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SE8501635D0 - MULTILAYER FLEXIBLE CIRCUIT WITH ULTRASONICALLY WELDED INTERLAYER CONNECTIONS - Google Patents

MULTILAYER FLEXIBLE CIRCUIT WITH ULTRASONICALLY WELDED INTERLAYER CONNECTIONS

Info

Publication number
SE8501635D0
SE8501635D0 SE8501635A SE8501635A SE8501635D0 SE 8501635 D0 SE8501635 D0 SE 8501635D0 SE 8501635 A SE8501635 A SE 8501635A SE 8501635 A SE8501635 A SE 8501635A SE 8501635 D0 SE8501635 D0 SE 8501635D0
Authority
SE
Sweden
Prior art keywords
flexible circuit
multilayer flexible
ultrasonically welded
interlayer connections
welded interlayer
Prior art date
Application number
SE8501635A
Other languages
Swedish (sv)
Other versions
SE8501635L (en
SE459832B (en
Inventor
M T Caton
F A Balash
R Meleard
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of SE8501635D0 publication Critical patent/SE8501635D0/en
Publication of SE8501635L publication Critical patent/SE8501635L/en
Publication of SE459832B publication Critical patent/SE459832B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0939—Curved pads, e.g. semi-circular or elliptical pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A multilayer flexible circuit (10) in which polymer thick film (PTF) circuits (18, 20, 28) are separated by an insulating polymer layer (16). The circuits are interconnected by ultrasonic welds, the circuit traces having enlarged connection pads (22, 24, 30, 32) in the areas of the welds. <IMAGE>
SE8501635A 1984-04-03 1985-04-02 MULTI-LAYER CIRCUIT CONFIGURATION SE459832B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8405220A FR2562335B1 (en) 1984-04-03 1984-04-03 FLEXIBLE MULTILAYER CIRCUIT WITH CONNECTIONS BETWEEN ULTRASONIC WELDED LAYERS

Publications (3)

Publication Number Publication Date
SE8501635D0 true SE8501635D0 (en) 1985-04-02
SE8501635L SE8501635L (en) 1985-10-04
SE459832B SE459832B (en) 1989-08-07

Family

ID=9302775

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8501635A SE459832B (en) 1984-04-03 1985-04-02 MULTI-LAYER CIRCUIT CONFIGURATION

Country Status (7)

Country Link
JP (1) JPS60227497A (en)
DE (1) DE3512237A1 (en)
ES (1) ES295813Y (en)
FR (1) FR2562335B1 (en)
GB (1) GB2157085B (en)
IT (1) IT1183552B (en)
SE (1) SE459832B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3535008C2 (en) * 1985-10-01 1994-09-29 Telefunken Microelectron Foil circuit with two overlapping cable carriers
DE3704497A1 (en) * 1987-02-13 1988-08-25 Aristo Graphic Systeme METHOD FOR PRODUCING A DIGITALIZED TABLET
DE3704498A1 (en) * 1987-02-13 1988-08-25 Aristo Graphic Systeme METHOD FOR PRODUCING A DIGITALIZED TABLET
GB2227887A (en) * 1988-12-24 1990-08-08 Technology Applic Company Limi Making printed circuits
GB2233157B (en) * 1989-06-13 1992-10-21 British Aerospace Printed circuit board
JPH03196691A (en) * 1989-12-26 1991-08-28 Cmk Corp Method of forming an insulating layer on a printed wiring board
US5347710A (en) * 1993-07-27 1994-09-20 International Business Machines Corporation Parallel processor and method of fabrication
DE19831876A1 (en) * 1997-07-16 1999-02-25 Fraunhofer Ges Forschung Producing contact between flexible conductor and substrate
JP3587748B2 (en) 1999-10-18 2004-11-10 ソニーケミカル株式会社 Multilayer flexible wiring board and method for manufacturing multilayer flexible wiring board
DE10035175C1 (en) * 2000-07-19 2002-01-03 Fraunhofer Ges Forschung Method for producing an electrical and / or mechanical connection of flexible thin film substrates
DE102005033218A1 (en) * 2005-07-15 2007-01-18 Printed Systems Gmbh Three-dimensional circuit
DE102011109992A1 (en) 2011-08-11 2013-02-14 Eppendorf Ag Circuit board cable device for a laboratory sample device and laboratory sample device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1456994A (en) * 1973-06-28 1976-12-01 Marconi Co Ltd Methods for forming electrical internconnection between metal layers for printed circuit assembly
FR2380686A1 (en) * 1977-02-15 1978-09-08 Lomerson Robert PROCESS FOR ESTABLISHING AN ELECTRICAL CONNECTION THROUGH A PLATE OF INSULATING MATERIAL

Also Published As

Publication number Publication date
JPH0564880B2 (en) 1993-09-16
FR2562335A1 (en) 1985-10-04
SE8501635L (en) 1985-10-04
DE3512237A1 (en) 1985-12-12
ES295813Y (en) 1987-12-16
JPS60227497A (en) 1985-11-12
GB2157085A (en) 1985-10-16
GB2157085B (en) 1987-06-24
IT1183552B (en) 1987-10-22
ES295813U (en) 1987-06-16
IT8520190A0 (en) 1985-04-02
GB8508567D0 (en) 1985-05-09
FR2562335B1 (en) 1988-11-25
SE459832B (en) 1989-08-07

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