JP7050718B2 - Positioning jig for soldering - Google Patents

Description

The present invention relates to a positioning jig for soldering.

In assembling a power module, a solder material is generally used as a bonding material for electronic components such as chip resistors and capacitors bridged between a plurality of circuit patterns formed on an insulating substrate. Conventionally, paste solder, which is a mixture of flux and spherical solder, has been used as the solder material. In this case, paste solder was applied to a part of the circuit pattern by printing, electronic components were mounted and reflow was performed to melt the solder, and then cleaning was performed to remove the flux.

In recent years, the soldering process using plate solder without using paste solder has spread, and since no flux is used, cleaning becomes unnecessary and the manufacturing cost can be reduced.

However, since the function of holding electronic components deteriorates due to the change from paste solder to plate solder, a soldering positioning jig for aligning electronic components at the time of soldering is required. The positioning jig for soldering is positioned according to the circuit pattern or the outer shape of the base plate, but due to these manufacturing variations, the electronic components may be misaligned and the electronic components may be tilted. Therefore, the connection between the electronic component and the circuit pattern may be incomplete, and in order to solve such a problem, it is conceivable to position the electronic component around the circuit pattern on which the electronic component is mounted.

For example, in Patent Document 1, the fixing device is provided with a frame for fixing to a circuit board and a recess for fixing a small electronic component, and the positions of the terminal of the small electronic component and the electrode on the board at the time of soldering are provided. A method of mounting a small electronic component with a fixing device for preventing displacement is disclosed.

Further, for example, Patent Document 2 discloses a structure in which a recess for fitting a lower portion of a positioning jig is provided on a substrate as a positioning portion for positioning a positioning jig.

Japanese Unexamined Patent Publication No. 62-250678 Japanese Unexamined Patent Publication No. 2009-231379

However, in the technique described in Patent Document 1, when the size of the circuit board changes due to the manufacturing variation of the circuit board, the position of the fixing device shifts, so that there is a problem that the amount of the position variation of the electronic component becomes large.

Further, in the technique described in Patent Document 2, since positioning is performed at a plurality of locations from one end of the substrate to the other, clearance with the positioning jig is required in consideration of thermal expansion of the substrate during soldering. Therefore, there is a problem that the amount of positional variation of electronic components becomes large.

Therefore, an object of the present invention is to provide a soldering positioning jig capable of reducing the amount of positional variation of electronic components even when the dimensions of the insulating substrate change due to manufacturing variation of the insulating substrate. ..

The soldering positioning jig according to the present invention is a soldering positioning jig set on the insulating substrate in the step of soldering electronic components bridged between a plurality of circuit patterns formed on the insulating substrate. The plate-shaped member is provided on the insulating substrate in contact with the upper surface of the circuit pattern, and the plate-shaped member is formed on the plate-shaped member so that the electronic component can be exposed. On the insulating substrate side so that it can be inserted into a groove formed between the opening and the peripheral edge of the opening in the plate-shaped member and formed between the plurality of circuit patterns in the insulating substrate. It has a pair of protruding portions.

According to the present invention, even when the dimensions of the insulating substrate change due to the manufacturing variation of the insulating substrate, the amount of the positional variation of the electronic components can be reduced.

It is a rear perspective view of the soldering positioning jig which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state which the positioning jig for soldering is set on the insulating substrate. It is sectional drawing which shows the state which the positioning jig for soldering is set on the insulating substrate. It is a perspective view which shows the state which the electronic component is mounted on the insulating substrate. It is sectional drawing which shows the state which set the soldering positioning jig which concerns on Embodiment 2 on an insulating substrate. It is sectional drawing which shows the state which set the soldering positioning jig which concerns on Embodiment 3 on an insulating substrate. It is sectional drawing which shows the state which set the soldering positioning jig which concerns on Embodiment 4 on an insulating substrate. It is sectional drawing which shows the state which set the soldering positioning jig which concerns on the modification of Embodiment 4 on an insulating substrate. It is sectional drawing which shows the state which set the soldering positioning jig which concerns on Embodiment 5 on an insulating substrate. It is sectional drawing of the soldering positioning jig which concerns on Embodiment 6. It is sectional drawing which shows the state which the soldering positioning jig which does not provide a protrusion is set on the insulating substrate.

<Embodiment 1>
Embodiment 1 of the present invention will be described below with reference to the drawings. FIG. 1 is a rear perspective view of the soldering positioning jig 1 according to the first embodiment. FIG. 2 is a cross-sectional view showing a state in which the soldering positioning jig 1 is set on the insulating substrate 11. Specifically, FIG. 1 is turned upside down and the cross-sectional shape and the insulating substrate are cut along the AA line. It is a figure which shows the cross-sectional shape of 11. FIG. 3 is a cross-sectional view showing a state in which the soldering positioning jig 1 is set on the insulating substrate 11. Specifically, FIG. 1 is turned upside down and cut along the BB line, and the cross-sectional shape and the insulating substrate are shown. It is a figure which shows the cross-sectional shape of 11.

As shown in FIGS. 1 to 3, the soldering positioning jig 1 is a jig set on the insulating substrate 11 in the process of soldering the electronic component 15.

First, the insulating substrate 11 and the electronic component 15 will be described with reference to FIG. FIG. 4 is a perspective view showing a state in which the electronic component 15 is mounted on the insulating substrate 11. The insulating substrate 11 includes a base plate 12 and an insulating layer 13 formed on the upper surface of the base plate 12. Circuit patterns 14a, 14b, 14c, 14d are formed on the upper surface of the insulating substrate 11. The electronic component 15 is, for example, a chip resistor or a capacitor, and has a rectangular shape in a plan view. The electronic component 15 is arranged in a state of being bridged between the circuit patterns 14a and 14b, and is joined by being soldered to the circuit patterns 14a and 14b in this state.

Returning to the description of the soldering positioning jig 1. As shown in FIGS. 1 to 3, the soldering positioning jig 1 includes a rectangular plate-shaped member 2 in a plan view. The plate-shaped member 2 is set on the insulating substrate 11 in a state of being in contact with the upper surfaces of the circuit patterns 14a, 14b, 14c, 14d, and has a frame portion 3, an opening portion 4, and a pair of protrusion portions 5.

The frame portion 3 is formed over the entire circumference of the peripheral edge portion of the plate-shaped member 2. The frame portion 3 projects downward from the lower surface of the peripheral edge portion of the plate-shaped member 2, and is in contact with the upper surface of the insulating substrate 11 in a state where the soldering positioning jig 1 is set on the insulating substrate 11. The opening 4 has a rectangular shape in a plan view and is formed in the central portion of the plate-shaped member 2. The plan view contour of the opening 4 has a larger shape than the plan view contour of the electronic component 15, and the electronic component 15 can be exposed from the opening 4.

The pair of protrusions 5 are formed at positions facing each other at the peripheral edge of the opening 4 in the plate-shaped member 2, that is, at positions in the front-rear direction of the paper surface of FIG. The pair of protrusions 5 project downward from this position on the insulating substrate 11 side, and can be inserted into the grooves 16 formed between the circuit patterns 14a and 14b. The front-back direction of the paper surface of FIG. 1 will be described as the front-back direction, and the left-right direction of the paper surface of FIG. 1 will be described as the left-right direction.

Next, a method of positioning the soldering positioning jig 1 with respect to the insulating substrate 11 will be described. As shown in FIG. 2, the left-right ends of the plate-shaped member 2 are located on the outer peripheral side of the outer peripheral ends of the circuit patterns 14a and 14b, and the inner wall of the frame portion 3 and the outer peripheral ends of the circuit patterns 14a and 14b. A clearance is formed between the and. By inserting the pair of protrusions 5 into the grooves 16 formed between the circuit patterns 14a and 14b, the soldering positioning jig 1 is positioned in the lateral direction.

As shown in FIG. 3, the front-rear end of the plate-shaped member 2 is located on the outer peripheral side of the outer peripheral ends of the circuit patterns 14c and 14d, and the inner wall of the frame portion 3 is the outer peripheral end of the circuit patterns 14c and 14d. Is in contact with. The inner wall of the frame portion 3 of the plate-shaped member 2 abuts on the outer peripheral ends of the circuit patterns 14c and 14d, so that the soldering positioning jig 1 is positioned in the front-rear direction.

In this way, with the soldering positioning jig 1 positioned with respect to the insulating substrate 11, the electronic component 15 is arranged so as to bridge between the circuit patterns 14a and 14b through the opening 4. It is joined by being soldered to the circuit patterns 14a and 14b. Here, since the electronic component 15 is mounted so as to bridge between the circuit patterns 14a and 14b, the positioning in the left-right direction is more important than the positioning in the front-rear direction.

Next, the effect of the soldering positioning jig 1 according to the first embodiment will be described in comparison with the case where the soldering positioning jig 101 having no protrusion 5 is set on the insulating substrate 11. FIG. 11 is a cross-sectional view showing a state in which the soldering positioning jig 101 having no protrusion 5 is set on the insulating substrate 11.

As shown in FIG. 11, the soldering positioning jig 101 having no protrusion 5 is set on the insulating substrate 11 with reference to the outer peripheral ends of the circuit patterns 14a and 14b on which the electronic components 15 are mounted. Therefore, when the dimensions of the insulating substrate 11 change due to manufacturing variations of the insulating substrate 11, the position of the soldering positioning jig 101 shifts, so that the electronic component 15 is displaced and the electronic component 15 is tilted. The connection between the component 15 and the circuit patterns 14a and 14b may be incomplete.

On the other hand, the soldering positioning jig 1 according to the first embodiment includes a plate-shaped member 2 set on the insulating substrate 11 in contact with the upper surfaces of the circuit patterns 14a, 14b, 14c, 14d. The plate-shaped member 2 is formed in an opening 4 formed in the plate-shaped member 2 so that the electronic component 15 can be exposed, and a peripheral portion of the opening 4 in the plate-shaped member 2, and is formed in the insulating substrate 11. It has a pair of protrusions 5 protruding toward the insulating substrate 11 so that it can be inserted into the groove 16 formed between the circuit patterns 14a and 14b.

Therefore, by inserting the pair of protrusions 5 into the grooves 16 formed between the circuit patterns 14a and 14b of the insulating substrate 11, the soldering positioning jig 1 is positioned with respect to the insulating substrate 11. The amount of positional variation of the electronic component 15 is reduced without being affected by the manufacturing variation of the insulating substrate 11, and the position of the electronic component 15 is stabilized. As a result, the electronic component 15 and the circuit patterns 14a and 14b are joined in a stable state, so that the yield of the product in which the electronic component 15 is mounted on the circuit patterns 14a and 14b of the insulating substrate 11 is improved.

Since the soldering positioning jig 1 is positioned at two locations near the central portion of the insulating substrate 11 on which the electronic component 15 is mounted, the soldering positioning jig 1 does not require high dimensional accuracy. As a result, it is possible to suppress an increase in the manufacturing cost of the soldering positioning jig 1. Further, since this positioning method is not easily affected by the thermal expansion of the insulating substrate 11, the clearance between the insulating substrate 11 and the soldering positioning jig 1 can be reduced. This also reduces the amount of positional variation of the electronic component 15, and stabilizes the position of the electronic component 15.

<Embodiment 2>
Next, the soldering positioning jig 1A according to the second embodiment will be described. FIG. 5 is a cross-sectional view showing a state in which the soldering positioning jig 1A according to the second embodiment is set on the insulating substrate 11. In the second embodiment, the same components as those described in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 5, in the second embodiment, two electronic components 15 are mounted, and the plate-shaped member 2 has two openings 4 and a pair of protrusions 5 in accordance with the two electronic components 15. I have one. One electronic component 15 is arranged in a state of being bridged between the circuit patterns 14a and 14e, and the other electronic component 15 is arranged in a state of being bridged between the circuit patterns 14e and 14b. When three or more electronic components 15 are mounted, the number of openings 4 and a pair of protrusions 5 may be adjusted accordingly.

As described above, in the soldering positioning jig 1A according to the second embodiment, the plate-shaped member 2 has a plurality of openings 4 and a plurality of a pair of protrusions 5. Therefore, even when two or more electronic components 15 are mounted, the amount of positional variation of the electronic component 15 is small without being affected by the manufacturing variation of the insulating substrate 11, and the position of the electronic component 15 is stable.

<Embodiment 3>
Next, the soldering positioning jig 1B according to the third embodiment will be described. FIG. 6 is a cross-sectional view showing a state in which the soldering positioning jig 1B according to the third embodiment is set on the insulating substrate 11. In the third embodiment, the same components as those described in the first and second embodiments are designated by the same reference numerals, and the description thereof will be omitted.

When the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, 14d are warped in a downward convex shape due to the influence of heat, the central portion of the soldering positioning jig 1 floats from the circuit patterns 14a, 14b, 14c, 14d. Then, when the mounted electronic component 15 is located in the central portion, the electronic component 15 may be misaligned and the product may have a defective appearance.

In order to solve such a problem, as shown in FIG. 6, in the third embodiment, the portion including a part of the peripheral edge portion of the opening 4 in the plate-shaped member 2 is removable.

The soldering positioning jig 1B further includes a detachable member 6 that can be attached to and detached from the plate-shaped member 2. The detachable member 6 constitutes a portion including a part of the peripheral edge portion of the opening 4 in the plate-shaped member 2 in a state of being mounted on the plate-shaped member 2. Specifically, the detachable member 6 constitutes a peripheral edge portion of the opening 4 where the protrusion 5 is not formed. The detachable member 6 has a contact portion 6a that protrudes toward the insulating substrate 11 and abuts on the circuit patterns 14a and 14b while being mounted on the plate-shaped member 2, and a mounting portion 6b that is attached to the plate-shaped member 2. ing. Further, the contact portion 6a and the mounting portion 6b are integrally formed.

The plate-shaped member 2 further has a peripheral groove 7 for holding the outer peripheral portion of the detachable member 6. The peripheral groove 7 is formed at a position corresponding to the attachment portion 6b of the detachable member 6 in the plate-shaped member 2. Since the width of the peripheral groove 7 in the vertical direction is larger than the thickness of the mounting portion 6b, the detachable member 6 can be moved in the vertical direction while being mounted on the plate-shaped member 2. As a result, even when the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, 14d are warped in a downward convex shape, the contact portion 6a of the detachable member 6 abuts on the upper surface of the circuit patterns 14a, 14b of the insulating substrate 11. Can be made to.

As described above, the soldering positioning jig 1B according to the third embodiment further includes a detachable member 6 that can be attached to and detached from the plate-shaped member 2, and the detachable member 6 is attached to the plate-shaped member 2. In the state, the plate-shaped member 2 includes a part of the peripheral edge portion of the opening 4 in the plate-shaped member 2, and has a contact portion 6a that protrudes toward the insulating substrate 11 and abuts on the circuit patterns 14a and 14b. It further has a peripheral groove 7 for holding the outer peripheral portion of the detachable member 6.

Therefore, even when the insulating substrate 11 and the circuit patterns 14a, 14b, 14c, and 14d are warped in a downward convex shape due to the influence of heat, the contact portion 6a of the detachable member 6 is placed on the upper surface of the circuit pattern 14a, 14b of the insulating substrate 11. The position of the electronic component 15 is stabilized by abutting on the electronic component 15, and it is possible to prevent the product from becoming a defective product.

Further, since the contact portion 6a of the detachable member 6 is integrally formed with the mounting portion 6b, the contact portion 6a and the mounting portion 6b do not fall apart, and a positioning jig for soldering to the insulating substrate 11 This leads to improved workability when setting and removing 1B.

<Embodiment 4>
Next, the soldering positioning jig 1C according to the fourth embodiment and the soldering positioning jig 1D according to the modified example of the fourth embodiment will be described. FIG. 7 is a cross-sectional view showing a state in which the soldering positioning jig 1C according to the fourth embodiment is set on the insulating substrate 11. FIG. 8 is a cross-sectional view showing a state in which the soldering positioning jig 1D according to the modified example of the fourth embodiment is set on the insulating substrate 11. In the fourth embodiment, the same components as those described in the first to third embodiments are designated by the same reference numerals, and the description thereof will be omitted.

The circuit patterns 14a, 14b, 14c, 14d are usually formed by etching, but depending on the etching conditions at the time of manufacture, the cross-sectional shape of the circuit patterns 14a, 14b, 14c, 14d has a trapezoidal shape in which the upper base is wider than the lower base. Or the lower bottom may be trapezoidal wider than the upper bottom. In this case, if the protrusion 5 has a rectangular cross-sectional shape, the meshing with the groove 16 formed between the circuit patterns 14a and 14b becomes poor, so that the electronic component 15 is displaced and the electronic component 15 is displaced. The 15 may be tilted and the connection between the electronic component 15 and the circuit patterns 14a and 14b may be incomplete.

In order to solve such a problem, in the fourth embodiment, the tip surface of the protrusion 5 is a curved surface. Specifically, as shown in FIG. 7, the tip surface of the protrusion 5 has a semi-cylindrical shape. Alternatively, as shown in FIG. 8, the tip surface of the protrusion 5 may be hemispherical. As a result, the meshing between the protrusion 5 and the groove 16 formed between the circuit patterns 14a and 14b becomes good. Note that FIGS. 7 and 8 show the case where the lower base is a trapezoid wider than the upper base in the cross-sectional shape of the circuit patterns 14a and 14b, but the same effect is obtained when the upper base is a trapezoid wider than the lower base. Is obtained.

As described above, in the soldering positioning jig 1C according to the fourth embodiment and the soldering positioning jig 1D according to the modified example of the fourth embodiment, the tip surface of the protrusion 5 is a curved surface. Therefore, by evenly contacting the protrusions 5 with the inner walls on both sides of the groove 16 formed between the circuit patterns 14a and 14b, centering, which is an operation of moving the protrusions 5 to the center of the grooves 16, becomes easy. The position of the electronic component 15 is stable.

<Embodiment 5>
Next, the soldering positioning jig 1E according to the fifth embodiment will be described. FIG. 9 is a cross-sectional view showing a state in which the soldering positioning jig 1E according to the fifth embodiment is set on the insulating substrate 11. In the fifth embodiment, the same components as those described in the first to fourth embodiments are designated by the same reference numerals and the description thereof will be omitted.

If the etching accuracy of the circuit patterns 14a, 14b, 14c, 14d at the time of manufacturing is poor, the clearance between the protrusion 5 and the circuit patterns 14a, 14b becomes large, the electronic component 15 is displaced, and the electronic component 15 is displaced. The electronic component 15 may be tilted and the connection between the electronic component 15 and the circuit patterns 14a and 14b may be incomplete.

In order to solve such a problem, as shown in FIG. 9, in the fifth embodiment, the protrusions 5 are paired so as to be fitted into the grooves 16 formed between the circuit patterns 14a and 14b. It is formed in the shape of a hook.

Each protrusion 5 is formed in the shape of a pair of hooks whose tip side is bent inward so as to have springiness. When the protrusions 5 are not inserted into the groove 16, the pair of hooks is opened so as to have a width larger than the lateral width of the groove 16, and when the protrusions 5 are inserted into the groove 16, a pair of hooks are opened. The hook shape is closed so as to have a width smaller than the lateral width of the groove 16. As a result, each protrusion 5 can be fitted into the groove 16.

As described above, in the soldering positioning jig 1E according to the fifth embodiment, each protrusion 5 has a pair of hooks so as to be fitted in the groove 16 formed between the circuit patterns 14a and 14b. Is formed in. Therefore, the clearance between the protrusion 5 and the circuit patterns 14a and 14b is reduced, and the position of the electronic component 15 is stabilized.

<Embodiment 6>
Next, the soldering positioning jig 1F according to the sixth embodiment will be described. FIG. 10 is a cross-sectional view of the soldering positioning jig 1F according to the sixth embodiment. In the sixth embodiment, the same components as those described in the first to fifth embodiments are designated by the same reference numerals, and the description thereof will be omitted.

In the fifth embodiment, since the protrusion 5 is integrally formed with the plate-shaped member 2, it is necessary to replace all of the soldering positioning jig 1E when the protrusion 5 is worn or damaged. The operating cost of the soldering positioning jig 1E increases.

In order to solve such a problem, as shown in FIG. 10, the protrusion 8a and the mounting portion 8b on the base end side thereof are detachable from the plate-shaped member 2 as separate parts.

The soldering positioning jig 1F includes a detachable member 8 that can be attached to and detached from the plate-shaped member 2 in place of the protrusion 5. The detachable member 8 is formed on a pair of hook-shaped protrusions 8a so as to be fitted in the grooves 16 formed between the circuit patterns 14a and 14b, and is formed on the base end side of the protrusions 8a and has a plate shape. It has a mounting portion 8b that can be mounted on the member 2. The plate-shaped member 2 further has a holding hole 9 for holding the attachment portion 8b of the detachable member 8. The holding hole 9 is formed at a position in the front-rear direction facing each other at the peripheral edge portion of the opening 4 in the plate-shaped member 2, and the detachable member 8 is attached to the holding hole 9.

As described above, in the soldering positioning jig 1F according to the sixth embodiment, the protrusion 8a and the mounting portion 8b on the base end side thereof are removable from the plate-shaped member 2 and the plate-shaped member 2 Further has a holding hole 9 for holding the mounting portion 8b.

Therefore, when the protrusion 8a is worn or damaged, only the detachable member 8 including the protrusion 8a and the attachment portion 8b on the base end side thereof needs to be replaced, which increases the operating cost of the soldering positioning jig 1F. Can be suppressed.

In the present invention, each embodiment can be freely combined, and each embodiment can be appropriately modified or omitted within the scope of the invention.

1,1A, 1B, 1C, 1D, 1E, 1F Soldering positioning jig, 2 plate-shaped member, 4 opening, 5 protrusion, 6 detachable member, 7 peripheral groove, 8a protrusion, 8b mounting part, 9 Holding holes, 11 insulated boards, 14a, 14b, 14c, 14d, 14e circuit patterns, 15 electronic components, 16 grooves.

Claims (6)

A soldering positioning jig set on the insulating substrate in the process of soldering electronic components bridged between a plurality of circuit patterns formed on the insulating substrate.
A plate-shaped member set on the insulating substrate in contact with the upper surface of the circuit pattern is provided.
The plate-shaped member is
An opening formed in the plate-shaped member so that the electronic component can be exposed,
A pair of protrusions protruding toward the insulating substrate so as to be inserted into a groove formed in the peripheral edge of the opening in the plate-shaped member and formed between a plurality of circuit patterns in the insulating substrate. A positioning jig for soldering that has a part. The soldering positioning jig according to claim 1, wherein the plate-shaped member has a plurality of the openings and a plurality of the pair of the protrusions. A detachable member that can be attached to and detached from the plate-shaped member is further provided.
The detachable member includes a part of the peripheral edge of the opening in the plate-shaped member in a state of being mounted on the plate-shaped member, and is a contact portion that protrudes toward the insulating substrate and abuts on the circuit pattern. Have,
The soldering positioning jig according to claim 1 or 2, wherein the plate-shaped member further has a peripheral groove for holding an outer peripheral portion of the detachable member. The soldering positioning jig according to claim 1 or 2, wherein the tip surface of the protrusion is a curved surface. The soldering positioning jig according to claim 1 or 2, wherein each of the protrusions is formed in a pair of hooks so as to be fitted in the groove. The protrusion and the attachment portion on the base end side thereof can be attached to and detached from the plate-shaped member.
The soldering positioning jig according to claim 5, wherein the plate-shaped member further has a holding hole for holding the mounting portion.

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