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FR2704094B1 - Monolithic diode network. - Google Patents

Monolithic diode network.

Info

Publication number
FR2704094B1
FR2704094B1 FR9304586A FR9304586A FR2704094B1 FR 2704094 B1 FR2704094 B1 FR 2704094B1 FR 9304586 A FR9304586 A FR 9304586A FR 9304586 A FR9304586 A FR 9304586A FR 2704094 B1 FR2704094 B1 FR 2704094B1
Authority
FR
France
Prior art keywords
diode network
monolithic diode
monolithic
network
diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9304586A
Other languages
French (fr)
Other versions
FR2704094A1 (en
Inventor
Pezzani Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics SA
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SA, SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics SA
Priority to FR9304586A priority Critical patent/FR2704094B1/en
Priority to US08/216,585 priority patent/US5559361A/en
Priority to DE69412327T priority patent/DE69412327T2/en
Priority to JP09545694A priority patent/JP3785644B2/en
Priority to EP94410026A priority patent/EP0620596B1/en
Publication of FR2704094A1 publication Critical patent/FR2704094A1/en
Priority to US08/479,953 priority patent/US5631181A/en
Application granted granted Critical
Publication of FR2704094B1 publication Critical patent/FR2704094B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528Layout of the interconnection structure
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/221Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
FR9304586A 1993-04-13 1993-04-13 Monolithic diode network. Expired - Fee Related FR2704094B1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR9304586A FR2704094B1 (en) 1993-04-13 1993-04-13 Monolithic diode network.
US08/216,585 US5559361A (en) 1993-04-13 1994-03-22 Monolithic diode assay
DE69412327T DE69412327T2 (en) 1993-04-13 1994-04-11 Monolithic diode grid
JP09545694A JP3785644B2 (en) 1993-04-13 1994-04-11 Semiconductor element
EP94410026A EP0620596B1 (en) 1993-04-13 1994-04-11 Monolithic diode grid
US08/479,953 US5631181A (en) 1993-04-13 1995-06-07 Method of making a monolithic diode array

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9304586A FR2704094B1 (en) 1993-04-13 1993-04-13 Monolithic diode network.

Publications (2)

Publication Number Publication Date
FR2704094A1 FR2704094A1 (en) 1994-10-21
FR2704094B1 true FR2704094B1 (en) 1995-07-07

Family

ID=9446200

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9304586A Expired - Fee Related FR2704094B1 (en) 1993-04-13 1993-04-13 Monolithic diode network.

Country Status (5)

Country Link
US (2) US5559361A (en)
EP (1) EP0620596B1 (en)
JP (1) JP3785644B2 (en)
DE (1) DE69412327T2 (en)
FR (1) FR2704094B1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5872386A (en) * 1995-07-17 1999-02-16 Sii R&D Center Inc. Wafer layout of semiconductor device
FR2779292B1 (en) * 1998-05-27 2000-09-29 Sgs Thomson Microelectronics ASSOCIATION OF DIODES IN SERIES
JP2002289879A (en) 2001-03-27 2002-10-04 Toshiba Corp diode
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US6797992B2 (en) * 2001-08-07 2004-09-28 Fabtech, Inc. Apparatus and method for fabricating a high reverse voltage semiconductor device
US20050269695A1 (en) * 2004-06-07 2005-12-08 Brogle James J Surface-mount chip-scale package
US8212327B2 (en) * 2008-03-06 2012-07-03 Sionyx, Inc. High fill-factor laser-treated semiconductor device on bulk material with single side contact scheme
JP2010098189A (en) * 2008-10-17 2010-04-30 Toshiba Corp Semiconductor device
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
WO2011160130A2 (en) 2010-06-18 2011-12-22 Sionyx, Inc High speed photosensitive devices and associated methods
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
WO2013010127A2 (en) 2011-07-13 2013-01-17 Sionyx, Inc. Biometric imaging devices and associated methods
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
WO2014127376A2 (en) 2013-02-15 2014-08-21 Sionyx, Inc. High dynamic range cmos image sensor having anti-blooming properties and associated methods
US9939251B2 (en) 2013-03-15 2018-04-10 Sionyx, Llc Three dimensional imaging utilizing stacked imager devices and associated methods
US9209345B2 (en) 2013-06-29 2015-12-08 Sionyx, Inc. Shallow trench textured regions and associated methods

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1108778A (en) * 1965-09-13 1968-04-03 Associated Semiconductor Mft Improvements in and relating to methods of manufacturing semiconductor devices
US3913216A (en) * 1973-06-20 1975-10-21 Signetics Corp Method for fabricating a precision aligned semiconductor array
DE3435751A1 (en) * 1984-09-28 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Integrated semiconductor circuit in complementary circuit logic having an overvoltage protector structure
FR2623663B1 (en) * 1987-11-24 1990-04-13 Sgs Thomson Microelectronics MONOLITHIC ASSEMBLY OF PROTECTION DIODES AND PROTECTION SYSTEMS
JP2513010B2 (en) * 1988-12-27 1996-07-03 日本電気株式会社 Input protection device for semiconductor integrated circuit
US5278101A (en) * 1989-06-28 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
JPH03124056A (en) * 1989-10-06 1991-05-27 Fujitsu Ltd protection element
FR2687009B1 (en) * 1992-01-31 1994-04-29 Sgs Thomson Microelectronics PROTECTIVE COMPONENT FOR AUTOMOTIVE CIRCUIT.
FR2689317B1 (en) * 1992-03-26 1994-06-17 Sgs Thomson Microelectronics INTEGRATED CIRCUIT CONSTITUTING A NETWORK OF PROTECTION DIODES.

Also Published As

Publication number Publication date
US5631181A (en) 1997-05-20
EP0620596A1 (en) 1994-10-19
DE69412327T2 (en) 1998-12-24
DE69412327D1 (en) 1998-09-17
FR2704094A1 (en) 1994-10-21
JPH0799327A (en) 1995-04-11
EP0620596B1 (en) 1998-08-12
JP3785644B2 (en) 2006-06-14
US5559361A (en) 1996-09-24

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