+

EP2181570A1 - Electric circuit configuration and method for producing an electric circuit configuration - Google Patents

Electric circuit configuration and method for producing an electric circuit configuration

Info

Publication number
EP2181570A1
EP2181570A1 EP08774954A EP08774954A EP2181570A1 EP 2181570 A1 EP2181570 A1 EP 2181570A1 EP 08774954 A EP08774954 A EP 08774954A EP 08774954 A EP08774954 A EP 08774954A EP 2181570 A1 EP2181570 A1 EP 2181570A1
Authority
EP
European Patent Office
Prior art keywords
circuit
circuit device
transfer device
transfer
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08774954A
Other languages
German (de)
French (fr)
Inventor
Michael Franz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2181570A1 publication Critical patent/EP2181570A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/19—Manufacturing methods of high density interconnect preforms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73267—Layer and HDI connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Definitions

  • the invention relates to an electrical circuit arrangement having at least one first circuit device and at least one second circuit device, wherein the circuit devices are electrically connected to one another with the interposition of at least one transfer device.
  • the invention further relates to a method for producing an electrical circuit arrangement which has at least one first circuit device and at least one second circuit device, wherein at least one transfer device is arranged between the circuit devices for electrical connection of the circuit devices and the circuit devices are electrically connected to the transfer device.
  • Such circuit arrangements with two circuit devices are known, for example, as electronic devices having different functions.
  • the electronic devices generally consist of a first circuit device configured as control electronics and a second circuit device designed as power electronics.
  • the control electronics and the power electronics are designed in many cases in different circuit technologies.
  • Most electrical and mechanical connection concepts of the control electronics and power electronics provide a surface trained assembly.
  • the different assembly concepts when using circuit devices with different technologies are usually by plug, cable, stamped grid, bonds, flex circuit boards and / or other electrical connection means electrically and / or mechanically realized.
  • These conventional assembly concepts require additional space for the wiring for electrical connection of the first with the second circuit device.
  • the transfer device is electrically connected to the first circuit device by means of conductive adhesive connections and that the transfer device is electrically connected to the second circuit device by means of conductive adhesive connections and / or solder connections.
  • the two circuit devices have contact regions which are electrically connected to one another by the transfer device.
  • the transfer device has a corresponding electrical line structure which electrically connects the contact regions of the first circuit device with the correspondingly assigned contact regions of the second circuit device.
  • the transfer device also has contact areas. The contact regions of the first circuit device are electrically connected to associated contact regions of the transfer device by means of conductive adhesive connections.
  • the contact regions of the second circuit device are electrically connected to associated contact regions of the transfer device by means of conductive adhesive connections and / or solder connections.
  • the contact regions of the transfer device assigned to the contact regions of the first circuit device are connected to the contact regions of the transfer device via an electrical conduction structure of the transfer device such that the contact regions of the first circuit device are electrically connected to the associated contact regions of the second circuit device after assembly are.
  • the material of the connections of the first circuit device with the transfer device or the transfer device with the second circuit device may be different or the same. This is before the production of the respective compounds respective material for forming the compounds is preferably pasty before.
  • the transfer device is preferably designed such that it also mechanically interconnects the circuit devices, resulting in a compact and stable electrical circuit arrangement.
  • at least one further transfer device and / or at least one transfer element for the electrical and / or mechanical connection of the circuit devices is provided.
  • the transfer device has on its upper side the conductive adhesive connections for connection to the first circuit device and on its underside the conductive adhesive connections and / or solder connections for connection to the second circuit device.
  • the two sides are - regardless of the actual orientation of the transfer device - two opposite sides of the transfer device.
  • the transfer device is a transfer board or has at least one transfer board.
  • the first circuit device is a first circuit board or has at least one first circuit board.
  • the second circuit device is a second circuit board or has at least one second circuit board.
  • the first circuit device is designed in a first circuit board technology.
  • the first circuit device is preferably included in conventional technology Printed circuit board or LTCC (Low Temperature Confired Ceramic) with LTCC substrate.
  • the second circuit device is designed in a second circuit carrier technology.
  • Circuit device is preferably carried out in DCB technology (DCB: Direct Copper Bonded) with DCB substrate.
  • DCB Direct Copper Bonded
  • the first circuit device is a low-current circuit device and / or the second circuit device is a high-current circuit device.
  • a low-current circuit device is to be understood as a circuit device whose power consumption is so low that the current carrying capacity of the conductive connection medium, that is to say of the conductive adhesive, is not exceeded.
  • a high-current circuit device is to be understood as a circuit device whose power consumption - at least in at least one operating situation - is so high that the current-carrying capacity of the conductive connection medium (of the conductive adhesive and / or the solder paste) is not exceeded.
  • the conductive adhesive bonds of conductive adhesive, in particular printed conductive adhesive, are formed.
  • the conductive adhesive is for electrical connection of the first circuit device with the transfer device preferably to the contact areas of the first
  • Circuit device and / or the transfer device and for the electrical connection of the second circuit device with the transfer device preferably printed on the contact areas of the second circuit device and / or the transfer device.
  • solder joints of solder paste in particular printed solder paste, are formed.
  • the contact regions of the transfer device and / or the second Circuit device printed with solder paste and then soldered together.
  • the two circuit devices and the transfer device are mechanically interconnected by means of an electrically insulating filling material (underfill), so that the electrical circuit arrangement is designed as an electrical circuit module.
  • underfill is known from SMD technology.
  • the method according to the invention is characterized in that the transfer device is electrically connected to the first circuit device by means of conductive adhesive and that the transfer device is electrically connected to the second circuit device by means of conductive adhesive connections and / or solder connections.
  • the following production steps preferably result for a circuit arrangement with two circuit devices:
  • FIG. 1 shows a first circuit device, a second one
  • FIG. 3 shows an intermediate module of transfer device and second circuit device soldered thereto
  • Circuit device and transfer device whose upper side is printed with conductive adhesive
  • FIG. 5 shows an electrical system formed from the first circuit device, the transfer device and the second circuit device
  • FIG. 6 shows the circuit arrangement of Figure 5 with an underfill for mechanical stabilization
  • FIG. 1 shows a first circuit device 1, a transfer device 2 and a second circuit device 3 before an electrical connection to a circuit arrangement 4.
  • This circuit arrangement 4 is in particular part of an electrical device.
  • electrical components 8 On the upper side 6 as well as on the lower side 7 of the first circuit device 1 electrical components 8, in particular electronic components are arranged and contacted with (only partially shown) conductor tracks 9 of the first circuit device 1.
  • the different layers of the first circuit device 1 are electrically contacted with each other by means not shown, formed as vias through holes.
  • the first circuit means On its underside 7, the first circuit means
  • the first circuit device is designed as a low-current circuit device 11.
  • the contact regions 15 are electrically connected to one another by means of conductor tracks 16 of the transfer device 2.
  • the connections are connections between the contact areas 15 on the upper side 13, connections between the contact areas 15 on the
  • the contact areas 15 on the upper side 13 of the transfer device 2 are arranged so that they are arranged in a mounting position congruent with associated contact areas 10 on the underside 8 of the first circuit device 1.
  • Circuit device 3 is in this embodiment free of electrical components 19 and can be used, for example, for the thermal contacting of a heat sink 21 shown in Figure 7.
  • the electrical components 19 of the second circuit device 3 are electrically connected to one another and to contact regions 22 on the upper side 18 of the second circuit device 3 by means of conductor tracks 23.
  • the contact regions 22 of the second circuit device 3 are arranged so that they coincide in a mounting position with the contact regions 15 on the underside
  • the second circuit device 3 is a high-current circuit device 24.
  • the electrical components 8, 19 are - at least partially - electronic components, in particular SMD components.
  • the first circuit device 1 forms within the assembled circuit 4 an electronic control unit 25 and the second circuit device 3 forms in the assembled circuit 4 power electronics 26. Accordingly, the electrical components 8 of the first circuit device 1 elements of the control electronics 25 and the electrical components 19 of second circuit device 3 power components of the power electronics 26.
  • These electrical components 19 of the second circuit device 3 are at least partially not hopped power semiconductors with corresponding electrical connections.
  • Multilayer circuit arrangement 27 formed circuit arrangement 4, which is shown in Figures 6 and 7. The assembly process looks like this:
  • Figure 3 shows the one another via the contact areas 15, 22 of the
  • Figure 4 shows the module 30 shown in Figure 3, in which the contact areas 15 on the upper side 13 of the transfer device 2 with conductive adhesive 31 for electrical contact with the not shown first circuit device 1 is printed.
  • FIG. 5 shows the circuit arrangement 4 consisting of the first circuit device 1, the transfer device 2 and the second circuit device 3. Opposite the module 30 shown in Figures 3 and 4 are the contact areas 10 of the first
  • Circuit device bonded to the contact areas 15 of the transfer device 2 for electrical contacting with each other.
  • the components 8 on the upper side 6 of the first circuit arrangement 1 are contacted by means of bonds 33 with the conductor tracks 9.
  • an electrically insulating underfill 34 is introduced between the first circuit device 1 and the second circuit device 3.
  • Such an underfill 34 is known, for example, from the surface mounting of the SMD technique. Subsequently, a final functional test of the circuit 4 can take place.
  • the three-dimensional multi-layer circuit arrangement 27 can be installed in a housing and the outer
  • circuit devices 1, 3 are made.
  • at least one of the circuit devices 1, 3 is preferably brought into thermal contact with a heat sink 21 via heat-conducting paste 35 (FIG. 7).
  • the following embodiments result: As printed circuit boards / circuit boards 5, 12, 17, all subracks are suitable, such as, for example: STD substrate, low-temperature baked-in ceramics (LTCC: Low Temperature Confused Ceramic), DCB substrate (DCB: direct copper bonded), conventional printed circuit boards.
  • LTCC Low Temperature Confused Ceramic
  • DCB substrate direct copper bonded
  • solder connections 29 for the high-current range or the power electronics 26 and the conductive adhesive connection 32 for the low-current range or the control electronics 25 are used.
  • the transfer device 2 assumes the following tasks:
  • Circuit device 1, transfer device 2 and second circuit device 3) in its respective technique (conventional circuit board, LTCC, DBC, ...) processed, each device 1, 2, 3 built up in a large substrate, tested and then isolated ,
  • the circuit arrangement 4 can also have more than two circuit devices which are electrically connected to one another by at least two transfer devices. Preferably, only the
  • Conductors of a transfer device designed as solder joints are soldered joints.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to an electric circuit configuration (4) having at least one first circuit device (1) and at least one second circuit device (3), the two circuit devices (1,3) being electrically connected to each other by intermediately connecting at least one transfer device (2). According to the invention, the transfer device (2) is electrically connected to the first circuit device (1) by means of conductive adhesive connections (32), and the transfer device (2) is electrically connected to the second circuit device (3) by means of conductive adhesive connections (32) and/or soldered connections (29). The invention further relates to a method for producing a corresponding electrical circuit configuration (1).

Description

Elektrische Schaltungsanordnung und Verfahren zur Herstellung einer elektrischen Schaltungsanordnung Electrical circuit arrangement and method for producing an electrical circuit arrangement
Die Erfindung betrifft eine elektrische Schaltungsanordnung mit mindestens einer ersten Schaltungseinrichtung und mindestens einer zweiten Schaltungseinrichtung, wobei die Schaltungseinrichtungen unter Zwischenschaltung mindestens einer Transfereinrichtung elektrisch miteinander verbunden sind.The invention relates to an electrical circuit arrangement having at least one first circuit device and at least one second circuit device, wherein the circuit devices are electrically connected to one another with the interposition of at least one transfer device.
Ferner betrifft die Erfindung ein Verfahren zur Herstellung einer elektrischen Schaltungsanordnung, die mindestens eine erste Schaltungseinrichtung und mindestens eine zweite Schaltungseinrichtung aufweist, wobei zur elektrischen Verbindung der Schaltungseinrichtungen zwischen den Schaltungseinrichtungen mindestens eine Transfereinrichtung angeordnet und die Schaltungseinrichtungen mit der Transfereinrichtung elektrisch verbunden werden.The invention further relates to a method for producing an electrical circuit arrangement which has at least one first circuit device and at least one second circuit device, wherein at least one transfer device is arranged between the circuit devices for electrical connection of the circuit devices and the circuit devices are electrically connected to the transfer device.
Stand der TechnikState of the art
Derartige Schaltungsanordnungen mit zwei Schaltungseinrichtungen sind zum Beispiel als elektronische Geräte unterschiedlicher Funktion bekannt. Die elektronischen Geräte bestehen im Allgemeinen aus einer als Steuerelektronik ausgebildeten ersten Schaltungseinrichtung und einer als Leistungselektronik ausgebildeten zweiten Schaltungseinrichtung. Die Steuerelektronik und die Leistungselektronik sind in vielen Fällen in unterschiedlichen Schaltungstechnologien ausgeführt. Die meisten elektrischen und mechanischen Verbindungskonzepte der Steuerelektronik und Leistungselektronik sehen eine flächig ausgebildete Montage vor. Die unterschiedlichen Montagekonzepte bei Verwendung von Schaltungseinrichtungen mit unterschiedlichen Technologien werden meist durch Stecker, Kabel, Stanzgitter, Bonds, Flex-Leiterplatten und/oder sonstige elektrische Verbindungsmittel elektrisch und/oder mechanisch realisiert. Diese herkömmlichen Montagekonzepte benötigen zusätzlichen Bauraum für die Leitungsführung zur elektrischen Verbindung der ersten mit der zweiten Schaltungseinrichtung.Such circuit arrangements with two circuit devices are known, for example, as electronic devices having different functions. The electronic devices generally consist of a first circuit device configured as control electronics and a second circuit device designed as power electronics. The control electronics and the power electronics are designed in many cases in different circuit technologies. Most electrical and mechanical connection concepts of the control electronics and power electronics provide a surface trained assembly. The different assembly concepts when using circuit devices with different technologies are usually by plug, cable, stamped grid, bonds, flex circuit boards and / or other electrical connection means electrically and / or mechanically realized. These conventional assembly concepts require additional space for the wiring for electrical connection of the first with the second circuit device.
Offenbarung der ErfindungDisclosure of the invention
Zur einfachen Montage und zur platzsparenden elektrischen Verbindung/Kontaktierung der Schaltungseinrichtungen mittels mindestens einer Transfereinrichtung ist vorgesehen, dass die Transfereinrichtung mit der ersten Schaltungseinrichtung mittels Leitklebeverbindungen elektrisch verbunden ist und dass die Transfereinrichtung mit der zweiten Schaltungseinrichtung mittels Leitklebeverbindungen und/oder Lotverbindungen elektrisch verbunden ist. Zur elektrischen Verbindung miteinander weisen die beiden Schaltungseinrichtungen Kontaktbereiche auf, die durch die Transfereinrichtung elektrisch miteinander verbunden werden. Dazu besitzt die Transfereinrichtung eine entsprechende elektrische Leitungsstruktur, die die Kontaktbereiche der ersten Schaltungseinrichtung mit den entsprechend zugeordneten Kontaktbereichen der zweiten Schaltungseinrichtung elektrisch verbindet. Zu diesem Zweck weist auch die Transfereinrichtung Kontaktbereiche auf. Die Kontaktbereiche der ersten Schaltungseinrichtung sind mit zugeordneten Kontaktbereichen der Transfereinrichtung mittels Leitklebeverbindungen elektrisch verbunden. Die Kontaktbereiche der zweiten Schaltungseinrichtung sind mit zugeordneten Kontaktbereichen der Transfereinrichtung mittels Leitklebeverbindungen und/oder Lotverbindungen elektrisch verbunden. Die den Kontaktbereichen der ersten Schaltungseinrichtung zugeordneten Kontaktbereiche der Transfereinrichtung sind mit den den Kontaktbereichen der zweiten Schaltungseinrichtung zugeordneten Kontaktbereichen der Transfereinrichtung über eine elektrische Leitungsstruktur der Transfereinrichtung so miteinander verbunden, dass die Kontaktbereiche der ersten Schaltungseinrichtung mit den zugeordneten Kontaktbereichen der zweiten Schaltungseinrichtung nach der Montage elektrisch verbunden sind. Das Material der Verbindungen der ersten Schaltungseinrichtung mit der Transfereinrichtung beziehungsweise der Transfereinrichtung mit der zweiten Schaltungseinrichtung kann unterschiedlich oder gleich sein. Vor der Herstellung der jeweiligen Verbindungen liegt das jeweilige Material zur Ausbildung der Verbindungen vorzugsweise Pastenförmig vor.For simple assembly and space-saving electrical connection / contacting of the circuit devices by means of at least one transfer device, it is provided that the transfer device is electrically connected to the first circuit device by means of conductive adhesive connections and that the transfer device is electrically connected to the second circuit device by means of conductive adhesive connections and / or solder connections. For electrical connection to one another, the two circuit devices have contact regions which are electrically connected to one another by the transfer device. For this purpose, the transfer device has a corresponding electrical line structure which electrically connects the contact regions of the first circuit device with the correspondingly assigned contact regions of the second circuit device. For this purpose, the transfer device also has contact areas. The contact regions of the first circuit device are electrically connected to associated contact regions of the transfer device by means of conductive adhesive connections. The contact regions of the second circuit device are electrically connected to associated contact regions of the transfer device by means of conductive adhesive connections and / or solder connections. The contact regions of the transfer device assigned to the contact regions of the first circuit device are connected to the contact regions of the transfer device via an electrical conduction structure of the transfer device such that the contact regions of the first circuit device are electrically connected to the associated contact regions of the second circuit device after assembly are. The material of the connections of the first circuit device with the transfer device or the transfer device with the second circuit device may be different or the same. This is before the production of the respective compounds respective material for forming the compounds is preferably pasty before.
Bevorzugt ist die Transfereinrichtung so ausgebildet, dass sie die Schaltungseinrichtungen auch mechanisch miteinander verbindet, wobei eine kompakte und stabile elektrische Schaltungsanordnung entsteht. Zusätzlich ist in einer vorteilhaften Ausgestaltung der Erfindung mindestens eine weitere Transfereinrichtung und/oder mindestens ein Transferelement zur elektrischen und/oder mechanischen Verbindung der Schaltungseinrichtungen vorgesehen.The transfer device is preferably designed such that it also mechanically interconnects the circuit devices, resulting in a compact and stable electrical circuit arrangement. In addition, in an advantageous embodiment of the invention, at least one further transfer device and / or at least one transfer element for the electrical and / or mechanical connection of the circuit devices is provided.
In einer vorteilhaften Ausgestaltung der Erfindung ist vorgesehen, dass die Transfereinrichtung auf ihrer Oberseite die Leitklebeverbindungen zur Verbindung mit der ersten Schaltungseinrichtung und auf ihrer Unterseite die Leitklebeverbindungen und/oder Lotverbindungen zur Verbindung mit der zweiten Schaltungseinrichtung aufweist. Die beiden Seiten sind - unabhängig von der tatsächlichen Ausrichtung der Transfereinrichtung - zwei einander gegenüberliegende Seiten der Transfereinrichtung.In an advantageous embodiment of the invention, it is provided that the transfer device has on its upper side the conductive adhesive connections for connection to the first circuit device and on its underside the conductive adhesive connections and / or solder connections for connection to the second circuit device. The two sides are - regardless of the actual orientation of the transfer device - two opposite sides of the transfer device.
Mit Vorteil ist vorgesehen, dass die Transfereinrichtung eine Transferplatine ist oder mindestens eine Transferplatine aufweist. Die Transfereinrichtung ist dabei n-lagig ausgebildet mit n = 1 , 2, 3... .It is advantageously provided that the transfer device is a transfer board or has at least one transfer board. The transfer device is formed n-ply with n = 1, 2, 3 ....
Weiterhin ist mit Vorteil vorgesehen, dass die erste Schaltungseinrichtung eine erste Schaltungsplatine ist oder mindestens eine erste Schaltungsplatine aufweist. Die erste Schaltungseinrichtung ist m-lagig ausgebildet mit m = 1 , 2, 3... .Furthermore, it is advantageously provided that the first circuit device is a first circuit board or has at least one first circuit board. The first circuit device is formed m-ply with m = 1, 2, 3 ....
In einer vorteilhaften Ausgestaltung der Erfindung ist vorgesehen, dass die zweite Schaltungseinrichtung eine zweite Schaltungsplatine ist oder mindestens eine zweite Schaltungsplatine aufweist. Die zweite Schaltungseinrichtung ist o- lagig ausgebildet mit o = 1 , 2, 3... .In an advantageous embodiment of the invention, it is provided that the second circuit device is a second circuit board or has at least one second circuit board. The second circuit device is formed o-lagig with o = 1, 2, 3 ....
Nach einer Weiterbildung der Erfindung ist vorgesehen, dass die erste Schaltungseinrichtung in einer ersten Schaltungsträgertechnik ausgeführt ist. Die erste Schaltungseinrichtung ist bevorzugt in herkömmlicher Technik mit Leiterplatte oder in LTCC-Technik (Low Temperature Confired Ceramic) mit LTCC-Substrat ausgeführt.According to a development of the invention, it is provided that the first circuit device is designed in a first circuit board technology. The first circuit device is preferably included in conventional technology Printed circuit board or LTCC (Low Temperature Confired Ceramic) with LTCC substrate.
Weiterhin ist mit Vorteil vorgesehen, dass die zweite Schaltungseinrichtung in einer zweiten Schaltungsträgertechnik ausgeführt ist. Die zweiteFurthermore, it is advantageously provided that the second circuit device is designed in a second circuit carrier technology. The second
Schaltungseinrichtung ist bevorzugt in DCB-Technik (DCB: Direct Copper Bonded) mit DCB-Substrat ausführt.Circuit device is preferably carried out in DCB technology (DCB: Direct Copper Bonded) with DCB substrate.
Insbesondere ist vorgesehen, dass die erste Schaltungseinrichtung eine Niederstrom-Schaltungseinrichtung und /oder die zweite Schaltungseinrichtung eine Hochstrom-Schaltungseinrichtung ist. Unter einer Niederstrom- Schaltungseinrichtung ist im Zusammenhang mit dieser Anmeldung eine Schaltungseinrichtung zu verstehen, deren Leistungsaufnahme so niedrig ist, dass die Stromtragfähigkeit des leitenden Verbindungsmediums, also des Leitklebers, nicht überschritten wird. Unter einer Hochstrom- Schaltungseinrichtung ist im Zusammenhang mit dieser Anmeldung eine Schaltungseinrichtung zu verstehen, deren Leistungsaufnahme - zumindest in mindestens einer Betriebssituation - so hoch ist, dass die Stromtragfähigkeit des leitenden Verbindungsmediums (des Leitklebers und/oder der Lotpaste) nicht überschritten wird.In particular, it is provided that the first circuit device is a low-current circuit device and / or the second circuit device is a high-current circuit device. In the context of this application, a low-current circuit device is to be understood as a circuit device whose power consumption is so low that the current carrying capacity of the conductive connection medium, that is to say of the conductive adhesive, is not exceeded. In the context of this application, a high-current circuit device is to be understood as a circuit device whose power consumption - at least in at least one operating situation - is so high that the current-carrying capacity of the conductive connection medium (of the conductive adhesive and / or the solder paste) is not exceeded.
Vorzugsweise ist vorgesehen, dass die Leitklebeverbindungen von Leitkleber, insbesondere aufgedrucktem Leitkleber, gebildet sind. Der Leitkleber wird zur elektrischen Verbindung der ersten Schaltungseinrichtung mit der Transfereinrichtung vorzugweise auf die Kontaktbereiche der erstenIt is preferably provided that the conductive adhesive bonds of conductive adhesive, in particular printed conductive adhesive, are formed. The conductive adhesive is for electrical connection of the first circuit device with the transfer device preferably to the contact areas of the first
Schaltungseinrichtung und/oder der Transfereinrichtung und zur elektrischen Verbindung der zweiten Schaltungseinrichtung mit der Transfereinrichtung vorzugweise auf die Kontaktbereiche der zweiten Schaltungseinrichtung und/oder der Transfereinrichtung aufgedruckt.Circuit device and / or the transfer device and for the electrical connection of the second circuit device with the transfer device preferably printed on the contact areas of the second circuit device and / or the transfer device.
Schließlich ist mit Vorteil vorgesehen, dass die Lotverbindungen von Lotpaste, insbesondere aufgedruckter Lotpaste, gebildet sind. Dabei werden vor der Montage der Transfereinrichtung und der zweiten Schaltungseinrichtung die Kontaktbereiche der Transfereinrichtung und/oder der zweiten Schaltungseinrichtung mit Lotpaste bedruckt und anschließend miteinander verlötet.Finally, it is advantageously provided that the solder joints of solder paste, in particular printed solder paste, are formed. In this case, before the assembly of the transfer device and the second circuit device, the contact regions of the transfer device and / or the second Circuit device printed with solder paste and then soldered together.
Mit Vorteil sind die beiden Schaltungseinrichtungen und die Transfereinrichtung mittels eines elektrisch isolierenden Füllmaterials (Underfill) mechanisch miteinander verbunden, sodass die elektrische Schaltungsanordnung als elektrisches Schaltungsmodul ausgebildet ist. Ein derartiges Underfill ist aus der SMD-Technik bekannt.Advantageously, the two circuit devices and the transfer device are mechanically interconnected by means of an electrically insulating filling material (underfill), so that the electrical circuit arrangement is designed as an electrical circuit module. Such an underfill is known from SMD technology.
Das erfindungsgemäße Verfahren ist dadurch gekennzeichnet, dass die Transfereinrichtung mit der ersten Schaltungseinrichtung mittels Leitkleber elektrisch verbunden wird und dass die Transfereinrichtung mit der zweiten Schaltungseinrichtung mittels Leitklebeverbindungen und/oder Lotverbindungen elektrisch verbunden wird. Bevorzugt ergeben sich folgende Herstellungsschritte für eine Schaltungsanordnung mit zwei Schaltungseinrichtungen:The method according to the invention is characterized in that the transfer device is electrically connected to the first circuit device by means of conductive adhesive and that the transfer device is electrically connected to the second circuit device by means of conductive adhesive connections and / or solder connections. The following production steps preferably result for a circuit arrangement with two circuit devices:
- Bedrucken der Transfereinrichtung mit Lotpaste auf seiner zweiten Seite- Printing the transfer device with solder paste on its second side
- Verlöten der Transfereinrichtung mit der zweiten Schaltungseinrichtung, wobei anschließend ein erster Funktionstest durchgeführt werden kann,Soldering the transfer device to the second circuit device, wherein subsequently a first functional test can be carried out,
- Bedrucken der ersten Seite der Transfereinrichtung mit Leitkleber,Printing the first side of the transfer device with conductive adhesive,
- Verkleben des Systems (Zwischenmoduls) aus Transfereinrichtung und zweiter Schaltungseinrichtung mit der ersten Schaltungseinrichtung, wobei anschließend ein Funktionstest der gesamten Schaltungsanordnung durchgeführt werden kann und- Gluing the system (intermediate module) from the transfer device and the second circuit device with the first circuit device, wherein subsequently a functional test of the entire circuit arrangement can be carried out and
- Einbringen eines Füllmaterials (Underfills) um die mechanische Stabilität des Moduls zu erhöhen.- introducing a filler (underfills) to increase the mechanical stability of the module.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Im Folgenden soll die Erfindung anhand von Zeichnungen näher erläutert werden. Dazu zeigen: Figur 1 eine erste Schaltungseinrichtung, eine zweiteIn the following, the invention will be explained in more detail with reference to drawings. To show: FIG. 1 shows a first circuit device, a second one
Schaltungseinrichtung und eine Transfereinrichtung,Circuit device and a transfer device,
Figur 2 die mit Lotpaste bedruckte Transfereinrichtung,2 shows the solder paste printed transfer device,
Figur 3 ein Zwischenmodul aus Transfereinrichtung und mit dieser verlöteten zweiten Schaltungseinrichtung,FIG. 3 shows an intermediate module of transfer device and second circuit device soldered thereto;
Figur 4 das in Figur 3 gezeigte Zwischenmodul aus zweiter4 shows the intermediate module shown in Figure 3 of the second
Schaltungseinrichtung und Transfereinrichtung, deren Oberseite mit Leitkleber bedruckt ist,Circuit device and transfer device whose upper side is printed with conductive adhesive,
Figur 5 eine aus der ersten Schaltungseinrichtung, der Transfereinrichtung und der zweiten Schaltungseinrichtung gebildete elektrischeFIG. 5 shows an electrical system formed from the first circuit device, the transfer device and the second circuit device
Schaltungsanordnung,Circuitry,
Figur 6 die Schaltungsanordnung der Figur 5 mit einem Underfill zur mechanischen Stabilisierung und6 shows the circuit arrangement of Figure 5 with an underfill for mechanical stabilization and
Figur 7 eine thermische Kontaktierung der Schaltungsanordnung an einem7 shows a thermal contacting of the circuit arrangement on a
Kühlkörper.Heatsink.
Ausführungsform(en) der ErfindungEmbodiment (s) of the invention
Die Figur 1 zeigt eine erste Schaltungseinrichtung 1 , eine Transfereinrichtung 2 und eine zweite Schaltungseinrichtung 3 vor einem elektrischen Verbinden zu einer Schaltungsanordnung 4. Diese Schaltungsanordnung 4 ist insbesondere Teil eines Elektrogeräts.FIG. 1 shows a first circuit device 1, a transfer device 2 and a second circuit device 3 before an electrical connection to a circuit arrangement 4. This circuit arrangement 4 is in particular part of an electrical device.
Die erste Schaltungseinrichtung 1 wird von einer m-lagig ausgebildeten ersten Schaltungsplatine 5 mit m = 4 gebildet. Auf der Oberseite 6 wie auch auf der Unterseite 7 der ersten Schaltungseinrichtung 1 sind elektrische Bauelemente 8, insbesondere elektronische Bauelemente angeordnet und mit (nur teilweise dargestellten) Leiterbahnen 9 der ersten Schaltungseinrichtung 1 kontaktiert. Die unterschiedlichen Lagen der ersten Schaltungseinrichtung 1 sind untereinander mittels nicht dargestellten, als Vias ausgebildeten Durchkontaktierungen elektrisch kontaktiert. An ihrer Unterseite 7 weist die erste SchaltungseinrichtungThe first circuit device 1 is formed by an m-layered first circuit board 5 with m = 4. On the upper side 6 as well as on the lower side 7 of the first circuit device 1 electrical components 8, in particular electronic components are arranged and contacted with (only partially shown) conductor tracks 9 of the first circuit device 1. The different layers of the first circuit device 1 are electrically contacted with each other by means not shown, formed as vias through holes. On its underside 7, the first circuit means
1 mehrere Kontaktbereiche 10 auf, die bei der montierten Schaltungsanordnung zur Kontaktierung der ersten Schaltungseinrichtung 1 mit der Transfereinrichtung1 a plurality of contact areas 10, which in the assembled circuit arrangement for contacting the first circuit device 1 with the transfer device
2 dienen. Die erste Schaltungseinrichtung ist als Niederstrom- Schaltungseinrichtung 11 ausgebildet.2 serve. The first circuit device is designed as a low-current circuit device 11.
Die Transfereinrichtung 2 wird von einer n-lagig ausgebildeten Transferplatine 12 mit n = 2 gebildet, die auf ihrer als Oberseite 13 ausgebildeten ersten Seite 13 und ihrer als Unterseite 14 ausgebildeten zweiten Seite 14 jeweils Kontaktbereiche 15 aufweist. Die Kontaktbereiche 15 sind mittels Leiterbahnen 16 der Transfereinrichtung 2 miteinander elektrisch verbunden. Die Verbindungen sind Verbindungen zwischen den Kontaktbereichen 15 auf der Oberseite 13, Verbindungen zwischen den Kontaktbereichen 15 auf derThe transfer device 2 is formed by an n-layered transfer board 12 with n = 2, which has contact areas 15 on its first side 13, which is in the form of a top 13, and its second side 14 is in the form of a bottom 14. The contact regions 15 are electrically connected to one another by means of conductor tracks 16 of the transfer device 2. The connections are connections between the contact areas 15 on the upper side 13, connections between the contact areas 15 on the
Unterseite 14 und Verbindungen zwischen Kontaktbereichen 15 der OberseiteBottom 14 and connections between contact areas 15 of the top
13 und der Unterseite 14. Die Kontaktbereiche 15 auf der Oberseite 13 der Transfereinrichtung 2 sind so angeordnet, dass sie in einer Montageposition deckungsgleich mit zugeordneten Kontaktbereichen 10 auf der Unterseite 8 der ersten Schaltungseinrichtung 1 angeordnet sind.13 and the underside 14. The contact areas 15 on the upper side 13 of the transfer device 2 are arranged so that they are arranged in a mounting position congruent with associated contact areas 10 on the underside 8 of the first circuit device 1.
Die zweite Schaltungseinrichtung 3 wird von einer o-lagig ausgebildeten zweiten Schaltungsplatine 17 gebildet, wobei o = 1 ist. Die zweite SchaltungseinrichtungThe second circuit device 3 is formed by an o-layered second circuit board 17, where o = 1. The second circuit device
3 weist auf ihrer Oberseite 18 elektrische Bauelemente 19, insbesondere elektronische Bauelemente, auf. Eine Unterseite 20 der zweiten3 has on its upper side 18 electrical components 19, in particular electronic components on. A bottom 20 of the second
Schaltungseinrichtung 3 ist in diesem Ausführungsbeispiel frei von elektrischen Bauelementen 19 und kann zum Beispiel zur thermischen Kontaktierung eines in Figur 7 gezeigten Kühlkörpers 21 genutzt werden. Die elektrischen Bauelemente 19 der zweiten Schaltungseinrichtung 3 sind untereinander und mit Kontaktbereichen 22 auf der Oberseite 18 der zweiten Schaltungseinrichtung 3 mittels Leiterbahnen 23 elektrisch kontaktiert. Die Kontaktbereiche 22 der zweiten Schaltungseinrichtung 3 sind so angeordnet, dass sie in einer Montageposition deckungsgleich mit den Kontaktbereichen 15 auf der UnterseiteCircuit device 3 is in this embodiment free of electrical components 19 and can be used, for example, for the thermal contacting of a heat sink 21 shown in Figure 7. The electrical components 19 of the second circuit device 3 are electrically connected to one another and to contact regions 22 on the upper side 18 of the second circuit device 3 by means of conductor tracks 23. The contact regions 22 of the second circuit device 3 are arranged so that they coincide in a mounting position with the contact regions 15 on the underside
14 der der Transfereinrichtung 2 angeordnet sind. Mittels der Kontaktbereiche 22 der zweiten Schaltungseinrichtung 3 und der Kontaktbereiche 15 auf der Unterseite 14 der Transfereinrichtung 2 werden die zweite Schaltungseinrichtung 3 und die Transfereinrichtung 2 bei montierter Schaltungsanordnung 4 miteinander elektrisch kontaktiert. Die zweite Schaltungseinrichtung 3 ist eine Hochstrom-Schaltungseinrichtung 24.14 of the transfer device 2 are arranged. By means of the contact regions 22 of the second circuit device 3 and the contact regions 15 on the Bottom side 14 of the transfer device 2, the second circuit device 3 and the transfer device 2 are electrically contacted with mounted circuit 4 with each other. The second circuit device 3 is a high-current circuit device 24.
Die elektrischen Bauelemente 8, 19 sind - zumindest teilweise - elektronische Bauelemente, insbesondere SMD-Bauteile. Die erste Schaltungseinrichtung 1 bildet innerhalb der fertig montierten Schaltungsanordnung 4 eine Steuerelektronik 25 und die zweite Schaltungseinrichtung 3 bildet in der fertig montierten Schaltungsanordnung 4 ein Leistungselektronik 26. Dementsprechend sind die elektrischen Bauelemente 8 der ersten Schaltungseinrichtung 1 Elemente der Steuerelektronik 25 und die elektrischen Bauelemente 19 der zweiten Schaltungseinrichtung 3 Leistungsbauelemente der Leistungselektronik 26. Diese elektrischen Bauelemente 19 der zweiten Schaltungseinrichtung 3 sind zumindest Teilweise nicht gehauste Leistungshalbleiter mit entsprechenden elektrischen Anschlüssen.The electrical components 8, 19 are - at least partially - electronic components, in particular SMD components. The first circuit device 1 forms within the assembled circuit 4 an electronic control unit 25 and the second circuit device 3 forms in the assembled circuit 4 power electronics 26. Accordingly, the electrical components 8 of the first circuit device 1 elements of the control electronics 25 and the electrical components 19 of second circuit device 3 power components of the power electronics 26. These electrical components 19 of the second circuit device 3 are at least partially not hopped power semiconductors with corresponding electrical connections.
In den Figuren 2 bis 7 wird im Folgenden ein Montageablauf einer Montage der Schaltungsanordnung 4 aus der ersten Schaltungseinrichtung 1 , der Transfereinrichtung 2 und der zweiten Schaltungseinrichtung 3 beschrieben. Durch die Montage entsteht eine als dreidimensionaleIn the figures 2 to 7 an assembly sequence of an assembly of the circuit arrangement 4 from the first circuit device 1, the transfer device 2 and the second circuit device 3 will be described below. The assembly creates one as a three-dimensional
Multilagenschaltungsanordnung 27 ausgebildete Schaltungsanordnung 4, die in den Figuren 6 und 7 dargestellt ist. Der Montageablauf sieht wie folgt aus:Multilayer circuit arrangement 27 formed circuit arrangement 4, which is shown in Figures 6 and 7. The assembly process looks like this:
1. Bedrucken der Unterseite 14 der Transfereinrichtung 2 mit Lotpaste 28. Die Figur 2 zeigt eine entsprechende Transfereinrichtung 2, deren Kontaktbereiche 15 auf der Unterseite 14 mit Lotpaste 28 bedruckt sind.1. Printing the underside 14 of the transfer device 2 with solder paste 28. Figure 2 shows a corresponding transfer device 2, the contact areas 15 are printed on the bottom 14 with solder paste 28.
2. Verlöten der Transfereinrichtung 2 mit der zweiten Schaltungseinrichtung 3. Die Figur 3 zeigt die miteinander über die Kontaktbereiche 15, 22 der2. Soldering the transfer device 2 with the second circuit device 3. Figure 3 shows the one another via the contact areas 15, 22 of the
Transfereinrichtung 2 und der zweiten Schaltungseinrichtung 3, sowie eine aus der Lotpaste 28 gebildete Lotverbindung 29 elektrisch kontaktierte Einrichtungen 2, 3. Dabei entsteht ein Zwischenmodul 30 aus diesen Einrichtungen 2, 3. Anschließend an diese erste Kontaktierung der Transfereinrichtung 2 mit der zweiten Schaltungseinrichtung 3 kann ein erster Funktionstest dieses Moduls 30 durchgeführt werden.Transfer device 2 and the second circuit device 3, as well as a formed from the solder paste 28 solder 29 electrically contacted devices 2, 3. This creates an intermediate module 30 of these devices 2, 3. Subsequently to this first contacting the transfer device 2 with the second circuit device 3, a first functional test of this module 30 can be performed.
3. Bedrucken der Kontaktbereiche 15 auf der Oberseite 13 der Transfereinrichtung 2 mit Leitkleber 31. Die Figur 4 zeigt das in Figur 3 gezeigte Modul 30, bei dem die Kontaktbereiche 15 auf der Oberseite 13 der Transfereinrichtung 2 mit Leitkleber 31 zur elektrischen Kontaktierung mit der nicht gezeigten ersten Schaltungseinrichtung 1 bedruckt ist.3. Printing the contact areas 15 on the upper side 13 of the transfer device 2 with conductive adhesive 31. Figure 4 shows the module 30 shown in Figure 3, in which the contact areas 15 on the upper side 13 of the transfer device 2 with conductive adhesive 31 for electrical contact with the not shown first circuit device 1 is printed.
4. Verkleben des Moduls 30 mit der ersten Schaltungseinrichtung 1 mittels Leitkleber 31 zur elektrischen Kontaktierung des Moduls 30 mit der ersten Schaltungseinrichtung 1. Die Figur 5 zeigt die Schaltungsanordnung 4 bestehend aus der ersten Schaltungseinrichtung 1 , der Transfereinrichtung 2 und der zweiten Schaltungseinrichtung 3. Gegenüber dem in den Figuren 3 und 4 gezeigten Modul 30 sind die Kontaktbereiche 10 der ersten4. Bonding of the module 30 to the first circuit device 1 by means of conductive adhesive 31 for electrically contacting the module 30 with the first circuit device 1. FIG. 5 shows the circuit arrangement 4 consisting of the first circuit device 1, the transfer device 2 and the second circuit device 3. Opposite the module 30 shown in Figures 3 and 4 are the contact areas 10 of the first
Schaltungseinrichtung mit den Kontaktbereichen 15 der Transfereinrichtung 2 zur elektrischen Kontaktierung miteinander verklebt. Die Bauelemente 8 auf der Oberseite 6 der ersten Schaltungsanordnung 1 werden mittels Bondverbindungen 33 mit den Leiterbahnen 9 kontaktiert.Circuit device bonded to the contact areas 15 of the transfer device 2 for electrical contacting with each other. The components 8 on the upper side 6 of the first circuit arrangement 1 are contacted by means of bonds 33 with the conductor tracks 9.
Zur Erhöhung der mechanischen Stabilität der als dreidimensionalen Multilagen- Schaltungsanordnung 27 ausgebildeten Schaltungsanordnung 4 wird zwischen die erste Schaltungseinrichtung 1 und die zweite Schaltungseinrichtung 3 ein die Transfereinrichtung 2 zumindest teilweise umgebender, elektrisch isolierender Underfill 34 eingebracht. Ein derartiger Underfill 34 ist zum Beispiel aus der Oberflächenmontage der SMD-Technik bekannt. Anschließend kann ein endgültiger Funktionstest der Schaltungsanordnung 4 erfolgen.In order to increase the mechanical stability of the circuit arrangement 4 embodied as a three-dimensional multilayer circuit arrangement 27, an electrically insulating underfill 34, at least partially surrounding the transfer device 2, is introduced between the first circuit device 1 and the second circuit device 3. Such an underfill 34 is known, for example, from the surface mounting of the SMD technique. Subsequently, a final functional test of the circuit 4 can take place.
Nach dem Einbringen des Underfills 34 kann die dreidimensionale Multilagen- Schaltungsanordnung 27 in ein Gehäuse eingebaut und die äußereAfter the introduction of the underfill 34, the three-dimensional multi-layer circuit arrangement 27 can be installed in a housing and the outer
Kontaktierung der Schaltungsanordnung 4 vorgenommen werden. Dabei wird mindestens eine der Schaltungseinrichtungen 1 , 3 vorzugsweise über Wärmeleitpaste 35 in thermischen Kontakt mit einem Kühlkörper 21 gebracht (Figur 7). Es ergeben sich folgende Ausführungsformen: Als Leiterplatten/Platinen 5, 12, 17 eignen sich alle Baugruppenträger, wie zum Beispiel: STD-Substrat, Niedertemperatur Einbrandkeramiken (LTCC: Low Temperature Confired Ceramic), DCB-Substrat (DCB: Direct Copper Bonded), herkömmliche Leiterplatten.Contacting the circuit 4 are made. In this case, at least one of the circuit devices 1, 3 is preferably brought into thermal contact with a heat sink 21 via heat-conducting paste 35 (FIG. 7). The following embodiments result: As printed circuit boards / circuit boards 5, 12, 17, all subracks are suitable, such as, for example: STD substrate, low-temperature baked-in ceramics (LTCC: Low Temperature Confused Ceramic), DCB substrate (DCB: direct copper bonded), conventional printed circuit boards.
Weiterhin ergeben sich folgende Vorteile:Furthermore, there are the following advantages:
- Entfall von platzraubenden Verbindungselementen wie zum Beispiel Stecker, Kabel, Stanzgitter, Bonds, Flex-Leiterplatten.- Elimination of space-consuming fasteners such as connectors, cables, stamped grid, bonds, flex PCBs.
- Vereinigung von Lot- und Leitklebermontage um insbesondere eine Steuer- und eine Leistungselektronik 25, 26 miteinander zu verbinden.- Association of solder and Leitklebermontage order in particular a control and power electronics 25, 26 to connect together.
Hierbei werden Lotverbindungen 29 für den Hochstrombereich beziehungsweise die Leistungselektronik 26 und die Leitklebeverbindung 32 für den Niederstrombereich beziehungsweise die Steuerelektronik 25 verwendet.In this case, solder connections 29 for the high-current range or the power electronics 26 and the conductive adhesive connection 32 for the low-current range or the control electronics 25 are used.
Die Vereinigung der Technik einer Lot- und einer Klebemontage wird durch die Verwendung der Transfereinrichtung 2 ermöglicht. Dabei übernimmt die Transfereinrichtung 2 folgende Aufgaben:The combination of the technique of soldering and adhesive mounting is made possible by the use of the transfer device 2. The transfer device 2 assumes the following tasks:
- die elektrische Kontaktierung („Verdrahtung") der ersten und der zweiten Schaltungseinrichtung 1 , 3- The electrical contacting ("wiring") of the first and the second circuit means 1, 3rd
- die thermische Trennung der ersten und der zweiten Schaltungseinrichtung 1 , 3, was insbesondere für eine Hochstrom- Schaltungseinrichtung 24 und eine Niederstrom-Schaltungseinrichtung 11 von Vorteil istthe thermal separation of the first and the second circuit devices 1, 3, which is particularly advantageous for a high-current circuit device 24 and a low-current circuit device 11
- ein Ausgleich von Materialspannungen zwischen erster und zweiter Schaltungseinrichtung und - ein Trennen der Bereiche der Lotverbindung 29 von den Bereichen der Leitklebeverbindung 32, wobei zusätzlich der Leitkleber 31 beziehungsweise Underfill 34 eingebracht werden kann.- A balance of material stresses between the first and second circuit means and separating the regions of the solder connection 29 from the regions of the conductive adhesive connection 32, wherein additionally the conductive adhesive 31 or underfill 34 can be introduced.
Besonders bevorzugt wird zunächst jede der Einrichtungen (ersteEach of the devices (first
Schaltungseinrichtung 1 , Transfereinrichtung 2 und zweite Schaltungseinrichtung 3) in seiner jeweiligen Technik (herkömmliche Leiterplatte, LTCC, DBC, ...) prozessiert, wobei jede Einrichtung 1 , 2, 3 für sich in einem großen Substrat aufgebaut, getestet und anschließend vereinzelt werden kann.Circuit device 1, transfer device 2 and second circuit device 3) in its respective technique (conventional circuit board, LTCC, DBC, ...) processed, each device 1, 2, 3 built up in a large substrate, tested and then isolated ,
Alternativ zu der gezeigten Schaltungsanordnung 4 mit zwei Schaltungseinrichtungen 1 , 3 und einer Transfereinrichtung 2 kann die Schaltungsanordnung 4 auch mehr als zwei Schaltungseinrichtungen aufweisen, die durch mindestens zwei Transfereinrichtungen miteinander elektrisch verbunden/kontaktiert werden. Vorzugsweise sind dabei nur dieAs an alternative to the illustrated circuit arrangement 4 with two circuit devices 1, 3 and a transfer device 2, the circuit arrangement 4 can also have more than two circuit devices which are electrically connected to one another by at least two transfer devices. Preferably, only the
Leitverbindungen einer Transfereinrichtung als Lotverbindungen ausgebildet. Conductors of a transfer device designed as solder joints.

Claims

Ansprüche claims
1. Elektrische Schaltungsanordnung mit mindestens einer ersten Schaltungseinrichtung und mindestens einer zweiten Schaltungseinrichtung, wobei die Schaltungseinrichtungen unter Zwischenschaltung mindestens einer Transfereinrichtung elektrisch miteinander verbunden sind, dadurch gekennzeichnet, dass die Transfereinrichtung (2) mit der ersten Schaltungseinrichtung (1 ) mittels Leitklebeverbindungen (32) elektrisch verbunden ist und dass die Transfereinrichtung (2) mit der zweiten Schaltungseinrichtung (3) mittels Leitklebeverbindungen (32) und/oder Lotverbindungen (29) elektrisch verbunden ist.1. Electrical circuit arrangement with at least one first circuit device and at least one second circuit device, wherein the circuit devices are electrically interconnected with the interposition of at least one transfer device, characterized in that the transfer device (2) with the first circuit device (1) by means Leitklebeverbindungen (32) electrically is connected and that the transfer device (2) with the second circuit means (3) by means of conductive adhesive joints (32) and / or solder joints (29) is electrically connected.
2. Schaltungsanordnung nach Anspruch 1 , dadurch gekennzeichnet, dass die Transfereinrichtung (2) auf ihrer Oberseite (13) die Leitklebeverbindungen (32) zur Verbindung mit der ersten Schaltungseinrichtung (1 ) und auf ihrer Unterseite (14) die Leitklebeverbindungen (32) und/oder Lotverbindungen (29) zur Verbindung mit der zweiten Schaltungseinrichtung (2) aufweist.2. The circuit arrangement according to claim 1, characterized in that the transfer device (2) on its upper side (13) the Leitklebeverbindungen (32) for connection to the first circuit means (1) and on its underside (14) the Leitklebeverbindungen (32) and / or solder connections (29) for connection to the second circuit device (2).
3. Schaltungsanordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Transfereinrichtung (2) eine Transferplatine (12) ist oder mindestens eine Transferplatine (12) aufweist.3. Circuit arrangement according to one of the preceding claims, characterized in that the transfer device (2) is a transfer plate (12) or at least one transfer plate (12).
4. Schaltungsanordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die erste Schaltungseinrichtung (1 ) eine erste Schaltungsplatine (5) ist oder mindestens eine erste Schaltungsplatine (5) aufweist.4. Circuit arrangement according to one of the preceding claims, characterized in that the first circuit means (1) is a first circuit board (5) or at least one first circuit board (5).
5. Schaltungsanordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die zweite Schaltungseinrichtung (3) eine zweite Schaltungsplatine (17) ist oder mindestens eine zweite Schaltungsplatine (17) aufweist.5. Circuit arrangement according to one of the preceding claims, characterized in that the second circuit means (3) is a second circuit board (17) or at least one second circuit board (17).
6. Schaltungsanordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die erste Schaltungseinrichtung (1 ) in einer ersten Schaltungsträgertechnik ausgeführt ist. 6. Circuit arrangement according to one of the preceding claims, characterized in that the first circuit device (1) is designed in a first circuit board technology.
7. Schaltungsanordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die zweite Schaltungseinrichtung (3) in einer zweiten Schaltungsträgertechnik ausgeführt ist.7. Circuit arrangement according to one of the preceding claims, characterized in that the second circuit device (3) is designed in a second circuit board technology.
8. Schaltungsanordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leitklebeverbindungen (32) von Leitkleber (31 ), insbesondere von aufgedrucktem Leitkleber (31 ), gebildet sind.8. Circuit arrangement according to one of the preceding claims, characterized in that the conductive adhesive bonds (32) of conductive adhesive (31), in particular of printed conductive adhesive (31) are formed.
9. Schaltungsanordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Lotverbindungen (29) von Lotpaste (28), insbesondere aufgedruckter Lotpaste (28), gebildet sind.9. Circuit arrangement according to one of the preceding claims, characterized in that the solder connections (29) of solder paste (28), in particular printed solder paste (28) are formed.
10. Verfahren zur Herstellung einer elektrischen Schaltungsanordnung, die mindestens eine erste Schaltungseinrichtung und mindestens eine zweite Schaltungseinrichtung aufweist, wobei zur elektrischen Verbindung der Schaltungseinrichtungen zwischen den Schaltungseinrichtungen mindestens eine Transfereinrichtung angeordnet und die Schaltungseinrichtungen mit der Transfereinrichtung elektrisch verbunden werden, dadurch gekennzeichnet, dass die Transfereinrichtung mit der ersten Schaltungseinrichtung mittels Leitkleber elektrisch verbunden wird und dass die Transfereinrichtung mit der zweiten Schaltungseinrichtung mittels Leitklebeverbindungen und/oder Lotverbindungen elektrisch verbunden wird. 10. A method for producing an electrical circuit arrangement which has at least one first circuit device and at least one second circuit device, wherein arranged for electrical connection of the circuit means between the circuit means at least one transfer means and the circuit means are electrically connected to the transfer means, characterized in that the transfer means is electrically connected to the first circuit device by means of conductive adhesive and that the transfer device is electrically connected to the second circuit device by means of Leitklebeverbindungen and / or solder joints.
EP08774954A 2007-08-16 2008-07-10 Electric circuit configuration and method for producing an electric circuit configuration Withdrawn EP2181570A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007038514A DE102007038514A1 (en) 2007-08-16 2007-08-16 Electrical circuit arrangement and method for producing an electrical circuit arrangement
PCT/EP2008/058959 WO2009021786A1 (en) 2007-08-16 2008-07-10 Electric circuit configuration and method for producing an electric circuit configuration

Publications (1)

Publication Number Publication Date
EP2181570A1 true EP2181570A1 (en) 2010-05-05

Family

ID=39885005

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08774954A Withdrawn EP2181570A1 (en) 2007-08-16 2008-07-10 Electric circuit configuration and method for producing an electric circuit configuration

Country Status (6)

Country Link
US (1) US20110085314A1 (en)
EP (1) EP2181570A1 (en)
JP (1) JP2010537397A (en)
CN (1) CN101779529B (en)
DE (1) DE102007038514A1 (en)
WO (1) WO2009021786A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8959762B2 (en) 2005-08-08 2015-02-24 Rf Micro Devices, Inc. Method of manufacturing an electronic module
US8572840B2 (en) * 2010-09-30 2013-11-05 International Business Machines Corporation Method of attaching an electronic module power supply
US8835226B2 (en) 2011-02-25 2014-09-16 Rf Micro Devices, Inc. Connection using conductive vias
US9627230B2 (en) 2011-02-28 2017-04-18 Qorvo Us, Inc. Methods of forming a microshield on standard QFN package
US9807890B2 (en) * 2013-05-31 2017-10-31 Qorvo Us, Inc. Electronic modules having grounded electromagnetic shields
US11127689B2 (en) 2018-06-01 2021-09-21 Qorvo Us, Inc. Segmented shielding using wirebonds
US11219144B2 (en) 2018-06-28 2022-01-04 Qorvo Us, Inc. Electromagnetic shields for sub-modules
US11114363B2 (en) 2018-12-20 2021-09-07 Qorvo Us, Inc. Electronic package arrangements and related methods
US11515282B2 (en) 2019-05-21 2022-11-29 Qorvo Us, Inc. Electromagnetic shields with bonding wires for sub-modules

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board

Family Cites Families (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3316017A1 (en) * 1983-05-03 1984-11-08 Siegert GmbH, 8501 Cadolzburg Method of making electrical connections in multisubstrate circuits, and multisubstrate circuits produced thereby
US5285926A (en) * 1987-10-26 1994-02-15 Unidynamics Corporation Multiple-product merchandising machine
US5048717A (en) * 1987-10-26 1991-09-17 Unidynamics Corporation Multiple-product merchandizing machine
JPH0363967U (en) * 1989-10-23 1991-06-21
JPH0426184A (en) * 1990-05-21 1992-01-29 Nec Corp Thick-film circuit board
US5768109A (en) * 1991-06-26 1998-06-16 Hughes Electronics Multi-layer circuit board and semiconductor flip chip connection
US5329695A (en) * 1992-09-01 1994-07-19 Rogers Corporation Method of manufacturing a multilayer circuit board
US5309629A (en) * 1992-09-01 1994-05-10 Rogers Corporation Method of manufacturing a multilayer circuit board
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5854302A (en) * 1993-04-29 1998-12-29 The Dow Chemical Company Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins
US5604673A (en) * 1995-06-07 1997-02-18 Hughes Electronics Low temperature co-fired ceramic substrates for power converters
US5661647A (en) * 1995-06-07 1997-08-26 Hughes Electronics Low temperature co-fired ceramic UHF/VHF power converters
US6297559B1 (en) * 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
US6583354B2 (en) * 1999-04-27 2003-06-24 International Business Machines Corporation Method of reforming reformable members of an electronic package and the resultant electronic package
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
SE514424C2 (en) * 1999-06-17 2001-02-19 Ericsson Telefon Ab L M Transition between symmetrical and asymmetric stripline in a multilayer PCB
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
US20020061665A1 (en) * 2000-07-03 2002-05-23 Victor Batinovich Method and apparatus for vertically stacking and interconnecting ball grid array (BGA) electronic circuit devices
US6507118B1 (en) * 2000-07-14 2003-01-14 3M Innovative Properties Company Multi-metal layer circuit
US6477054B1 (en) * 2000-08-10 2002-11-05 Tektronix, Inc. Low temperature co-fired ceramic substrate structure having a capacitor and thermally conductive via
US6373348B1 (en) * 2000-08-11 2002-04-16 Tektronix, Inc. High speed differential attenuator using a low temperature co-fired ceramic substrate
US6535083B1 (en) * 2000-09-05 2003-03-18 Northrop Grumman Corporation Embedded ridge waveguide filters
US6600224B1 (en) * 2000-10-31 2003-07-29 International Business Machines Corporation Thin film attachment to laminate using a dendritic interconnection
US6663399B2 (en) * 2001-01-31 2003-12-16 High Connection Density, Inc. Surface mount attachable land grid array connector and method of forming same
US6495771B2 (en) * 2001-03-29 2002-12-17 International Business Machines Corporation Compliant multi-layered circuit board for PBGA applications
CN2481114Y (en) * 2001-05-08 2002-03-06 富莉科技股份有限公司 A printed circuit inner substrate fixing device
US6707671B2 (en) * 2001-05-31 2004-03-16 Matsushita Electric Industrial Co., Ltd. Power module and method of manufacturing the same
US6788171B2 (en) * 2002-03-05 2004-09-07 Xytrans, Inc. Millimeter wave (MMW) radio frequency transceiver module and method of forming same
US6835682B2 (en) * 2002-06-04 2004-12-28 E. I. Du Pont De Nemours And Company High thermal expansion glass and tape composition
US7141874B2 (en) * 2003-05-14 2006-11-28 Matsushita Electric Industrial Co., Ltd. Electronic component packaging structure and method for producing the same
US7060601B2 (en) * 2003-12-17 2006-06-13 Tru-Si Technologies, Inc. Packaging substrates for integrated circuits and soldering methods
US7049170B2 (en) * 2003-12-17 2006-05-23 Tru-Si Technologies, Inc. Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
US7241680B2 (en) * 2004-04-30 2007-07-10 Intel Corporation Electronic packaging using conductive interposer connector
FR2872992B1 (en) * 2004-07-09 2006-09-29 Valeo Vision Sa ELECTRONIC ASSEMBLY WITH THERMAL DRAIN, IN PARTICULAR FOR A MOTOR VEHICLE LIGHT DISCHARGE LAMP CONTROL MODULE
US7252408B2 (en) * 2004-07-19 2007-08-07 Lamina Ceramics, Inc. LED array package with internal feedback and control
US7105918B2 (en) * 2004-07-29 2006-09-12 Micron Technology, Inc. Interposer with flexible solder pad elements and methods of manufacturing the same
US7365273B2 (en) * 2004-12-03 2008-04-29 Delphi Technologies, Inc. Thermal management of surface-mount circuit devices
US7317249B2 (en) * 2004-12-23 2008-01-08 Tessera, Inc. Microelectronic package having stacked semiconductor devices and a process for its fabrication
TWI280593B (en) * 2005-06-16 2007-05-01 Via Tech Inc Inductor
TWI268627B (en) * 2005-07-27 2006-12-11 Impac Technology Co Ltd Image sensing module and method for packing the same
US7529013B2 (en) * 2005-08-29 2009-05-05 Samsung Electro-Mechanics Co., Ltd. Optical modulator module package
JP2007108753A (en) * 2005-10-11 2007-04-26 Samsung Electro Mech Co Ltd Mems package and optical modulator module package
US7679201B2 (en) * 2005-12-20 2010-03-16 Intel Corporation Device package
US7365553B2 (en) * 2005-12-22 2008-04-29 Touchdown Technologies, Inc. Probe card assembly
US8704349B2 (en) * 2006-02-14 2014-04-22 Stats Chippac Ltd. Integrated circuit package system with exposed interconnects
JP4916241B2 (en) * 2006-07-28 2012-04-11 パナソニック株式会社 Semiconductor device and manufacturing method thereof
US20080029884A1 (en) * 2006-08-03 2008-02-07 Juergen Grafe Multichip device and method for producing a multichip device
US8163600B2 (en) * 2006-12-28 2012-04-24 Stats Chippac Ltd. Bridge stack integrated circuit package-on-package system
US20080218988A1 (en) * 2007-03-08 2008-09-11 Burns Jeffrey H Interconnect for an electrical circuit substrate
US7742311B2 (en) * 2007-04-13 2010-06-22 Hewlett-Packard Development Company, L.P. Damage prevention interposer for electronic package and electronic interconnect structure
TW200906263A (en) * 2007-05-29 2009-02-01 Matsushita Electric Ind Co Ltd Circuit board and method for manufacturing the same
US7687899B1 (en) * 2007-08-07 2010-03-30 Amkor Technology, Inc. Dual laminate package structure with embedded elements
KR101373010B1 (en) * 2007-11-12 2014-03-14 삼성전자주식회사 Multilayer coplanar waveguide filter unit and manufacturing method thereof
US20090207568A1 (en) * 2008-02-18 2009-08-20 Haveri Heikki Antti Mikael Method and apparatus for cooling in miniaturized electronics
KR20100037300A (en) * 2008-10-01 2010-04-09 삼성전자주식회사 Method of forming semiconductor device having embedded interposer
US8405229B2 (en) * 2009-11-30 2013-03-26 Endicott Interconnect Technologies, Inc. Electronic package including high density interposer and circuitized substrate assembly utilizing same
US8245392B2 (en) * 2009-12-01 2012-08-21 Endicott Interconnect Technologies, Inc. Method of making high density interposer and electronic package utilizing same
US8653654B2 (en) * 2009-12-16 2014-02-18 Stats Chippac Ltd. Integrated circuit packaging system with a stackable package and method of manufacture thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board

Also Published As

Publication number Publication date
DE102007038514A1 (en) 2009-02-19
CN101779529A (en) 2010-07-14
WO2009021786A1 (en) 2009-02-19
CN101779529B (en) 2013-11-27
JP2010537397A (en) 2010-12-02
US20110085314A1 (en) 2011-04-14

Similar Documents

Publication Publication Date Title
EP1255299B1 (en) Power semiconductor device with pressure contact
EP2181570A1 (en) Electric circuit configuration and method for producing an electric circuit configuration
DE10306643B4 (en) Arrangement in pressure contact with a power semiconductor module
DE112006002302B4 (en) ELECTRICAL SYSTEM INCLUDING A POWER TRANSISTOR ARRANGEMENT, A BUSBAR AND A CIRCUIT BOARD ASSEMBLY
EP1898466B1 (en) Encased PCB switch assembly with contact device
DE102015210099B4 (en) Electronic component and method of manufacturing such an electronic component
DE102008001414A1 (en) Substrate circuit module with components in multiple contacting levels
DE112007000183T5 (en) High performance module with open frame assembly
EP0935818B1 (en) Electronic control apparatus
WO2015135734A1 (en) Power component integrated into a circuit board
DE10340297B4 (en) Verbindugsanordnung for connecting active and passive electrical and electronic components
DE102006053461A1 (en) Microelectronic assembly and method of making a microelectronic assembly
DE19701469C1 (en) Electronic control module
EP1057384B1 (en) Electronic control device
WO2017089213A1 (en) Circuit carrier for an electrical circuit and associated production method
DE102006032441A1 (en) Device has printed circuit board, module which comprising electro-technical element and mechanically loadable electrical contact element on side, and module is electrically connected on side
EP3881652A1 (en) Circuit carrier, (power) electronics assembly and electrical drive device
DE19855076A1 (en) DC/DC voltage converter e.g. for switching network, solar energy plant or electric vehicle drive, has metallic carrier supporting respective circuit boards for primary and secondary circuits and coupling transformer
DE102023208297B3 (en) Power module and method for producing a power module
DE102010003927A1 (en) Control module for motor car gear box, has contacting areas firmly bonded i.e. laser-welded, with one another such that strip guard layer extends at underside and fixed permanently adjacent to underside
DE102010019717A1 (en) Power circuit for controlling three-phase electric motor i.e. server motor, in motor car, has condenser attached to carriers as part of screening unit, where condenser is small-spatially arranged and electrically connected with carriers
DE102021113502A1 (en) Electronic assembly with circuit board connector, electronic module and motor vehicle
WO2017032613A1 (en) Light-emitting component
EP1647051A2 (en) Semiconductor power module with strip conductors which are detached from a substrate as external connections
DE102016107249A1 (en) Circuit board with recess for electrical component

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20100316

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20160111

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20160525

点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载