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  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
  • C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
  • C23C16/45523—Pulsed gas flow or change of composition over time
  • C23C16/45525—Atomic layer deposition [ALD]
  • C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
  • C23C16/45536—Use of plasma, radiation or electromagnetic fields
  • C23C16/45542—Plasma being used non-continuously during the ALD reactions
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
  • C23C16/45523—Pulsed gas flow or change of composition over time
  • C23C16/45525—Atomic layer deposition [ALD]
  • C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/02104—Forming layers
  • H01L21/02365—Forming inorganic semiconducting materials on a substrate
  • H01L21/02612—Formation types
  • H01L21/02617—Deposition types
  • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD

Definitions

• Copper has displaced aluminum to become the standard back-end-of-line (BEOL) metallization material for advanced logic devices. Copper's benefits over aluminum for logic are now well-documented. Its lower resistivity allows line thickness to be reduced by nearly one-third while achieving similar sheet resistance.
• BEOL back-end-of-line
• PEALD and PECVD are promising techniques to produce high purity and high-density metal thin films at low growth temperatures.
• PEALD and PECVD have never been considered as possible for the deposition of pure copper with copper bis-ketoiminate precursors.
• a copper-containing precursor having the following formula is introduced into the reactor:
• R 1 , R 2 , R 3 , and R 4 are independently selected from the group consisting of H, a C 1 -C 5 alkyl, an alkyl amino group, and Si(R′) 3 where R′ is selected from H and a C 1 -C 5 alkyl group.
• the method comprises reacting a copper alkoxide (Cu(OR 5 ) 2 ), wherein R 5 is selected from the group consisting of methyl, ethyl, and isopropyl, with two equivalents of a ketoimine ligand (R 4 C( ⁇ O)C(R 3 ) ⁇ C(NHR 1 )R 2 ) in a solvent selected from the group consisting of alcohol, tetrahydrofuran, diethylether, and toluene.
• a copper alkoxide (Cu(OR 5 ) 2 )
• R 5 is selected from the group consisting of methyl, ethyl, and isopropyl
• R 4 C( ⁇ O)C(R 3 ) ⁇ C(NHR 1 )R 2 two equivalents of a ketoimine ligand
• the disclosed methods may include one or more of the following aspects:
• alkyl group refers to saturated functional groups containing exclusively carbon and hydrogen atoms. Further, the term “alkyl group” may refer to linear, branched, or cyclic alkyl groups. Examples of linear alkyl groups include without limitation, methyl groups, ethyl groups, propyl groups, butyl groups, etc. Examples of branched alkyls groups include without limitation, isopropyl groups, t-butyl groups, etc. Examples of cyclic alkyl groups include without limitation, cyclopropyl groups, cyclopentyl groups, cyclohexyl groups, etc.
• the abbreviation “Me” refers to a methyl group
• the abbreviation “Et” refers to an ethyl group
• the abbreviation “iPr” refers to an isopropyl group
• the abbreviation “t-Bu” refers to a tertiary butyl group.
• R groups independently selected relative to other R groups bearing the same or different subscripts or superscripts, but is also independently selected relative to any additional species of that same R group.
• the two or three R 1 groups may, but need not be identical to each other or to R 2 or to R 3 .
• values of R groups are independent of each other when used in different formulas.
• FIG. 1 is a graph of the percent residual mass of bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II) as a function of temperature during open-cup Thermo-Gravimetric Analysis (TGA) under atmospheric and vacuum conditions;
• FIG. 2 is a graph of the vapor pressure of bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II) as a function of temperature measured by isothermal evaporation under atmospheric pressure;
• FIG. 3 is an isothermal evaporation graph of the percent residual mass of bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II) at 120° C. over a period of 4 hours under atmospheric pressure;
• FIG. 4 is a graph of PEALD Cu thickness resulting from 750 cycle depositions as a function of bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II) precursor pulse time at 60° C.;
• FIG. 5 is a scanning electron microscopy (SEM) photograph showing the surface microstructure of PEALD Cu films grown at 60° C. using bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II); and
• FIG. 6 is a cross-section SEM photograph showing conformality of a ⁇ 40 nm thick PEALD Cu film deposited with (4N-(ethylamino)pent-3-en-2-onato)Copper(II).
• the disclosed copper-containing precursors also interchangeably referred to as bis-ketoiminate copper precursors, have the general formula:
• R 1 , R 2 , R 3 , and R 4 is independently selected from H, a C 1 -C 5 alkyl group, an alkyl amino group, and Si(R′) 3 wherein each R′ is independently selected from H and a C 1 -C 5 alkyl group.
• R 1 Et
• R 2 and R 4 Me
• R 3 H.
• bis-ketoiminate copper precursors include bis(4N-(amino)pent-3-en-2-onato)Copper(II), bis(4N-(methylamino)pent-3-en-2-onato)Copper(II), bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II), bis(4N-(isopropylamino)pent-3-en-2-onato)Copper(II), bis(4N-(n-propylamino)pent-3-en-2-onato)Copper(II), bis(4N-(n-butylamino)pent-3-en-2-onato)Copper(II), bis(4N-(isobutylamino)pent-3-en-2-onato)Copper(II), bis(4N-(secbutylamino)pent-3-en-2-onato)Copper(II), and bis(4N
• bis(4N-(amino)pent-3-en-2-onato)Copper(II) may be prepared as described in the literature (P. A. Stabnikov, J. Structural Chemistry 2003, 44, 6, 1054-1061) by reacting copper acetate (Cu(OAc) 2 ) with the ketoimine ligand in aqueous alcohol in the presence of excess ammonia.
• copper precursors bis(4N—(R-amino)pent-3-en-2-onato)Copper(II)
• CuCl 2 or CuBr 2 may be prepared either by reacting CuCl 2 or CuBr 2 with two equivalents of the lithium salt of the R-ketoimine ligand in tetrahydrofuran, or by reacting Cu(OMe) 2 or Cu(OEt) 2 with two equivalents of R-ketoimine ligand in alcohol (MeOH or EtOH).
• the bis-ketoiminate copper precursor may be used to deposit a pure copper, copper silicate (Cu k Si l ), copper oxide (Cu n O m ) or copper oxynitride (Cu x N y O z ) film, wherein k, l, m, n, x, y, and z are integers which inclusively range from 1 to 6. These types of films may be useful in Resistive Random Access Memory (ReRAM) type applications. Some typical film types include a copper film and CuO film. Using the disclosed precursors and methods, the copper-containing film is formed on the substrate at a rate ranging from 0.1 to 1.0 angstroms/cycle.
• ReRAM Resistive Random Access Memory
• the thin film may be deposited from the disclosed precursors using any plasma enhanced deposition methods known to those of skill in the art.
• suitable deposition methods include without limitation, Plasma Enhanced Chemical Vapor Depositions (PECVD), pulse PECVD, Plasma Enhanced Atomic Layer Deposition (PE-ALD), or combinations thereof.
• PECVD Plasma Enhanced Chemical Vapor Depositions
• PE-ALD Plasma Enhanced Atomic Layer Deposition
• the plasma processes may utilize direct or remote plasma sources.
• the plasma process allows the deposition at lower temperatures of films having higher density, which is critical to deposition of a thin, continuous film such as copper. Additionally, the nucleation process and microstructure of the resulting films are much less sensitive to the condition of the substrate surface than in a thermal ALD process. In other words, the plasma process may allow depositions on substrates that previously proved inefficient using the thermal ALD process. Finally, the plasma process may provide an increase in the deposition rate and form a more pure film than those produced by thermal ALD.
• the bis-ketoiminate copper precursor may be supplied either in neat form or in a blend with a suitable solvent, such as ethyl benzene, xylenes, mesitylene, decane, dodecane.
• a suitable solvent such as ethyl benzene, xylenes, mesitylene, decane, dodecane.
• the bis-ketoiminate copper precursor may be present in varying concentrations in the solvent.
• the neat or blended bis-ketoiminate copper precursor is introduced into a reactor in vapor form.
• the precursor in vapor form may be produced by vaporizing the neat or blended precursor solution through a conventional vaporization step such as direct vaporization, distillation, or by bubbling.
• the neat or blended bis-ketoiminate copper precursor may be fed in liquid state to a vaporizer where it is vaporized before it is introduced into the reactor.
• the neat or blended bis-ketoiminate copper precursor may be vaporized by passing a carrier gas into a container containing the bis-ketoiminate copper precursor or by bubbling the carrier gas into the bis-ketoiminate copper precursor.
• the carrier gas may include, but is not limited to, Ar, He, N 2 , and mixtures thereof. Bubbling with a carrier gas may also remove any dissolved oxygen present in the neat or blended precursor solution.
• the carrier gas and bis-ketoiminate copper precursor are then introduced into the reactor as a vapor.
• the container of bis-ketoiminate copper precursor may be heated to a temperature that permits the bis-ketoiminate copper precursor to be in its liquid phase and to have a sufficient vapor pressure.
• the container may be maintained at temperatures in the range of, for example, approximately 0° C. to approximately 150° C. Those skilled in the art recognize that the temperature of the container may be adjusted in a known manner to control the amount of bis-ketoiminate copper precursor vaporized.
• the reactor may be any enclosure or chamber within a device in which deposition methods take place such as, and without limitation, a parallel-plate type reactor, a cold-wall type reactor, a hot-wall type reactor, a single-wafer reactor, a multi-wafer reactor, or other types of deposition systems under conditions suitable to cause the precursors to react and form the layers.
• the reactor contains one or more substrates onto which the thin films will be deposited.
• the one or more substrates may be any suitable substrate used in semiconductor, photovoltaic, flat panel or LCD-TFT device manufacturing.
• suitable substrates include without limitation silicon substrates, silica substrates, silicon nitride substrates, silicon oxy nitride substrates, tungsten substrates, titanium nitride, tantalum nitride, or combinations thereof. Additionally, substrates comprising tungsten or noble metals (e.g. platinum, palladium, rhodium or gold) may be used.
• the substrate may also have one or more layers of differing materials already deposited upon it from a previous manufacturing step.
• the temperature and the pressure within the reactor are held at conditions suitable for PE-ALD, PECVD, or pulse PECVD depositions.
• the pressure in the reactor may be held between about 0.5 mTorr and about 20 Torr, preferably between about 0.2 Torr and 10 Torr, and more preferably between about 1 Torr and 10 Torr, as required per the deposition parameters.
• the temperature in the reactor may be held between about 50° C. and about 600° C., preferably between about 50° C. and about 250° C., and more preferably between about 50° C. and about 100° C.
• a co-reactant is introduced into the reactor.
• the co-reactant may be an oxidizing gas, such as oxygen, ozone, water, hydrogen peroxide, nitric oxide, nitrogen dioxide, as well as mixtures of any two or more of these.
• the co-reactant may be a reducing gas, such as hydrogen, ammonia, a silane (e.g. SiH 4 , Si 2 H 6 , Si 3 H 8 ), an alkyl silane containing a Si—H bond (e.g. SiH 2 Me 2 , SiH 2 Et 2 ), N(SiH 3 ) 3 , as well as mixtures of any two or more of these.
• the co-reactant is H 2 or NH 3 .
• the co-reactant is treated by a plasma, in order to decompose the co-reactant into its radical form.
• the plasma may be generated with a power ranging from about 50 W to about 500 W, preferably from about 100 W to about 200 W.
• the plasma may be generated or present within the reactor itself.
• the plasma may generally be at a location removed from the reaction chamber, for instance, in a remotely located plasma system.
• the co-reactant is treated with the plasma prior to introduction into the reactor.
• One of skill in the art will recognize methods and apparatus suitable for such plasma treatment.
• the bis-ketoiminate copper precursor and the plasma-treated co-reactant react to form a copper-containing film on the substrate. Applicants believe that plasma-treating the co-reactant provides the co-reactant with the energy needed to react with the bis-ketoiminate copper precursor at lower temperatures.
• a second precursor may be introduced into the reactor.
• the second precursor may be another metal source, such as manganese, ruthenium, titanium, tantalum, bismuth, zirconium, hafnium, lead, niobium, magnesium, aluminum, lanthanides, or mixtures of these.
• the resultant film deposited on the substrate may contain at least two different metal types.
• the bis-ketoiminate copper precursor, the co-reactants, and any optional precursors may be introduced into the reactor simultaneously (PECVD), sequentially (PE-ALD), or in other combinations.
• the precursor and the co-reactant may be mixed together to form a co-reactant/precursor mixture, and then introduced to the reactor in mixture form.
• the precursor and co-reactant may be sequentially introduced into the reaction chamber and purged with an inert gas between the introduction of the precursor and the introduction of the co-reactant.
• the bis-ketoiminate copper precursor may be introduced in one pulse and two additional metal sources may be introduced together in a separate pulse [modified PE-ALD].
• the reactor may already contain the co-reactant species prior to introduction of the bis-ketoiminate copper precursor, the introduction of which may optionally be followed by a second introduction of the co-reactant species.
• the bis-ketoiminate copper precursor may be introduced to the reactor continuously while other metal sources are introduced by pulse (pulse PECVD).
• pulse PECVD pulse PECVD
• a pulse may be followed by a purge or evacuation step to remove excess amounts of the component introduced.
• the pulse may last for a time period ranging from about 0.01 seconds to about 10 seconds, alternatively from about 0.3 seconds to about 5 seconds, alternatively from about 0.5 seconds to about 2 seconds.
• deposition may take place for a varying length of time. Generally, deposition may be allowed to continue as long as desired or necessary to produce a film with the necessary properties. Typical film thicknesses may vary from several hundred angstroms to several hundreds of microns, depending on the specific deposition process. The deposition process may also be performed as many times as necessary to obtain the desired film.
• the vapor phase of a bis-ketoiminate copper precursor is introduced into the reactor, where it is contacted with a suitable substrate. Excess bis-ketoiminate copper precursor may then be removed from the reactor by purging and/or evacuating the reactor.
• a reducing gas for example, H 2
• H 2 is introduced into the reactor under plasma power where it reacts with the absorbed bis-ketoiminate copper precursor in a self-limiting manner. Any excess reducing gas is removed from the reactor by purging and/or evacuating the reactor. If the desired film is a copper film, this two-step process may provide the desired film thickness or may be repeated until a film having the necessary thickness has been obtained.
• the two-step process above may be followed by introduction of the vapor of a metal-containing precursor into the reactor.
• the metal-containing precursor will be selected based on the nature of the bimetal film being deposited.
• the metal-containing precursor is contacted with the substrate. Any excess metal-containing precursor is removed from the reactor by purging and/or evacuating the reactor.
• a reducing gas may be introduced into the reactor to react with the metal-containing precursor. Excess reducing gas is removed from the reactor by purging and/or evacuating the reactor.
• a desired film thickness has been achieved, the process may be terminated. However, if a thicker film is desired, the entire four-step process may be repeated.
• the copper-containing films or copper-containing layers resulting from the processes discussed above may include a pure copper, copper silicate (Cu k Si l ), copper oxide (Cu n O m ), or copper oxynitride (M x N y O z ) film wherein k, l, m, n, x, y, and z are integers which inclusively range from 1 to 6.
• the copper-containing films are selected from a copper film and CuO film.
• TGA Thermal Gravimetric Analysis
• bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II) demonstrates a good volatility, achieving a vapor pressure of 1 Torr at ⁇ 145° C. (see FIG. 2 ) making it suitable for use in vapor deposition processes. Moreover, its room-temperature liquid state gives the precursor an additional advantage in manufacturing applications.
• PEALD tests were performed using bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II), which was heated to 100° C. in the delivery vessel and introduced into the reactor chamber with the 40 sccm flow of helium carrier gas.
• the reactor pressure was in the range of 1.7-2.3 torr.
• Plasma power was set in a range of 80-160 W, and the reactor temperature was set in the range of 60-100° C.
• the PEALD cycle consisted of 5 second precursor pulse followed by 5 second purge followed by 10 second hydrogen plasma pulse (300 sccm hydrogen flow) and 5 second purge. Pure copper films were deposited on ruthenium, tantalum nitride, titanium nitride and silicon oxide substrates at rates ranging from approximately 0.2 to approximately 0.8 angstroms/cycle.
• FIG. 4 is a graph of the resulting Cu film thickness as a function of precursor pulse time resulting from 750 cycles. For all precursor pulses, deposition rates higher than 0.20 ⁇ /cycle were obtained at 60° C. At a precursor pulse time of three seconds, complete surface saturation is achieved.
• Auger Electron Spectroscopy (AES) of a copper film produced from the PEALD process described above using 120 W plasma, 60° C. reactor temperature, and 5 second precursor pulse showed no carbon or nitrogen incorporation into the film.
• Scanning Electron Microscopy (SEM) of the surface microstructure of the same copper film showed a surface ( ⁇ 17 nm thick) with uniform and smooth grains, and with good continuity (see FIG. 5 ).
• FIG. 6 is a cross-section SEM image showing conformality of a ⁇ 40 nm thick PEALD Cu film.
• the perpendicular green line marks the boundary between the Cu film and the substrate.
• Resistivity provides an indication of film conformality and purity, with higher resistivity indicating poor conformality. Resistivity as low as ⁇ 20-25 ⁇ cm were obtained for 20 nm thick copper film produced by the method described above.
• ALD tests were performed using bis(4N-(ethylamino)pent-3-en-2-onato)Copper(II), which was heated to 90° C. in the delivery vessel and introduced into the reactor chamber with the 1 sccm flow of nitrogen carrier gas.
• the reactor pressure was around 1 torr.
• the ALD cycle consisted of 5 second precursor pulse followed by 5 second nitrogen purge followed by 5 second hydrogen pulse (20 sccm hydrogen flow) and 5 second nitrogen purge—in this sequence.
• the reactor temperature was set to 100° C. No films were deposited on palladium, tantalum nitride, silicon and silicon oxide substrates at these conditions.

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• 2010
  • 2010-07-09 WO PCT/US2010/041518 patent/WO2011006064A1/fr active Application Filing
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  • 2010-07-09 EP EP20100751728 patent/EP2451989A2/fr not_active Withdrawn
  • 2010-07-09 US US13/383,343 patent/US9121093B2/en not_active Expired - Fee Related
  • 2010-07-09 JP JP2012519751A patent/JP2012532993A/ja active Pending
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