US7460760B2 - Optical waveguide master and method of manufacturing the same - Google Patents
Optical waveguide master and method of manufacturing the same Download PDFInfo
- Publication number
- US7460760B2 US7460760B2 US11/449,412 US44941206A US7460760B2 US 7460760 B2 US7460760 B2 US 7460760B2 US 44941206 A US44941206 A US 44941206A US 7460760 B2 US7460760 B2 US 7460760B2
- Authority
- US
- United States
- Prior art keywords
- master
- optical waveguide
- inclined surfaces
- pdms
- embossed pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related, expires
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 claims description 17
- 238000005498 polishing Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 8
- 238000001020 plasma etching Methods 0.000 claims description 5
- 239000004819 Drying adhesive Substances 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 10
- 230000008878 coupling Effects 0.000 abstract description 4
- 238000010168 coupling process Methods 0.000 abstract description 4
- 238000005859 coupling reaction Methods 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000011162 core material Substances 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
- G02B6/4203—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12104—Mirror; Reflectors or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12166—Manufacturing methods
- G02B2006/12197—Grinding; Polishing
Definitions
- the present invention relates to an optical waveguide, and more particularly, to an optical waveguide master having an integrated 45° inclined reflection surface and a method of manufacturing the same.
- a next generation information telecommunication system comprised of a large-capacity parallel computer, or an asynchronous transfer mode (ATM) switching system operating at more than a Terra bit per second (Tb/s), requires improved signal processing capability. This, in turn, requires high-speed signal transfer and high-density wiring.
- ATM asynchronous transfer mode
- Such a method using an optical signal is applicable to several fields such as device-to-device, board-to-board, and chip-to-chip, and more particularly, is suitable to building of an optical signal communication system for use within a relatively short distance such as a chip-to-chip distance.
- a predetermined pattern mask is formed, a master is manufactured using the mask, and the optical waveguide is manufactured using molding or injection.
- 45° inclined surface polishing is performed using a polisher.
- an ultraviolet (UV) lithography method not employing molding or injection may be used to form the waveguide. In this case also, the 45° inclined surface polishing is performed.
- the method of manufacturing the optical waveguide using 45° inclined surface polishing has several drawbacks. Most notably, due to poor reproducibility, after one optical waveguide is produced, the polishing process has to be repeated every time in mass production.
- the present invention is directed to implementation of an optical waveguide master and a method of manufacturing the same, based on a remarkable advance of optical interconnection technology, advent of optical layout technology, and system on packaging (SOP) technology for connection between an optical printed circuit board (PCB) and a chip.
- SOP system on packaging
- the present invention is also directed to implementation of an optical waveguide master and a method of manufacturing the same, in which an integrated optical waveguide can be made in various shapes, thereby facilitating optical coupling between an active photo-electronic device (VCSEL, PIN, or PD) and the optical waveguide, and enabling inexpensive mass production.
- an active photo-electronic device VCSEL, PIN, or PD
- One aspect of the present invention provides a method of manufacturing an optical waveguide master, the method including the steps of (i) forming an optical waveguide manufacturing master having at least one embossed pattern to be a core region, on a substrate; (ii) polishing the optical waveguide manufacturing master at predetermined regions at both ends of the embossed pattern to form inclined surfaces; (iii) cutting the optical waveguide manufacturing master with the inclined surfaces at both sides of and in parallel with the embossed pattern, and forming a main master having the embossed pattern and the inclined surfaces, and first and second sub masters having only the inclined surfaces without the embossed pattern; (iv) mutually facing, overlaying, and fixing inclined surfaces of the first and second sub masters to respective inclined surfaces of the main master, to form an optical waveguide manufacturing master with inclined surfaces; and (v) pouring PDMS (Poly-DiMethal-Siloxane) onto the optical waveguide manufacturing master with the inclined surfaces, covering the PDMS with a glass sheet, thermally curing the PDMS, and
- the step (i) may include the steps of: forming a mask for forming a channel using photolithography; and forming the optical waveguide manufacturing master having the embossed pattern on the substrate through deep RIE (reactive ion etching) and dry etching using the formed mask.
- RIE reactive ion etching
- an engraved pattern adjacent to the embossed pattern may have a greater width than the embossed pattern.
- the inclined surface may have an inclination of 30° to 60°.
- the step (iv) may include the steps of: placing the main master and the sub masters on a glass plate, and matching the respective inclined surfaces in height using a microscope; and fixing rears of the sub masters to a bottom using a quick-drying adhesive, and forming the optical waveguide master with the inclined surfaces.
- FIGS. 1 to 5 illustrate a method of manufacturing an optical waveguide master according to the present invention
- FIG. 6 illustrates a process of manufacturing an optical waveguide using a PDMS master manufactured according to the present invention.
- FIG. 7 illustrates technology related to application of a 45° inclined surface integrated optical waveguide and an exemplary embodiment related to the scope of its application according to the present invention.
- FIGS. 1 to 5 illustrate a method of manufacturing an optical waveguide master according to the present invention.
- an optical waveguide manufacturing master 100 having at least one embossed pattern 110 is formed on a silicon substrate 130 .
- a mask for forming a channel is formed by photolithography, and the optical waveguide manufacturing master 100 having the embossed pattern 110 is formed on the silicon substrate 130 through deep reactive ion etching (RIE) and dry etching using the formed mask.
- RIE deep reactive ion etching
- the part of the silicon region where the embossed pattern 110 is formed is called a main master 100 and the regions on either side of the main master 100 are called first and second sub masters 200 a and 200 b .
- the main master 100 and the first and second sub masters 200 a and 200 b are collectively referred to as “an optical waveguide master.”
- the optical waveguide master is formed to have 45° inclined surfaces 300 at predetermined regions of both end surfaces such that the main master 100 and the first and second sub masters 200 a and 200 b have the same inclined surfaces at both ends.
- the inclined surface may have an inclination of 30° to 60°, but is preferably formed to have an inclination of 45°.
- the 45° inclined surface 300 can be formed by various inclined surface forming methods, but is preferably formed by polishing with a polishing paper using a 45° inclined surface dedicated jig. The polishing is performed until the 45° inclined surface becomes a mirror surface, thereby preventing reflection loss.
- the optical waveguide master with the 45° inclined surface completely polished is cut to have both wing parts along a cut line 310 parallel with the embossed pattern 110 . Accordingly, one main master 100 having the embossed pattern 110 and the 45° inclined surface 300 , and two first and second sub masters 200 a and 200 b having only the 45° inclined surface 300 without the embossed pattern 110 are formed.
- the inclined surfaces of the main master 100 and the first and second sub masters 200 a and 200 b have the same inclination.
- the 45° inclined surfaces 300 of the main master 100 precisely match with the 45° inclined surfaces 300 of the first and second sub masters 200 a and 200 b , and an error resulting from a clad step of the master caused by mutual adherence is reduced to 2 ⁇ m or less.
- an optical waveguide manufacturing master with a 45° inclined surface and reduced error resulting from a clad step can be manufactured with ease.
- FIG. 4 illustrates an optical waveguide master completed by turning over and attaching the sub masters 200 a and 200 b to both inclined surfaces of the main master 100 , which is an embossed optical waveguide.
- the 45° inclined surfaces of the main master 100 for the embossed optical waveguide precisely match the 45° inclined surfaces of the cut first and second sub masters 200 a and 200 b , and that the master and the sub masters match each other in height.
- the sub masters 200 a and 200 b are shorter than the main master 100 , which is the original optical waveguide, a core is unnecessarily formed, thereby forming an inaccurate waveguide model.
- the 45° inclined surfaces 300 are not formed.
- the sub masters are cut from the main master and turned over, thereby completely solving the problem of height mismatch between the two masters.
- Poly-DiMethal-Siloxane (PDMS) 400 is poured onto the completed embossed silicon master, covered with a glass sheet 500 , and thermally cured. Accordingly, a PDMS master 400 a having a reflection surface with the 45° inclined surface 300 is manufactured.
- PDMS Poly-DiMethal-Siloxane
- the PDMS master 400 a is an integrated substrate formed of PDMS, and the waveguide has an engraved pattern formed on one surface of the integrated substrate and 45° inclined surfaces formed at both ends of the engraved pattern.
- the engraved pattern can be also formed on both surfaces of the integrated substrate.
- a 45° inclined surface may be formed at only one end of the engraved pattern.
- FIG. 6 illustrates a process of manufacturing an optical waveguide using a PDMS master manufactured according to the present invention.
- the PDMS 400 is poured onto the silicon master 100 manufactured in FIG. 4 , thereby completing the PDMS master 400 a as in FIG. 5 .
- a core material 800 is poured onto the PDMS master 400 a , and a cover sheet 600 having a slightly low refractive index is placed on top of the poured core material 800 .
- the cover sheet 600 is pressed a little using the jig to prevent generation of a slab and then cured using an ultraviolet (UV) light source 700 . This completes formation of the optical waveguide 800 having the 45° inclined surface 300 .
- UV ultraviolet
- the inclined surface has an inclination of 30° to 60°, and preferably, 45°.
- FIG. 7 illustrates technology related to application of a 45° inclined surface integrated optical waveguide and an exemplary embodiment related to the scope of its application according to the present invention.
- a completed optical waveguide 830 can provide interconnection for signal transmission between chips, and its principle will be briefly described below.
- electro-optical devices VCSEL, and LD
- their drivers 810 and 850 will be required.
- the optical signal After an electric signal is converted into an optical signal in an electro-optical device, the optical signal requires a transmission medium for transmission to other chips. Once transmitted, the signal is again restored into an electric signal by a photo-electronic device (PD) 840 , and transmitted to a desired chip.
- PD photo-electronic device
- the 45° inclined surface integrated optical waveguide manufactured using the inventive method inexpensive mass production becomes possible.
- an optical module can be configured with ease. In such a case, a method in which the 45° inclined surface is provided at only one end is adopted.
- the inventive optical waveguide master and method of its manufacture have several effects.
- a molding master simultaneously equipped with a multi-mode optical waveguide and a 45° inclined surface is made possible, so that the integrated optical waveguide with the 45° inclined surface, enabling a 90° optical path change of various shapes is made possible.
- This facilitates optical coupling between active photo-electronic devices (VCSEL, PIN, PD) and the optical waveguide, as well as between the active optical devices, and enables low-priced mass production.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050085158A KR100696178B1 (en) | 2005-09-13 | 2005-09-13 | Optical waveguide master and its manufacturing method |
KR10-2005-0085158 | 2005-09-13 |
Publications (2)
Publication Number | Publication Date |
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US20070058922A1 US20070058922A1 (en) | 2007-03-15 |
US7460760B2 true US7460760B2 (en) | 2008-12-02 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US11/449,412 Expired - Fee Related US7460760B2 (en) | 2005-09-13 | 2006-06-08 | Optical waveguide master and method of manufacturing the same |
Country Status (2)
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US (1) | US7460760B2 (en) |
KR (1) | KR100696178B1 (en) |
Cited By (28)
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US10096516B1 (en) | 2017-08-18 | 2018-10-09 | Applied Materials, Inc. | Method of forming a barrier layer for through via applications |
US10179941B1 (en) | 2017-07-14 | 2019-01-15 | Applied Materials, Inc. | Gas delivery system for high pressure processing chamber |
US10224224B2 (en) | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
US10234630B2 (en) | 2017-07-12 | 2019-03-19 | Applied Materials, Inc. | Method for creating a high refractive index wave guide |
US10269571B2 (en) | 2017-07-12 | 2019-04-23 | Applied Materials, Inc. | Methods for fabricating nanowire for semiconductor applications |
US10276908B2 (en) | 2016-12-23 | 2019-04-30 | Industrial Technology Research Institute | Electromagnetic wave transmission board and differential electromagnetic wave transmission board |
US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
US10529585B2 (en) | 2017-06-02 | 2020-01-07 | Applied Materials, Inc. | Dry stripping of boron carbide hardmask |
US10566188B2 (en) | 2018-05-17 | 2020-02-18 | Applied Materials, Inc. | Method to improve film stability |
US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
US10636669B2 (en) | 2018-01-24 | 2020-04-28 | Applied Materials, Inc. | Seam healing using high pressure anneal |
US10636677B2 (en) | 2017-08-18 | 2020-04-28 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
US10643867B2 (en) | 2017-11-03 | 2020-05-05 | Applied Materials, Inc. | Annealing system and method |
US10675581B2 (en) | 2018-08-06 | 2020-06-09 | Applied Materials, Inc. | Gas abatement apparatus |
US10685830B2 (en) | 2017-11-17 | 2020-06-16 | Applied Materials, Inc. | Condenser system for high pressure processing system |
US10704141B2 (en) | 2018-06-01 | 2020-07-07 | Applied Materials, Inc. | In-situ CVD and ALD coating of chamber to control metal contamination |
US10714331B2 (en) | 2018-04-04 | 2020-07-14 | Applied Materials, Inc. | Method to fabricate thermally stable low K-FinFET spacer |
US10720341B2 (en) | 2017-11-11 | 2020-07-21 | Micromaterials, LLC | Gas delivery system for high pressure processing chamber |
US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
US10847360B2 (en) | 2017-05-25 | 2020-11-24 | Applied Materials, Inc. | High pressure treatment of silicon nitride film |
US10854483B2 (en) | 2017-11-16 | 2020-12-01 | Applied Materials, Inc. | High pressure steam anneal processing apparatus |
US10957533B2 (en) | 2018-10-30 | 2021-03-23 | Applied Materials, Inc. | Methods for etching a structure for semiconductor applications |
US10998200B2 (en) | 2018-03-09 | 2021-05-04 | Applied Materials, Inc. | High pressure annealing process for metal containing materials |
US11177128B2 (en) | 2017-09-12 | 2021-11-16 | Applied Materials, Inc. | Apparatus and methods for manufacturing semiconductor structures using protective barrier layer |
US11227797B2 (en) | 2018-11-16 | 2022-01-18 | Applied Materials, Inc. | Film deposition using enhanced diffusion process |
US11581183B2 (en) | 2018-05-08 | 2023-02-14 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
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US20090148393A1 (en) * | 2007-12-11 | 2009-06-11 | Avon Products, Inc. | Multistep Cosmetic Compositions |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5526454A (en) * | 1992-04-10 | 1996-06-11 | Robert Bosch Gmbh | Method for producing optical polymer components having integrated fibre-chip coupling by means of casting technology |
US5761350A (en) | 1997-01-22 | 1998-06-02 | Koh; Seungug | Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system assembly |
US6793405B1 (en) | 1998-08-05 | 2004-09-21 | Seiko Epson Corporation | Optical module |
KR20040089014A (en) | 2004-09-10 | 2004-10-20 | 한국정보통신대학교 산학협력단 | Architectures of optical connection blocks and optical transceiver modules for passive alignment onto optical PCBs |
US20050008316A1 (en) * | 2003-05-02 | 2005-01-13 | Aydin Yeniay | Optical waveguide amplifier |
US20050133943A1 (en) * | 2003-12-19 | 2005-06-23 | Fuji Xerox Co., Ltd. | Process for producing polymer optical waveguide |
US20070025671A1 (en) * | 2004-10-29 | 2007-02-01 | Fuji Xerox Co., Ltd. | Bidirectional communication optical waveguide and manufacturing method thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3417555B2 (en) * | 2001-06-29 | 2003-06-16 | 株式会社コナミコンピュータエンタテインメント東京 | GAME DEVICE, PERSONAL IMAGE PROCESSING METHOD, AND PROGRAM |
JP4897192B2 (en) * | 2002-10-30 | 2012-03-14 | 株式会社日立製作所 | Functional substrate having columnar microprojections and method for manufacturing the same |
-
2005
- 2005-09-13 KR KR1020050085158A patent/KR100696178B1/en not_active Expired - Fee Related
-
2006
- 2006-06-08 US US11/449,412 patent/US7460760B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5526454A (en) * | 1992-04-10 | 1996-06-11 | Robert Bosch Gmbh | Method for producing optical polymer components having integrated fibre-chip coupling by means of casting technology |
US5761350A (en) | 1997-01-22 | 1998-06-02 | Koh; Seungug | Method and apparatus for providing a seamless electrical/optical multi-layer micro-opto-electro-mechanical system assembly |
US6793405B1 (en) | 1998-08-05 | 2004-09-21 | Seiko Epson Corporation | Optical module |
US20050008316A1 (en) * | 2003-05-02 | 2005-01-13 | Aydin Yeniay | Optical waveguide amplifier |
US20050133943A1 (en) * | 2003-12-19 | 2005-06-23 | Fuji Xerox Co., Ltd. | Process for producing polymer optical waveguide |
KR20040089014A (en) | 2004-09-10 | 2004-10-20 | 한국정보통신대학교 산학협력단 | Architectures of optical connection blocks and optical transceiver modules for passive alignment onto optical PCBs |
US20070025671A1 (en) * | 2004-10-29 | 2007-02-01 | Fuji Xerox Co., Ltd. | Bidirectional communication optical waveguide and manufacturing method thereof |
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US10847360B2 (en) | 2017-05-25 | 2020-11-24 | Applied Materials, Inc. | High pressure treatment of silicon nitride film |
US11705337B2 (en) | 2017-05-25 | 2023-07-18 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
US10529585B2 (en) | 2017-06-02 | 2020-01-07 | Applied Materials, Inc. | Dry stripping of boron carbide hardmask |
US10234630B2 (en) | 2017-07-12 | 2019-03-19 | Applied Materials, Inc. | Method for creating a high refractive index wave guide |
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US10720341B2 (en) | 2017-11-11 | 2020-07-21 | Micromaterials, LLC | Gas delivery system for high pressure processing chamber |
US11756803B2 (en) | 2017-11-11 | 2023-09-12 | Applied Materials, Inc. | Gas delivery system for high pressure processing chamber |
US10854483B2 (en) | 2017-11-16 | 2020-12-01 | Applied Materials, Inc. | High pressure steam anneal processing apparatus |
US11610773B2 (en) | 2017-11-17 | 2023-03-21 | Applied Materials, Inc. | Condenser system for high pressure processing system |
US10685830B2 (en) | 2017-11-17 | 2020-06-16 | Applied Materials, Inc. | Condenser system for high pressure processing system |
US10636669B2 (en) | 2018-01-24 | 2020-04-28 | Applied Materials, Inc. | Seam healing using high pressure anneal |
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US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
US11110383B2 (en) | 2018-08-06 | 2021-09-07 | Applied Materials, Inc. | Gas abatement apparatus |
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KR20070030469A (en) | 2007-03-16 |
US20070058922A1 (en) | 2007-03-15 |
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