Classifications

• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
  • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
  • C07F7/02—Silicon compounds
  • C07F7/08—Compounds having one or more C—Si linkages
  • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
  • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
  • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
  • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
  • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
  • C08G59/4238—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof heterocyclic
• • C—CHEMISTRY; METALLURGY
  • C07—ORGANIC CHEMISTRY
  • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
  • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
  • C07F7/02—Silicon compounds
  • C07F7/08—Compounds having one or more C—Si linkages
  • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
  • C07F7/1804—Compounds having Si-O-C linkages

Definitions

• the present invention relates to a new composition made up of an organic carboxylate of a basic silane coupling agent and a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater, the new composition being capable of exhibiting exceptional storage stability and enhanced adhesion as an additive for powdered paints and one-component epoxy resin compositions or as an additive for sealing resins, and to a producing method and utilization thereof.
• Imidazoles are curing agents that are receiving attention for providing exceptional curing properties to resin compositions, resulting in cured materials with a high heat resistance.
• problems with storage stability extending their working life by controlling basicity is being investigated through formation of metal complexes and various types of acid salts.
• the inventors have filed patent applications (Japanese Patent Application Publication Nos. 9-12683 and 2000-297094) in which at least one of imidazole group-containing silane coupling agents expressed by the general formulas (1) through (4) below would provide, as curing agents for epoxy resins, a curing epoxy resin composition having exceptional adhesion properties.
• these imidazole group-containing silane coupling agents are disadvantageous in having a poor storage stability when mixed with an epoxy resin in the same manner as in the case of conventional imidazoles.
• silane coupling agents such as amino group-containing silane coupling agents (commercial products), dialkylamino group-containing silane coupling agents (Japanese Patent Application Publication Nos. 9-295988, 9-296135, and 9-295989), monomethylamino group-containing silane coupling agents (commercial products), benzimidazole group-containing silane coupling agents (Japanese Patent Application Publication No. 6-279458), benzotriazole group-containing silane coupling agents (Japanese Patent Application Publication No. 6-279463), or pyridine ring-containing silane coupling agents (Japanese Patent Application Publication Nos. 9-295990 and 9-295991).
• silane coupling agents such as amino group-containing silane coupling agents (commercial products), dialkylamino group-containing silane coupling agents (Japanese Patent Application Publication Nos. 9-295988, 9-296135, and 9-295989), monomethylamino group-containing silane coupling
• the present invention provides a composition that is a solid at room temperature and that provides a stable, long working life without compromising the desirable adhesion characteristics of the above-mentioned silane coupling agents, yet melts at a prescribed temperature and has a silane coupling functionality capable of contributing to the curing reaction, and a method for producing the same; and is aimed at application to an epoxy resin thereof.
• a basic silane coupling agent organic carboxylate composition obtained by a specific method not only had exceptional storage stability as an additive for an epoxy resin, but also yielded a significant enhancement to its adhesion properties.
• the present invention is based upon this discovery, and comprises [1] through [6] below.
• a basic silane coupling agent organic carboxylate composition obtained by a process in which an organic carboxylate of a basic silane coupling agent obtained by reacting a basic silane coupling agent and an organic carboxylic acid is heated and mixed with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.
• R 1 to R 3 each represent hydrogen, a vinyl group, or an alkyl group having 1 to 20 carbon atoms wherein the R 2 and R 3 may form an aromatic ring;
• R 4 and R 5 each represent an alkyl group having 1–5 carbon atoms
• R 6 to R 8 each represent hydrogen, an alkyl group having 1 to 20 carbon atoms, a vinyl group, a phenyl group, or a benzyl group wherein R 7 and R 8 may bond and form an aromatic ring;
• R 9 represents hydrogen or an alkyl group having 1 to 3 carbon atoms
• R 10 and R 11 each represent an alkyl group having 1 to 5 carbon atoms
• n, o, and p are integers of 1 to 10, 1 to 3, 1 to 10, and 1 to 3, respectively.
• R 1 to R 3 each represent hydrogen, a vinyl group, or an alkyl group having 1 to 20 carbon atoms, and aromatic rings may be formed from R 2 and R 3 .
• R 4 and R 5 each represent an alkyl group having 1 to 5 carbon atoms, and m and n represent integers of 1 to 10 and 1 to 3, respectively. Within this range, a value of 3 is particularly preferable for m.
• R 6 to R 8 each represent hydrogen, an alkyl group having 1 to 20 carbon atoms, a vinyl, a phenyl group, or a benzyl group;
• R 9 represents hydrogen or an alkyl group having 1 to 3 carbon atoms, and
• R 10 and R 11 each represent an alkyl group having 1 to 5 carbon atoms.
• o and p are integers of 1 to 10 and 1 to 3, respectively.
• R 7 and R 8 may bond and form an aromatic ring.
• the compounds expressed by the general formulas (1) through (3) above can be synthesized based on the method disclosed in Japanese Patent Application Publication No. 5-186479, and the compound expressed by the general formula (4) above can be synthesized based on the method disclosed in Japanese Patent Application Publication No. 2000-297094.
• the compounds of the general formulas (1) through (3) above are often obtained as a mixture of three types in the producing process, for which separation and purification procedures are not particularly necessary, and a mixture thereof is suitable for use as-is.
• Amino group-containing silane coupling agents include (3-aminopropyl)trimethoxysilane, (3-aminopropyl)triethoxysilane, (3-aminopropyl)dimethoxymethylsilane, (3-aminopropyl)diethoxymethylsilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, and the like.
• Monomethylamino group-containing silane coupling agents include N-methylaminopropyltrimethoxysilane, N-methylaminopropyltriethoxysilane, and the like.
• Dialkylamino group-containing silane coupling agents include those disclosed in Japanese Patent Application Publication Nos.
• dimethylamino group-containing silane coupling agents are particularly preferred.
• Benzotriazole-containing silane coupling agents include those disclosed in Japanese Patent Application Publication No. 6-279463
• benzimidazole group-containing silane coupling agents include those disclosed in Japanese Patent Application Publication No. 6-279458
• pyridine ring-containing silane coupling agents include those disclosed in Japanese Patent Application Publication Nos. 9-295990 and 9-295991.
• the basic silane coupling agent organic carboxylate composition of the present invention is obtained by reacting at least one selected from the above-mentioned basic silane coupling agents with an organic carboxylic acid at 50–200° C. and mixing the product at a heating temperature of 50–200° C. with a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.
• the basic silane coupling agent organic carboxylate composition of the present invention can be used directly as an additive (curing agent) for a one-component epoxy resin.
• An aliphatic saturated carboxylic acid, aliphatic unsaturated carboxylic acid, aromatic carboxylic acid, or the like can be used as the organic carboxylic acid reacted with the basic silane coupling agent.
• Desirable organic carboxylic acids from among these include maleic acid, itaconic acid, azelaic acid, phthalic acid, acrylic acid, methacrylic acid, isobutyric acid, octylic acid, formic acid, glyoxylic acid, crotonic acid, acetic acid, propionic acid, benzoic acid, salicylic acid, cyclohexanecarboxylic acid, toluic acid, phenylacetic acid, p-t-butylbenzoic acid, trimellitic acid, trimellitic anhydride, cis-4-cyclohexene dicarboxylic acid, 2-octenyl succinic acid, 2-dodecenyl succinic acid, pyromellitic acid, and the like
• the reaction molar ratio of the basic silane coupling agent and organic carboxylic acid should preferably be such that at least one carboxyl group per molecule of the organic carboxylic acid forms a salt with a base. That is, the ratio should preferably be from 1:0.1 to 1:5, and preferably from 1:0.2 to 1:2.
• Preferred compounds that have a softening point or melting point of 40° C. or greater and exhibit a good affinity for the basic silane coupling agent or organic carboxylic acid constituting the present invention include those having a softening point or melting point of 40° C. or greater and containing a hydroxyl group, amido group, urea bond, urethane bond, silanol group, amino group, mercapto group, carbonyl group, triazine backbone, or the like.
• Examples thereof include phenol compounds, a polyvinyl alcohol, an acrylic resin, an EVOH resin, an epoxy resin, an epoxy resin partially or completely modified with acrylic acid or methacrylic acid, a melamine-polyamide resin, a urea resin, a urethane resin, a silicone resin, acid anhydrides, and the like.
• the role of these compounds is to make the basic silane coupling agent organic carboxylate into a crushable solid and the compounds are required to have miscibility with and good affinity for the basic silane coupling agent or organic carboxylic acid.
• the merits of the present invention can be sufficiently demonstrated by using the compound having a softening point or melting point of 40° C. or greater.
• Phenol compounds preferably have at least two phenolic hydroxyl groups per molecule, and examples thereof include bisphenol A, bisphenol F, polyvinyl phenol, phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, bisphenol F novolak resin, aralkyl phenol resins, and the like.
• a phenol compound capable of solidifying the composition of the present invention should be selected in an appropriate manner, and such compounds are also believed to be effective in terms of solidification and reactivity in relation to epoxy resins.
• the basic silane coupling agent organic carboxylate and the compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater must be mixed in a ratio at which the composition obtained by heating and mixing the organic carboxylate and the compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater is in a solid form when cooled to room temperature.
• a basic silane coupling agent organic carboxylate composition that is a solid at room temperature can be obtained by controlling the melting point and mixing ratio of the compound having a softening point or melting point of 40° C. or greater and exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid to be admixed.
• Epoxy resin composition :
• Bisphenol A-type epoxy (Epikote 828, mfd. by Japan Epoxy Resins Co., Ltd.): 100 parts by weight
• Dicyandiamide (AH-154, mfd. by Ajinomoto Co., Inc.): 5 parts by weight
• the epoxy resin compositions thus obtained were sandwiched between two sheets of backing material and heat-cured under the conditions described below, yielding bonded materials.
• SUS 304 with the dimensions described below was used for the backing material, and the material was polished with No. 240 abrasive paper in accordance with JIS K6848 immediately before use, and used after being cleaned with acetone.
• Shear adhesive strength was measured for the bonded materials thus obtained, and the effects on adhesion exerted by the additive of the present invention were evaluated.
• the shear adhesive strength of each bonded material was measured at a crosshead speed of 1 mm/min by means of a tensile tester in accordance with JIS K6850. The evaluation results thus obtained are shown in Table 2 below.
• Comparative Example 1 an epoxy resin composition and bonded material thereof were produced in the same manner as in Examples 8–14, except that any one of the above-mentioned additives (Sample Nos. 1–7) for the epoxy resin was not added.
• Comparative Example 2 an epoxy resin composition and bonded material thereof were also produced in the same manner as in Examples 8–14, except that one part of (3-glycidoxypropyl)trimethoxysilane was added instead of the above-mentioned sample as an additive for the epoxy resin. Adhesion testing was performed in the same manner as in Examples 8–14 for each of the bonded materials thus obtained, and the results are shown in Table 2 below.
• Epoxy resin composition :
• Bisphenol A-type epoxy (Epikote 828, mfd. by Japan Epoxy Resins Co., Ltd.): 100 parts by weight
• Dicyandiamide (AH-154, mfd. by Ajinomoto Co., Inc.): 5 parts by weight
• Granular silica filler (RD-8, mfd. by Tatsumori K.K.): 100 parts by weight
• epoxy resin compositions were heat-cured under the conditions described below, and epoxy resin cured materials of the dimensions described below were obtained.
• Comparative Example 3 an epoxy resin composition and cured material thereof were produced in the same manner as in Examples 15–21, except that any one of the above-mentioned additives (Sample Nos. 1–7) for the epoxy resin was not added.
• Comparative Example 4 an epoxy resin composition and cured material thereof were also produced in the same manner as in Examples 15–21, except that one part of (3-glycidoxypropyl)trimethoxysilane was added instead of the above-mentioned sample as an additive for the epoxy resin. Evaluation of mechanical properties was performed in the same manner as in Examples 15–21 for each of the cured materials thus obtained. The results are shown in Table 3 below.
• Epoxy resin composition :
• Bisphenol A-type epoxy (Epikote 828, mfd. by Japan Epoxy Resins Co., Ltd.): 100 parts by weight
• Dicyandiamide (AH-154, mfd. by Ajinomoto Co., Inc.): 5 parts by weight
• the storage stability of the compositions thus obtained was evaluated based on the viscosity change during storage at room temperature.
• the curing acceleration of each composition was also evaluated by measuring the gelation time thereof on a hot plate set to 150° C.
• the evaluation results related to storage stability and curing acceleration are shown in Table 4.
• Comparative Example 5 an epoxy resin composition was produced in the same manner as in Examples 22–28, except that a product obtained by adding one part of 2-ethyl-4-methylimidazole (2E4MZ, mfd. by Shikoku Chemicals Corp.) was used instead of Sample Nos. 1–7.
• Comparative Example 6 an epoxy resin composition was also produced in the same manner as in Examples 22–28, except that any one of the above-mentioned additives (Sample Nos. 1–7) for the epoxy resin was not added.
• storage stability and curing acceleration were evaluated in the same manner as in Examples 22–28. The evaluation results are shown in Table 4.
• Epoxy resin composition :
• Phenol resin (Phenol novolac, hydroxyl group equivalent 106): 4.38 parts by weight
• TPP Curing accelerator
• Carbon black 0.20 part by weight
• Carnauba wax 0.25 part by weight
• the producing procedure for the sealing material was as follows.
• the above ingredients were added and mixed in an automated mortar in the following sequence: filler, epoxy resin, phenol resin, TPP, carbon black, carnauba wax, (3-glycidoxypropyl)trimethoxysilane, and Sample No. 2 or 5.
• the ingredients were then dry-blended directly for 10 minutes using the automated mortar.
• a heat roller was then heated to 90° C., and the ingredients were heat-kneaded. After the ingredients had blackened, the heat-kneading was still continued for 4 minutes.
• the ingredients were ultimately crushed for approximately 20 minutes using a stamping mill.
• Copper material C7025 strike-plated with 0.1- ⁇ m-thick copper, 50 ⁇ 25 ⁇ (thickness) 0.15 (mm)
• a copper sealing material was produced in the same manner as in Examples 29 and 30, except that Sample No. 2 or 5 as an additive for the epoxy resin was not added. This sealing material was also evaluated for its shear strength in the same manner as in Examples 29 and 30. The evaluation results are shown in Table 5.
• Basic silane coupling agent organic carboxylate compositions were obtained by using the basic silane coupling agents and organic carboxylic acids shown in Tables 6-1 and 6-2 below together with compounds having a softening point or melting point of 40° C. or greater and exhibiting good affinity for the basic silane coupling agents or organic carboxylates, in the same manner as in Example 7, except that the heating and mixing conditions of the basic silane coupling agents and carboxylic acids as well as the heating and mixing conditions of the resulting basic silane coupling agent organic carboxylates and the compounds having a softening point or melting point of 40° C. or greater and exhibiting good affinity for the basic silane coupling agents or organic carboxylates were 180° C. for 1 hour for Sample Nos. 14, 22, and 23, and 120° C. for the other samples. The products were crushed in a ball mill and classified by a sieve with hole openings of 90 microns to yield pulverized Sample Nos. 8–25.
• 6-279458 0.1 mol Trimellitic acid: 0.1 mol Phenol resin (TD-2093) (softening point 100° C.): 41.6 g 13 Pyridine ring-containing silane coupling agent synthesized in Example 1 of Japanese Patent Application Publication No.
• the basic silane coupling agent organic carboxylate composition of the present invention is a solid at room temperature and can also function as a silane coupling agent. Applications thereof include not only functioning as an exceptional adhesion enhancer when added to a one-component epoxy resin composition, but also serving as an additive which imparts a long working life due to being a solid at room temperature and having an organic carboxylate structure. Furthermore, the composition of the present invention is extremely useful as an additive for an epoxy resin that has a high storage stability.
• the composition of the present invention can also be pulverized and used in powdered coating materials because it has a relatively high heat-softening temperature and can be pulverized.
• the adhesiveness, mechanical properties, and storage stability satisfy the characteristics required for application to epoxy resin compositions in a wide range of possible applications, including adhesives, paints, laminates, moldings, printed wiring boards, copper-clad laminates, resin-coated copper foil, semiconductor chip coating materials, semiconductor chip mounting materials, photoresists, solder resists, dry film resists, and the like.

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• Health & Medical Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Polymers & Plastics (AREA)
• Epoxy Resins (AREA)
• Compositions Of Macromolecular Compounds (AREA)
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• 2002
  • 2002-05-21 JP JP2002146196A patent/JP4260418B2/ja not_active Expired - Lifetime
  • 2002-08-27 DE DE60234710T patent/DE60234710D1/de not_active Expired - Lifetime
  • 2002-08-27 KR KR1020037008964A patent/KR100560262B1/ko not_active Expired - Lifetime
  • 2002-08-27 EP EP02765355A patent/EP1452535B1/fr not_active Expired - Lifetime
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  • 2002-08-27 WO PCT/JP2002/008620 patent/WO2003048170A1/fr active IP Right Grant
  • 2002-11-28 TW TW091134581A patent/TWI311579B/zh not_active IP Right Cessation
• 2006
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