US8403279B2 - Fastening device and heat dissipation apparatus using the same - Google Patents
Fastening device and heat dissipation apparatus using the same Download PDFInfo
- Publication number
- US8403279B2 US8403279B2 US12/756,981 US75698110A US8403279B2 US 8403279 B2 US8403279 B2 US 8403279B2 US 75698110 A US75698110 A US 75698110A US 8403279 B2 US8403279 B2 US 8403279B2
- Authority
- US
- United States
- Prior art keywords
- adjusting
- fixed arm
- retaining slots
- sliding
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 230000017525 heat dissipation Effects 0.000 title claims description 14
- 230000000717 retained effect Effects 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to fastening devices, and more particularly to a fastening device for fastening a heat sink on an electronic device mounted on a printed circuit board.
- the heat sink generally has a fixing bracket mounted on a bottom thereof.
- the fixing bracket defines a plurality of through holes at corners thereof.
- the PCB is provided with a plurality of retaining pillars, each having a threaded hole defined therein.
- the retaining pillars surround the electronic device.
- the plurality of through holes of the fixing bracket are in alignment with the threaded holes of the retaining pillars, respectively.
- a plurality of screws are extended through the through holes of the fixing bracket and engaged in the threaded holes of the retaining pillars of the PCB, respectively, thereby securing the heat sink to the PCB.
- PCBs made according to different industry standards, and these PCBs have differing layouts of the threaded holes.
- a particular heat sink with its fixing bracket may fit a particular PCB.
- the through holes of the fixing bracket may not match the threaded holes of the other PCB. That is, and the heat sink cannot be mounted on the other PCB using the fixing bracket.
- FIG. 1 is an isometric, assembled view of a heat dissipation apparatus in accordance with one embodiment of the disclosure.
- FIG. 2 is an isometric, exploded view of a fixing bracket of the heat dissipation apparatus of FIG. 1 .
- FIG. 3 is a view of part of the fixing bracket of FIG. 2 , showing an adjusting arm thereof attached to a fixing arm thereof.
- FIG. 4 is similar to FIG. 3 , but showing the adjusting arm in a different position relative to the fixing arm.
- a heat dissipation apparatus in accordance with an embodiment of the disclosure is provided for cooling an electronic device (not shown) mounted on a printed circuit board (not shown).
- the heat dissipation apparatus includes a heat sink 10 thermally contacting the electronic device, a fastening device 20 mounted at a bottom of the heat sink 10 , a fan 30 mounted at a side of the heat sink 10 , and a holder 40 fixing the fan 30 on the heat sink 10 .
- the fastening device 20 includes two fixing brackets 22 and four fasteners 24 attached to the two fixing brackets 22 .
- the fixing brackets 22 are mounted at two opposite sides of the bottom of the heat sink 10 .
- the fasteners 24 extend through the fixing brackets 22 and are engaged in mounting holes (not shown) defined in the printed circuit board to thereby fasten the heat dissipation apparatus on the printed circuit board.
- each fixing bracket 22 includes a fixed arm 26 fixed on the heat sink 10 , and two adjusting arm 28 respectively connecting at two ends of the fixed arm 26 .
- Each adjusting arm 28 includes a fixing end 282 and a sliding end 283 .
- the fixing end 282 has a width larger than that of the sliding end 283 .
- the sliding end 283 defines a slit 2840 therein, which extends along a lengthwise direction of the sliding end 283 , whereby the slit 2840 divides the sliding end 283 into two sliding legs 284 .
- a locking leg 286 extends vertically and upwardly from a distal end of each sliding leg 284 .
- An abutting tab 288 protrudes laterally outwardly from a distal end of each locking leg 286 .
- the fixing end 282 of the adjusting arm 28 defines a fixing hole 2820 therein, and the fastener 24 extends through the fixing hole 2820 and is fixed on the fixing end 282 .
- Each fixed arm 26 is generally C-shaped, and defines two through holes 260 in a middle portion thereof. Two screws 60 are extended through the two through holes 260 to fix the fixed arm 26 on the heat sink 10 .
- An elongated adjusting groove 262 and a generally rectangular limiting hole 264 are defined in each of the two opposite ends of the fixed arm 26 .
- the adjusting groove 262 and the limiting hole 264 are spaced from each other.
- the limiting hole 264 is located near a free end of the fixed arm 26
- the adjusting groove 262 is located at an inner side (or back side) of the limiting hole 264 .
- the limiting hole 264 has a width equal to that of the sliding end 283 of the corresponding adjusting arm 28 , while the adjusting groove 262 has a width slightly smaller than that of the sliding end 283 .
- a front portion of the free end of the fixed arm 26 where the limiting hole 264 is defined slopes downward relative to a back portion of the free end of the fixed arm 26 where the adjusting groove 262 is defined.
- the limiting hole 264 is located lower than the adjusting groove 262 , such that the limiting hole 264 is aligned with the sliding end 283 of the adjusting arm 28 .
- Three spaced retaining slots 266 are defined in each of two lateral sides of the adjusting groove 262 , for selectively engagingly receiving the locking legs 286 of the adjusting arm 28 . That is, there is a total of three pairs of retaining slots 266 formed in the adjusting groove 262 .
- the two adjusting arms 28 are secured to the two free ends of the fixed arm 26 , respectively.
- the sliding end 283 of each adjusting arm 28 extends into the corresponding limiting hole 264 of the fixed arm 26 to cause the two sliding legs 284 and the two locking legs 286 to enter a bottom side of the adjusting groove 262 of the fixed arm 26 .
- the locking legs 286 of the adjusting arm 28 are aligned with one pair of the three pairs of retaining slots 266 of the fixed arm 26 . Then, the sliding end 284 is pushed upwardly to move towards the adjusting groove 262 .
- the abutting tabs 288 of the adjusting arm 28 are pressed by inner walls of the retaining slot 266 and elastically contract toward each other in the slit 2840 .
- the abutting tabs 288 and the locking legs 286 rebound and abut a top surface of the fixed arm 26 .
- the locking legs 286 are retained in the corresponding pair of retaining slots 266 .
- the adjusting arm 28 is fixedly and firmly connected to the fixed arm 26 .
- each adjusting arm 28 of each fixing bracket 22 can be moved horizontally relative to the corresponding fixed arm 26 .
- the locking legs 286 retained in a certain pair of the retaining slots 266 of the fixed arm 26 can be moved to engage in a different pair of retaining slots 266 . That is, the position of the adjusting arm 28 relative to the fixed arm 26 can be adjusted, so that the fasteners 24 can be aligned with the mounting holes of different kinds of printed circuit boards having different layouts. For example, in FIG.
- the locking legs 286 of one of the adjusting arms 28 of one of the fixing brackets 22 are retained in the middle pair of retaining slots 266 of the corresponding fixed arm 26 .
- the locking legs 286 of the adjusting arm 28 are retained in the front pair of retaining slots 266 of the fixed arm 26 .
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910309635.9 | 2009-11-12 | ||
CN200910309635 | 2009-11-12 | ||
CN2009103096359A CN102065663A (en) | 2009-11-12 | 2009-11-12 | Fastener and cooling device using same |
Publications (2)
Publication Number | Publication Date |
---|---|
US20110108234A1 US20110108234A1 (en) | 2011-05-12 |
US8403279B2 true US8403279B2 (en) | 2013-03-26 |
Family
ID=43973270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/756,981 Expired - Fee Related US8403279B2 (en) | 2009-11-12 | 2010-04-08 | Fastening device and heat dissipation apparatus using the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US8403279B2 (en) |
CN (1) | CN102065663A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130163207A1 (en) * | 2011-12-26 | 2013-06-27 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US20130239387A1 (en) * | 2012-03-14 | 2013-09-19 | James N. Richey | Bracket Assembly |
US20140150993A1 (en) * | 2012-11-30 | 2014-06-05 | Foxconn Technology Co., Ltd. | Base with heat absorber and heat dissipating module having the base |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8120919B2 (en) * | 2009-12-23 | 2012-02-21 | Coolit Systems Inc. | Adjustable mounting bracket for a computer component |
US9169856B2 (en) * | 2012-02-02 | 2015-10-27 | Asia Vital Components Co., Ltd. | Fastening structure for thermal module |
Citations (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5542468A (en) * | 1995-06-28 | 1996-08-06 | Lin; Chuen-Sheng | CPU heat dissipator hook-up apparatus |
US5791403A (en) * | 1997-06-10 | 1998-08-11 | Chiou; Ming Chin | Clamping device adapted for securing a heat sink to a CPU mount to hold down a CPU |
US6250375B1 (en) * | 2000-07-01 | 2001-06-26 | Foxconn Precision Components Co., Ltd. | Clip for securing heat sink to electronic device |
US6430049B1 (en) * | 2000-12-22 | 2002-08-06 | Foxconn Precision Components Co., Ltd. | Clip for heat sink |
US6466445B1 (en) * | 2001-04-27 | 2002-10-15 | Foxconn Precision Components Co., Ltd. | Clip for heat sink |
US6492202B1 (en) * | 1999-12-28 | 2002-12-10 | Motorola, Inc. | Method of assembling components onto a circuit board |
US6501656B1 (en) * | 2001-06-28 | 2002-12-31 | Hon Hai Precision Ind. Co., Ltd. | Clip for heat sink |
US6507489B1 (en) * | 2001-08-02 | 2003-01-14 | Dell Products L.P. | Toggle heat sink clip |
US6522545B2 (en) * | 2001-05-31 | 2003-02-18 | Intel Corporation | Securing heat sinks |
US20030159819A1 (en) * | 2002-02-27 | 2003-08-28 | Sang-Cheol Lee | Heatsink device for cooling chipset |
US6771506B2 (en) * | 2002-08-23 | 2004-08-03 | Hon Hai Precision Ind. Co., Ltd. | Heat sink fastener |
US20040257770A1 (en) * | 2003-06-17 | 2004-12-23 | Jun-Liang Hu | Clamping structure and heat dissipating module using same |
US20050066487A1 (en) * | 2003-09-26 | 2005-03-31 | Jie Zhang | Heat sink clip |
US20050195572A1 (en) * | 2004-03-03 | 2005-09-08 | Franz John P. | Heat sink retention assembly and related methods |
US7017653B2 (en) * | 2003-10-02 | 2006-03-28 | Molex Incorporated | Heat sink clip mechanism |
US7063136B2 (en) * | 2004-08-25 | 2006-06-20 | Hon Hai Precision Industry Co., Ltd | Heat dissipation device having cap for protecting thermal interface material thereon |
US7239518B2 (en) * | 2005-11-01 | 2007-07-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Universal locking device for heat sink |
US7301774B2 (en) * | 2004-12-04 | 2007-11-27 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Universal locking device for heat sink |
US7333333B2 (en) * | 2005-11-30 | 2008-02-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Locking device for heat sink |
US7631402B2 (en) * | 2006-11-03 | 2009-12-15 | Po-Hui Huang | Retaining device for heat sink |
US7719840B2 (en) * | 2007-10-29 | 2010-05-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fixing base thereof |
US7835152B2 (en) * | 2008-11-20 | 2010-11-16 | Inventec Corporation | Heat dissipating module |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW402120U (en) * | 1997-12-19 | 2000-08-11 | Lian Jinn Aluminium Co Ltd | CPU cooling fin fastener |
CN2476918Y (en) * | 2001-02-09 | 2002-02-13 | 神基科技股份有限公司 | Pressure adjustment device for cooling elements |
CN2510908Y (en) * | 2001-12-14 | 2002-09-11 | 谢佐昌 | Adjustable fixing buckle for heat dissipation components |
-
2009
- 2009-11-12 CN CN2009103096359A patent/CN102065663A/en active Pending
-
2010
- 2010-04-08 US US12/756,981 patent/US8403279B2/en not_active Expired - Fee Related
Patent Citations (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5542468A (en) * | 1995-06-28 | 1996-08-06 | Lin; Chuen-Sheng | CPU heat dissipator hook-up apparatus |
US5791403A (en) * | 1997-06-10 | 1998-08-11 | Chiou; Ming Chin | Clamping device adapted for securing a heat sink to a CPU mount to hold down a CPU |
US6492202B1 (en) * | 1999-12-28 | 2002-12-10 | Motorola, Inc. | Method of assembling components onto a circuit board |
US6250375B1 (en) * | 2000-07-01 | 2001-06-26 | Foxconn Precision Components Co., Ltd. | Clip for securing heat sink to electronic device |
US6430049B1 (en) * | 2000-12-22 | 2002-08-06 | Foxconn Precision Components Co., Ltd. | Clip for heat sink |
US6466445B1 (en) * | 2001-04-27 | 2002-10-15 | Foxconn Precision Components Co., Ltd. | Clip for heat sink |
US6522545B2 (en) * | 2001-05-31 | 2003-02-18 | Intel Corporation | Securing heat sinks |
US6501656B1 (en) * | 2001-06-28 | 2002-12-31 | Hon Hai Precision Ind. Co., Ltd. | Clip for heat sink |
US6507489B1 (en) * | 2001-08-02 | 2003-01-14 | Dell Products L.P. | Toggle heat sink clip |
US20030159819A1 (en) * | 2002-02-27 | 2003-08-28 | Sang-Cheol Lee | Heatsink device for cooling chipset |
US6771506B2 (en) * | 2002-08-23 | 2004-08-03 | Hon Hai Precision Ind. Co., Ltd. | Heat sink fastener |
US20040257770A1 (en) * | 2003-06-17 | 2004-12-23 | Jun-Liang Hu | Clamping structure and heat dissipating module using same |
US7042728B2 (en) * | 2003-06-17 | 2006-05-09 | Molex Incorporated | Clamping structure and heat dissipating module using same |
US20050066487A1 (en) * | 2003-09-26 | 2005-03-31 | Jie Zhang | Heat sink clip |
US7017653B2 (en) * | 2003-10-02 | 2006-03-28 | Molex Incorporated | Heat sink clip mechanism |
US20050195572A1 (en) * | 2004-03-03 | 2005-09-08 | Franz John P. | Heat sink retention assembly and related methods |
US7063136B2 (en) * | 2004-08-25 | 2006-06-20 | Hon Hai Precision Industry Co., Ltd | Heat dissipation device having cap for protecting thermal interface material thereon |
US7301774B2 (en) * | 2004-12-04 | 2007-11-27 | Fu Zhun Precision Industry (Shenzhen) Co., Ltd. | Universal locking device for heat sink |
US7239518B2 (en) * | 2005-11-01 | 2007-07-03 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Universal locking device for heat sink |
US7333333B2 (en) * | 2005-11-30 | 2008-02-19 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Locking device for heat sink |
US7631402B2 (en) * | 2006-11-03 | 2009-12-15 | Po-Hui Huang | Retaining device for heat sink |
US7719840B2 (en) * | 2007-10-29 | 2010-05-18 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink assembly having a fixing base thereof |
US7835152B2 (en) * | 2008-11-20 | 2010-11-16 | Inventec Corporation | Heat dissipating module |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20130163207A1 (en) * | 2011-12-26 | 2013-06-27 | Hon Hai Precision Industry Co., Ltd. | Heat sink |
US20130239387A1 (en) * | 2012-03-14 | 2013-09-19 | James N. Richey | Bracket Assembly |
US8876073B2 (en) * | 2012-03-14 | 2014-11-04 | H. M. Richards, Inc. | Bracket assembly |
US20150037091A1 (en) * | 2012-03-14 | 2015-02-05 | H.M. Richards, Inc. | Bracket Assembly |
US9334891B2 (en) * | 2012-03-14 | 2016-05-10 | H.M. Richards, Inc. | Bracket assembly |
US20140150993A1 (en) * | 2012-11-30 | 2014-06-05 | Foxconn Technology Co., Ltd. | Base with heat absorber and heat dissipating module having the base |
US9449894B2 (en) * | 2012-11-30 | 2016-09-20 | Furui Precise Component (Kunshan) Co., Ltd. | Base with heat absorber and heat dissipating module having the base |
US20160351470A1 (en) * | 2012-11-30 | 2016-12-01 | Furui Precise Component (Kunshan) Co., Ltd. | Base with heat absorber and heat dissipating module having the base |
US9842791B2 (en) * | 2012-11-30 | 2017-12-12 | Furui Precise Component (Kunshan) Co., Ltd. | Base with heat absorber and heat dissipating module having the base |
Also Published As
Publication number | Publication date |
---|---|
US20110108234A1 (en) | 2011-05-12 |
CN102065663A (en) | 2011-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CAO, LEI;LI, MIN;REEL/FRAME:024208/0110 Effective date: 20100320 Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CAO, LEI;LI, MIN;REEL/FRAME:024208/0110 Effective date: 20100320 |
|
REMI | Maintenance fee reminder mailed | ||
LAPS | Lapse for failure to pay maintenance fees | ||
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Expired due to failure to pay maintenance fee |
Effective date: 20170326 |