WO1993011732A1 - Highly bonding, water-impermeable and hydrolysis-resistant binding layer for metal, ceramic, glass, polymer-plastic composite materials, and dispersion for producing the same - Google Patents
Highly bonding, water-impermeable and hydrolysis-resistant binding layer for metal, ceramic, glass, polymer-plastic composite materials, and dispersion for producing the same Download PDFInfo
- Publication number
- WO1993011732A1 WO1993011732A1 PCT/EP1992/002820 EP9202820W WO9311732A1 WO 1993011732 A1 WO1993011732 A1 WO 1993011732A1 EP 9202820 W EP9202820 W EP 9202820W WO 9311732 A1 WO9311732 A1 WO 9311732A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- dispersion
- methacrylate
- metal
- phenolic resin
- adhesive
- Prior art date
Links
- 239000006185 dispersion Substances 0.000 title claims abstract description 47
- 239000002131 composite material Substances 0.000 title claims abstract description 38
- 229920003023 plastic Polymers 0.000 title claims abstract description 25
- 239000004033 plastic Substances 0.000 title claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 title claims abstract description 20
- 230000007062 hydrolysis Effects 0.000 title claims abstract description 12
- 238000006460 hydrolysis reaction Methods 0.000 title claims abstract description 12
- 239000000919 ceramic Substances 0.000 title claims abstract description 10
- 239000011521 glass Substances 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 12
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 12
- 229920001568 phenolic resin Polymers 0.000 claims description 11
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 10
- 239000005011 phenolic resin Substances 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 150000002734 metacrylic acid derivatives Chemical class 0.000 claims description 8
- -1 methylol groups Chemical group 0.000 claims description 8
- 239000012153 distilled water Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- 239000004922 lacquer Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 4
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 4
- 150000002989 phenols Chemical class 0.000 claims description 3
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- 229930006711 bornane-2,3-dione Natural products 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims 2
- 238000007711 solidification Methods 0.000 claims 2
- 230000008023 solidification Effects 0.000 claims 2
- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 claims 1
- KBXUTBMGSKKPFL-UHFFFAOYSA-N 3-hydroxy-2-methylprop-2-enoic acid Chemical class OC=C(C)C(O)=O KBXUTBMGSKKPFL-UHFFFAOYSA-N 0.000 claims 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000000470 constituent Substances 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000003564 dental alloy Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 239000010431 corundum Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- NNNLYDWXTKOQQX-UHFFFAOYSA-N 1,1-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical compound C=CC(=O)OC(CC)(OC(=O)C=C)OC(=O)C=C NNNLYDWXTKOQQX-UHFFFAOYSA-N 0.000 description 1
- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- WROUWQQRXUBECT-UHFFFAOYSA-N 2-ethylacrylic acid Chemical compound CCC(=C)C(O)=O WROUWQQRXUBECT-UHFFFAOYSA-N 0.000 description 1
- KCHLLAWHWKRZIV-UHFFFAOYSA-N 2-methyl-6-trimethoxysilylhex-2-enoic acid Chemical compound CO[Si](OC)(OC)CCCC=C(C)C(O)=O KCHLLAWHWKRZIV-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- LBJBPGRQRGLKPL-UHFFFAOYSA-N 7-(4-chlorophenyl)-5-naphthalen-2-yl-6-sulfanylidene-2,3-dihydro-1h-pyrrolo[3,4-e][1,4]diazepin-8-one Chemical compound C1=CC(Cl)=CC=C1N1C(=S)C(C(=NCCN2)C=3C=C4C=CC=CC4=CC=3)=C2C1=O LBJBPGRQRGLKPL-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 238000006668 aldol addition reaction Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000003479 dental cement Substances 0.000 description 1
- 239000011350 dental composite resin Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 229910052909 inorganic silicate Inorganic materials 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000002905 metal composite material Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- CQRYARSYNCAZFO-UHFFFAOYSA-N salicyl alcohol Chemical class OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K6/00—Preparations for dentistry
- A61K6/70—Preparations for dentistry comprising inorganic additives
- A61K6/71—Fillers
- A61K6/76—Fillers comprising silicon-containing compounds
Definitions
- Non-stick, water-impermeable and hydrolysis-resistant composite layer for metal, ceramic, glass, poly-plastic composites and
- the invention relates to an adhesive, water-impermeable and hydrolysis-resistant composite layer for metal, ceramic, glass, polymer-plastic composites and a dispersion for their production.
- the composite layer according to the invention is preferably used for composites which are subject to constant mechanical and thermal cycling under simultaneous exposure to moisture, here in particular for composites in dental technology.
- This adhesive forms the link between the inorganic silicate layer and a methacrylate-containing dental plastic, whereby on the one hand the free OH groups of the adhesive silane with the surface OH groups of the silicate layer under condensation reactions to the Silicate layer are chemically bound, while on the other hand via the methacrylate group of the adhesive silane there is a connection, for example to a dental plastic.
- the known methods differ in the methods of applying the silicate layer differently, while the application of the adhesive silane is almost identical in all of the methods described.
- US Pat. No. 4,364,731 describes a method for applying a silicon dioxide layer to metallic dental prosthesis parts by means of a high-frequency magnesium sputtering device. Since a vacuum coating system is required for this, the process is associated with a considerable outlay on equipment.
- the silicate layer is applied by a much simpler flame hydrolysis process of the tetraethoxysilane, although good adhesive strengths of the plastic on the metal are obtained only if the device parameters are strictly observed.
- DD 276453 also describes a process in which a silicate chromium oxide layer is applied to a dental alloy surface by means of a sol-gel solution and is solidified by a subsequent annealing process (320 ° C., 2-8 min).
- Dental alloys with a higher copper content prove to be particularly critical since the tempering process then forms poorly adhering copper (II) oxide on the alloy surface, as a result of which the metal-plastic composite is weakened .
- DE-PS 3802043 describes a method in which the silicate layer is applied by a sandblasting process by adding a certain amount of silicon dioxide with an average particle size ⁇ S ⁇ um to the jet. In the impact area of the corundum particles, local energy densities occur which are sufficient to melt the fine-particle silicate particles onto the metallic surface. Adequate bond strengths can also be achieved with this method only if the operating parameters are adhered to very precisely.
- the invention is therefore based on the object of specifying an adhesive, water-impermeable, hydrolysis-resistant layer which is inexpensive to produce with little outlay on equipment and which is suitable for permanently protecting plastics, in particular methacrylate-containing dental plastics or adhesives, with a high adhesive strength without gaps on metal, To bind glass, ceramic or organic surfaces.
- a dispersion which, according to the invention, consists of a phenol-formaldehyde dispersion (in addition to phenol as the starting monomer for the formaldehyde reaction, phenol derivatives, such as cresols and resorcinol can also be used as reactants) with hydroxymethylated phenol with free methylol groups, Polyvinyl formal or polyvinyl butyral as a plasticizing component, dispersed acrylate, distilled water and acetone. One or more single- or honorary-functional methacrylate compounds are added to this dispersion.
- These polymerizable olefinically unsaturated monomers can also be alkoxysilanes with at least one polymerizable olefinically unsaturated group, such as, for example, methacrylic acid-3-trimethoxysilylpropyl ester or vinyltri ethoxysilane.
- a phenolic resin dispersion to be used for the invention contains 0.5 to 5 g of phenolic resin and phenol with free methylol groups, 0.05 to 0.5 g of poly vinyl formal or polyvinyl butyral, 1 to 5 g of dispersed acrylate, 10 to 30 ml of distilled water and 10 to 30 ml of acetone, the content of pheno with free methylol groups, based on the dispersion, being 0.05 to 0.2% by mass. 2 to 20 g of one or more one- or more-functional methacrylate compounds are added to this dispersion, so that the result is a phenolic resin-methacrylate dispersion according to the invention.
- This dispersion is spread onto a metal, glass, ceramic or organic surface and subjected to a temperature treatment between 120 and 220 ° C.
- the methylolphenols finally condense via the resole and resitol resins to form space-crosslinking resin resins to form the composite layer according to the invention.
- the methacrylate onomers can be incorporated into this phenolic resin network by base-catalytic addition reactions of the methylene group of the methacrylate onomer to the carbonyl function of the aldehyde (aldol addition) or by interpenetrating networks.
- the solution according to the invention has the following
- the applied layer prevents the weakening of the composite water diffusion via a plastic or adhesive to a e.g. Metal alloy surface.
- the layer solidifies in a relatively low temperature range (120-220 ° C), so that it e.g. There is no discoloration or scaling on critical dental alloys.
- the solution according to the invention is completely independent of the composite materials to be brought into contact.
- the solution according to the invention can be easily implemented in any field of application without extensive compliance with process parameters by means of a small outlay on equipment such as simple heat sources.
- the unconditioned surface serves as a comparative value of the bond strength, whereby this surface, like the surfaces used for the invention, is first sandblasted (aluminum corundum 50 to 250 ⁇ m, 1-5 bar).
- a further comparison value is the adhesive strength which is achieved when the solid surfaces are coated only with part of the dispersion according to the invention (dispersion A), and finally, as a third comparison value, the shear strengths which are achieved with the dispersion according to the invention.
- composition of dispersion A is Composition of dispersion A:
- dispersion A alone is applied to sandblasted dental alloys and subjected to a heat treatment at about 120 to 220 ° C., preferably 150 ° C., for about 15 minutes.
- a light-curing opaque based on methacrylate can be applied and polymerized on this surface.
- a cylinder in the example 5 mm in diameter and 2 mm in height is modeled from light-curing plastic and also polymerized.
- the tensile shear strength values of metal-metal bonds listed in Table 3 serve to further confirm the success according to the invention.
- the metal surface conditioning is carried out analogously to the procedure already described for the creation of the metal-plastic composites.
- the overlap length of the bond is 10 mm and the bond area 50 mm. These bonds were cooked for 10 hours.
- Helapox blue (epoxy resin) occupies a certain special position compared to the methacrylate-containing dental adhesives Chemiace, Brilliant enamel kit, Palavit 55 and Microfill pontic. Both the tensile shear strengths of the metal-metal bonds and the compressive shear strengths of the metal-dental composites show that the solution according to the invention can achieve about 100 * higher adhesive strength compared to the unconditioned surfaces.
- the break is a pure cohesive break.
- the invention provides an adhesive, water-impermeable and hydrolysis-resistant composite layer which is suitable for a wide variety of composites and is therefore not restricted to use in dental technology.
- An equally advantageous use of the dispersion according to the invention as a lacquer underlayer is given in machine and body series construction, as a result of which a significant extension of the service life of the composite layer system can be achieved even under tropical conditions.
Landscapes
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Epidemiology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Veterinary Medicine (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dental Preparations (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP92924677A EP0570559B1 (en) | 1991-12-09 | 1992-12-05 | Highly bonding, water-impermeable and hydrolysis-resistant binding layer for metal, ceramic, glass, polymer-plastic composite materials, and dispersion for producing the same |
US08/098,376 US5418262A (en) | 1991-12-09 | 1992-12-05 | Adhesive, waterproof and hydrolysis-resistant bonding layer for metal, ceramic, glass, polymer-plastic bonds and dispersion for producing it |
DE59205973T DE59205973D1 (en) | 1991-12-09 | 1992-12-05 | ADHESIVE, WATERPROOF AND HYDROLYSIS-RESISTANT COMPOSITE LAYER FOR METAL, CERAMIC, GLASS, POLYMER-PLASTIC COMPOSITIONS AND DISPERSION FOR THEIR PRODUCTION |
JP5510581A JPH06505528A (en) | 1991-12-09 | 1992-12-05 | Highly adhesive, waterproof and hydrolytically stable bonding film for bonding metals, ceramics, glasses or polymers to synthetic materials |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4140504 | 1991-12-09 | ||
DEP4140504.8 | 1991-12-09 | ||
DE4228530A DE4228530A1 (en) | 1991-12-09 | 1992-08-27 | Adhesive, water-impermeable binding layer for composites |
DEP4228530.5 | 1992-08-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993011732A1 true WO1993011732A1 (en) | 1993-06-24 |
Family
ID=25909893
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1992/002820 WO1993011732A1 (en) | 1991-12-09 | 1992-12-05 | Highly bonding, water-impermeable and hydrolysis-resistant binding layer for metal, ceramic, glass, polymer-plastic composite materials, and dispersion for producing the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US5418262A (en) |
EP (1) | EP0570559B1 (en) |
JP (1) | JPH06505528A (en) |
AT (1) | ATE136452T1 (en) |
DE (1) | DE59205973D1 (en) |
WO (1) | WO1993011732A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4441124C2 (en) * | 1994-11-18 | 1997-03-27 | Heraeus Kulzer Gmbh | Process for producing a non-stick, moisture-proof plastic coating on a base and its use |
DE19610262A1 (en) * | 1996-03-15 | 1997-09-18 | Bayer Ag | Process for the production of hydrocarbon-driven rigid polyurethane foams |
US5772432A (en) * | 1996-10-18 | 1998-06-30 | Minnesota Mining & Manufacturing Co. | Dental impression tray with improved adhesion to impression material |
US20040209975A1 (en) * | 1997-04-02 | 2004-10-21 | Subelka John C. | Dental composite restorative material and method of restoring a tooth |
US6262142B1 (en) | 1997-04-02 | 2001-07-17 | Dentsply Research & Development | Translucent wear resistant dental enamel material and method |
US6353040B1 (en) * | 1997-04-02 | 2002-03-05 | Dentsply Research & Development Corp. | Dental composite restorative material and method of restoring a tooth |
JP4639036B2 (en) * | 2003-04-30 | 2011-02-23 | トミー株式会社 | Surface treatment method for medical base material, surface treated medical base material, and dental treatment member comprising the base material |
US9156059B2 (en) * | 2011-05-16 | 2015-10-13 | New Hampshire Ball Bearings, Inc. | Self-lubricating surface coating composition |
JP2018522954A (en) | 2015-05-01 | 2018-08-16 | ロード コーポレイション | Adhesive for rubber bonding |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2227309A1 (en) * | 1973-04-30 | 1974-11-22 | Union Carbide Corp | |
EP0223067A1 (en) * | 1985-10-15 | 1987-05-27 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Adhesive and sealant compositions and their use |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011909A (en) * | 1957-01-16 | 1961-12-05 | Pittsburgh Plate Glass Co | Primer comprising an epoxy resin, a phenol-formaldehyde resin and a methyl methacrylate polymer, and method of bonding a vinyl resin coating to a surface therewith |
SU279018A1 (en) * | 1968-07-10 | 1973-10-12 | Е. К. Ашкенази, В. П. Маркар нц, А. Г. Ракин, П. Э. Пюдик | METHOD OF MAKING WOOD-LAYERED PLASTICS |
FR2227293A1 (en) * | 1973-04-30 | 1974-11-22 | Union Carbide Corp | |
JPS526791A (en) * | 1975-07-07 | 1977-01-19 | Agency Of Ind Science & Technol | Process for preparing new phenolic copolymers |
EP0053442B2 (en) * | 1980-12-03 | 1993-05-19 | Imperial Chemical Industries Plc | Dental compositions |
US4364731A (en) * | 1981-01-29 | 1982-12-21 | Board Of Regents, The University Of Texas System | Methods for producing adhesive bonds between substrate and polymer employing an intermediate oxide layer |
DE3332179A1 (en) * | 1982-12-07 | 1984-06-07 | Kulzer & Co GmbH, 6393 Wehrheim | PRIMER |
DE3403894C1 (en) * | 1984-02-04 | 1985-07-25 | Kulzer & Co GmbH, 6393 Wehrheim | Device for coating a metallic dental prosthesis part and method for operating such a device |
DE3802043C1 (en) * | 1988-01-25 | 1989-07-06 | Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De | Process for preparing a metal surface for bonding to plastic by applying a silicon-containing layer, and use of silicon-containing material |
DD276453A1 (en) * | 1988-10-26 | 1990-02-28 | Univ Schiller Jena | METAL / PLASTIC COMPOSITE BODY AND METHOD FOR ITS MANUFACTURE |
JPH0372578A (en) * | 1989-05-30 | 1991-03-27 | Kansai Paint Co Ltd | Double-layered coating film for can internal surface |
-
1992
- 1992-12-05 WO PCT/EP1992/002820 patent/WO1993011732A1/en active IP Right Grant
- 1992-12-05 DE DE59205973T patent/DE59205973D1/en not_active Expired - Fee Related
- 1992-12-05 JP JP5510581A patent/JPH06505528A/en active Pending
- 1992-12-05 EP EP92924677A patent/EP0570559B1/en not_active Expired - Lifetime
- 1992-12-05 US US08/098,376 patent/US5418262A/en not_active Expired - Fee Related
- 1992-12-05 AT AT92924677T patent/ATE136452T1/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2227309A1 (en) * | 1973-04-30 | 1974-11-22 | Union Carbide Corp | |
EP0223067A1 (en) * | 1985-10-15 | 1987-05-27 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Adhesive and sealant compositions and their use |
Also Published As
Publication number | Publication date |
---|---|
EP0570559A1 (en) | 1993-11-24 |
DE59205973D1 (en) | 1996-05-15 |
EP0570559B1 (en) | 1996-04-10 |
JPH06505528A (en) | 1994-06-23 |
US5418262A (en) | 1995-05-23 |
ATE136452T1 (en) | 1996-04-15 |
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