US7989034B2 - Method for continuous atmospheric pressure plasma treatment of workpieces - Google Patents
Method for continuous atmospheric pressure plasma treatment of workpieces Download PDFInfo
- Publication number
- US7989034B2 US7989034B2 US11/993,095 US99309506A US7989034B2 US 7989034 B2 US7989034 B2 US 7989034B2 US 99309506 A US99309506 A US 99309506A US 7989034 B2 US7989034 B2 US 7989034B2
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- United States
- Prior art keywords
- workpiece
- electrode
- voltage
- atmosphere
- plasma
- Prior art date
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- Expired - Fee Related, expires
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32348—Dielectric barrier discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
- C23C16/545—Apparatus specially adapted for continuous coating for coating elongated substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2418—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the electrodes being embedded in the dielectric
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2437—Multilayer systems
Definitions
- the invention relates to a method for continuous plasma treatment of workpieces.
- the invention relates to a method of continuous plasma treatment of boards or sheets of material at atmospheric pressure.
- a plasma treatment in the sense of this invention is understood in particular to refer to a plasma coating.
- An industrial corona system usually consists of a high-voltage electrode and a counter-electrode designed as a roll and guided over the plastic film, which is in close proximity.
- the electrode is arranged parallel to the roll, with the electrode being connected to a high voltage of approximately 10 kilovolts at approximately 20-40 kilohertz and the roll being connected to ground potential.
- a corona discharge develops with conventional practical power outputs of 1 to 5 kilowatts per meter.
- the plastic film is activated by the corona discharge, i.e., oxidized at the surface.
- a primer For higher adhesion demands, a primer must be applied to the plastic film after the plasma activation.
- Primers generally consist mostly of solvent plus a component that improves adhesion. After application of the primer, e.g., by rolling, the solvent must be removed. This is accomplished through a drying tunnel, and in the case of an organic solvent, it must be burned thermally.
- a carrier gas e.g., air, nitrogen, a noble gas or mixtures thereof with precursors, e.g., tetramethyl orthosilicate or hexamethylene disiloxane
- precursors e.g., tetramethyl orthosilicate or hexamethylene disiloxane
- the electrode system itself is also coated here. Therefore, the required discharge gap between the electrode system and the counter-electrode is closed and the coating process must be interrupted for cleaning, which is not acceptable for continuous industrial processes.
- the object of the present invention is to provide a method with which a workpiece can be subjected to an atmospheric-pressure plasma treatment and/or plasma discharge on a side facing away from the electrode.
- This object is achieved by a method for continuous atmospheric-pressure plasma treatment and/or plasma coating.
- the essential aspect of the inventive method is to create different atmospheres on the side of the workpiece facing the at least one high-voltage electrode and the side of the workpiece facing away from the electrode.
- atmospheric pressure in the sense of the present invention should also be understood to include pressures which are reduced or elevated with respect to the standard pressure of 1,013 millibar. Pressure differences of approximately + ⁇ 100 millibar around this normal pressure are still regarded as falling under the term “atmospheric pressure.”
- the variant of the adjustment of different atmospheres i.e., the adjustment by using different gases and/or gas mixtures, will definitely be selected more often.
- the gas or gas atmosphere used there will be one that allows a greater free path length and thus a plasma discharge at a lower high voltage than in the first atmosphere.
- a different gas mixture in the sense of the present invention is also understood to include different gases or gas mixtures in which one of the gas mixtures contains a precursor, while the second gas mixture, which otherwise has the same composition, does not contain a precursor. With such an adjustment, it is possible, for example, to apply a coating to the back side of the workpiece, while implementing only a plasma treatment on the front side (the side facing the high-voltage electrode) by introducing precursors only into the second atmosphere.
- a plasma discharge for a plasma treatment and/or a plasma coating exclusively in the second atmosphere by selecting the first and second atmospheres and the high voltage on the at least one high-voltage electrode accordingly.
- a plasma discharge may also be triggered in both atmospheres by performing the adjustment of the atmosphere and the high voltage, which is applied to the at least high-voltage electrode, accordingly.
- the plasma coating of the workpiece is applied only to the back side, i.e., the side where the second atmosphere is located, by introducing chemical reagents (precursors) there—and only there—as starting materials for a coating.
- At least two high-voltage electrodes which are arranged on one and the same side of the workpiece (in the first atmosphere) are used to create the plasma discharge and/or corona discharge.
- the high-voltage electrodes used to perform this method may include both barrier electrodes as well as metal electrodes and combinations of such electrodes (e.g., a barrier electrode and a metal electrode).
- FIG. 1 a schematic sectional view of a device for performing the inventive method in a first variant, shown in a direction of conveyance of a workpiece that is to be treated continuously and/or coated by means of a precursor, using two barrier electrodes as high-voltage electrodes and a plasma discharge on the side of the workpiece facing away from the barrier electrodes;
- FIG. 2 in a view like that of FIG. 1 , an alternative device with metal electrodes instead of barrier electrodes;
- FIG. 3 in a view like that in FIG. 1 , another alternative device with a combined electrode arrangement comprising a metal electrode and a barrier electrode;
- FIG. 4 in a view like that in FIG. 1 , another alternative device with a combined electrode arrangement with one metal electrode between two barrier electrodes;
- FIG. 5 in a view like that in FIG. 1 , another alternative device with a combined electrode arrangement with a barrier electrode arranged between two metal electrodes;
- FIG. 6 a diagram of a device like that in FIG. 1 , but here a plasma discharge occurs on both sides of the workpiece through control of the method;
- FIG. 7 a diagram of a device like that in FIG. 3 , but here a plasma discharge occurs on both sides of the workpiece through control of the method;
- FIG. 8 a diagram of a device like that in FIG. 4 , but here a plasma discharge occurs on both sides of the workpiece through control of the method;
- FIG. 9 a diagram of a device like that in FIG. 5 , but with a plasma discharge occurring on both sides of the workpiece here through control of the method.
- FIG. 1 shows schematically a device for performing the inventive method, as done with a first variant of such a method.
- the device includes two barrier electrodes 1 arranged at a distance from the surface of a workpiece 3 , a high voltage in the form of an AC voltage preferably being applied to the barrier electrodes.
- the barrier electrodes 1 have in their interior an electric conductor, which is electrically insulated with respect to the environment by using a barrier material. This material is preferably an aluminum oxide ceramic, which has proven to be especially stable in these applications.
- the space between the pair of barrier electrodes 1 and the surface of the workpiece 3 (in this case a workpiece path) is filled with a first atmosphere.
- a housing 5 is arranged on the “back side” of the workpiece 3 facing away from the barrier electrodes 1 , and a second space having a second atmosphere is formed inside this housing.
- This space is charged with a process gas 7 and optionally a precursor 6 , as indicated by the two arrows. In this way, a different atmosphere is established in the space in the housing 5 than in the area between the barrier electrodes 1 and the workpiece 3 .
- a plasma discharge 4 can be ignited in a targeted manner on the “back side” of the workpiece 3 due to these different atmospheres, given a choice of a suitable high voltage; this plasma discharge 4 acts as a pure plasma discharge in a process gas to induce a plasma treatment, or when precursors 6 are added, the plasma discharge produces a plasma coating on this side of the workpiece 3 .
- the workpiece 3 is guided continuously in this direction through the device, which is diagramed schematically, and in this way the entirety of the workpiece is plasma treated, i.e., plasma coated on the “back side.”
- Suction 8 is provided here, i.e., the process gas 7 along with any remaining precursors 6 and species generated in the plasma discharge 4 are removed by suction and sent to a downstream exhaust gas treatment system (not shown here) to prevent unwanted plasma products, such as ozone in particular, from entering the environment.
- the precursors (labeled as 6 in the figure schematically) for performing this method need not necessarily be introduced into the housing 5 and therefore introduced into the second atmosphere. It is also equally good for the method to be performed with a pure process gas 7 , even without the addition of precursors, to be able to perform a plasma treatment of the workpiece 3 on its “back side.”
- FIG. 1 shows that the two barrier electrodes 1 , which together form a pair of high-voltage electrodes, are separated by a gap and at a distance from one another. It is important to note here that as long as this gap, i.e., distance between the barrier electrodes 1 , is not too great, a continuous plasma discharge 4 is still formed on the back side of the workpiece 3 . Those skilled in the art will attempt to perform the adjustment of the gap shown in FIG. 1 on the basis of their technical expertise or simple experimental series.
- barrier electrodes 1 may equally well be arranged on each side of the gap shown there without leaving a wider gap or being aligned during next to one another. It is also possible to provide more than two barrier electrodes 1 separated by a gap from one another as the electrode arrangement.
- Suitable precursors 6 include, for example, tetramethyl orthosilicate, hexamethylene disiloxane in the gas phase or gaseous precursors, e.g., silane.
- a silicon dioxide layer in the range of a few nanometers to micrometers may be deposited on the “back” surface of the workpiece by using these precursors. Such a layer constitutes a substitute for the function of a wet chemical primer.
- other types of layers with other chemical functions and other effects may also be deposited as antiadhesion, antiscratch or barrier layers.
- the barrier electrodes 1 shown in the exemplary embodiment may have a length of up to several meters.
- the conductors 2 to be provided to establish a potential difference between the barrier electrodes 1 in the course of the high voltage (AC voltage) may be, for example, a metal powder filling or a metal coating of the barrier electrodes 1 from the inside.
- the preferred barrier electrodes 1 are those made of rectangular tubes with one or more channels each.
- a sinusoidal voltage between 10 and 60 kilovolt with a frequency of 1 to 100 kilohertz, preferably 5 to 30 kilohertz is used in executing the inventive method.
- the voltage may also be pulsed here.
- FIGS. 2 through 5 which otherwise show a similar discharge situation, different electrode arrangements that are suitable for use with the inventive method are shown, although they do not constitute a definitive representation.
- FIG. 2 shows an arrangement similar to that in FIG. 1 , with the high-voltage electrodes shown there being metal electrodes 9 .
- Different electrode arrangements comprising barrier electrodes 1 and metal electrodes 9 , which are also suitable for performing the inventive method, are shown in the additional FIGS. 3 through 5 .
- FIGS. 6 through 9 A device for performing the inventive method in a second variant is illustrated in FIGS. 6 through 9 —likewise with a different assembly of the electrode arrangement with barrier electrodes 1 and metal electrodes 9 .
- a housing 5 surrounds a space (a first space on the “front side” and a second space on the “back side”) on both the “back side” of the workpiece and on the “front side” which faces the electrode arrangement.
- the second space is charged with a process gas 7 and optionally with added precursors 6 as depicted and described in conjunction with the FIGS. 1 through 5 and is connected to a suction exhaust 8 . Therefore, in this variant of the process, a plasma discharge 4 is also ignited in a targeted manner on the “back side” of the workpiece 3 .
- the atmosphere in the first space (the space enclosed in a housing 5 , containing the electrode arrangement) is selected in accordance with the high voltage applied so that a plasma discharge 10 is also ignited here.
- a process gas may be fed into this space (not shown in the figures), and this process gas differs in composition from the process gas 7 , which is fed from the space enclosed by the housing 5 on the “back side” of the workpiece 3 .
- the space enclosed by the housing 5 on the side of the workpiece 3 containing the electrode arrangement is also connected to a suction exhaust 8 to remove the reaction products, ozone in particular, formed by the plasma discharge 10 and render it harmless.
- precursors are not introduced into the plasma discharge 10 onto the electrode side in order to avoid coating of the high-voltage electrodes (barrier electrodes 1 /metal electrodes 9 ).
- the inventive method allows a plasma treatment and/or plasma coating on the “back side” of the workpiece 3 and at the same time a plasma treatment on the “front side” facing its electrode arrangement.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Treatment Of Fiber Materials (AREA)
Abstract
Description
- 1 Barrier electrode
- 2 Electric conductor
- 3 Workpiece
- 4 Plasma discharge
- 5 Housing
- 6 Precursor
- 7 Process gas
- 8 Suction exhaust
- 9 Metal electrode
- 10 Plasma discharge (electrode side)
- P Arrow (direction of movement)
Claims (19)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005029360A DE102005029360B4 (en) | 2005-06-24 | 2005-06-24 | Two methods for continuous atmospheric pressure Plasma treatment of workpieces, in particular material plates or sheets |
DE102005029360.3 | 2005-06-24 | ||
DE102005029360 | 2005-06-24 | ||
PCT/EP2006/005838 WO2007000255A2 (en) | 2005-06-24 | 2006-06-19 | Method for treating plasma and/or covering plasma of workpieces under continuous atmospheric pressure, in particular material plates or strips |
Publications (2)
Publication Number | Publication Date |
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US20100221451A1 US20100221451A1 (en) | 2010-09-02 |
US7989034B2 true US7989034B2 (en) | 2011-08-02 |
Family
ID=36997862
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/993,362 Abandoned US20100112235A1 (en) | 2005-06-24 | 2006-06-19 | Method for treating plasma under continuous atmospheric pressure of work pieces, in particular, material plates or strips |
US11/993,095 Expired - Fee Related US7989034B2 (en) | 2005-06-24 | 2006-06-19 | Method for continuous atmospheric pressure plasma treatment of workpieces |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/993,362 Abandoned US20100112235A1 (en) | 2005-06-24 | 2006-06-19 | Method for treating plasma under continuous atmospheric pressure of work pieces, in particular, material plates or strips |
Country Status (9)
Country | Link |
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US (2) | US20100112235A1 (en) |
EP (2) | EP1902156B1 (en) |
JP (1) | JP2008547166A (en) |
CN (1) | CN101198718B (en) |
AT (2) | ATE432379T1 (en) |
DE (2) | DE102005029360B4 (en) |
DK (1) | DK1902156T3 (en) |
PL (1) | PL1894449T3 (en) |
WO (2) | WO2007000255A2 (en) |
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US20100112235A1 (en) * | 2005-06-24 | 2010-05-06 | Softal Electronic Erik Blumenfeld Gmbh & Co. Kg | Method for treating plasma under continuous atmospheric pressure of work pieces, in particular, material plates or strips |
US20120291706A1 (en) * | 2011-05-17 | 2012-11-22 | Hitachi, Ltd. | Atmospheric Pressure Plasma Processing Apparatus |
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BG66022B1 (en) * | 2005-06-14 | 2010-10-29 | ДИНЕВ Петър | Method for plasma chemical surface modification |
DE102005029360B4 (en) * | 2005-06-24 | 2011-11-10 | Softal Corona & Plasma Gmbh | Two methods for continuous atmospheric pressure Plasma treatment of workpieces, in particular material plates or sheets |
US20070154650A1 (en) * | 2005-12-30 | 2007-07-05 | Atomic Energy Council - Institute Of Nuclear Energy Research | Method and apparatus for glow discharge plasma treatment of flexible material at atmospheric pressure |
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2005
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2006
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- 2006-06-19 EP EP06762073A patent/EP1902156B1/en not_active Not-in-force
- 2006-06-19 WO PCT/EP2006/005838 patent/WO2007000255A2/en active Application Filing
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100112235A1 (en) * | 2005-06-24 | 2010-05-06 | Softal Electronic Erik Blumenfeld Gmbh & Co. Kg | Method for treating plasma under continuous atmospheric pressure of work pieces, in particular, material plates or strips |
US20120291706A1 (en) * | 2011-05-17 | 2012-11-22 | Hitachi, Ltd. | Atmospheric Pressure Plasma Processing Apparatus |
US10827598B2 (en) | 2017-08-16 | 2020-11-03 | DBD Plasma GmbH | Plasma generator module |
Also Published As
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ATE432379T1 (en) | 2009-06-15 |
JP2008547166A (en) | 2008-12-25 |
WO2007016999A2 (en) | 2007-02-15 |
DE102005029360B4 (en) | 2011-11-10 |
DK1902156T3 (en) | 2009-08-24 |
EP1894449B1 (en) | 2011-11-09 |
EP1894449A2 (en) | 2008-03-05 |
US20100112235A1 (en) | 2010-05-06 |
CN101198718A (en) | 2008-06-11 |
EP1902156B1 (en) | 2009-05-27 |
PL1894449T3 (en) | 2012-04-30 |
CN101198718B (en) | 2010-05-26 |
WO2007016999A3 (en) | 2009-09-03 |
DE502006003822D1 (en) | 2009-07-09 |
ATE533339T1 (en) | 2011-11-15 |
EP1902156A2 (en) | 2008-03-26 |
WO2007000255A3 (en) | 2007-04-26 |
US20100221451A1 (en) | 2010-09-02 |
DE102005029360A1 (en) | 2006-12-28 |
WO2007000255A2 (en) | 2007-01-04 |
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