SU1365537A1 - Soldering paste for low-temperature soldering - Google Patents
Soldering paste for low-temperature solderingInfo
- Publication number
- SU1365537A1 SU1365537A1 SU3994110/27A SU3994110A SU1365537A1 SU 1365537 A1 SU1365537 A1 SU 1365537A1 SU 3994110/27 A SU3994110/27 A SU 3994110/27A SU 3994110 A SU3994110 A SU 3994110A SU 1365537 A1 SU1365537 A1 SU 1365537A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- soldering
- paste
- low
- temperature
- hydroxypolyoxyethylene
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
FIELD: tinning and soldering. SUBSTANCE: paste has components at the following ratio, wt. -%: colophony 7.0-9.5; hydroxy-derivative compound of alkylamine order (dibutanolamine, triethanolamine, butylethanolamine) 7.0-9.5; hydroxypolyoxyethylene of molecular mass 1500-20000 0.75-1.5, and solder powder - the rest. Storage time of soldering paste without stratification is 3 months, retentivity coefficient is 95%. EFFECT: enhanced quality of paste and soldered welds. 2 tbl
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU3994110/27A SU1365537A1 (en) | 1985-10-21 | 1985-10-21 | Soldering paste for low-temperature soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU3994110/27A SU1365537A1 (en) | 1985-10-21 | 1985-10-21 | Soldering paste for low-temperature soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU1365537A1 true SU1365537A1 (en) | 1996-06-10 |
Family
ID=60533827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU3994110/27A SU1365537A1 (en) | 1985-10-21 | 1985-10-21 | Soldering paste for low-temperature soldering |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU1365537A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2591920C1 (en) * | 2015-04-13 | 2016-07-20 | Акционерное общество "Научно-производственный центр "Алмаз-Фазотрон" | Solder paste |
| RU2767945C1 (en) * | 2020-09-25 | 2022-03-22 | Олег Арсентьевич Шапошников | Solder paste preparation method |
-
1985
- 1985-10-21 SU SU3994110/27A patent/SU1365537A1/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2591920C1 (en) * | 2015-04-13 | 2016-07-20 | Акционерное общество "Научно-производственный центр "Алмаз-Фазотрон" | Solder paste |
| RU2767945C1 (en) * | 2020-09-25 | 2022-03-22 | Олег Арсентьевич Шапошников | Solder paste preparation method |
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