AU2001266131A1 - Preparation method of a coating of gallium nitride - Google Patents
Preparation method of a coating of gallium nitrideInfo
- Publication number
- AU2001266131A1 AU2001266131A1 AU2001266131A AU6613101A AU2001266131A1 AU 2001266131 A1 AU2001266131 A1 AU 2001266131A1 AU 2001266131 A AU2001266131 A AU 2001266131A AU 6613101 A AU6613101 A AU 6613101A AU 2001266131 A1 AU2001266131 A1 AU 2001266131A1
- Authority
- AU
- Australia
- Prior art keywords
- coating
- preparation
- gallium nitride
- gallium
- nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/38—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
- H01L21/02496—Layer structure
- H01L21/02505—Layer structure consisting of more than two layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
- H01L21/02661—In-situ cleaning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12528—Semiconductor component
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Led Devices (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0007417 | 2000-06-09 | ||
FR0007417A FR2810159B1 (en) | 2000-06-09 | 2000-06-09 | THICK LAYER OF GALLIUM NITRIDE OR MIXED NITRIDE OF GALLIUM AND ANOTHER METAL, PROCESS FOR PREPARING THE SAME, AND ELECTRONIC OR OPTOELECTRONIC DEVICE COMPRISING SUCH A LAYER |
PCT/FR2001/001777 WO2001095380A1 (en) | 2000-06-09 | 2001-06-08 | Preparation method of a coating of gallium nitride |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001266131A1 true AU2001266131A1 (en) | 2001-12-17 |
Family
ID=8851146
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001266131A Abandoned AU2001266131A1 (en) | 2000-06-09 | 2001-06-08 | Preparation method of a coating of gallium nitride |
Country Status (9)
Country | Link |
---|---|
US (3) | US7273664B2 (en) |
EP (1) | EP1290721B1 (en) |
JP (1) | JP5378634B2 (en) |
KR (1) | KR100897589B1 (en) |
CN (2) | CN100380588C (en) |
AU (1) | AU2001266131A1 (en) |
CA (1) | CA2411606C (en) |
FR (1) | FR2810159B1 (en) |
WO (1) | WO2001095380A1 (en) |
Families Citing this family (72)
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FR2810159B1 (en) * | 2000-06-09 | 2005-04-08 | Centre Nat Rech Scient | THICK LAYER OF GALLIUM NITRIDE OR MIXED NITRIDE OF GALLIUM AND ANOTHER METAL, PROCESS FOR PREPARING THE SAME, AND ELECTRONIC OR OPTOELECTRONIC DEVICE COMPRISING SUCH A LAYER |
WO2002013245A1 (en) * | 2000-08-04 | 2002-02-14 | The Regents Of The University Of California | Method of controlling stress in gallium nitride films deposited on substrates |
US6649287B2 (en) * | 2000-12-14 | 2003-11-18 | Nitronex Corporation | Gallium nitride materials and methods |
EP1459362A2 (en) * | 2001-12-21 | 2004-09-22 | Aixtron AG | Method for depositing iii-v semiconductor layers on a non-iii-v substrate |
JP2005513797A (en) * | 2001-12-21 | 2005-05-12 | アイクストロン、アーゲー | Manufacturing method of III-V laser structural parts |
US7229405B2 (en) | 2002-11-15 | 2007-06-12 | Paracor Medical, Inc. | Cardiac harness delivery device and method of use |
DE10256911B4 (en) * | 2002-11-30 | 2008-02-07 | Azzurro Semiconductors Ag | Group III nitride transistor device on silicon substrate |
EP1617464A4 (en) * | 2003-03-19 | 2011-04-27 | Japan Science & Tech Agency | PROCESS FOR GROWING SEMICONDUCTOR CRYSTAL |
EP1484794A1 (en) | 2003-06-06 | 2004-12-08 | S.O.I. Tec Silicon on Insulator Technologies S.A. | A method for fabricating a carrier substrate |
US7261777B2 (en) | 2003-06-06 | 2007-08-28 | S.O.I.Tec Silicon On Insulator Technologies | Method for fabricating an epitaxial substrate |
WO2005060007A1 (en) * | 2003-08-05 | 2005-06-30 | Nitronex Corporation | Gallium nitride material transistors and methods associated with the same |
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JP2005136200A (en) * | 2003-10-30 | 2005-05-26 | Univ Nagoya | Method for producing nitride semiconductor crystal layer, nitride semiconductor crystal layer, and substrate for producing nitride semiconductor crystal layer |
JP4525894B2 (en) * | 2003-11-21 | 2010-08-18 | サンケン電気株式会社 | Semiconductor device forming plate-like substrate, manufacturing method thereof, and semiconductor device using the same |
US7071498B2 (en) * | 2003-12-17 | 2006-07-04 | Nitronex Corporation | Gallium nitride material devices including an electrode-defining layer and methods of forming the same |
US20050145851A1 (en) * | 2003-12-17 | 2005-07-07 | Nitronex Corporation | Gallium nitride material structures including isolation regions and methods |
CN1314081C (en) * | 2004-02-04 | 2007-05-02 | 中国科学院半导体研究所 | Method for growing crackless III family nitride film on silicon substrate |
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JPH11186602A (en) * | 1997-12-24 | 1999-07-09 | Toshiba Corp | Light emitting element and crystal growth method |
JPH11298039A (en) * | 1998-03-20 | 1999-10-29 | Ind Technol Res Inst | Method of growing gan layer ad buffer layer and structure thereof |
SG94712A1 (en) * | 1998-09-15 | 2003-03-18 | Univ Singapore | Method of fabricating group-iii nitride-based semiconductor device |
JP4298023B2 (en) * | 1998-10-28 | 2009-07-15 | フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー | Nitride semiconductor multilayer deposition substrate and method for forming nitride semiconductor multilayer deposition substrate |
JP2000150388A (en) * | 1998-11-05 | 2000-05-30 | Fuji Electric Co Ltd | Group III nitride semiconductor thin film and method of manufacturing the same |
JP4174910B2 (en) * | 1999-05-21 | 2008-11-05 | 昭和電工株式会社 | Group III nitride semiconductor device |
FR2807909B1 (en) * | 2000-04-12 | 2006-07-28 | Centre Nat Rech Scient | GaInN SEMICONDUCTOR THIN LAYER, PROCESS FOR PREPARING SAME; LED COMPRISING THIS LAYER AND LIGHTING DEVICE COMPRISING SAID LED |
FR2810159B1 (en) * | 2000-06-09 | 2005-04-08 | Centre Nat Rech Scient | THICK LAYER OF GALLIUM NITRIDE OR MIXED NITRIDE OF GALLIUM AND ANOTHER METAL, PROCESS FOR PREPARING THE SAME, AND ELECTRONIC OR OPTOELECTRONIC DEVICE COMPRISING SUCH A LAYER |
-
2000
- 2000-06-09 FR FR0007417A patent/FR2810159B1/en not_active Expired - Lifetime
-
2001
- 2001-06-08 US US10/297,494 patent/US7273664B2/en not_active Expired - Lifetime
- 2001-06-08 KR KR1020027016639A patent/KR100897589B1/en not_active Expired - Lifetime
- 2001-06-08 CN CNB018108970A patent/CN100380588C/en not_active Expired - Lifetime
- 2001-06-08 JP JP2002502823A patent/JP5378634B2/en not_active Expired - Lifetime
- 2001-06-08 EP EP01943590.8A patent/EP1290721B1/en not_active Expired - Lifetime
- 2001-06-08 WO PCT/FR2001/001777 patent/WO2001095380A1/en active Application Filing
- 2001-06-08 AU AU2001266131A patent/AU2001266131A1/en not_active Abandoned
- 2001-06-08 CA CA2411606A patent/CA2411606C/en not_active Expired - Lifetime
- 2001-06-08 CN CN2008100099793A patent/CN101241883B/en not_active Expired - Lifetime
-
2007
- 2007-08-01 US US11/832,015 patent/US7767307B2/en not_active Expired - Lifetime
- 2007-08-01 US US11/832,020 patent/US7776154B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20080050894A1 (en) | 2008-02-28 |
JP2003536257A (en) | 2003-12-02 |
FR2810159A1 (en) | 2001-12-14 |
FR2810159B1 (en) | 2005-04-08 |
US7273664B2 (en) | 2007-09-25 |
CA2411606A1 (en) | 2001-12-13 |
US7776154B2 (en) | 2010-08-17 |
EP1290721B1 (en) | 2015-01-21 |
CA2411606C (en) | 2010-03-16 |
US20080185611A2 (en) | 2008-08-07 |
WO2001095380A1 (en) | 2001-12-13 |
US20080188065A2 (en) | 2008-08-07 |
KR20030007896A (en) | 2003-01-23 |
US20080048207A1 (en) | 2008-02-28 |
KR100897589B1 (en) | 2009-05-14 |
EP1290721A1 (en) | 2003-03-12 |
JP5378634B2 (en) | 2013-12-25 |
CN101241883B (en) | 2012-03-21 |
CN100380588C (en) | 2008-04-09 |
US7767307B2 (en) | 2010-08-03 |
CN1436365A (en) | 2003-08-13 |
US20030136333A1 (en) | 2003-07-24 |
CN101241883A (en) | 2008-08-13 |
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