AU2003238253A8 - Acid etching mixture having reduced water content - Google Patents
Acid etching mixture having reduced water contentInfo
- Publication number
- AU2003238253A8 AU2003238253A8 AU2003238253A AU2003238253A AU2003238253A8 AU 2003238253 A8 AU2003238253 A8 AU 2003238253A8 AU 2003238253 A AU2003238253 A AU 2003238253A AU 2003238253 A AU2003238253 A AU 2003238253A AU 2003238253 A8 AU2003238253 A8 AU 2003238253A8
- Authority
- AU
- Australia
- Prior art keywords
- water content
- acid etching
- reduced water
- etching mixture
- mixture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000002253 acid Substances 0.000 title 1
- 238000005530 etching Methods 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/174,174 US20030230548A1 (en) | 2002-06-18 | 2002-06-18 | Acid etching mixture having reduced water content |
| US10/174,174 | 2002-06-18 | ||
| PCT/US2003/019079 WO2003107400A2 (en) | 2002-06-18 | 2003-06-18 | Acid etching mixture having reduced water content |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2003238253A8 true AU2003238253A8 (en) | 2003-12-31 |
| AU2003238253A1 AU2003238253A1 (en) | 2003-12-31 |
Family
ID=29733511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003238253A Abandoned AU2003238253A1 (en) | 2002-06-18 | 2003-06-18 | Acid etching mixture having reduced water content |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20030230548A1 (en) |
| EP (1) | EP1516356A2 (en) |
| JP (1) | JP2005530045A (en) |
| KR (1) | KR20050013143A (en) |
| CN (1) | CN1679146A (en) |
| AU (1) | AU2003238253A1 (en) |
| WO (1) | WO2003107400A2 (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7067015B2 (en) * | 2002-10-31 | 2006-06-27 | Texas Instruments Incorporated | Modified clean chemistry and megasonic nozzle for removing backside CMP slurries |
| JP2006100799A (en) * | 2004-09-06 | 2006-04-13 | Sumco Corp | Method of manufacturing silicon wafer |
| JP4642001B2 (en) * | 2006-10-24 | 2011-03-02 | 関東化学株式会社 | Composition for removing photoresist residue and polymer residue |
| DE102007004060B4 (en) * | 2007-01-22 | 2013-03-21 | Gp Solar Gmbh | Use of an etching solution comprising water, nitric acid and sulfuric acid and etching process |
| TWI358467B (en) * | 2007-12-07 | 2012-02-21 | Nanya Technology Corp | Etchant for metal alloy having hafnium and molybde |
| DE102007061687B4 (en) | 2007-12-19 | 2010-04-29 | Cpi Chemiepark Institut Gmbh | Process for the matt etching of silicon substrates and etching mixture for carrying out the method |
| DE102009007136A1 (en) * | 2009-02-02 | 2010-08-12 | Sovello Ag | Etching mixture for producing a structured surface on silicon substrates |
| CN102656250B (en) * | 2009-09-21 | 2015-02-25 | 巴斯夫欧洲公司 | Aqueous acidic etching solution and method for texturing the surface of single crystal and polycrystal silicon substrates |
| CN102534620A (en) * | 2010-12-08 | 2012-07-04 | 无锡华润上华科技有限公司 | Wet-process silicon etching solution for P-type wafer |
| SG192574A1 (en) * | 2011-03-11 | 2013-09-30 | Fujifilm Electronic Materials | Novel etching composition |
| US8894877B2 (en) | 2011-10-19 | 2014-11-25 | Lam Research Ag | Method, apparatus and composition for wet etching |
| US8986559B2 (en) * | 2012-02-29 | 2015-03-24 | Avantor Performance Materials, Inc. | Compositions and methods for texturing polycrystalline silicon wafers |
| CN104624512A (en) * | 2015-01-21 | 2015-05-20 | 江西久顺科技有限公司 | Method for sorting P-type heavy-doped silicon material and N-type heavy-doped silicon material in dyeing manner |
| WO2016167892A1 (en) | 2015-04-13 | 2016-10-20 | Honeywell International Inc. | Polysiloxane formulations and coatings for optoelectronic applications |
| TWI538986B (en) * | 2015-07-15 | 2016-06-21 | 綠能科技股份有限公司 | Etching solution and method for roughening surface of germanium substrate |
| CN113299551B (en) * | 2021-04-27 | 2023-05-02 | 南昌大学 | Method for regulating and controlling semiconductor corrosion area |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1383662A (en) * | 1964-03-05 | 1964-12-24 | Bayer Ag | Improved process for regenerating pickling baths containing hydrofluoric acid and sulfuric acid |
| JPS6092500A (en) * | 1983-10-26 | 1985-05-24 | Mitsubishi Heavy Ind Ltd | Liquid composition for electropolishing niobium material and its preparation |
| DE3728693A1 (en) * | 1987-08-27 | 1989-03-09 | Wacker Chemitronic | METHOD AND DEVICE FOR ETCHING SEMICONDUCTOR SURFACES |
| US5300463A (en) * | 1992-03-06 | 1994-04-05 | Micron Technology, Inc. | Method of selectively etching silicon dioxide dielectric layers on semiconductor wafers |
| KR0124484B1 (en) * | 1993-03-23 | 1997-12-10 | 모리시다 요이치 | A method and apparatus for cleaning the semiconductor device |
| DE19805525C2 (en) * | 1998-02-11 | 2002-06-13 | Sez Semiconduct Equip Zubehoer | Process for wet-etching semiconductor wafers to produce a defined edge region by under-etching |
-
2002
- 2002-06-18 US US10/174,174 patent/US20030230548A1/en not_active Abandoned
-
2003
- 2003-06-18 AU AU2003238253A patent/AU2003238253A1/en not_active Abandoned
- 2003-06-18 KR KR10-2004-7020659A patent/KR20050013143A/en not_active Withdrawn
- 2003-06-18 CN CNA038196425A patent/CN1679146A/en active Pending
- 2003-06-18 JP JP2004514122A patent/JP2005530045A/en not_active Withdrawn
- 2003-06-18 EP EP03737149A patent/EP1516356A2/en not_active Withdrawn
- 2003-06-18 WO PCT/US2003/019079 patent/WO2003107400A2/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| EP1516356A2 (en) | 2005-03-23 |
| WO2003107400A2 (en) | 2003-12-24 |
| US20030230548A1 (en) | 2003-12-18 |
| JP2005530045A (en) | 2005-10-06 |
| WO2003107400A3 (en) | 2004-04-15 |
| KR20050013143A (en) | 2005-02-02 |
| AU2003238253A1 (en) | 2003-12-31 |
| CN1679146A (en) | 2005-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AUPS159302A0 (en) | Water skimmer | |
| AU2003238253A8 (en) | Acid etching mixture having reduced water content | |
| TW543509U (en) | Improved structure for water sprinkle-nozzle | |
| AU2003287063A8 (en) | Hemostatic and acid etch compositions containing sucralose | |
| ZA200306327B (en) | Purification of 2-nitro-4-methylsulphonylbenzoic acid. | |
| AU2002357534A1 (en) | Polycarboxylic acid mixture | |
| IL157717A (en) | Stabilized hypobromous acid solutions | |
| PL376926A1 (en) | Novel 2',5'-oligoadenylic acid analogues | |
| PL366978A1 (en) | Hydroxyfattysulfonic acid analogs | |
| GB0230240D0 (en) | Removal of an acid | |
| GB0226445D0 (en) | Water craft | |
| AU2003202496A1 (en) | Water purifier | |
| AU2003240137A8 (en) | Novel phosphonocarboxylic acid esters | |
| TW543371U (en) | Float | |
| TW543368U (en) | Float connector | |
| GB0125819D0 (en) | Improvements to flooring | |
| IL162752A0 (en) | Carboxylic acid compounds for use as surfactants | |
| GB0207159D0 (en) | Floating platforms | |
| TW555237U (en) | Improved structure for I/O connector | |
| TW499859U (en) | Improved structure of luminous buoy | |
| TW549132U (en) | Improved structure of linking-type kite | |
| TW549133U (en) | Improved structure of kite | |
| TW482013U (en) | Improved discharge structure for water drinker | |
| TW551688U (en) | Improved structure of connector | |
| TW547856U (en) | Improved structure of connector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |