WO1991011269A1 - Procede de nettoyage d'ensembles electriques - Google Patents
Procede de nettoyage d'ensembles electriques Download PDFInfo
- Publication number
- WO1991011269A1 WO1991011269A1 PCT/US1991/000594 US9100594W WO9111269A1 WO 1991011269 A1 WO1991011269 A1 WO 1991011269A1 US 9100594 W US9100594 W US 9100594W WO 9111269 A1 WO9111269 A1 WO 9111269A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid
- vapor
- boiling point
- electrical assembly
- cleaned
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 28
- 239000007788 liquid Substances 0.000 claims abstract description 96
- 238000009835 boiling Methods 0.000 claims abstract description 29
- 239000000356 contaminant Substances 0.000 claims abstract description 15
- 238000005507 spraying Methods 0.000 claims abstract description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 26
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 21
- 235000007586 terpenes Nutrition 0.000 claims description 18
- 150000003505 terpenes Chemical class 0.000 claims description 16
- COWKRCCNQSQUGJ-UHFFFAOYSA-N 1,1,2,2,3-pentafluoropropan-1-ol Chemical compound OC(F)(F)C(F)(F)CF COWKRCCNQSQUGJ-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- OHMHBGPWCHTMQE-UHFFFAOYSA-N 2,2-dichloro-1,1,1-trifluoroethane Chemical compound FC(F)(F)C(Cl)Cl OHMHBGPWCHTMQE-UHFFFAOYSA-N 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 14
- 239000002904 solvent Substances 0.000 description 21
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 230000000712 assembly Effects 0.000 description 8
- 238000000429 assembly Methods 0.000 description 8
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 5
- 229930195733 hydrocarbon Natural products 0.000 description 5
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- -1 terpene hydrocarbon Chemical class 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 2
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 2
- 230000000779 depleting effect Effects 0.000 description 2
- 239000002274 desiccant Substances 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 description 1
- PSQZJKGXDGNDFP-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)(F)F PSQZJKGXDGNDFP-UHFFFAOYSA-N 0.000 description 1
- 208000000453 Skin Neoplasms Diseases 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000000855 fermentation Methods 0.000 description 1
- 230000004151 fermentation Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000011874 heated mixture Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000008040 ionic compounds Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000008601 oleoresin Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 201000000849 skin cancer Diseases 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000341 volatile oil Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/024—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/04—Apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Definitions
- Pentafluoropropanol which has a zero ozone depletion potential, has the following significant properties:
- the assembly ( ⁇ 04) to be cleaned is first placed in the primary liquid (103) by passing it through the vapor.
- the assembly (104) is positioned in the vapor layer (102) where it can be sprayed with the primary liquid (105) to remove the remaining contaminants.
- the primary liquid (105) when it strikes the assembly (104), will atomize. This atomization may present the risk of explosion if the atomized mist was exposed to the atmosphere.
- the vapor (102) mixes with the atomized primary liquid from the assembly being cleaned. This vapor mixture is then condensed by the condensing elements (101). The now liquid primary and secondary mixture is returned to the heated primary liquid (103) below where the secondary liquid is again vaporized to repeat the cycle.
- the condensing elements (101) therefore, retains the vapor (102) which, in turn, retains the primary liquid (103).
- FIG 2 illustrates another embodiment of this invention.
- This embodiment is suited for assembly line cleaning of electronic assemblies.
- the electronic assembly is first moved into a terpene wash (201) where it is emersed in heated terpene.
- the assembly next travels through a high pressure terpene spray (202) to remove any remaining impurities.
- the assembly finally travels through an isopropyl alcohol immersion (203) to remove the terpene residue.
- Figure 3 illustrates yet another embodiment of this invention.
- the electronic assembly is lowered through the vapor layer (302) for either immersion in the primary liquid (305) or spraying with primary liquid (301).
- the primary liquid (305) should be kept at a temperature above 83°C to prevent the vapor (302) from condensing on the surface of the primary liquid.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Detergent Compositions (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
On chauffe un mélange d'un liquide primaire et d'un liquide secondaire dans un appareil de chauffage. On chauffe le mélange au moins jusqu'au point d'ébullition du liquide secondaire, mais à une température inférieure au point d'ébullition du liquide primaire. Le liquide secondaire s'évapore (102), formant une couche de vapeur au-dessus du liquide primaire (103). Des éléments de condensation (101), situés à proximité de la partie supérieure de l'appareil de nettoyage, condensent la vapeur (102), la renvoyant au liquide primaire chauffé (103) pour une nouvelle évaporation. L'ensemble électronique (104) à nettoyer est abaissé dans la vapeur, puis il est immergé dans le liquide primaire (103) avant d'être positionné dans la vapeur (102) où il peut être exposé à une pulvérisation de liquide primaire (105) afin d'éliminer les éventuels contaminants restants. La vapeur (102) se mélange au liquide primaire atomisé formé par la pulvérisation, et elle le renvoie au liquide primaire (103).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46911790A | 1990-01-24 | 1990-01-24 | |
| US469,117 | 1990-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO1991011269A1 true WO1991011269A1 (fr) | 1991-08-08 |
Family
ID=23862491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/US1991/000594 WO1991011269A1 (fr) | 1990-01-24 | 1991-01-18 | Procede de nettoyage d'ensembles electriques |
Country Status (2)
| Country | Link |
|---|---|
| IE (1) | IE910220A1 (fr) |
| WO (1) | WO1991011269A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993011280A1 (fr) * | 1991-12-02 | 1993-06-10 | Allied-Signal, Inc. | Systeme de nettoyage a base de solvants multiples |
| EP0588978A4 (fr) * | 1991-06-14 | 1994-03-17 | Petroferm Inc | Composition et procede d'elimination du flux a souder a la resine a l'aide de terpene et d'hydrocarbures. |
| US6355113B1 (en) | 1991-12-02 | 2002-03-12 | 3M Innovative Properties Company | Multiple solvent cleaning system |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1907875A (en) * | 1929-05-10 | 1933-05-09 | Carrier Engineering Co Ltd | Method and apparatus for cleaning articles |
| US3904430A (en) * | 1972-09-07 | 1975-09-09 | Ici Ltd | Cleaning process using a non-azeotrope forming contaminated cleaning mixture |
| US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
| US4828751A (en) * | 1987-08-28 | 1989-05-09 | Pcr, Inc. | Solvent composition for cleaning silicon wafers |
| US4867800A (en) * | 1988-07-21 | 1989-09-19 | E. I. Du Pont De Nemours And Company | Cleaning composition of terpene compound and dibasic ester |
-
1991
- 1991-01-18 WO PCT/US1991/000594 patent/WO1991011269A1/fr unknown
- 1991-01-23 IE IE22091A patent/IE910220A1/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1907875A (en) * | 1929-05-10 | 1933-05-09 | Carrier Engineering Co Ltd | Method and apparatus for cleaning articles |
| US3904430A (en) * | 1972-09-07 | 1975-09-09 | Ici Ltd | Cleaning process using a non-azeotrope forming contaminated cleaning mixture |
| US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
| US4640719B1 (fr) * | 1985-07-01 | 1993-04-27 | Petroferm Inc | |
| US4828751A (en) * | 1987-08-28 | 1989-05-09 | Pcr, Inc. | Solvent composition for cleaning silicon wafers |
| US4867800A (en) * | 1988-07-21 | 1989-09-19 | E. I. Du Pont De Nemours And Company | Cleaning composition of terpene compound and dibasic ester |
| US4867800B1 (en) * | 1988-07-21 | 1995-02-14 | Du Pont | Cleaning composition of terpene compound and dibasic ester |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0588978A4 (fr) * | 1991-06-14 | 1994-03-17 | Petroferm Inc | Composition et procede d'elimination du flux a souder a la resine a l'aide de terpene et d'hydrocarbures. |
| US5679175A (en) * | 1991-06-14 | 1997-10-21 | Petroferm Inc. | Cleaning process including use of solvating and rinsing agents |
| US5716457A (en) * | 1991-06-14 | 1998-02-10 | Petroferm Inc. | Cleaning with solvating and rinsing agents |
| WO1993011280A1 (fr) * | 1991-12-02 | 1993-06-10 | Allied-Signal, Inc. | Systeme de nettoyage a base de solvants multiples |
| AU664586B2 (en) * | 1991-12-02 | 1995-11-23 | Minnesota Mining And Manufacturing Company | Multiple solvent cleaning system |
| US6355113B1 (en) | 1991-12-02 | 2002-03-12 | 3M Innovative Properties Company | Multiple solvent cleaning system |
Also Published As
| Publication number | Publication date |
|---|---|
| IE910220A1 (en) | 1991-07-31 |
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