ES2897019T3 - A power converter comprising a heat dissipation system - Google Patents

Abstract

A power converter (104) comprising: a sealed housing (109); a first component (108), a second component (118), and a third component (128) disposed within the sealed casing (109); and a heat dissipation system (110) comprising: a condenser (114); a first cooling loop (111) coupled to the condenser (114), wherein the first cooling loop (111) comprises a first two-phase heat transfer device (122) disposed within the sealed casing (109), wherein the first biphasic heat transfer device (122) is coupled to the first component (108) and adapted to dissipate heat from the first component (108); and a second cooling loop (121) coupled to the condenser (114), wherein the second cooling loop (121) comprises: a second biphasic heat transfer device (132) disposed within the sealed casing (109), in wherein the second two-phase heat transfer device (132) is coupled to the second component (118) and is adapted to dissipate heat from the second component (118) and a first single-phase heat transfer device (136) disposed within the housing sealed (109) and coupled and disposed upstream relative to the second two-phase heat transfer device (132), wherein the first single-phase heat transfer device (136) couples to the third component (128) and is adapted to dissipate third component heat (128); wherein the condenser (114) is disposed outside the sealed casing (109) and is disposed above the first and second biphasic heat transfer devices (122, 132); wherein the third component (128) is an auxiliary component and the first and second components (108, 118) are power electronic components that generate substantially more heat than the third component (128).

Description

DESCRIPTION

A power converter comprising a heat dissipation system

Background

Embodiments of the present invention generally relate to a power converter system comprising a heat dissipation system.

Many known semiconductor devices (eg, rectifiers and inverters) are used for the conversion of electrical energy. Rectifiers are used to convert alternating current (AC) to direct current (DC) and inverters are used to convert DC current to AC current. Typically, rectifiers and inverters are integrated into full power conversion assemblies (ie power converters) used in renewable electrical power generation facilities such as solar power generation farms and wind turbine farms. Semiconductor devices typically generate a large amount of heat during the operation of power converters. At least some known power converters use a liquid cooling system that can be coupled to major components such as power electronic components of semiconductor devices to cool the major components. Such a liquid cooling system cannot be used to cool certain auxiliary components such as inductors and busbar laminates of semiconductor devices and to cool air inside the power converter, due to the high cost incurred and complexity of implementation. Furthermore, the liquid cooling system includes an active pump for pumping a working liquid into the liquid cooling system to cool the semiconductor devices. In such a system, maintaining a working liquid flow rate in two or more branches of the liquid cooling system can be problematic due to the high resistance to flow of the working liquid in some branches compared to the low resistance to flow of the working liquid. in other branches.

A power converter comprising a heat dissipation system is known from document US2013/0312937 A1.

Thus, there is a need for an improved heat dissipation system and improved thermal management of a power converter using such a heat dissipation system.

Short description

A power converter according to claim 1 is described.

The power converter includes a sealed case, a first component, a second component, and a third component disposed within the sealed case, and a heat dissipation system.

The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The condenser is arranged outside the sealed casing. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device disposed within the sealed casing and coupled to the first component, and adapted to dissipate heat from the first component. The second cooling loop is coupled to the condenser and includes a second biphasic heat transfer device disposed within the sealed casing and coupled to the second component and adapted to dissipate heat from the second component. The second cooling loop comprises a first single-phase heat transfer device disposed within the sealed casing and coupled and disposed upstream relative to the second two-phase heat transfer device, wherein the first single-phase heat transfer device is coupled to the third component and is adapted to dissipate heat from the third component. The condenser is disposed above the first and second two-phase heat transfer devices. The third component is an auxiliary component and the first and second components are power electronic components that generate substantially more heat than the third component.

A method for thermal management of a power converter is described, but does not form part of the invention. The method involves directing a first portion of a single-phase fluid from a condenser to a first two-phase heat transfer device of a first cooling loop. The monophasic fluid comprises a liquid medium. The method further involves directing a second part of the single-phase fluid from the condenser to a second two-phase heat transfer device of a second cooling loop. Furthermore, the method involves dissipating heat from a first component to the first part of the single-phase fluid through the first two-phase heat transfer device and producing a first part of a two-phase fluid. The biphasic fluid includes the liquid medium and a gaseous medium. Furthermore, the method involves dissipating heat from a second component to the second part of the single-phase fluid through the second two-phase heat transfer device and producing a second part of the two-phase fluid.

The method further involves pumping the first part of the two-phase fluid from the first two-phase heat transfer device to the condenser and the second part of the two-phase fluid from the second two-phase heat transfer device to the condenser. The first and second components and the first and second devices of Biphasic heat transfer units are arranged inside a sealed casing. The condenser is disposed outside the sealed casing and above the first and second two-phase heat transfer devices.

Drawings

These and other features and aspects of the described prior art embodiments will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:

Figure 1 is a schematic block diagram of a power generation system according to an example, which is not part of the invention;

Figure 2 is a schematic diagram of a power converter according to an embodiment of the invention;

Figure 3 is a perspective view of a two-phase heat transfer device according to an example, which is not part of the invention;

Figure 4 is a schematic diagram of a heat dissipation system including an intermediate duct according to an example, not forming part of the invention;

Figure 5 is a schematic diagram of a heat dissipation system according to an example, which is not part of the invention; and

Figure 6 is a flow diagram of a thermal management method of a power converter according to an example, which is not part of the invention.

Detailed description

The embodiments discussed herein describe a heat dissipation system such as a thermosiphon that includes a plurality of cooling loops, where each cooling loop includes at least one biphasic heat transfer device. According to the invention, such a heat dissipation system is used for thermal management of a power converter. In some other examples, which are not part of the invention, the heat sink system may be used for thermal management of a hermetically sealed motor or the like. In one embodiment, the heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices. It should be noted herein that the term "above" as used herein means that the condenser is physically located at a higher location relative to the first and second heat transfer devices. In certain embodiments, the first cooling loop includes a first conduit extending from a downstream end of the condenser to an upstream end of the first two-phase heat transfer device and a second conduit extending from an upstream end. downstream of the first two-phase heat transfer device to an upstream end of the condenser. Similarly, the second cooling loop includes a third conduit extending from the downstream end of the condenser to an upstream end of the second two-phase heat transfer device and a fourth conduit extending from an upstream end. below the second two-phase heat transfer device to the upstream end of the condenser. In such an embodiment, the first and second conduits, and the third and fourth conduits are arranged parallel to each other. Furthermore, said heat dissipation system may further include at least one of a first intermediate duct coupled to the first and second ducts and a second intermediate duct coupled to the third and fourth ducts to control the height difference of a biphasic fluid in the second and fourth ducts. It should be noted herein that the term "control height difference" can refer to "control the equivalent height of fluid pressure". In some embodiments, the second cooling loop may further include a single phase heat transfer device coupled to and disposed upstream of the second two phase heat transfer device.

In one embodiment, the heat sink system is used for thermal management of a power converter used to convert direct current (DC) to alternating current (AC) or vice versa. Specifically, the power converter includes a first component, a second component, and a third component, wherein the first and second components are power electronic components, for converting DC power to AC power. Components generate heat during the energy conversion process. The biphasic heat transfer device in each of the first and second cooling loops is coupled, respectively, to the first and second components to extract heat from the first and second components. According to the invention, the single phase fluid transfer device is coupled to the third component, which is an auxiliary component such as an inductor and a bus laminate to extract heat from said auxiliary component.

In some other examples, which are not part of the invention, the single-phase fluid transfer device is used to cool a fluid inside the power converter.

In some embodiments, at least one of the first and second two-phase heat transfer devices includes an evaporator. In some other embodiments, at least one of the first and second two-phase heat transfer devices is an evaporator. In one embodiment, the evaporator is used to i) extract heat from one or more components and produce a biphasic fluid, and ii) passively pump the biphasic fluid to the condenser. In such an embodiment, the evaporator includes a supply housing, a receiving housing, and at least one expansion housing extending between the supply housing and the receiving housing. The at least one expansion housing includes a flow inlet defined in the supply housing and a flow outlet defined in the receiving housing. In one embodiment, the stream input has a first size and the stream output has a second size greater than the first size. It should be noted herein that the term "size" can refer to a diameter or a width of the inlet or outlet of the expansion housing. In one or more embodiments, the condenser is used to receive the two-phase fluid from at least one of the first and second two-phase heat transfer devices and dissipate the extracted heat to an ambient atmosphere to produce a single-phase fluid. It should be noted herein that the term "single-phase fluid" can refer to a liquid medium. Similarly, the term "biphasic fluid" can refer to a mixture of liquid and gaseous media.

In one or more embodiments, the heat dissipation system including at least one biphasic heat transfer device in each of the first and second cooling loops passively maintains a flow rate of the monophasic fluid and biphasic fluid in each of the first and second cooling loops without incurring pressure losses. Furthermore, the heat dissipation system includes the single-phase heat transfer device coupled to the at least one cooling loop and arranged upstream of the corresponding two-phase fluid transfer device. The heat dissipation system extracts heat from auxiliary components for complete thermal management of a power converter.

In some other embodiments, the heat dissipation system may further include a third cooling loop coupled to the condenser and having a third biphasic heat transfer device. In such an embodiment, the third cooling loop further includes a single phase heat transfer device coupled to and disposed upstream relative to the third two phase heat transfer device.

Figure 1 illustrates a schematic block diagram of a power generation system 100 according to an example, which is not part of the present invention. The power generation system 100 includes one or more power generation units, such as a solar array 102 formed from a plurality of solar panels (not shown in Figure 1). Alternatively, power generation system 100 may include any suitable number and type of power generation units, such as a plurality of wind turbines, fuel cells, geothermal generators, hydroelectric power generators, and/or other devices that generate power at from renewable sources and/or non-renewable energy sources.

In one embodiment, solar array 102 may include any number of solar panels that allow operation of power generation system 100 to generate a desired power output. In one embodiment, the plurality of solar panels of solar distribution 102 may be coupled in a series-parallel configuration to allow generation of the desired current and/or voltage output from power generation system 100. The solar panels they may include one or more than one photovoltaic panel, a solar thermal collector, or any other device that converts solar energy into electrical energy. In one embodiment, the solar panels of the solar distribution 102 are photovoltaic panels that generate direct current (DC) energy resulting from the solar energy received.

In one embodiment, solar distribution 102 is coupled to a power conversion assembly, such as a power converter 104, that converts DC power to alternating current (AC) power. In certain embodiments, power converter 104 includes a sealed housing 109 and one or more components 108, for example, an electrical component and/or an electronic component disposed within sealed housing 109. For ease of illustration, it is shown that the power converter 104 has a first component 108. Such illustration should not be construed as limiting the technique described. The first component 108 is used to convert DC power to AC power. First component 108 may include one or more semiconductor devices, such as a DC-AC inverter (not shown) that converts DC power received from solar array 102 into AC power for transmission to an electrical distribution grid 106. power converter 104 adjusts a voltage and/or current amplitude of the converted AC power to an amplitude suitable for use by an electrical distribution network 106. Power converter 104 provides the AC power at a frequency and phase that are substantially equal to the frequency and phase of the electrical distribution network 106. In the illustrated embodiment, the power converter 104 provides three-phase AC power to the electrical distribution network 106. Alternatively, the power converter 104 may provide three-phase AC power. single phase to the electrical distribution network 106. Typically, the first component 108 generates heat during the operation of the power converter 10 Four.

Power converter 104 further includes a heat dissipation system 110 such as a thermosyphon configured to dissipate heat from first component 108. In one embodiment, heat dissipation system 110 includes a first cooling loop 111 and a condenser 114. Condenser 114 is disposed outside of sealed casing 109. In addition, first cooling loop 111 includes a first two-phase heat transfer device 112 disposed within sealed casing 109. For ease of illustration, it is shown that the cooling system heat dissipation 110 has only one cooling loop 111 and only one biphasic heat transfer device 112. Such illustration should not be construed as limiting the performance of the present invention. In some embodiments, condenser 114 is physically located above a first two-phase heat transfer device 112. In certain embodiments, condenser 114 may be located above first two-phase heat transfer device 112 to create a free-pumping effect. As the bubbles (i.e. biphasic fluid 124) are generated from the heat transfer devices (i.e. the first biphasic heat transfer device 112), the bubbles float from the heat transfer device 112 arranged in a location lower than the condenser 114 located at a higher location, where the bubbles condense back to liquid form (i.e. single-phase fluid 120) and discharge downwards into the first two-phase heat transfer device 112. In other words However, if the condenser 114 is located below the first two-phase heat transfer device 112, the heat dissipation system 110 may not work properly. In one embodiment, the first cooling loop 111 includes an inlet conduit 113 extending from the first two-phase heat transfer device 112 to the condenser 114 through the sealed casing 109 and an outlet conduit 115 extending from condenser 114 to first two-phase heat transfer device 112 through sealed casing 109. In one or more embodiments, first two-phase heat transfer device 112 is an evaporator that is thermally coupled to first component 108. In such a In this embodiment, the inlet conduit 113 extends from a downstream end of the first two-phase heat transfer device 112 to an upstream end of the condenser 114. In addition, the outlet conduit 115 extends from a downstream end of the condenser 114 to an upstream end of the first two-phase heat transfer device 112. The first two-phase heat transfer device Biphasic heat source 112 is coupled in flow communication with capacitor 114 to dissipate heat generated by first component 108 to an ambient environment 116, for example.

In some embodiments, the first two-phase heat transfer device 112, the inlet conduit 113, and the outlet conduit 115 are hermetically attached to the condenser 114. In addition, the first two-phase heat transfer device 112 is hermetically sealed in the sealed housing. 109 and is prefilled with a fluid that is in a saturated liquid state. In such an embodiment, the fluid may include, but is not limited to, inert gas, nitrogen, argon, and the like. Also, in such an embodiment, a single-phase fluid 120 and a two-phase fluid 124 may be refrigerants with a boiling point of less than 0 degrees Celsius at atmospheric pressures. For example, refrigerants can include r134a, r1234yf, and the like. In some other embodiments, the first two-phase heat transfer device 112, the inlet conduit 113, and the outlet conduit 115 may not be hermetically attached to the condenser 114. In addition, the first two-phase heat transfer device 112 may not be hermetically sealed. sealed in the sealed housing 109. In such an embodiment, the sealed housing 109 may be prefilled with a fluid having a boiling point below a predefined threshold temperature of the first component 108 at atmospheric pressure. In one embodiment, the fluid may include, but is not limited to, air and the like. Furthermore, in such an embodiment, the single-phase fluid 120 and the two-phase fluid 124 may be refrigerants with a boiling point in the range of about zero degrees Centigrade to about 70 degrees Centigrade at atmospheric pressure. For example, the refrigerant may include Novec649, HFE7000, SES30, and the like.

During operation, heat dissipation system 110 is used to direct a single-phase fluid 120 from condenser 114 to first two-phase heat transfer device 112 through outlet conduit 115. First two-phase heat transfer device 112 is used to extract heat from the first component 108 to the single-phase fluid 120 and produce a two-phase fluid 124. The first two-phase heat transfer device 112 is further used to pump the two-phase fluid 124 to the condenser 114 through the inlet conduit 113. condenser 114 is used to dissipate the generated heat to the atmosphere and produce the single-phase fluid 120. The heat dissipation system 110 is described in more detail below. Figure 2 illustrates a schematic diagram of power converter 104 according to one embodiment of the invention. In one embodiment, the power converter 104 includes a plurality of components: a first component 108, a second component 118, a third component 128, possibly a fourth component 138, the sealed case 109, and the heat dissipation system 110. first, second, third, and fourth components 108, 118, 128, 138 and a portion of the heat dissipation system 110 are disposed within the sealed housing 109. In an exemplary embodiment, the sealed housing 109 is a hermetically sealed enclosure filled of a fluid, for example, inert gas, nitrogen, argon and the like.

The first, second, and possibly fourth components 108, 118, 138 are power electronic components, such as inverters, converters, and the like, and the third component 128 is an auxiliary component, such as an inductor, bus laminate, and the like. Power electronic components generate substantially higher heat (or temperature) compared to the auxiliary component.

In one embodiment, heat sink system 110 is a thermosyphon system. In the illustrated embodiment, heat dissipation system 110 includes a first cooling loop 111, a second cooling loop 121, a third cooling loop 131, and a condenser 114. Condenser 114 is disposed outside of sealed housing 109. The first cooling loop 111 includes a first two-phase heat transfer device 122. In one embodiment, the first two-phase heat transfer device 122 is an evaporator disposed within the sealed casing 109. In addition, the first heat transfer device biphasic 122 is configured to work as the first passive pump. It should be noted herein that the term "first passive pump" refers to the first two-phase heat transfer device 122, which is configured to indirectly pump a two-phase fluid to the condenser 114. The first cooling loop 111 includes a first conduit 111a that extends from a downstream end 150 of condenser 114 to an upstream end 152 of the first cooling device. biphasic heat transfer 122 through the sealed casing 109. Similarly, the first cooling loop 111 further includes a second conduit 111b extending from a downstream end 154 of the first biphasic heat transfer device 122 to a upstream end 156 of condenser 114 through sealed casing 109.

The second cooling loop 121 includes a second two-phase heat transfer device 132 and a single-phase heat transfer device 136. The second two-phase heat transfer device 132 and a single-phase heat transfer device 136 are arranged inside the casing. 109. The single-phase heat transfer device 136 is disposed upstream relative to the second two-phase heat transfer device 132. In one embodiment, the single-phase heat transfer device 136 is a cold plate coupled to the third component 128. The The second two-phase heat transfer device 132 is a two-phase heat exchanger or an evaporator. The second two-phase heat transfer device 132 is coupled to the second component 118. The second two-phase heat transfer device 132 includes a first plenum chamber 132a, a second plenum chamber 132b, and a plurality of heat exchange tubes 132c extending between the first plenum chamber 132a and the second plenum chamber 132b. In one embodiment, the first and second plenum chambers 132a, 132b are arranged parallel to each other. Also, the second plenum 132b is configured to function as a second passive pump. It should be noted herein that the term "second passive pump" refers to the second plenum 132b, which is configured to indirectly pump biphasic fluid to condenser 114. In the illustrated embodiment, second biphasic heat transfer device 132 includes furthermore a fan 132d disposed over the plurality of heat exchange tubes 132c and configured to blow a fluid 148 along the plurality of heat exchange tubes 132c.

Second cooling loop 121 further includes a third conduit 121a extending from downstream end 150 of condenser 114 to an upstream end 158 of second biphasic heat transfer device 132 through sealed casing 109. The second cooling loop 121 further includes a fourth conduit 121b that extends from a downstream end 160 of the second two-phase heat transfer device 132 to the upstream end 156 of the condenser 114 through the sealed casing 109.

The third cooling loop 131 includes a third two-phase heat transfer device 142 and a single-phase heat transfer device 146. The third two-phase heat transfer device 142 and a single-phase heat transfer device 146 are arranged inside the casing. seal 109. The single-phase heat transfer device 146 is disposed upstream relative to the third two-phase heat transfer device 142. In one embodiment, the single-phase heat transfer device 146 is a single-phase heat exchanger. Single phase heat transfer device 146 includes a plurality of fins 146a and a fan 146b disposed on the plurality of fins 146a. Fan 146b is used to blow fluid 148 over the plurality of fins 126a. The third two-stage heat transfer device 142 is an evaporator coupled to the fourth component 138. The third two-stage heat transfer device 142 must also function as a third passive pump. It should be noted herein that the term "third passive pump" refers to the third biphasic heat transfer device 142, which is configured to indirectly pump the biphasic fluid to the condenser 114. The third cooling loop 131 further includes a fifth conduit 131a. extending from the downstream end 150 of the condenser 114 to an upstream end 162 of the third two-phase heat transfer device 142 through the sealed casing 109. The third cooling loop 131 further includes a sixth duct 131b that extends from a downstream end 164 of the third biphasic heat transfer device 142 to the upstream end 156 of the condenser 114 through the sealed casing 109. In one embodiment, the first, second, and third cooling loops 111 , 121, 131 are arranged parallel to each other.

Condenser 114 includes a first plenum 114a, a second plenum 114b, and a plurality of heat exchange tubes 114c extending between first plenum 114a and second plenum 114b. In one embodiment, the first and second plenum chambers 114a, 114b are arranged parallel to each other. Condenser 114 further includes a fan 114d disposed over the plurality of heat exchange tubes 114c and used to blow ambient air 148a over the plurality of heat exchange tubes 114c. The first plenum chamber 114a couples to the downstream ends 154, 160, 164 of the first, second, and third biphasic heat transfer devices 112, 132, 143, respectively. Similarly, the second plenum chamber 114b is coupled to the upstream ends 152, 158, 162 of the first, second, and third biphasic heat transfer devices 112, 132, 143, respectively. The condenser 114 is disposed above the first, second, and third biphasic heat transfer devices 122, 132, 142. In some embodiments, the first conduit 111a, the second conduit 111b, the third conduit 121a, the fourth conduit 121b, the The fifth conduit 131a and the sixth conduit 131b are hermetically attached to the condenser 114. The first, second and third biphasic heat transfer devices 122, 132, 142 are hermetically sealed in the sealed casing 109 and prefilled with a fluid in liquid condition. saturated. In some other embodiments, the first conduit 111a, the second conduit 111b, the third conduit 121a, the fourth conduit 121b, the fifth conduit 131a, and the sixth conduit 131b may not be hermetically attached to condenser 114. In such embodiments, the devices first, second, and third biphasic heat transfer valves 122, 132, 142 may not be hermetically sealed in the sealed casing 109. Also, in such embodiments, the sealed casing 109 may be prefilled with a fluid having a boiling point less than a predefined threshold temperature of the first, second, third and fourth components 108, 118, 128, 138 at atmospheric pressure. In such an exemplary embodiment, the fluid may include air and the like.

During operation, condenser 114 is used to direct a first portion 120a of single-phase fluid 120 to first two-phase heat transfer device 122 of first cooling loop 111. In one embodiment, single-phase fluid 120 may be water, nitrogen, or the like. . First biphasic heat transfer device 112 is configured to dissipate heat from first component 108 to first portion 120a of single phase fluid 120 and produce a first portion 124a of biphasic fluid 124. In one embodiment, biphasic fluid 124 includes a liquid medium and a gaseous medium. The first two-phase heat transfer device 112 is further configured to passively pump the first portion 124a of the two-phase fluid 124 to the condenser 114.

Condenser 114 is further used to direct a second portion 120b of single-phase fluid 120 to single-phase heat transfer device 136 before directing second portion 120b to second two-phase heat transfer device 132. Single-phase heat transfer device 136 is used to extract heat from the third component 128 and heat the second part 120b of the single-phase fluid 120 before directing the second part 120b of the single-phase fluid 120 to the second two-phase heat transfer device 132. Specifically, the second part 120b of the single-phase fluid 120 is it is directed to the first plenum chamber 132a from the single-phase heat transfer device 136. The second portion 120b of the single-phase fluid 120 is then directed to the second plenum chamber 132b through the plurality of heat exchange tubes 132c. The plurality of heat exchange tubes 132c dissipates heat from the second component 118 to the second portion 120b of the single phase fluid 120 and produces a second portion 124b of the biphasic fluid 124. The second plenum chamber 132b receives the second portion 124b from the plurality of heat exchange tubes 132c and passively pumps the second part 124b of the biphasic fluid 124 to the condenser 114.

Condenser 114 is further used to direct a third portion 120c of single-phase fluid 120 to single-phase heat transfer device 146 before directing third portion 120c to third two-phase heat transfer device 142. Single-phase heat transfer device 146 is used to dissipate heat from the fluid 148 in the sealed enclosure and heat the third part 120c before directing the third part 120c of the single-phase fluid 120 to the third two-phase heat transfer device 142. The two-phase heat transfer device 142 dissipates heat from the fourth component 138 and produces a third portion 124c of the biphasic fluid 124. The third biphasic heat transfer device 142 is further used to passively pump the third portion 124c of the biphasic fluid 124 to the condenser 114.

Condenser 114 is configured to receive first, second, and third portions 124a, 124b, 124c of biphasic fluid 124. Specifically, first plenum chamber 114a of condenser 114 receives first, second, and third portions 124a, 124b, 124c and mixes them together. first, second, and third portions 124a, 124b, 124c before directing the biphasic fluid 124 to the second plenum chamber 114b through the plurality of heat exchange tubes 114c. The plurality of heat exchange tubes 114c are used to produce the single phase fluid 120 by dissipating heat in the two phase fluid 124 to ambient air 148a. Fan 114d is used to blow fluid 148 through the plurality of heat exchange tubes 114c to produce single-phase fluid 120. As discussed herein, the first, second, and third cooling loops 111, 121, 131 are configured to supply the first, second, and third portions 120a, 120b, 120c of single-phase fluid 120 to respective two-phase heat transfer devices 122, 132, 142. In some embodiments, condenser 114 is configured to simultaneously drive the first portions , second, and third 120a, 120b, 120c of the single-phase fluid 120 to respective first, second, and third two-phase heat transfer devices 122, 132, 142. In some other embodiments, condenser 114 may be configured to sequentially drive the first, second and third 120a, 120b, 120c of the single-phase fluid 120 to the respective first, second and second two-phase heat transfer devices. third 122, 132, 142 depending on the corresponding temperature of the first, second and fourth components 108, 118, 138.

Although, the heat dissipation system 110 illustrated in the embodiment of Figure 2 includes three cooling loops 111, 121, 131, the number of such cooling loops may vary depending on design and application. The illustrated embodiment should not be construed as limiting the performance of the present invention. Although each of the first, second, and third cooling loops 111, 121, 131 illustrated in the embodiment of Figure 2 includes a biphasic heat transfer device, the number of biphasic heat transfer devices in each of the first, second, and third cooling loops 111, 121, 131 may vary by design and application.

Figure 3 illustrates a perspective view of a biphasic heat transfer device 172 according to an example, which is not part of the invention. Biphasic heat transfer device 172 is substantially similar to the first, second, and third biphasic heat transfer devices 122, 132, 142 as depicted in the embodiment of Figure 2. Biphasic heat transfer device 172 includes a housing supply housing 180, a receiving housing 182, and an expansion housing 184 extending between the supply housing 180 and receiving housing 182. The expansion housing 184 includes a flow inlet 186 coupled to the supply housing 180 and a flow outlet 188 coupled to receiving housing 182. Supply housing 180 includes a first flow opening 190 defined therein and receiving housing 182 includes a second flow opening 192 defined therein. In another embodiment, a plurality of Two-phase heat transfer devices 172 can be coupled together to increase the cooling capacity of the heat dissipation system 110. Alternatively, as will be described in more detail below, the plurality of two-phase heat transfer devices 172 can be integrally formed as a unitary structure. In the illustrated embodiment, at least a portion of each of supply housing 180 and receiving housing 182 may be oriented perpendicular to expansion housing 184. The plurality of biphasic heat transfer devices 172 may be vertically spaced apart.

As described herein, single-phase fluid is directed from the condenser to supply housing 180 through first flow opening 190. Supply housing 180 directs single-phase fluid to expansion housing 184 through flow inlet. flow 186. The expansion housing 184 extracts heat from the components corresponding to the single-phase fluid and produces the two-phase fluid. The biphasic fluid is subsequently discharged from the expansion housing 184 to the receiving housing 182 through the flow outlet 188. The receiving housing 182 discharges the biphasic fluid to the condenser through the second flow opening 192. Discussed herein, expansion housing 184 is thermally coupled to a heat load 194. Heat transferred from heat load 194 facilitates vaporization of the single phase fluid to produce the biphasic fluid channeled through expansion housing 184.

In the exemplary embodiment, the expansion housing 184 has an asymmetrical design such that the flow inlet 186 has a smaller size compared to the size of the flow outlet 188. More specifically, the flow inlet 186 has a smaller area. smaller in cross-section than the cross-sectional area of the flow outlet 188. When the single-phase fluid is vaporized, the volume of the two-phase fluid increases according to an Ideal Gas Law. The difference in the cross-sectional areas of the flow inlet 186 and the flow outlet 188 allows to accommodate the increase in volume of the biphasic fluid channeled through the expansion housing 184 so that the biphasic fluid is forced towards the flow outlet. 188 and backflow is restricted through flow inlet 186. In one embodiment, the ratio of the cross-sectional area of the flow inlet 186 to the cross-sectional area of the flow outlet 188 is less than or equal to about 0.5.

Figure 4 illustrates a schematic diagram of a heat dissipation system 210 according to an example, which is not part of the present invention. In the illustrated embodiment, heat dissipation system 210 includes a first cooling loop 211, a second cooling loop 221, a third cooling loop 231, and a condenser 214. The first cooling loop 211 includes a first heat transfer device. two-phase heat transfer device 222 and an accumulator 230. The first cooling loop 211 further includes a first conduit 211a extending from a downstream end 250 of the condenser 214 to an upstream end 252 of the first two-phase heat transfer device 222. Similarly, the first cooling loop 211 further includes a second conduit 211b extending from an upstream end 254 of the first two-phase heat transfer device 222 to a downstream end 256 of the condenser 214. The system The heat sink 210 further includes a first intermediate conduit 212 coupled to the first conduit 211a and the second conduit 211b. The second cooling loop 221 includes a second two-phase heat transfer device 224 and an accumulator 232. The second cooling loop 221 further includes a third conduit 221a that extends from the downstream end 250 of the condenser 214 to an end of upstream 257 of the second biphasic heat transfer device 224. Similarly, the second cooling loop 221 further includes a fourth conduit 221b extending from an upstream end 258 of the second biphasic heat transfer device 224 to the downstream end 256 of the condenser 214. The heat dissipation system 210 further includes a second intermediate conduit 213 coupled to the third conduit 221a and the fourth conduit 221b. The third cooling loop 231 includes a third two-phase heat transfer device 226 and an accumulator 234. The third cooling loop 231 further includes a fifth conduit 231a extending from the downstream end 250 of the condenser 214 to a downstream end 250 of the condenser 214. 260 of the third biphasic heat transfer device 226. Similarly, the third cooling loop 231 further includes a sixth conduit 231b extending from an upstream end 262 of the third biphasic heat transfer device 226 to the downstream end 256 of condenser 214. Heat dissipation system 210 further includes a third intermediate conduit 225 coupled to fifth conduit 231a and sixth conduit 231b. Although the first intermediate conduit 212, the second intermediate conduit 213, and the third intermediate conduit 225 are shown as disposed in a different plane, in certain embodiments, all three intermediate conduit 212, 213, 225 may be aligned in the same plane. In some other embodiments, the heat dissipation system 210 may include only one accumulator coupled to the first, third, and fifth conduits 211a, 221a, 231a.

During operation, condenser 214 is used to direct a first part of a single-phase fluid 220 to the first two-phase heat transfer device 222 through the first conduit 211a, a second part of single-phase fluid 220 to the second single-phase heat transfer device 224 through the third conduit 221a, and a third of the single-phase fluid 220 to the third heat transfer device 226 through the fifth conduit 231a. Accumulator 230 is coupled to first conduit 211a and is used to temporarily store the first portion of single-phase fluid 220 before it is supplied to first two-phase heat transfer device 222. Similarly, accumulator 232 is coupled to third conduit 221a and is used to temporarily store the second part of the single-phase fluid 220 before supplying it to the second two-phase heat transfer device 224. The accumulator 234 is coupled to the fifth conduit 231a and is used to temporarily store the third part of the single-phase fluid 220 before supplying it to the third biphasic heat transfer device 226. The first biphasic heat transfer device 222 that is coupled to a first component (not shown in Figure 4), is configured to dissipate heat from the first component to the first part of the single-phase fluid 220 and produces a first part of a two-phase fluid 224. The first two-phase heat transfer device 222 is further configured to passively pump the first part of the two-phase fluid 224 to the condenser 214. During continuous operation of the heat dissipation system 210, the level of the first part of the single-phase fluid 220 in the first conduit 211a is reduced and the level of the The first part of the biphasic fluid 224 in the second conduit 211b increases, thus generating a height difference "H" between the levels of the single-phase fluid 220 and the biphasic fluid 224 in the first cooling loop 211. The generation of the height difference "H" may result in throttling of the first two-phase heat transfer device 222. It should be noted herein that the term "throttling" as used a in the context described herein refers to shutting off the supply of the single-phase fluid 220 to the first two-phase heat transfer device 222. According to the exemplary embodiment, the first intermediate conduit 212 is configured to transfer at least a portion of the first portion of the biphasic fluid 224 from the second conduit 211b to the first conduit 211a, thereby allowing the first cooling loop 211 to maintain the level of the monophasic fluid 220 in the first conduit 211a equal to the level of the biphasic fluid 224 in the second conduit 211b . Thus, the first intermediate conduit 212 prevents throttling of the first two-phase heat transfer device 222. Similarly, the second two-phase heat transfer device 224 that is coupled to a second component (not shown in Figure 4 ), is configured to dissipate heat from the second component to the second portion of the single phase fluid 220 and produce a second portion of the biphasic fluid 224. The second portion of the biphasic fluid 224 is further configured to passively pump the second portion of the biphasic fluid. 224 to condenser 214. As discussed herein, second intermediate conduit 213 is configured to transfer at least a portion of the second portion of biphasic fluid 224 from fourth conduit 221b to third conduit 221a, thereby allowing the second cooling loop 221 maintain a level of the single-phase fluid 220 in the third conduit 221a equal to the level of the fluid biphasic 224 in the fourth channel 221b. In this way, the second intermediate conduit 213 allows to avoid throttling of the second biphasic heat transfer device 224. Similarly, the third intermediate conduit 225 is configured to transfer at least a part of the third part of the biphasic fluid 224 from the sixth conduit 231b to the fifth conduit 231a, thereby allowing the third cooling loop 231 to maintain a level of the single phase fluid 220 in the fifth conduit 231a equal to the level of the biphasic fluid 224 in the sixth conduit 231b. In this way, the third intermediate conduit 225 allows to avoid the throttling of the third biphasic heat transfer device 226. Although, the embodiment of Figure 4 is discussed with three intermediate conduits 212, 213, 225, in some embodiments, the system of heat sink 210 may include only one intermediate conduit connecting the first, third, and fifth conduits 211a, 221a, 231a with the second, fourth, and sixth conduits 211b, 221b, 231b. Similarly, in some other embodiments, the number of such cooling loops in heat dissipation system 210 may vary depending on the application.

Figure 5 illustrates a schematic diagram of a heat dissipation system 310 according to an example not forming part of the present invention. In the illustrated embodiment, the heat dissipation system 310 includes a first cooling loop 311, a second cooling loop 321, and a third cooling loop 331. For ease of illustration, the condenser is not shown in the embodiment of Figure 5. The first cooling loop 311 includes a first two-phase heat transfer device 312, the second cooling loop 321 includes a second two-phase heat transfer device 322, and the third cooling loop 331 includes a third heat transfer device 332. The first 2-phase heat transfer device 312 receives a first part 320a of a single-phase fluid 320 from the condenser and produces a first part 324a of a 2-phase fluid 324. Similarly, the second 2-phase heat transfer device 322 receives a second part 320b of the single-phase fluid 320 from the condenser and produces a second part 324b of the biphasic fluid ico 324. The third biphasic heat transfer device 332 receives a third part 320c of the single phase fluid 320 from the condenser and produces a third part 324c of the biphasic fluid 324. It should be noted herein that the first part 324a, the second part 324b and the third part 324c of the biphasic fluid 324 are produced by exchanging heat with respective electronic components and/or the fluid within a sealed housing. In certain embodiments, the heat dissipation system 310 is configured to perform at least one of the following: regulate the flow rate of the single-phase fluid 320 and the bi-phase fluid 324 in the first, second, and third cooling loops 311, 321, 331 by passively pumping the first, second, and third portions 324a, 324b, 324c of the biphasic fluid 324 through each of the biphasic heat transfer devices 312, 322, 332. Specifically, the first portion 320a of the single-phase fluid 320 and the first portion 324a of a two-phase fluid 324 in the first cooling loop 311 are passively pumped by the first two-phase heat transfer device 312 to regulate the flow rate of the single-phase fluid 320 and the two-phase fluid 324. Similarly, the second part 320b of the fluid single-phase fluid 320 and the second part 324b of the two-phase fluid 324 in the second cooling loop 321 are passively pumped by the second transfer device. biphasic heat flow 322 to regulate the flow rate of the single-phase fluid 320 and the biphasic fluid 324 in the second cooling loop 321. In addition, the third part 320c of the single-phase fluid 320 and the third part 324c of the biphasic fluid 324 in the third cooling loop cooling loop 331 are passively pumped by the third biphasic heat transfer device 332 to regulate the flow rate of the single phase fluid 330 and biphasic fluid 334 in the third cooling loop 331. According to embodiments of the present invention, there is no need to use pumps active to pump the biphasic fluid from the biphasic heat transfer devices 312, 322, 332.

Figure 6 illustrates a flow diagram of a method 400 of thermal management of a power converter according to an example, which is not part of the invention.

In one embodiment, method 400 involves directing a first portion of a single-phase fluid from a condenser to a first two-phase heat transfer device of a first cooling loop in step 402. In certain embodiments, the single-phase fluid includes a liquid medium . In one embodiment, the power converter includes a sealed case and the capacitor is disposed outside of the sealed case. Method 400 further involves directing a second part of the single-phase fluid from the condenser to a second two-phase heat transfer device of a second cooling loop in step 404. Furthermore, method 400 involves dissipating heat from a first component to the first component. part of the single-phase fluid through the first two-phase heat transfer device and producing a first part of a two-phase fluid in step 406. The first component is disposed within the sealed housing and coupled to the first two-phase heat transfer device. In certain embodiments, the biphasic fluid includes a liquid medium and a gaseous medium. The method 400 further involves a step 408 of dissipating heat from a second component to the second part of the single phase fluid through the second part of the two phase heat transfer device and producing a second part of the two phase fluid. In an exemplary embodiment, the second component is disposed within the sealed housing and coupled to the second biphasic heat transfer device. Method 400 further involves pumping the first portion of the biphasic fluid from the first biphasic heat transfer device to the condenser in step 410. In one embodiment, the first portion of the biphasic heat transfer device is configured to passively pump the first portion of the fluid biphasic to the capacitor. Method 400 further involves pumping the second portion of the biphasic fluid from the second biphasic heat transfer device to the condenser in step 412. In one embodiment, the second portion of the biphasic heat transfer device is configured to passively pump the second portion of the fluid. biphasic to the capacitor. In some embodiments, the first and second cooling loops are arranged parallel to each other. In some embodiments, method 400 further involves a step of dissipating heat from a third component to the second part of the single-phase fluid through a second cooling loop single-phase heat transfer device before directing the second part of the single-phase fluid to the second biphasic heat transfer device. In one embodiment, the third component and the single phase heat transfer device are disposed within the sealed housing. Also, the single-phase heat transfer device is coupled to the third component.

In one embodiment, method 400 further involves a substep (i) of directing a third of the single-phase fluid from the condenser to a third two-phase heat transfer device of a third cooling loop, a substep (ii) of dissipating heat from a fourth component to the third part of the single-phase fluid through a third two-phase heat transfer device of the third cooling loop and producing a third part of the two-phase fluid, and a substep (iii) of pumping the third part of the two-phase fluid from the third two-phase heat transfer device to the condenser. In some embodiments, the fourth component and the third biphasic heat transfer device are disposed within the sealed housing. Furthermore, the fourth component is coupled to the third biphasic heat transfer device. In an exemplary embodiment, the method further involves a sub-step (iv) of dissipating heat from a fluid in the sealed housing to the third single phase fluid through a third cooling loop single phase heat transfer device before directing the third part of the single-phase fluid to the third two-phase heat transfer device. In such an embodiment, the single-phase heat transfer device is disposed within the sealed casing. In some embodiments, the first, second, and third cooling loops are arranged parallel to each other.

In one or more embodiments, method 400 further involves performing at least one of i) transferring a portion of the first portion of the biphasic fluid from a first conduit to a second conduit of the first cooling loop, ii) transferring a portion of the second part of the biphasic fluid from a third conduit to a fourth conduit of the second cooling loop, and iii) transferring a part of the third part of the biphasic fluid from a fifth conduit to a sixth conduit of the third cooling loop. In such embodiments, the first conduit extends from a downstream end of the first two-phase heat transfer device to an upstream end of the condenser and the second conduit extends from a downstream end of the condenser to an upstream end. above the first two-phase heat transfer device. The third conduit extends from a downstream end of the second two-phase heat transfer device to the upstream end of the condenser and the fourth conduit extends from the downstream end of the condenser to an upstream end of the second device. biphasic heat transfer. The fifth conduit extends from a downstream end of the third two-phase heat transfer device to the upstream end of the condenser and the sixth conduit extends from the downstream end of the condenser to an upstream end of the third device. biphasic heat transfer.

In one or more embodiments, method 400 further involves performing at least one of i) regulating the flow rate of the first part of the single-phase fluid and the first part of the two-phase fluid in the first cooling loop using a first two-phase heat transfer device , ii) regulating a flow rate of the second part of the monophasic fluid and the second part of the biphasic fluid in the second cooling loop using the second biphasic heat transfer device, and iii) regulating a flow rate of the third part of the monophasic fluid and the third part of the biphasic fluid in the third cooling loop using the third biphasic heat transfer device.

While only certain features of the embodiments have been illustrated and described herein, many modifications and changes will occur to those skilled in the art. Therefore, it is to be understood that the appended embodiments are intended to cover all such modifications and changes within the scope of the appended claims.

Claims (6)

1. A power converter (104) comprising: a sealed casing (109); a first component (108), a second component (118), and a third component (128) disposed within the sealed casing (109); and a heat dissipation system (110) comprising: a capacitor (114); a first cooling loop (111) coupled to the condenser (114), wherein the first cooling loop (111) comprises a first two-phase heat transfer device (122) disposed within the sealed casing (109), wherein the first biphasic heat transfer device (122) is coupled to the first component (108) and adapted to dissipate heat from the first component (108); and a second cooling loop (121) coupled to the condenser (114), wherein the second cooling loop (121) comprises: a second biphasic heat transfer device (132) disposed within the sealed casing (109), wherein the second biphasic heat transfer device (132) is coupled to the second component (118) and adapted to dissipate heat from the second component (118) and a first single-phase heat transfer device (136) disposed within the sealed casing (109) and coupled and disposed upstream relative to the second two-phase heat transfer device (132), wherein the first single phase heat transfer device (136) is coupled to the third component (128) and adapted to dissipate heat from the third component (128); wherein the condenser (114) is disposed outside the sealed casing (109) and is disposed above the first and second biphasic heat transfer devices (122, 132); wherein the third component (128) is an auxiliary component and the first and second components (108, 118) are power electronic components that generate substantially more heat than the third component (128). 2. The power converter (104) of claim 1, wherein the heat dissipation system (110) further comprises a fourth component (138) and a third cooling loop (131) coupled to the capacitor (114), in wherein the third cooling loop (131) comprises a third biphasic heat transfer device (142) disposed within the sealed casing (109), and wherein the third biphasic heat transfer device (142) is coupled to the fourth component (138). 3. The power converter (104) of claim 2, wherein the third cooling loop (131) further comprises a second single-phase heat transfer device (146) coupled and disposed upstream relative to the third heat transfer device. biphasic heat (142). 4. The power converter (104) of claim 2, wherein the first cooling loop (111) comprises a first conduit (111a) extending from a downstream end (150) of the condenser (114) to a upstream end (152) of the first two-phase heat transfer device (122) and a second conduit (111b) extending from a downstream end (154) of the first two-phase heat transfer device (122) to a upstream end (156) of the condenser (114), wherein the second cooling loop (121) comprises a third conduit (121a) extending from the downstream end (150) of the condenser (114) to an upstream end (158) of the second heat transfer device (132) through the first single-phase heat transfer device (136) and a fourth conduit (121b) extending from a downstream end (160) of the second two-phase heat transfer device (132) to the end upstream (156) of the condenser (114), and wherein the third cooling loop (131) comprises a fifth conduit (131a) extending from the downstream end (150) of the condenser (114) to an upstream end (162) of the third heat transfer device two-phase heat transfer device (142) and a sixth conduit (131b) extending from a downstream end (164) of the third two-phase heat transfer device (142) to the upstream end (156) of the condenser (114). 5. The power converter of claim 4, further comprising at least one of: a first intermediate conduit coupled to the first conduit and to the second conduit, a second intermediate conduit coupled to the third conduit and the fourth conduit, and a third intermediate conduit coupled to the fifth conduit and the sixth conduit. 6. The power converter (104) of claim 2, wherein each of the first, second, and third biphasic heat transfer devices (122, 132, 142) comprises: a supply housing (180); a reception housing (182); and at least one expansion housing (184) extending between the supply housing (180) and the receiving housing (182), wherein the at least one expansion housing (184) comprises a flow inlet (186) defined in the supply housing (180) and a flow outlet (188) defined in the receiving housing (182), and wherein the flow inlet (186) has a first size and the flow outlet (188) has a first size. second size larger than first size.

116 FIG. 1