AU2002368160A1 - Fiducial alignment marks on microelectronic spring contacts - Google Patents

Fiducial alignment marks on microelectronic spring contacts

Info

Publication number: AU2002368160A1
Authority: AU; Australia
Prior art keywords: alignment marks; spring contacts; microelectronic spring; fiducial alignment; fiducial
Prior art date: 2002-07-15
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2002368160A

Inventor

Robert C. Martin

Eric T. Watje

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

FormFactor Inc

Original Assignee

FormFactor Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2002-07-15

Filing date

2002-07-15

Publication date

2004-02-25

2002-07-15 Application filed by FormFactor Inc filed Critical FormFactor Inc

2004-02-25 Publication of AU2002368160A1 publication Critical patent/AU2002368160A1/en

Status Abandoned legal-status Critical Current

Links

238000004377 microelectronic Methods 0.000 title 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Manufacturing & Machinery (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Geometry (AREA)
Measuring Leads Or Probes (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)

AU2002368160A 2002-07-15 2002-07-15 Fiducial alignment marks on microelectronic spring contacts Abandoned AU2002368160A1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/US2002/022477 WO2004015432A1 (en)	2002-07-15	2002-07-15	Fiducial alignment marks on microelectronic spring contacts

Publications (1)

Publication Number	Publication Date
AU2002368160A1 true AU2002368160A1 (en)	2004-02-25

Family

ID=31713782

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2002368160A Abandoned AU2002368160A1 (en)	2002-07-15	2002-07-15	Fiducial alignment marks on microelectronic spring contacts

Country Status (6)

Country	Link
EP (1)	EP1523684A1 (en)
JP (1)	JP2005533263A (en)
KR (1)	KR100880088B1 (en)
CN (1)	CN100447573C (en)
AU (1)	AU2002368160A1 (en)
WO (1)	WO2004015432A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4841620B2 (en)	2006-03-15	2011-12-21	株式会社日本マイクロニクス	Probe and probe assembly for current test
CN100399532C (en) *	2006-07-24	2008-07-02	友达光电股份有限公司	Alignment precision detection device
US7836587B2 (en) *	2006-09-21	2010-11-23	Formfactor, Inc.	Method of repairing a contactor apparatus
JP5113392B2 (en)	2007-01-22	2013-01-09	株式会社日本マイクロニクス	Probe and electrical connection device using the same
KR101324284B1 (en)	2007-05-25	2013-11-01	주식회사 코리아 인스트루먼트	Electrical connecting assembly for probe card, probe card having the electrical connecting assembly, manufacturing method of electrical connecting assembly for probe card and manufacturing method of having the electrical connecting assembly
JP5416986B2 (en)	2009-02-19	2014-02-12	株式会社日本マイクロニクス	Electrical connection device
JP5412685B2 (en) *	2009-07-24	2014-02-12	日本電子材料株式会社	Probe and probe manufacturing method
KR101638228B1 (en) *	2014-05-15	2016-07-11	주식회사 코리아 인스트루먼트	Fabrication method of probe pin capable of being used for fine pitch
US9804196B2 (en) *	2016-01-15	2017-10-31	Cascade Microtech, Inc.	Probes with fiducial marks, probe systems including the same, and associated methods
WO2017177300A1 (en) *	2016-04-15	2017-10-19	Teledyne Dalsa, Inc.	Alignment of multiple image dice in package
JP7125407B2 (en) *	2017-09-08	2022-08-24	株式会社エンプラス	Socket for electrical connection

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS61154044A (en) *	1984-12-26	1986-07-12	Toyo Electric Mfg Co Ltd	Probe card of prober
US5917707A (en) *	1993-11-16	1999-06-29	Formfactor, Inc.	Flexible contact structure with an electrically conductive shell
US5829128A (en) *	1993-11-16	1998-11-03	Formfactor, Inc.	Method of mounting resilient contact structures to semiconductor devices
JPH0265150A (en) *	1988-08-30	1990-03-05	Fujitsu Ltd	How to automatically align the probe card
JPH06209033A (en) *	1993-01-12	1994-07-26	Hitachi Ltd	Probe with mark
JPH08327658A (en) *	1995-03-31	1996-12-13	Tokyo Electron Ltd	Board inspection equipment
JP3562166B2 (en) *	1996-09-25	2004-09-08	凸版印刷株式会社	Method of forming printed circuit board having inspection electrode
JPH10160793A (en) *	1996-12-02	1998-06-19	Hitachi Cable Ltd	Probe substrate for bare chip inspection, method of manufacturing the same, and bare chip inspection system
JPH10213597A (en) *	1997-01-31	1998-08-11	Hitachi Ltd	Probe card
JP3378259B2 (en) *	1997-05-15	2003-02-17	フォームファクター，インコーポレイテッド	How to create a contact structure
US6566149B1 (en) *	1998-09-16	2003-05-20	Hitachi, Ltd.	Method for manufacturing substrate for inspecting semiconductor device
KR20080024236A (en) *	1998-12-02	2008-03-17	폼팩터, 인크.	Lithographic contact elements
US7189077B1 (en) *	1999-07-30	2007-03-13	Formfactor, Inc.	Lithographic type microelectronic spring structures with improved contours

2002
- 2002-07-15 AU AU2002368160A patent/AU2002368160A1/en not_active Abandoned
- 2002-07-15 WO PCT/US2002/022477 patent/WO2004015432A1/en active Application Filing
- 2002-07-15 KR KR1020057000689A patent/KR100880088B1/en not_active Expired - Fee Related
- 2002-07-15 EP EP02752348A patent/EP1523684A1/en not_active Ceased
- 2002-07-15 CN CNB028295919A patent/CN100447573C/en not_active Expired - Fee Related
- 2002-07-15 JP JP2004527495A patent/JP2005533263A/en active Pending

Also Published As

Publication number	Publication date
CN1668928A (en)	2005-09-14
CN100447573C (en)	2008-12-31
KR20050019870A (en)	2005-03-03
WO2004015432A1 (en)	2004-02-19
KR100880088B1 (en)	2009-01-23
JP2005533263A (en)	2005-11-04
EP1523684A1 (en)	2005-04-20

Legal Events

Date	Code	Title	Description
2005-07-21	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase

Publication	Publication Date	Title
AU2002256325A1 (en)	2002-10-28	Microelectronic spring with additional protruding member
AU2002247383A1 (en)	2002-10-08	In-street integrated circuit wafer via
AU2003299786A1 (en)	2004-07-22	Microelectronic contact structure
AU2002256203A1 (en)	2002-10-28	Stacked semiconductor device assembly with microelectronic spring contacts
AU2003247695A1 (en)	2004-01-19	Silicon-on-insulator wafer for integrated circuit
EP1524790B8 (en)	2012-02-15	Base station
AU2003261317A1 (en)	2004-02-23	Scatterometry alignment for imprint lithography
AU2002244124A1 (en)	2002-09-12	Self-coplanarity bumping shape for flip chip
AU2002368160A1 (en)	2004-02-25	Fiducial alignment marks on microelectronic spring contacts
AU2002308030A1 (en)	2003-04-03	Fibre-enriched table sweeteners
AU2003216835A1 (en)	2003-10-08	A bias circuit for a bipolar transistor
AU2002341677A1 (en)	2003-04-01	Integrated equipment set for forming an interconnect on a substrate
AU2002355469A1 (en)	2003-02-24	Semiconductor module
AU2002333613A1 (en)	2003-04-14	Semiconductor wafer identification
AU2002256502A1 (en)	2003-03-10	Immunoassays using an azlactone-modified polymeric substrate
AU2002334941A1 (en)	2003-05-06	Testing circuits on substrates
AU2002334942A1 (en)	2003-05-06	Testing circuits on substrates
AU2002341318A1 (en)	2003-04-28	Multilevel poly-si tiling for semiconductor circuit manufacture
AU2003247432A1 (en)	2003-09-09	Integrated circuit having reduced substrate bounce
AU2002343445A1 (en)	2003-04-14	Spring mounted recuperator
AU2002324708A1 (en)	2003-03-03	Wafer chuck with plunger
AU2002250583A1 (en)	2003-03-24	Error correction code circuits
AU2002332397A1 (en)	2003-01-02	Marking substrates
AU2002258179A1 (en)	2002-11-11	A contact lens
AU2002951750A0 (en)	2002-10-17	True Vision Projection (T.V.P.)