FR2704094B1 - Monolithic diode network. - Google Patents
Monolithic diode network.Info
- Publication number
- FR2704094B1 FR2704094B1 FR9304586A FR9304586A FR2704094B1 FR 2704094 B1 FR2704094 B1 FR 2704094B1 FR 9304586 A FR9304586 A FR 9304586A FR 9304586 A FR9304586 A FR 9304586A FR 2704094 B1 FR2704094 B1 FR 2704094B1
- Authority
- FR
- France
- Prior art keywords
- diode network
- monolithic diode
- monolithic
- network
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Layout of the interconnection structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
- H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
- H10D84/221—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9304586A FR2704094B1 (en) | 1993-04-13 | 1993-04-13 | Monolithic diode network. |
US08/216,585 US5559361A (en) | 1993-04-13 | 1994-03-22 | Monolithic diode assay |
DE69412327T DE69412327T2 (en) | 1993-04-13 | 1994-04-11 | Monolithic diode grid |
JP09545694A JP3785644B2 (en) | 1993-04-13 | 1994-04-11 | Semiconductor element |
EP94410026A EP0620596B1 (en) | 1993-04-13 | 1994-04-11 | Monolithic diode grid |
US08/479,953 US5631181A (en) | 1993-04-13 | 1995-06-07 | Method of making a monolithic diode array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9304586A FR2704094B1 (en) | 1993-04-13 | 1993-04-13 | Monolithic diode network. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2704094A1 FR2704094A1 (en) | 1994-10-21 |
FR2704094B1 true FR2704094B1 (en) | 1995-07-07 |
Family
ID=9446200
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9304586A Expired - Fee Related FR2704094B1 (en) | 1993-04-13 | 1993-04-13 | Monolithic diode network. |
Country Status (5)
Country | Link |
---|---|
US (2) | US5559361A (en) |
EP (1) | EP0620596B1 (en) |
JP (1) | JP3785644B2 (en) |
DE (1) | DE69412327T2 (en) |
FR (1) | FR2704094B1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5872386A (en) * | 1995-07-17 | 1999-02-16 | Sii R&D Center Inc. | Wafer layout of semiconductor device |
FR2779292B1 (en) * | 1998-05-27 | 2000-09-29 | Sgs Thomson Microelectronics | ASSOCIATION OF DIODES IN SERIES |
JP2002289879A (en) | 2001-03-27 | 2002-10-04 | Toshiba Corp | diode |
US7442629B2 (en) | 2004-09-24 | 2008-10-28 | President & Fellows Of Harvard College | Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate |
US7057256B2 (en) | 2001-05-25 | 2006-06-06 | President & Fellows Of Harvard College | Silicon-based visible and near-infrared optoelectric devices |
US6797992B2 (en) * | 2001-08-07 | 2004-09-28 | Fabtech, Inc. | Apparatus and method for fabricating a high reverse voltage semiconductor device |
US20050269695A1 (en) * | 2004-06-07 | 2005-12-08 | Brogle James J | Surface-mount chip-scale package |
US8212327B2 (en) * | 2008-03-06 | 2012-07-03 | Sionyx, Inc. | High fill-factor laser-treated semiconductor device on bulk material with single side contact scheme |
JP2010098189A (en) * | 2008-10-17 | 2010-04-30 | Toshiba Corp | Semiconductor device |
US9911781B2 (en) | 2009-09-17 | 2018-03-06 | Sionyx, Llc | Photosensitive imaging devices and associated methods |
US9673243B2 (en) | 2009-09-17 | 2017-06-06 | Sionyx, Llc | Photosensitive imaging devices and associated methods |
US8692198B2 (en) | 2010-04-21 | 2014-04-08 | Sionyx, Inc. | Photosensitive imaging devices and associated methods |
WO2011160130A2 (en) | 2010-06-18 | 2011-12-22 | Sionyx, Inc | High speed photosensitive devices and associated methods |
US9496308B2 (en) | 2011-06-09 | 2016-11-15 | Sionyx, Llc | Process module for increasing the response of backside illuminated photosensitive imagers and associated methods |
WO2013010127A2 (en) | 2011-07-13 | 2013-01-17 | Sionyx, Inc. | Biometric imaging devices and associated methods |
US9064764B2 (en) | 2012-03-22 | 2015-06-23 | Sionyx, Inc. | Pixel isolation elements, devices, and associated methods |
WO2014127376A2 (en) | 2013-02-15 | 2014-08-21 | Sionyx, Inc. | High dynamic range cmos image sensor having anti-blooming properties and associated methods |
US9939251B2 (en) | 2013-03-15 | 2018-04-10 | Sionyx, Llc | Three dimensional imaging utilizing stacked imager devices and associated methods |
US9209345B2 (en) | 2013-06-29 | 2015-12-08 | Sionyx, Inc. | Shallow trench textured regions and associated methods |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1108778A (en) * | 1965-09-13 | 1968-04-03 | Associated Semiconductor Mft | Improvements in and relating to methods of manufacturing semiconductor devices |
US3913216A (en) * | 1973-06-20 | 1975-10-21 | Signetics Corp | Method for fabricating a precision aligned semiconductor array |
DE3435751A1 (en) * | 1984-09-28 | 1986-04-10 | Siemens AG, 1000 Berlin und 8000 München | Integrated semiconductor circuit in complementary circuit logic having an overvoltage protector structure |
FR2623663B1 (en) * | 1987-11-24 | 1990-04-13 | Sgs Thomson Microelectronics | MONOLITHIC ASSEMBLY OF PROTECTION DIODES AND PROTECTION SYSTEMS |
JP2513010B2 (en) * | 1988-12-27 | 1996-07-03 | 日本電気株式会社 | Input protection device for semiconductor integrated circuit |
US5278101A (en) * | 1989-06-28 | 1994-01-11 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing the same |
JPH03124056A (en) * | 1989-10-06 | 1991-05-27 | Fujitsu Ltd | protection element |
FR2687009B1 (en) * | 1992-01-31 | 1994-04-29 | Sgs Thomson Microelectronics | PROTECTIVE COMPONENT FOR AUTOMOTIVE CIRCUIT. |
FR2689317B1 (en) * | 1992-03-26 | 1994-06-17 | Sgs Thomson Microelectronics | INTEGRATED CIRCUIT CONSTITUTING A NETWORK OF PROTECTION DIODES. |
-
1993
- 1993-04-13 FR FR9304586A patent/FR2704094B1/en not_active Expired - Fee Related
-
1994
- 1994-03-22 US US08/216,585 patent/US5559361A/en not_active Expired - Lifetime
- 1994-04-11 JP JP09545694A patent/JP3785644B2/en not_active Expired - Fee Related
- 1994-04-11 DE DE69412327T patent/DE69412327T2/en not_active Expired - Fee Related
- 1994-04-11 EP EP94410026A patent/EP0620596B1/en not_active Expired - Lifetime
-
1995
- 1995-06-07 US US08/479,953 patent/US5631181A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5631181A (en) | 1997-05-20 |
EP0620596A1 (en) | 1994-10-19 |
DE69412327T2 (en) | 1998-12-24 |
DE69412327D1 (en) | 1998-09-17 |
FR2704094A1 (en) | 1994-10-21 |
JPH0799327A (en) | 1995-04-11 |
EP0620596B1 (en) | 1998-08-12 |
JP3785644B2 (en) | 2006-06-14 |
US5559361A (en) | 1996-09-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |