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FI20035223L - Piirilevy ja menetelmä sen valmistamiseksi - Google Patents

Piirilevy ja menetelmä sen valmistamiseksi Download PDF

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Publication number
FI20035223L
FI20035223L FI20035223A FI20035223A FI20035223L FI 20035223 L FI20035223 L FI 20035223L FI 20035223 A FI20035223 A FI 20035223A FI 20035223 A FI20035223 A FI 20035223A FI 20035223 L FI20035223 L FI 20035223L
Authority
FI
Finland
Prior art keywords
manufacturing
same
circuit board
printed circuit
printed
Prior art date
Application number
FI20035223A
Other languages
English (en)
Swedish (sv)
Other versions
FI20035223A0 (fi
Inventor
Joni Hietala
Original Assignee
Asperation Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asperation Oy filed Critical Asperation Oy
Priority to FI20035223A priority Critical patent/FI20035223L/fi
Publication of FI20035223A0 publication Critical patent/FI20035223A0/fi
Priority to PCT/FI2004/050175 priority patent/WO2005052659A1/en
Priority to EP04819268A priority patent/EP1692553A1/en
Priority to JP2006540496A priority patent/JP2007512559A/ja
Publication of FI20035223L publication Critical patent/FI20035223L/fi

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/12104—Mirror; Reflectors or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
FI20035223A 2003-11-27 2003-11-27 Piirilevy ja menetelmä sen valmistamiseksi FI20035223L (fi)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FI20035223A FI20035223L (fi) 2003-11-27 2003-11-27 Piirilevy ja menetelmä sen valmistamiseksi
PCT/FI2004/050175 WO2005052659A1 (en) 2003-11-27 2004-11-24 A circuit board and a method for its manufacture
EP04819268A EP1692553A1 (en) 2003-11-27 2004-11-24 A circuit board and a method for its manufacture
JP2006540496A JP2007512559A (ja) 2003-11-27 2004-11-24 回路基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI20035223A FI20035223L (fi) 2003-11-27 2003-11-27 Piirilevy ja menetelmä sen valmistamiseksi

Publications (2)

Publication Number Publication Date
FI20035223A0 FI20035223A0 (fi) 2003-11-27
FI20035223L true FI20035223L (fi) 2005-05-28

Family

ID=29558743

Family Applications (1)

Application Number Title Priority Date Filing Date
FI20035223A FI20035223L (fi) 2003-11-27 2003-11-27 Piirilevy ja menetelmä sen valmistamiseksi

Country Status (4)

Country Link
EP (1) EP1692553A1 (fi)
JP (1) JP2007512559A (fi)
FI (1) FI20035223L (fi)
WO (1) WO2005052659A1 (fi)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5637134B2 (ja) * 2009-06-09 2014-12-10 日本電気株式会社 治具、パッケージ、システム基板および素子搭載方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW255015B (fi) * 1993-11-05 1995-08-21 Motorola Inc
US6539157B2 (en) * 2000-12-28 2003-03-25 Honeywell Advanced Circuits, Inc. Layered circuit boards and methods of production thereof
JP3846284B2 (ja) * 2001-11-26 2006-11-15 株式会社トッパンＮｅｃサーキットソリューションズ 光導波路の製造方法
JP2004061799A (ja) * 2002-07-29 2004-02-26 Canon Inc 二次元光導波装置、およびそれを用いた光電融合配線基板

Also Published As

Publication number Publication date
EP1692553A1 (en) 2006-08-23
FI20035223A0 (fi) 2003-11-27
JP2007512559A (ja) 2007-05-17
WO2005052659A1 (en) 2005-06-09

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Legal Events

Date Code Title Description
PC Transfer of assignment of patent

Owner name: ASPOCOMP TECHNOLOGY OY

Free format text: ASPOCOMP TECHNOLOGY OY

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