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WO1991013535A1 - Systeme visuel pour le controle de composants electroniques - Google Patents

Systeme visuel pour le controle de composants electroniques Download PDF

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Publication number
WO1991013535A1
WO1991013535A1 PCT/CA1991/000055 CA9100055W WO9113535A1 WO 1991013535 A1 WO1991013535 A1 WO 1991013535A1 CA 9100055 W CA9100055 W CA 9100055W WO 9113535 A1 WO9113535 A1 WO 9113535A1
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WO
WIPO (PCT)
Prior art keywords
camera
component
inspection
leads
components
Prior art date
Application number
PCT/CA1991/000055
Other languages
English (en)
Inventor
Klaus Dietmar Woerner
Gerald Ralph Wootton
Original Assignee
Ats Automation Tooling Systems Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ats Automation Tooling Systems Inc. filed Critical Ats Automation Tooling Systems Inc.
Publication of WO1991013535A1 publication Critical patent/WO1991013535A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

Definitions

  • This invention relates to apparatus for installing fine pitch components onto printed circuit boards (PCBs). More specifically, the invention relates to a vision system used to inspect components prior to mounting them on the circuit board.
  • the vision system, or inspection station can be used in a system which combines component acquisition, inspection and placement in a highly efficient and effective manner, or can also be used as a stand-alone unit through its dedicated microcomputer.
  • Fine pitch components are those electrical components typically intended for surface mounting on printed circuit boards and having very small spacing between leads.
  • Surface mount technology has recently become well known, and typically involves reflow soldering of leads to the surface of the printed circuit board, rather than passing the leads through holes in the board.
  • Robotic devices are now in common use in various industrial processes such as, for instance, the production of electronic circuit boards.
  • One area of technology where it has been found feasible to perform visual inspections using a robotic device relates to the surface mount placement of electronic components including packaged semiconductor chips and fine pitch leaded devices.
  • the increasing miniaturization of critical electronic surface mount components's dimensions introduces considerations which make the capability of 100% inspection (and accept/reject decisions) of surface mount components essential or highly desirable.
  • These smaller electronic components are more fragile and are very easily damaged during routine handling.
  • the rework costs associated with very delicate and very small components are escalating, making placement of damaged components very undesirable.
  • All robotic devices used for visual inspection require a means for inspecting a component.
  • One vision inspection means commonly used is a fixed station in which cameras are fixed in place around a receptacle designed to hold in place a component for inspection, into which vision inspection station a component is deposited by a handling device before inspection, and removed from after inspection, after which a new component is picked up and. this cycle is repeated.
  • Two major flaws intrinsic to such vision inspection assembly designs stem from the extensive and repeated material handling steps necessary for this inspection means. Firstly, repeated extensive handling of components frequently can damage very small and very delicate components, and cause component lead damage.
  • the vision inspection system of the present invention may be used to visually inspect a component contemporaneously with a component acquisition subsystem and a component placement subsystem, and to pass the component through the vision inspection system to a component placement subsystem adjacent the vision inspection system.
  • the method of solving these difficulties is to place the electronic component on a programmable vision inspection pedestal (including programmable illumination) which carries the components on a programmable path from the working envelope of the component acquisition subsystem through a vision inspection assembly and thence into the working envelope of the component placement subsystem.
  • the independent vision inspection pedestal performs its operations contemporaneously with the operations of the component acquisition stage and the placement head. Sequencing in this manner allows components to be placed while other components are simultaneously being inspected, and while still other components are being picked from feeder trays. System cycle time is thus substantially reduced.
  • This pass-through design feature permits unobstructed movement of components from input to output (i.e. the acquisition of a component to its being surface mounted on a printed circuit board). Since motion is a major cycle time component, this pass-through arrangement represents the optimal solution.
  • the inspection stage acts as a buffer queue of size one. In effect, this buys back cycle time so long as the component inspection system part of the cycle is not excessively long.
  • the preferred embodiment of the invention combines transport and inspection steps in a single robotic device, and provides a generic facility for precise three-dimensional inspection of most electronic surface mount components, including chip components and fine pitch leaded devices.
  • the mechanism of the invention is capable of performing the dual programmable functions of both visually inspecting electronic surface mount components and passing a component through the vision inspection system to a pickup point following visual inspection.
  • the vision inspection system concept both in hardware and software design maximizes the use of hardware and software modules which have been developed through extensive experience in printed circuit board factory automation.
  • the invention can programmably analyze the data of a given individual component to determine the least risk use (best fit) for the component, thereby recovering a significant proportion of marginal components and increasing process yield.
  • the system is designed to handle Quad Flat Packs (QFP), Tape Automated Bonded (TAB), and other flat pack leaded components with gull-wing or similar lead forms.
  • QFP Quad Flat Packs
  • TAB Tape Automated Bonded
  • the system uses machine vision to measure X, Y and Z position in 3 dimensions of all leads of a component. From these primary measurements the following inferences are made:
  • Lead pitch error (sweep and skew type); Toe in/out; Body center X;Y;Rz based on all lead tip coordinates;
  • the output of the vision inspection station is a serial data stream, consisting of a combination of the above measurements.
  • the data is available either through a serial port, or through a network card (Ethernet, or Arcnet).
  • the flexibility of the design allows it to perform these tasks in a stand-alone mode for other applications. Since the system is data driven, it gives maximum flexibility to the user. Data files may be easily configured to input key component dimensions and inspection tolerance limits. Similarly, configuration files may describe the type of measurement to be performed and the data type to be transmitted to a host computer. Since the vision inspection station control computer has a hard disk, data logging can be performed on the system and data may be transmitted at a later time to another location.
  • the vision inspection station was designed to inspect any size surface mount component which will fit within the working envelope of the X-Y stage. Component types may be described or changed through data files, without any change to the operating software.
  • the system is fully self-calibrating from three built-in chrome-on-glass reticles, manufactured to a precision of ⁇ .00005 cm. ( ⁇ .000020 inches). Calibration is carried out automatically under software control. Cameras are calibrated from one of the three reticles, which is set at the nominal component lead height. Calibration of the measurement cameras establishes the following:
  • Z-dimension calibration is verified using the other two reticles, which are placed at +25 mm. and -25 mm. (+.010 and -.010 inches) above and below nominal height respectively. This ensures that camera misalignments, mirror block errors and offsets from the rotational axis are fully compensated.
  • the placement alignment camera which has no measurement role, is centered on a fiducial marker with a known relationship to the vacuum quills on the light table. Vacuum quills are then located under the measurement cameras with respect to the fiducial.
  • the system consists of the following major components:
  • AT compatible including vision processor, disk, motion and illumination controller
  • X-Y positioning stage carrying the inspection light table, with vacuum nests and self calibration reticles
  • Optical head mounted on a precision wrist, or rotary indexer; and Framework.
  • An upwards facing vacuum quill is mounted to a programmable precision positioning stage which steps the component past one or more downward looking area cameras mounted to an overhead rotary indexer.
  • the component positioning stage is comprised of two programmable axes (X and Y) each with an approximate 20 cm. (eight inch) programmable travel and extremely high repeatability.
  • the optics that are incorporated allow each of two cameras to see both the top view of the component as well as a 45 degree view of the lead tips in space. Casting both views on the same camera ensures long term optical alignment stability.
  • the purpose of using two cameras with the fields overlapping at the margins is to increase the combined field of view. Illumination is provided by an LED light panel. By using red LEDs and red filters on all cameras the system's susceptibility to ambient lighting conditions is eliminated as ambient lighting normally has a very small component of red energy.
  • a precision chrome-on-glass reticle is mounted on the light table and serves for camera calibration.
  • the reticle incorporates a precision grid of squares photo etched onto the glass plate.
  • any optical distortions in the camera lens are measured as a distortion of the grid lines.
  • the distortions are mapped and used to correct the optical readings.
  • a set of translating coordinates are generated to transform the image seen by the vision system to real world coordinates based on the known alignments of the reticle pattern.
  • the rotary indexer is used to move the inspection camera(s) around the four sides of the component.
  • Each camera is provided with a dedicated image buffer to which camera data is transferred for processing by the system as the component continues to be moved through its inspection path.
  • the image analysis routines perform lead inspection including lead splay, lead toe in, toe out, lead count, coplanarity and lead presence.
  • coplanarity is defined as the largest deviation of a lead tip Z position from the seating plane of the component.
  • the seating plane is evaluated as a roll and pitch from a point at the component's lead center.
  • the Z position of this point is calculated as the average Z position of all the component lead tips.
  • the inspection stage tends to be the slowest stage, and can be operated on an intermittent sampling basis if desired, to achieve greater speed at the expense of some certainty of accuracy, i.e. if a decision is made to forego 100% inspection.
  • the invention does however readily permit 100% inspection if that is desired.
  • Fig. 1 is a perspective view of the preferred embodiment of the overall component installation system
  • Fig. 2 is a perspective view of the vision inspection station of the present invention
  • Fig. 3 is a side view of the station of Fig. 2;
  • Fig. 4 is a front view of the station of Fig. 2;
  • Fig. 5 is a partial perspective view from the rear of the station of Fig. 2;
  • Fig. 6 is another side view of the inspection head of Fig. 2;
  • Fig. 7 is a cross section of the vision inspection head at C-C in Fig. 6;
  • Fig. 8 is a side view of the vision inspection head of Fig. 6 with the side plate removed;
  • Fig. 9 is a front view of the vision inspection head of Fig. 6 with dust cover removed;
  • Fig. 10 is a front view showing the mirror block arrangement;
  • Fig. 11 is a side view of the mirror block arrangement, corresponding to Fig. 10;
  • Fig. 12 is a ray diagram corresponding to Fig. 11;
  • Fig. 13 is a reproduction of the image produced in a camera in the vision inspection head.
  • Fig. 14 is a block diagram of the system.
  • the preferred embodiment of the overall component installation system provides a system which is capable of excising, forming, inspecting, placing and soldering fine pitch components onto printed circuit boards. This invention relates to the inspection stage of that system.
  • the overall component installation system illustrated in Fig. 1, has a base 1. Mounted on top of the base is a top plate 3, to which all system components are mounted.
  • the system has the following main components or subsystems, all directed and sequenced by a personal computer such as an AT-compatible controller: (1) PCB conveyor: A dual belt PCB conveyor 6, which moves boards through the placement stage and allows pass-through board handling. (2) Component installation system: A four-axis placement platform is provided for placement and "hot bar” reflow soldering of fine pitch components onto the surface of the circuit board.
  • the system includes a component acquisition stage 200, the vision inspection stage 300 of the present invention, and a component placement or installation stage 400.
  • the component acquisition stage has a two-axis servo-driven pick and place unit 121, which travels the length of a set f hardened steel tracks 122.
  • the pick and place unit is equipped with a pneumatically-actuated Z-axis vacuum gripper 124 on a vertically compliant slide 126, constituting the third axis.
  • the pickup head namely vacuum quill 130
  • the vacuum quill is then extended and lowered into the tooling for component pickup from the feeder, and transfers it to the vision inspection pedestal 138 of the inspection stage.
  • the vision inspection pedestal 138 has upwardly facing vacuum quills 139 to hold the component in place. Which quill is to be used is selected depending on the size of the component. It is the inspection stage which is the focus of this invention, and it will be described in greater detail below.
  • the quill assembly 20 of the installation stage is movable between a pick-up position at the right end of carriage 21 in Fig. 1, i.e. from the inspection stage, and the installation or deposition position at which quill assembly 20 sits in Fig. 1.
  • the placement stage uses a "split axis" concept involving the three-axis quill assembly 20 and a single-axis board positioning subsystem, all directed and sequenced by a personal computer such as an AT-compatible controller. Incoming boards are positioned in the X axis while the placement head simultaneously moves overhead along the Y axis.
  • the placement head also contains a Z and theta axis resulting in a total of four degrees of freedom for the system.
  • a swivelling ball and socket head at the end of the placement head actually provides even further freedom of movement, lockable in the desired orientation for correct placement.
  • Components are picked from the vision inspection pedestal by the quill assembly 20 and are moved in a straight line past an upward looking camera 158. As the camera field of view is filled strobed "snapshots" are taken of the component to corner register the component leads.
  • “Snapshot” data is collected by a Coreco Oculus 300 (trademark) imaging board which is installed into the system controller backplane. Camera data is analyzed by high level routines written in the C programming language.
  • “Snapshots” are taken of the component held in the placement quill while it is in movement without slowing the motions of the placement head.
  • the placement head has previously examined local placement fiducials with its camera and the board positioning system has been moved to the proper position for placement.
  • the component is then lowered to the surface of the board for installation via reflow soldering.
  • the Vision Inspection System Physical configuration of the vision system is such that it presents a relatively small system footprint of no greater than 0.5 metre per side, exclusive of the space required for feeders.
  • the vision inspection system can be linked to existing lines in a fully pass-through configuration allowing components to pass through the vision inspection system while a component is being inspected.
  • the vision inspection system has the following main components or subsystems, all directed and sequenced by a personal computer such as an AT-compatible controller:
  • Vision inspection pedestal 138 A multi- position pedestal 138 with upwards facing vacuum quills 139, mounted to a programmable micro positioning stage which precisely moves components through the vision inspection assembly and allows pass-through component handling.
  • a gantry 310 with three vertical supports is provided for support of the vision inspection assembly.
  • the vision inspection assembly includes a programmable X-Y table 152, a programmable rotary index table 156, a vision inspection head 304, and a permanent camera calibration device 309.
  • the component inspection platform has been configured as a pass-through system which is accessed by the customer's existing component acquisition stage. Components are passed to an upwards facing vacuum quill 139 on the pedestal 138 mounted to a programmable micro positioning stage which precisely moves the vision inspection pedestal along two programmable axes (X and Y), each with programmable travel and extremely high repeatability, through the vision inspection system directly underneath the vision inspection assembly to the working envelope of the component placement stage.
  • X and Y programmable axes
  • the inspection station includes a programmable X-Y table 152; programmable rotary index table 156; multi-position component pedestal 138 including programmable illumination, vision inspection head 304, including one or more cameras 305, 306, lenses 307, optical multiplexer generally indicated at 308, programmable illumination (not shown); permanent calibration device 309; gantry frame structure generally indicated at 310; and general purpose computer including image processing peripheral hardware and motion control hardware (not shown).
  • the programmable X-Y table 152 comprises a base section 401, an intermediate section 402 and a top section 403.
  • the base section 401 includes plate 404, support 405, and a pair of rails 406. Rails 406 are disposed on opposite sides of the top surface of support 405 to permit the intermediate section 402 to move across the top of support 402.
  • the main structure of the vision inspection assembly is the gantry 310 constructed of stress-relieved materials of constant temperature coefficient, mounted to a base to which all cell tooling and the vision inspection pedestal is mounted. While measurements of components being inspected are being obtained, components are placed at the center of this gantry structure.
  • the camera(s) preferably are also mounted near and rotate about this center, as described below, thereby minimizing the runout error introduced by temperature changes.
  • Mounted to the under surface of the top plane of the gantry is a programmable rotary index table 156.
  • the rotary index table is capable of programmably rotating through 360 degrees in a fixed plane parallel to that of the base to which the gantry is mounted.
  • the vision inspection head 304 is mounted to the rotary index table's surface most proximate to the base to which the gantry and the vision inspection pedestal are attached.
  • the vision inspection head is also capable of programmably rotating through 360 degrees in a fixed plane parallel to that of the base.
  • the vision inspection head comprises one or more cameras, lenses and mirrors, an optical multiplexer, and programmable illumination.
  • Currently commercially available camera and digital image processors restrict the maximum obtainable resolution in the line scanning direction. Since the vision inspection head is mounted on a programmable rotary index table, the camera(s) can always be positioned so that critical measurements are made in the orthogonal direction to video line scanning. Pointing error of the camera(s) and image blurring due to vibration are minimized by maintaining a very short and completely folded optical path. Since this in turn emphasizes the effect of apparent magnitude versus object distance, the required measurement accuracies (less than 4 microns) can only be properly achieved by means of three-dimensional (3-D) imaging which this vision inspection system provides.
  • An additional benefit of a short working distance is that absolute intensity of illumination can be held to reasonable limits (i.e. within a factory setting) .
  • Good quality lighting can be programmably configured to each specific imaging task.
  • Programmable illumination incorporated into the vision inspection pedestal provides backlighting for inspection of component outline.
  • Programmable illumination incorporated into the vision head provides variable frontlighting.
  • the illumination is provided by LED light sources arrayed in such a manner that various rows and columns of LEDs can be programmably switched on and off according to the illumination pattern required for each particular component.
  • Near infrared LEDs and near infrared filters are used on one or more cameras, and thus the vision inspection system's susceptibility to ambient lighting conditions is eliminated, because ambient lighting normally has a very small component of near infrared energy.
  • the optics that are incorporated into the vision inspection head allow each camera to see a top view of the component as well as an angled side elevation view of the lead tips in space.
  • the components After loading components onto the pedestal, the components are moved in a straight line past the two downward-looking cameras. Multiple “snapshots” are taken of the component while the component continues to be moved through its inspection path. The component is then accelerated in the other axis, the overhead cameras are rotated 90 degrees via the turntable 156, and a similar procedure is carried out for the leads on the other two sides of the component.
  • components are loaded onto the pedestal, they are moved to the location of the downward-looking camera.
  • a "snapshot" is taken of the area of the leads on one side of the component, the camera rotates 90 degrees, the component is moved to position another side under the cameras, and another snapshot is taken. The process is repeated until all four sides have been viewed. This inspection may take place on every component, or on an intermittent sampling basis.
  • the vision inspection pedestal conveys the component across the vision inspection system's field of view at a constant velocity.
  • the ability to also programmably offset the vision inspection pedestal motion increases the flexibility of the ⁇ ision inspection system in that one or more pedestals of varying dimensions (designed to support and transport a wide set of variably sized components) may be used to transport a component from the input handoff coordinate to the inspection coordinate(s) to output handoff coordinate, simply by programmably offsetting the X-Y table motions.
  • component changeover may be instantaneous, depending only upon software programming.
  • image planes of approximately 590 (lines) x 800 (elements) x 8 (bit) resolution can be achieved.
  • the vision inspection system overcomes this limitation in two ways. The first is through the use of multiple cameras which are optically and digitally multiplexed to provide a larger composite image plane. The second means involves repositioning the programmable X-Y table such that multiple overlapping images of the component can be accumulated.
  • the use of 3-D imaging is essential to achieving the required precision and accuracy of inspection.
  • the preferred embodiment of this invention achieves stereoscopic 3-D imaging within a single image sensor plane by optically multiplexing two perspectives of the same region of space into the same camera via a single lens.
  • the relationship of the views is controlled stringently by means of a very precisely manufactured array of plane mirrors, as described below, and depends on mechanical parameters alone.
  • a single image sensor is used to detect all of the image data.
  • the stereo images are temporally concurrent and have predictably matched contrast levels.
  • illuminated surfaces and specifically, the vision inspection pedestal backlight
  • the contrast of the stereoscopic views can be compensated for relative intensity by adjusting the optical sensitivity of the two views with independent neutral density filters.
  • the use of independent neutral density filters is essential for optimal performance when digitizing the inspection image to finite resolution (because sub-pixel measurement resolution is sensitive to the effective digital resolution of image contrast).
  • Figs. 10 and 11 are corresponding views, at right angles to each other.
  • Fig. 10 simply shows the mirror arrangement which facilitates the use of two cameras, one to look at each half of the leads on one side of the component, since one camera could not have a sufficiently large field of view without sacrificing resolution.
  • Fig. 11 shows how the simultaneous viewing of the leads from the top and at 45 degrees is achieved.
  • Fig. 13 shows a typical processed image which results.
  • the required three-dimensional information can be calculated from the image.
  • System stability and measurement accuracy can be continuously verified by means of a permanently attached calibration device which is imaged between machine cycles.
  • the calibration device comprises a set of precision glass reticles 309 arranged so that the relationships of optical paths and effects of lens distortion can be determined from the displacement of the grid lines with respect to the vision system coordinates.
  • a set of translating coordinates are developed to transform the image observed by the vision inspection system to real world coordinates based on the known spacing of the reticle pattern. This mapping increases the accuracy of the vision system.
  • a separate 386 compatible computer is provided for control of the vision system and motion control of the X-Y table 152.
  • Camera data is collected and assembled for display on a CRT monitor by vision imaging boards installed into the computer backplane.
  • Camera data is analyzed by high level routines in the C programming language.
  • Component inspection algorithms are data driven such that new components can be accommodated simply by making a local data file entry specifying major component attributes such as lead count, lead spacing and toe-to-toe dimension. Parts are not taught as such, rather a generic software model of the components to be processed is provided allowing new components to be learned from design data alone.
  • Component inspection and positioning algorithms are implemented in a layered fashion such that some parts of the inspection process can be disabled or executed on a sampling basis only.
  • the computer is IBM AT compatible, with industrial enclosure, 80386/20 processor, 80387 coprocessor, minimum 2 MByte memory, 60 MByte hard drive, VGA card and color monitor.
  • the operating system is QNX, in real-time, with multitasking. There i ⁇ a vision processor, vision monitor, Galil X-Y controller with scale readback capability, network card as required, and serial and parallel ports to control the rotary indexer, illumination, and serial communications.
  • the vision routines perform lead inspection including lead splay, lead toe in, lead toe out, lead count, coplanarity and lead presence.
  • the data received as a result of these inspections is compared to lead inspection criteria for each type of component (stored on the microcomputer hard drive) , and each component is either accepted or rejected based on these lead inspection criteria.
  • Component offsets which have passed inspection and been accepted for pickup by the placement head (and later surface mounting to a circuit board) are then carried by the vision pedestal directly under the pickup point for pickup by the quill assembly 20 for placement.
  • Components rejected by the vision inspection stage are picked by the placement head and deposited onto a reject shuttle which moves the component back within reach of the component acquisition stage.
  • the rejected component is transferred to a reject tray.
  • operator attention is not required to remove a rejected component from the placement quill and the reject cycle does not affect the system throughput.
  • the component position within the reject tray is recorded and the failure data corresponding to each component is written to disk for later retrieval.
  • the invention is capable of high speed pattern recognition of randomly-oriented objects, with conventional image acquisition technology. Total cycle time including materials handling should not exceed 10 seconds while maintaining a maximum acceleration limit of 1 g.
  • the invention permits the desired measurement resolution to be achieved with accuracy and repeatability, accounting for additional constraints of temperature stability, resistance to vibration, optimization of optical image quality, and optimization of image sampling.
  • the invention has utility in the field of inspecting components for mounting onto printed circuit boards.

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Dans le système décrit de contrôle des fils de composants électroniques, au moins une caméra est installée sur un cadre et positionnée au-dessus d'une plate-forme de contrôle. La plate-forme est équipée d'une table X-Y programmable qui supporte un bâti d'inspection équipé d'un stylet à vide tourné vers le haut et destiné à recevoir le composant. Le bâti transporte les composants sur un chemin programmable depuis la zone de réception, en passant sous la (les) caméra(s) pour aboutir à la zone de reprise. La (les) caméra(s) est/sont montée(s) de manière rotative autour d'un axe vertical sur une table d'indexage rotative programmable. Chaque caméra dispose d'un tampon d'image spécialisé vers lequel les données de caméra sont transférées pour être traitées par le système au fur et à mesure que le composant suit le trajet de contrôle. Un arrangement à prisme est disposé au-dessous de chaque caméra pour séparer l'image des câbles, de sorte qu'une partie de l'objectif de la caméra reçoit une vue verticale des câbles, alors que l'autre partie observe les câbles sous un angle important par rapport à la verticale. Un ordinateur commande la table X-Y pour amener le composant dans une position où un jeu de câbles se trouve au-dessous de la (des) caméra(s). De cette manière, les données de caméra peuvent être enregistrées sur le tampon d'image pour la caméra, après quoi le composant est amené vers une position où un autre jeu de câbles est placé sous la (les) caméra(s), et pour tourner la table d'indexage rotative programmable afin d'orienter la (les) caméra(s) dans la direction correcte pour permettre la visualisation des câbles. Au moins un réticule d'étalonnage est monté sur la plate-forme, de manière à permettre l'étalonnage de la caméra. Des diodes électroluminescentes dans le proche infrarouge éclairent les composants, et des filtres infrarouges sont utilisés sur les caméras pour éviter toute influence causée par les conditions d'éclairage ambiantes.
PCT/CA1991/000055 1990-02-26 1991-02-26 Systeme visuel pour le controle de composants electroniques WO1991013535A1 (fr)

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GB9004246.6 1990-02-26
GB909004246A GB9004246D0 (en) 1990-02-26 1990-02-26 Vision system for inspection of electronic components

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WO2002029383A3 (fr) * 2000-10-02 2002-07-11 Teradyne Inc Systeme d'inspection optique dote d'une capacite integree d'apprentissage de composant
US7423743B2 (en) 2000-12-29 2008-09-09 Icos Vision Systems Nv Method and an apparatus for measuring positions of contact elements of an electronic component
US7428326B1 (en) * 2001-11-30 2008-09-23 Universal Instruments Corporation Method for improving reliability in a component placement machine by vacuum nozzle inspection
US7508974B2 (en) 1998-01-16 2009-03-24 Scanner Technologies Corporation Electronic component products and method of manufacturing electronic component products
US7891919B2 (en) 2006-01-23 2011-02-22 Hy-Ko Products Company Key duplication machine
US8128322B2 (en) 2006-01-23 2012-03-06 Hy-Ko Products Company Key duplication machine
US9101990B2 (en) 2006-01-23 2015-08-11 Hy-Ko Products Key duplication machine
US9308590B2 (en) 2006-01-23 2016-04-12 Hy-Ko Products Company Key duplication machine
US9514385B2 (en) 2009-05-01 2016-12-06 Hy-Ko Products Company Key blank identification system with groove scanning
US9582734B2 (en) 2009-05-01 2017-02-28 Hy-Ko Products Company Key blank identification system with bitting analysis
US9818041B2 (en) 2015-08-03 2017-11-14 Hy-Ko Products Company High security key scanning system

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US5502890A (en) * 1992-03-24 1996-04-02 Siemens Aktiengesellschaft Process for determining the position and coplanarity of the leads of components
US5687475A (en) * 1992-03-24 1997-11-18 Siemens Aktiengesellschaft Process for determining the position and/or checking the separation and/or checking the coplanarity of the leads of components
US7508974B2 (en) 1998-01-16 2009-03-24 Scanner Technologies Corporation Electronic component products and method of manufacturing electronic component products
WO2002029383A3 (fr) * 2000-10-02 2002-07-11 Teradyne Inc Systeme d'inspection optique dote d'une capacite integree d'apprentissage de composant
US6621566B1 (en) 2000-10-02 2003-09-16 Teradyne, Inc. Optical inspection system having integrated component learning
CN100395540C (zh) * 2000-10-02 2008-06-18 良瑞科技股份有限公司 具有集成元件学习能力的光学检测系统
US7423743B2 (en) 2000-12-29 2008-09-09 Icos Vision Systems Nv Method and an apparatus for measuring positions of contact elements of an electronic component
US7428326B1 (en) * 2001-11-30 2008-09-23 Universal Instruments Corporation Method for improving reliability in a component placement machine by vacuum nozzle inspection
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