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USD953280S1 - Heat sink - Google Patents

Heat sink Download PDF

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Publication number
USD953280S1
USD953280S1 US35/355,098 US35509825F USD953280S US D953280 S1 USD953280 S1 US D953280S1 US 35509825 F US35509825 F US 35509825F US D953280 S USD953280 S US D953280S
Authority
US
United States
Prior art keywords
heat sink
view
ornamental design
design
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US35/355,098
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Inventor
Shuta HIKICHI
Yoshikatsu INAGAKI
Yosuke Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to US35/355,098 priority Critical patent/USD953280S1/en
Application granted granted Critical
Publication of USD953280S1 publication Critical patent/USD953280S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Images

Description

1. Heat sink
1.1 : Perspective view
1.2 : Perspective view
1.3 : Front view
1.4 : Back view
1.5 : Top view
1.6 : Bottom view
1.7 : Left side view
1.8 : Right side view
In the reproductions, the dash-dash broken lines are for the purpose of illustrating portions of the heat sink that form no part of the claimed design. The dot-dash broken lines are for the purpose of illustrating the boundaries of the claim and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a heat sink, as shown and described.
US35/355,098 2020-01-17 2020-01-17 Heat sink Active USD953280S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US35/355,098 USD953280S1 (en) 2020-01-17 2020-01-17 Heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US35/355,098 USD953280S1 (en) 2020-01-17 2020-01-17 Heat sink

Publications (1)

Publication Number Publication Date
USD953280S1 true USD953280S1 (en) 2022-05-31

Family

ID=81732212

Family Applications (1)

Application Number Title Priority Date Filing Date
US35/355,098 Active USD953280S1 (en) 2020-01-17 2020-01-17 Heat sink

Country Status (1)

Country Link
US (1) USD953280S1 (en)

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143592A (en) * 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
US3359461A (en) * 1967-02-15 1967-12-19 Powercube Corp Modular circuit package
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
USD277748S (en) * 1982-09-30 1985-02-26 Aavid Engineering, Inc. Pinned-extrusion heat sink for electronic devices
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US4807018A (en) * 1985-10-10 1989-02-21 Sgs Microelettronica S.P.A. Method and package for dissipating heat generated by an integrated circuit chip
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
US5287083A (en) * 1992-03-30 1994-02-15 Dale Electronics, Inc. Bulk metal chip resistor
USD378915S (en) * 1996-03-15 1997-04-22 Motorola, Inc. Heat sink
USD379088S (en) * 1996-02-08 1997-05-06 Augat Communication Products Inc. CATV housing with heat sink fins
USD401225S (en) * 1997-02-27 1998-11-17 Rockford Corporation Heat sink
USD404720S (en) * 1997-02-06 1999-01-26 Charles Gayle Heat sink and mounting plate for integrated circuits
US7650177B2 (en) * 2005-09-29 2010-01-19 Nellcor Puritan Bennett Llc Medical sensor for reducing motion artifacts and technique for using the same
USD717745S1 (en) * 2011-12-01 2014-11-18 Alpoint Technologies, LLC Heat sink
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD827589S1 (en) * 2016-04-05 2018-09-04 Sumitomo Seika Chemicals Co., Ltd. Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
USD886744S1 (en) * 2017-11-01 2020-06-09 Jeffrey Baldwin Cable cover
USD890257S1 (en) * 2018-10-10 2020-07-14 Checkmate Lifting & Safety Ltd Label assembly
USD905647S1 (en) * 2018-07-20 2020-12-22 Heatscape.Com, Inc. Combination heat pipe and heat sink
US20200400381A1 (en) * 2019-04-18 2020-12-24 Furukawa Electric Co., Ltd. Heatsink
US20210007246A1 (en) * 2019-05-10 2021-01-07 Furukawa Electric Co., Ltd. Heatsink
US11054190B2 (en) * 2016-09-23 2021-07-06 Furukawa Electric Co., Ltd. Heat insulating structure body

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3143592A (en) * 1961-11-14 1964-08-04 Inland Electronics Products Co Heat dissipating mounting structure for semiconductor devices
US3372310A (en) * 1965-04-30 1968-03-05 Radiation Inc Universal modular packages for integrated circuits
US3359461A (en) * 1967-02-15 1967-12-19 Powercube Corp Modular circuit package
USD277748S (en) * 1982-09-30 1985-02-26 Aavid Engineering, Inc. Pinned-extrusion heat sink for electronic devices
US4807018A (en) * 1985-10-10 1989-02-21 Sgs Microelettronica S.P.A. Method and package for dissipating heat generated by an integrated circuit chip
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device
US5049973A (en) * 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
US5287083A (en) * 1992-03-30 1994-02-15 Dale Electronics, Inc. Bulk metal chip resistor
USD379088S (en) * 1996-02-08 1997-05-06 Augat Communication Products Inc. CATV housing with heat sink fins
USD378915S (en) * 1996-03-15 1997-04-22 Motorola, Inc. Heat sink
USD404720S (en) * 1997-02-06 1999-01-26 Charles Gayle Heat sink and mounting plate for integrated circuits
USD401225S (en) * 1997-02-27 1998-11-17 Rockford Corporation Heat sink
US7650177B2 (en) * 2005-09-29 2010-01-19 Nellcor Puritan Bennett Llc Medical sensor for reducing motion artifacts and technique for using the same
USD717745S1 (en) * 2011-12-01 2014-11-18 Alpoint Technologies, LLC Heat sink
USD798831S1 (en) * 2015-12-04 2017-10-03 Nippon Light Metal Company, Ltd Cooling device for an electronic component heat sink
USD827589S1 (en) * 2016-04-05 2018-09-04 Sumitomo Seika Chemicals Co., Ltd. Heat sink
USD819579S1 (en) * 2016-07-22 2018-06-05 Tsung-Hsien Huang Heat sink
USD833988S1 (en) * 2016-07-22 2018-11-20 Tsung-Hsien Huang Heat sink
US11054190B2 (en) * 2016-09-23 2021-07-06 Furukawa Electric Co., Ltd. Heat insulating structure body
USD886744S1 (en) * 2017-11-01 2020-06-09 Jeffrey Baldwin Cable cover
USD905647S1 (en) * 2018-07-20 2020-12-22 Heatscape.Com, Inc. Combination heat pipe and heat sink
USD890257S1 (en) * 2018-10-10 2020-07-14 Checkmate Lifting & Safety Ltd Label assembly
US20200400381A1 (en) * 2019-04-18 2020-12-24 Furukawa Electric Co., Ltd. Heatsink
US20210007246A1 (en) * 2019-05-10 2021-01-07 Furukawa Electric Co., Ltd. Heatsink

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Trends in State-of-the-Art Heatsinks and Their Patent Technology" reference dated Dec. 31, 2005 found by RMS on the internet at: https://www.furukawa.co.jp/review/fr027/fr27 _13.pdf. *

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