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USD480371S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD480371S1
USD480371S1 US29/161,321 US16132102F USD480371S US D480371 S1 USD480371 S1 US D480371S1 US 16132102 F US16132102 F US 16132102F US D480371 S USD480371 S US D480371S
Authority
US
United States
Prior art keywords
semiconductor device
view
elevational view
ornamental design
mirror image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/161,321
Inventor
Shigeki Sako
Masahiro Ootomo
Kazuyoshi Fukuda
Takahiro Ide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUDA, KAZUYOSHI, OOTOMO, MASAHIRO, IDE, TAKAHIRO, SAKO, SHIGEKI
Application granted granted Critical
Publication of USD480371S1 publication Critical patent/USD480371S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof; and,
FIG. 5 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/161,321 2001-11-30 2002-05-29 Semiconductor device Expired - Lifetime USD480371S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001035198 2001-11-30
JP2001-035198 2001-11-30

Publications (1)

Publication Number Publication Date
USD480371S1 true USD480371S1 (en) 2003-10-07

Family

ID=28658863

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/161,321 Expired - Lifetime USD480371S1 (en) 2001-11-30 2002-05-29 Semiconductor device

Country Status (1)

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US (1) USD480371S1 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD763806S1 (en) * 2012-12-12 2016-08-16 Soraa, Inc. Triangular semiconductor die
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Extract of Denpa Shimbum (newspaper) showing a AV decoder system LSI (MN677521) for a DVD player.
Extract of Denpa Shimbun (newspaper) showing a CCD signal processor (VSP2101).
Extract of Denpa Shimbun (newspaper) showing a PAM built-in microcomputer (MB91110).
Extract of Denpa Shimbun (newspaper) showing a Scan USB (NET 1031).
TOSHIBA Catalog of micro controller (TMP86CM25F).

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD763806S1 (en) * 2012-12-12 2016-08-16 Soraa, Inc. Triangular semiconductor die
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD856947S1 (en) * 2017-10-19 2019-08-20 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD1043594S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1043595S1 (en) * 2022-11-01 2024-09-24 Rohm Co., Ltd. Semiconductor device
USD1052545S1 (en) * 2022-11-01 2024-11-26 Rohm Co., Ltd. Semiconductor device
USD1059315S1 (en) * 2022-11-02 2025-01-28 Ganrich Semiconductor Corporation Package structure for a semiconductor element

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