+

USD661261S1 - Heat spreader for a VCSEL array and mounting support - Google Patents

Heat spreader for a VCSEL array and mounting support Download PDF

Info

Publication number
USD661261S1
USD661261S1 US29/380,920 US38092010F USD661261S US D661261 S1 USD661261 S1 US D661261S1 US 38092010 F US38092010 F US 38092010F US D661261 S USD661261 S US D661261S
Authority
US
United States
Prior art keywords
heat spreader
mounting support
vcsel array
vcsel
array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/380,920
Inventor
James Taylor
Brian Desnoyer
Jiaxi Kan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Emcore Corp
Solaero Solar Power Inc
Original Assignee
Emcore Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emcore Corp filed Critical Emcore Corp
Priority to US29/380,920 priority Critical patent/USD661261S1/en
Assigned to EMCORE SOLAR POWER, INC. reassignment EMCORE SOLAR POWER, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DESNOYER, BRIAN, KAN, JIAXI, TAYLOR, JAMES
Application granted granted Critical
Publication of USD661261S1 publication Critical patent/USD661261S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Description

FIG. 1 is a top perspective view of the heat spreader for a VCSEL array and mounting support;
FIG. 2 is a top elevation view thereof;
FIG. 3 is a bottom elevation view thereof;
FIG. 4 is a right side elevation view thereof;
FIG. 5 is a left side elevation view thereof;
FIG. 6 is a front elevation view thereof; and,
FIG. 7 is a rear elevation view thereof.
The broken lines illustrated in the Figures form no part of the claimed design.

Claims (1)

  1. The ornamental design for a heat spreader for a VCSEL array and mounting support, as shown and described.
US29/380,920 2010-12-13 2010-12-13 Heat spreader for a VCSEL array and mounting support Active USD661261S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/380,920 USD661261S1 (en) 2010-12-13 2010-12-13 Heat spreader for a VCSEL array and mounting support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/380,920 USD661261S1 (en) 2010-12-13 2010-12-13 Heat spreader for a VCSEL array and mounting support

Publications (1)

Publication Number Publication Date
USD661261S1 true USD661261S1 (en) 2012-06-05

Family

ID=46148402

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/380,920 Active USD661261S1 (en) 2010-12-13 2010-12-13 Heat spreader for a VCSEL array and mounting support

Country Status (1)

Country Link
US (1) USD661261S1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5973407A (en) * 1998-07-23 1999-10-26 Sampo Semiconductor Corporation Integral heat spreader for semiconductor package
US6118177A (en) * 1998-11-17 2000-09-12 Lucent Technologies, Inc. Heatspreader for a flip chip device, and method for connecting the heatspreader
US6538320B1 (en) * 2000-06-28 2003-03-25 Advanced Micro Devices, Inc. Heat spreader having holes for rivet-like adhesive connections
US6631077B2 (en) * 2002-02-11 2003-10-07 Thermal Corp. Heat spreader with oscillating flow
US6807058B2 (en) * 2002-11-20 2004-10-19 International Business Machines Corporation Heat sink and combinations
US20050072557A1 (en) * 2003-10-03 2005-04-07 Tai-Sol Electronics Co., Ltd. Heat-conductive structure
US6906413B2 (en) * 2003-05-30 2005-06-14 Honeywell International Inc. Integrated heat spreader lid
US7015073B2 (en) * 2002-04-05 2006-03-21 Intel Corporation Method of forming heat spreader with down set leg attachment feature
US7122911B2 (en) * 2003-11-18 2006-10-17 Advanced Semiconductor Engineering, Inc. Heat spreader and semiconductor device package having the same
US20080283222A1 (en) * 2007-05-18 2008-11-20 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and heat dissipation apparatus using the same
US20090101318A1 (en) * 2007-10-23 2009-04-23 Hon Hai Precision Ind.Co., Ltd. Electrical connector assembly with heat dissipating device
US20090166008A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat spreader with vapor chamber
US7575956B2 (en) * 2003-11-24 2009-08-18 St Assembly Test Services Ltd. Fabrication method for semiconductor package heat spreaders

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5973407A (en) * 1998-07-23 1999-10-26 Sampo Semiconductor Corporation Integral heat spreader for semiconductor package
US6118177A (en) * 1998-11-17 2000-09-12 Lucent Technologies, Inc. Heatspreader for a flip chip device, and method for connecting the heatspreader
US6538320B1 (en) * 2000-06-28 2003-03-25 Advanced Micro Devices, Inc. Heat spreader having holes for rivet-like adhesive connections
US6631077B2 (en) * 2002-02-11 2003-10-07 Thermal Corp. Heat spreader with oscillating flow
US7015073B2 (en) * 2002-04-05 2006-03-21 Intel Corporation Method of forming heat spreader with down set leg attachment feature
US6807058B2 (en) * 2002-11-20 2004-10-19 International Business Machines Corporation Heat sink and combinations
US6906413B2 (en) * 2003-05-30 2005-06-14 Honeywell International Inc. Integrated heat spreader lid
US20050072557A1 (en) * 2003-10-03 2005-04-07 Tai-Sol Electronics Co., Ltd. Heat-conductive structure
US7122911B2 (en) * 2003-11-18 2006-10-17 Advanced Semiconductor Engineering, Inc. Heat spreader and semiconductor device package having the same
US7575956B2 (en) * 2003-11-24 2009-08-18 St Assembly Test Services Ltd. Fabrication method for semiconductor package heat spreaders
US20080283222A1 (en) * 2007-05-18 2008-11-20 Foxconn Technology Co., Ltd. Heat spreader with vapor chamber and heat dissipation apparatus using the same
US20090101318A1 (en) * 2007-10-23 2009-04-23 Hon Hai Precision Ind.Co., Ltd. Electrical connector assembly with heat dissipating device
US20090166008A1 (en) * 2007-12-27 2009-07-02 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat spreader with vapor chamber

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD807824S1 (en) * 2016-07-18 2018-01-16 General Electric Company Heat spreader
USD825463S1 (en) * 2016-07-18 2018-08-14 General Electric Company Heat spreader

Similar Documents

Publication Publication Date Title
USD675188S1 (en) Loudspeaker array
USD672023S1 (en) Fan heater
USD630011S1 (en) Backpack back support frame
USD623363S1 (en) Heat steamer
USD638114S1 (en) Fan
USD639282S1 (en) Earphone
USD661188S1 (en) Packaging
USD659252S1 (en) Back support device
USD670751S1 (en) Mount
USD643560S1 (en) Lantern
USD743747S1 (en) Saucer
USD661189S1 (en) Packaging
USD661190S1 (en) Packaging
USD638344S1 (en) Bracket design
USD638159S1 (en) Solar spotlight
USD623365S1 (en) Steamer
USD636058S1 (en) Sprinkler
USD623366S1 (en) Steamer
USD652240S1 (en) Pillow
USD639283S1 (en) Earphone
USD648823S1 (en) Sprinkler
USD660843S1 (en) Support arm
USD653479S1 (en) Support leg
USD850353S1 (en) Vehicle rack support tower
USD642401S1 (en) Plant support
点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载