated compound can also be determined empirically, e.g., by adding a selected metallic filler to a mixture of ethylenically unsaturated compound and polymerization initiator, which mixture cures in a satisfactory manner absent the metallic filler. When cure of the metal-containing mixture is attempted, any interference with cure due to the metallic filler will be readily observable.
- the filler can be a pure metal such as those of Groups IVA, VA, VIA, VIIA, VIII, IB, or IIB, aluminum, indium, and thallium of Group IIIB, and tin and lead of Group IVB, or alloys thereof.
- Conventional dental amalgam alloy powders typically mixtures of silver, tin, copper, and zinc, are also suitable.
- the particulate metallic filler preferably has an average particle size of about 1 micron to about 100 microns, more preferably 1 micron to about 50 microns.
- the metallic filler is present in an amount effective to increase adhesion of amalgam to tooth structure when the composition is used as an intermediate layer between the tooth structure and the amalgam, compared to the adhesion obtained using a like composition absent the metallic filler.
- An effective amount in these embodiments can be determined according to the method set forth in the EXAMPLES that follow.
- the particulate metallic filler is present in an amount of 50 to about 4000 parts by weight, preferably about 200 to about 3000 parts by weight based on 100 parts by weight of the ethylenically unsaturated compound.
- a composition of the invention also includes a polymerization initiator in an amount sufficient to effect cure of the composition.
- Suitable polymerization initiators include autocure and light cure polymerization initiators such as those mentioned in columns 28 and 29 of U.S. Pat. No. 4,539,382, chromophore-substituted halomethyl-s-triazines such as those shown in U.S. Pat. No. 3,954,475, and chromophore-substituted halomethyl-oxadiazoles such as those shown in U.S. Pat. No. 4,212,970.
- the polymerization initiator is preferably present in an amount of about 0.01 to about 20 parts by weight, more preferably about 0.1 to about 10 parts by weight, based on 100 parts by weight of ethylenically unsaturated compound.
- Suitable compounds include mono- or polyacrylates and methacrylates such as methyl acrylate, 2-hydroxyethyl acrylate, triethyleneglycol diacrylate, neopentylglycol diacrylate, hexamethyl- eneglycol diacrylate, trimethylolpropane triacrylate, pentaerythritol tetraacrylate, polyalkylene glycol mono- and di-acrylates, urethane mono- or polyfunctional acrylates, Bisphenol A diacrylates, and the corresponding methacrylates of the above compounds, as well as acrylamides and methacrylamides, vinyl compounds, styrene compounds, and other olefinically unsaturated compounds suitable for use in the oral environment.
- compositions of the invention can also contain conventional adjuvants such as accelerators, inhibitors, stabilizers, pigments, dyes, viscosity modifiers, extending or reinforcing fillers, surface tension depressants, wetting aids, antioxidants, and other ingredients known to those skilled in the art.
- adjuvants such as accelerators, inhibitors, stabilizers, pigments, dyes, viscosity modifiers, extending or reinforcing fillers, surface tension depressants, wetting aids, antioxidants, and other ingredients known to those skilled in the art.
- compositions of the invention can be prepared by mixing and packaging the various components according to methods well known to those skilled in the art.
- an appropriate package form keeps the oxidant and the reducing agent apart from each other in order to ensure storage stability of the composition.
- package forms include two-part packages of (a) an ethylenically unsaturated compound, a metallic filler, and a reducing agent in one part and (b) an ethylenically unsaturated compound and an oxidant in the other.
- an organic sulfinic acid (or salt thereof)/amine (or salt thereof)/peroxide ternary system it is also possible to use a three-part package form in which the sulfinic acid and the amine are packaged separately.
- an ethylenically unsaturated compound and a photoinitiator are preferably packaged separately or in a container opaque to light.
- a thermal initiator that initiates polymerization when it is brought into contact with the ethylenically unsaturated compound e.g., tributylborane
- the ethylenically unsaturated compound and the initiator are packaged separately. Such separately packaged components are mixed together shortly before use.
- a composition of the invention can be used as an intermediate layer between a substrate such as hard tissue (e.g., bone, enamel, or dentin) or ceramic, and a restorative material such as a pure metal or alloy, an amalgam, a ceramic composite, or a composite comprising an adhesive polymer (or a mixture of polymers) and a particulate filler.
- a primer may be used, but good adhesion is obtained without the use of auxiliary primers.
- the compositions of the invention generally provide better adhesion than is obtained using the ethylenically unsaturated compound alone.
- the components of a composition of the invention are first combined in appropriate amounts.
- the components can be mixed prior to packaging or they can be packaged as two- or three-part systems and combined just prior to use.
- the resulting composition of the invention can be placed in the form of a thin layer (e.g., by brushing) on either the restorative material or on the substrate.
- the layer can then optionally be cured by appropriate means (e.g., heat including exposure to room temperature, visible light, ultraviolet light, or the like) .
- the other member of the restorative material/substrate pair can then be prepared (e.g., mixed) if necessary and placed on the adhesive layer.
- compositions of the invention involves adhering dental amalgam to tooth structure in a prepared cavity.
- a modified amalgam in order to optimize adhesion to tooth structure.
- a modified amalgam can be produced by admixing particulate additives into conventional amalgam alloy powder.
- the modified amalgam is then prepared in a conventional manner by triturating the modified alloy powder with mercury in an amalgamator.
- the preferred particulate additives are selected from the following groups: 1) acrylate- or methacrylate-functional polymers, 2) metal salts of acrylates or methacrylates, 3) nonmetallic fillers, 4) oxidizing agents, and 5) reducing agents.
- the particulate additives are applicable to the full range of conventional amalgam alloy powders and conventional weight ratios of mercury to amalgam alloy powder.
- Representative acrylate- or methacrylate- functional polymers include poly(alkanoic acid) powder.
- Representative metal salts of acrylates or methacrylates include zinc dimethacrylate, zirconium dimethacrylate, silver methacrylate, sodium methacrylate, and magnesium methacrylate.
- Nonmetallic fillers include both untreated organic fillers and surface-treated fillers.
- Representative nonmetallic fillers, also known as organic fillers include blends of silane-treated OX-50TM pyrogenic silica (Degussa Company) , tetraethyleneglycol dimethacrylate (“TEGDMA”) (Rohm Tech Co.), and Bisphenol A diglycidylether dimethacrylate in a 60:17:17 weight ratio.
- Nonmetallic fillers include zirconia/silica filler either untreated or pretreated with gamma-methacryloxypropyl trimethoxysilane as described in U.S. Pat. No. 4,503,169.
- Preferred oxidizing agents include benzoyl peroxide.
- Preferred reducing agents include sodium benzenesulfinate. Adhesion of amalgam to etched enamel was evaluated as follows: Bovine teeth of similar age and appearance were partially embedded in circular acrylic disks such that the enamel was exposed. The exposed portion of each tooth was ground flat and parallel to the acrylic disc using Grade 120 silicon carbide paper-backed abrasive mounted on a lapidary wheel.
- the polished teeth were removed from the water and dried using a stream of compressed air.
- Phosphoric acid etching gel was applied to the enamel for 15 seconds, rinsed with water, and dried.
- the adhesive composition was applied to the entire enamel surface with a brush and blown into a thin film with compressed air and cured according to manufacturer's instructions.
- a mold made from a 2 mm thick TEFLONTM polytetra- fluoroethylene sheet with a 5 mm diameter circular hole through the sheet was clamped to each polished tooth so that the central axis of the hole in the mold was normal to the polished tooth surface.
- the hole in each mold was filled with a prepared amalgam and allowed to stand for about 15 minutes at room temperature, then stored in distilled water at 37°C for 24 hours. The molds were then carefully removed, leaving a molded button of amalgam attached to each tooth.
- Adhesive strength was evaluated by mounting the acrylic disk in a holder clamped in the jaws of an INSTRONTM tensile testing apparatus with the polished tooth surface oriented parallel to the direction of pull.
- a loop of orthodontic wire (0.44 mm diameter) was placed around the base of the amalgam button adjacent to the polished tooth surface. The ends of the orthodontic wire were clamped in the pulling jaw of the tensile testing apparatus, placing the bond in shear stress. The bond was stressed until it (or amalgam button) failed, using a crosshead speed of 2 mm/min.
- compositions of this invention were prepared by preweighing the metal additive into a mixing well. One drop (approximately 0.03 g) of a phosphorylated ethylenically unsaturated compound (SCOTCHBONDTM Dual Cure Dental Adhesive resin) and one drop (approximately 0.02 g) of a polymerization initiator (SCOTCHBONDTM Dual Cure Dental Adhesive liquid) were added to the metal additive.
- SCOTCHBONDTM Dual Cure Dental Adhesive resin phosphorylated ethylenically unsaturated compound
- SCOTCHBONDTM Dual Cure Dental Adhesive liquid a polymerization initiator
- composition comprising a phosphorus-free ethylenically unsaturated compound was prepared by preweighing the metal additive into a mixing well and adding one drop each of: (i) a combination of a phosphorus-free ethylenically unsaturated compound and dihydroxyethyl-p-toluidine reducing agent (CONCISETM Enamel Bond A) ; and (ii) a combination of a phosphorus-free ethylenically unsaturated compound and benzoyl peroxide oxidizing agent (CONCISETM Enamel Bond B) .
- the components were then mixed rapidly and applied with a brush to the etched enamel.
- the applied adhesive was then cured according to manufacturer's instructions prior to placement of the amalgam.
- compositions comprising a metallic filler and an ethylenically unsaturated compound provide improved shear adhesion to hard tissue and amalgam relative to the unfilled ethylenically unsaturated compound.
- compositions of this invention provided mean shear adhesion values better than those obtained with commercially available hard tissue/amalgam adhesives. Also, it was observed in Comparative Example C-6 that zinc interferes with the cure of the SCOTCHBONDTM Dual Cure Dental Adhesive resin when SCOTCHBONDTM Dual Cure Dental Adhesive liquid was used as the polymerization initiator.
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- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Veterinary Medicine (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Plastic & Reconstructive Surgery (AREA)
- Dental Preparations (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP93900802A EP0623016A1 (fr) | 1991-12-31 | 1992-12-02 | Composition adhesive chargee de metal et procede |
BR9207010A BR9207010A (pt) | 1991-12-31 | 1992-12-02 | Composição adesiva e processo de aderência de um material restaurador a um substrato |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81517291A | 1991-12-31 | 1991-12-31 | |
US07/815,172 | 1991-12-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993012757A1 true WO1993012757A1 (fr) | 1993-07-08 |
Family
ID=25217081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1992/010371 WO1993012757A1 (fr) | 1991-12-31 | 1992-12-02 | Composition adhesive chargee de metal et procede |
Country Status (9)
Country | Link |
---|---|
EP (1) | EP0623016A1 (fr) |
CN (1) | CN1073961A (fr) |
AU (1) | AU3233493A (fr) |
BR (1) | BR9207010A (fr) |
CA (1) | CA2117347A1 (fr) |
IL (1) | IL104008A0 (fr) |
MX (1) | MX9207423A (fr) |
WO (1) | WO1993012757A1 (fr) |
ZA (1) | ZA9210019B (fr) |
Families Citing this family (1)
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SE9402528D0 (sv) * | 1994-07-19 | 1994-07-19 | Astra Ab | Hårdvävnadsstimulerande med el |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4064629A (en) * | 1976-01-26 | 1977-12-27 | The University Of Virginia | Cavity liner for dental restorations |
EP0120559A2 (fr) * | 1983-01-27 | 1984-10-03 | Kuraray Co., Ltd. | Adhésif |
WO1992011837A1 (fr) * | 1991-01-08 | 1992-07-23 | Minnesota Mining And Manufacturing Company | Composition adhesive a base d'amalgame |
-
1992
- 1992-12-02 WO PCT/US1992/010371 patent/WO1993012757A1/fr not_active Application Discontinuation
- 1992-12-02 EP EP93900802A patent/EP0623016A1/fr not_active Withdrawn
- 1992-12-02 BR BR9207010A patent/BR9207010A/pt not_active Application Discontinuation
- 1992-12-02 CA CA002117347A patent/CA2117347A1/fr not_active Abandoned
- 1992-12-02 AU AU32334/93A patent/AU3233493A/en not_active Abandoned
- 1992-12-07 IL IL104008A patent/IL104008A0/xx unknown
- 1992-12-18 MX MX9207423A patent/MX9207423A/es unknown
- 1992-12-23 ZA ZA9210019A patent/ZA9210019B/xx unknown
- 1992-12-30 CN CN92111811A patent/CN1073961A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4064629A (en) * | 1976-01-26 | 1977-12-27 | The University Of Virginia | Cavity liner for dental restorations |
EP0120559A2 (fr) * | 1983-01-27 | 1984-10-03 | Kuraray Co., Ltd. | Adhésif |
WO1992011837A1 (fr) * | 1991-01-08 | 1992-07-23 | Minnesota Mining And Manufacturing Company | Composition adhesive a base d'amalgame |
Also Published As
Publication number | Publication date |
---|---|
ZA9210019B (en) | 1994-06-23 |
MX9207423A (es) | 1993-06-01 |
AU3233493A (en) | 1993-07-28 |
CN1073961A (zh) | 1993-07-07 |
CA2117347A1 (fr) | 1993-07-08 |
BR9207010A (pt) | 1995-12-05 |
IL104008A0 (en) | 1993-05-13 |
EP0623016A1 (fr) | 1994-11-09 |
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