+

WO1993012560A1 - Procede permettant de realiser l'union de plaques de connexion - Google Patents

Procede permettant de realiser l'union de plaques de connexion Download PDF

Info

Publication number
WO1993012560A1
WO1993012560A1 PCT/SE1992/000852 SE9200852W WO9312560A1 WO 1993012560 A1 WO1993012560 A1 WO 1993012560A1 SE 9200852 W SE9200852 W SE 9200852W WO 9312560 A1 WO9312560 A1 WO 9312560A1
Authority
WO
WIPO (PCT)
Prior art keywords
hole
rivet
contact
contact plate
ring
Prior art date
Application number
PCT/SE1992/000852
Other languages
English (en)
Inventor
Sandor Katona
Original Assignee
Sandor Katona
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sandor Katona filed Critical Sandor Katona
Priority to EP93900479A priority Critical patent/EP0617850A1/fr
Publication of WO1993012560A1 publication Critical patent/WO1993012560A1/fr

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/65Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
    • H01R12/69Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals, e.g. crimping terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06Riveted connections
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048Crimping apparatus or processes
    • H01R43/0484Crimping apparatus or processes for eyelet contact members
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/091Locally and permanently deformed areas including dielectric material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10401Eyelets, i.e. rings inserted into a hole through a circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/1059Connections made by press-fit insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954Other details of electrical connections
    • H05K2201/10962Component not directly connected to the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Definitions

  • the present invention relates to a method of securing electrical connection tags to electrical conductors in printed circuits in thermal foils and the like, in which a contact plate is riveted in place near a hole passing through plastic layers and a metal part.
  • thermal foils and other components having printed circuits are extremely thin which makes it difficult to attach contact plates and similar contact members without risk of damage, sparking, poor contact, etc.
  • the object of the invention is to provide a method for solving this and other associated problems, and is characterised in that the contact plate is riveted in place near a hole passing through the plastic layers and a metal foil arranged adjacent to the layers, by means of a rivet, preferably a hollow rivet, which is passed through the hole and bent on the opposite side around an upset at the lower edge of the hole, the hole being made with the aid of a mandrel, suitably hot and at least partly conical in shape, so that the upper edge of the hole is flanged to a recessed sealing surface for the rivet, the central part is formed to an exposed cylindrical metal contact surface against the rivet, and the lower side to a sealing upset, preferably reinforced at the edge, increasing the contact pressure and hermetically sealing the area around the contact surface.
  • a reliable and easily applied contact to the contact plate is thus obtained from the metal foil, and such a thermal foil can easily be applied in a floor with flooring on top with negligible risk of damage to the thermal foil or the flooring.
  • a ring with protrusions directed axially downwards is applied between the contact plate and the upper plastic layer, said ring being pressed through the layer into contact with the metal foil during riveting.
  • This provides better electrical contact between contact plate and metal foil.
  • the ring is suitably coated with electrically conducting paint.
  • Figure 1 shows a hole produced in what is to become a metal foil
  • Figure 2 shows application of a hot mandrel
  • Figure 3 removal of the mandrel
  • Figure 4 application of the contact plate
  • Figures 5 and 6 the arrangement of an intermediate ring provided with protrusions.
  • Figure 1 shows two plastic layers 1, 2 with a metal foil 3 located between them.
  • a hole 4 (diameter Dl) is produced in these three layers 1-3 by means of punching, for instance.
  • the plastic layer 1 may have a thickness of 0.05 mm, for instance, and the layer 2 a thickness of approximately 0.1 mm.
  • the foil 3 is approximately 0.01 mm thick.
  • Figure 2 shows flanging of the hole 4 by means of a conical or partly conical mandrel 5 (temperature 100-300°C). Flanging is performed to a diameter D2 and the ratio D1.D2 is chosen so as to ensure crack-free flanging and suitable fit to the hollow rivet applied subsequently.
  • Figure 3 shows how the mandrel 5 has been removed, the flange hole (D2) thus having been shaped to provide a recessed sealing surface for the hollow rivet 6.
  • the central part has been formed to an exposed metal contact surface 7 against the rivet 6.
  • a sealing upset 8, reinforced at the edge, is formed on the lower side of the hole, increasing the contact pressure and hermetically sealing the area around the contact surface 7.
  • Figure 4 shows how a contact plate 9 has been riveted in place by means of the hollow rivet 6 which has also been bent around the upset 8 on the lower side, thereby producing an electrically conducting connection between metal foil, hollow rivet and contact plate, which is also protected against oxidization.
  • Figure 5 shows the alternative embodiment with a studded ring 10 between the contact plate 9 and the metal foil 3, where the entirely or partially axially directed studs are pressed through the upper layer of plastic 1 into contact with the metal foil 3.
  • the ring 10 is suitably filled with electrically conducting paint, for example mixed with graphite, which fills any cavities and eliminates deformations when applied.
  • Figure 6 shows more in detail the embodiment according to the invention with a studded ring 10 filled with electrically conducting paint, for example mixed with graphite, inserted between the contact plate 9 and plastic foil 1.
  • 3 denotes a metal foil and contact between the plate 9 and foil 3 is ensured in the manner described above.
  • a layer of glass fibre or the like may be applied on the finished plastic foil to protect the foil and the flooring on top of the foil.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Procédé permettant de fixer des cosses de branchement à des conducteurs électriques pris dans des couches thermoisolantes ou des éléments analogues. Une plaque de contact est rivetée en place à l'endroit d'un trou traversant les couches plastiques (1, 2) et l'élément métallique (3). Selon ce procédé, la plaque (9) est rivetée en place près d'un trou (4) traversant les couches de plastique et la couche métallique (3) prise entre les deux premières à l'aide d'un rivet (6) creux. Du côté opposé, le rivet est recourbé autour d'un relèvement (8) formé à l'extrémité inférieure du trou (4), lequel a été formé au moyen d'une broche (5) de forme tronconique élevée à une température suffisamment haute, de telle sorte que le bord supérieur du trou se trouve embouti en creux pour former une surface de joint accueillant le rivet (6), la partie centrale formant un corps cylindrique creux exposant la surface métallique (7) au contact du rivet (6), tandis que la partie inférieure forme un relèvement (8) réalisant un scellement, de préférence renforcé sur son pourtour, ce qui augmente ainsi la pression de contact et assure l'étanchéité de la surface entourant la surface de contact.
PCT/SE1992/000852 1991-12-19 1992-12-10 Procede permettant de realiser l'union de plaques de connexion WO1993012560A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP93900479A EP0617850A1 (fr) 1991-12-19 1992-12-10 Procede permettant de realiser l'union de plaques de connexion

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9103761A SE470275B (sv) 1991-12-19 1991-12-19 Förfaringssätt för att fästa anslutningsbleck till elektriska ledare i tryckt krets
SE9103761-4 1991-12-19

Publications (1)

Publication Number Publication Date
WO1993012560A1 true WO1993012560A1 (fr) 1993-06-24

Family

ID=20384655

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE1992/000852 WO1993012560A1 (fr) 1991-12-19 1992-12-10 Procede permettant de realiser l'union de plaques de connexion

Country Status (4)

Country Link
EP (1) EP0617850A1 (fr)
HU (1) HUT68305A (fr)
SE (1) SE470275B (fr)
WO (1) WO1993012560A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995015594A1 (fr) * 1993-12-01 1995-06-08 Oy Iws International Inc. Manchon de jonction, outillage et procede de confection du manchon
FR2770935A1 (fr) * 1997-11-12 1999-05-14 Peugeot Connexion electrique entre panneaux composites rtm

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2109119A1 (de) * 1970-03-12 1971-09-23 Gen Electric Nietdichtungsvorrichtung
DE2754619A1 (de) * 1977-12-08 1979-06-13 Reinshagen Kabelwerk Gmbh Elektrische anschlussvorrichtung und verfahren zu ihrer herstellung
DE2056378B2 (de) * 1969-11-28 1980-01-03 Mepco/Electra, Inc., New York, N.Y. (V.St.A.) Anschlußteil für elektrische Vorrichtungen mit einem elektrisch leitenden Niet
US4831722A (en) * 1981-10-26 1989-05-23 Burndy Corporation Apparatus and method for installing electrical connectors on flat conductor cable

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2056378B2 (de) * 1969-11-28 1980-01-03 Mepco/Electra, Inc., New York, N.Y. (V.St.A.) Anschlußteil für elektrische Vorrichtungen mit einem elektrisch leitenden Niet
DE2109119A1 (de) * 1970-03-12 1971-09-23 Gen Electric Nietdichtungsvorrichtung
DE2754619A1 (de) * 1977-12-08 1979-06-13 Reinshagen Kabelwerk Gmbh Elektrische anschlussvorrichtung und verfahren zu ihrer herstellung
US4831722A (en) * 1981-10-26 1989-05-23 Burndy Corporation Apparatus and method for installing electrical connectors on flat conductor cable

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995015594A1 (fr) * 1993-12-01 1995-06-08 Oy Iws International Inc. Manchon de jonction, outillage et procede de confection du manchon
US5997338A (en) * 1993-12-01 1999-12-07 Oy Iws International Inc. Conductor joint for connecting an intelligent socket to a cable
FR2770935A1 (fr) * 1997-11-12 1999-05-14 Peugeot Connexion electrique entre panneaux composites rtm
EP0917244A1 (fr) * 1997-11-12 1999-05-19 Automobiles Peugeot Connexion électrique entre panneaux composités R.T.M.

Also Published As

Publication number Publication date
SE470275B (sv) 1993-12-20
HU9401729D0 (en) 1994-09-28
EP0617850A1 (fr) 1994-10-05
HUT68305A (en) 1995-06-28
SE9103761D0 (sv) 1991-12-19
SE9103761L (sv) 1993-06-20

Similar Documents

Publication Publication Date Title
US4663840A (en) Method of interconnecting conductors of different layers of a multilayer printed circuit board
US6247228B1 (en) Electrical connection with inwardly deformable contacts
US5065283A (en) Printed circuit board with busbar interconnections
EP0602609B1 (fr) Connecteur électriques ayant une configuration de bombément supportée
EP1100295A3 (fr) Feuille métallique à condensateurs montés et son procédé de fabrication, et panneau à circuit et son procédé de fabrication
US2683839A (en) Electric circuit components and method of preparing same
DE3712189A1 (de) Tastenfeldabdeckung mit grundplatte
EP0667736B1 (fr) Panneau laminaire pour la production de circuits imprimés, circuit imprimé produit en utilisant ce panneau, et procédé pour sa fabrication
US6444910B1 (en) Structure and method for connecting a flat cable to bus bars
CA2143833A1 (fr) Cartes de circuits imprimes structurees et cartes de circuits imprimes a couche metallique et methode de fabrication de ces cartes
US6338232B1 (en) Waterproof sheet fixing member and method of fixing the same
WO1993012560A1 (fr) Procede permettant de realiser l'union de plaques de connexion
WO1995017983A1 (fr) Structure et procede d'assemblage de plaques de metal
EP0175662A1 (fr) Procédé de fabrication d'éléments métalliques minces en forme de méandres
US4571322A (en) Method for providing insulated holes in conducting substrate
US6291780B1 (en) Method and device for connecting FPCs
EP0835046B1 (fr) Carte de montage de composants, procede de production de cette carte et procede de production du module
EP3111735B1 (fr) Laminé avec fonction électrique à appliquer sur un substrat
KR102245806B1 (ko) Smt용 쉴드캔에 절연층을 형성하는 제조 방법
JPH08778Y2 (ja) 多層誘電体基板
JPS6236313Y2 (fr)
JPH0420785B2 (fr)
JPH05283831A (ja) 銅張積層板
JPH02239684A (ja) 樹脂成形体上への回路パターンの形成法
JPS5930565Y2 (ja) ジヤンクシヨンブロツク用バスバ−と絶縁板の組立体

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA FI HU JP NO US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IE IT LU MC NL PT

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1993900479

Country of ref document: EP

WWP Wipo information: published in national office

Ref document number: 1993900479

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: CA

WWR Wipo information: refused in national office

Ref document number: 1993900479

Country of ref document: EP

WWW Wipo information: withdrawn in national office

Ref document number: 1993900479

Country of ref document: EP

点击 这是indexloc提供的php浏览器服务,不要输入任何密码和下载