+

AU2001253251A1 - Cooling system and method for high density electronics enclosure - Google Patents

Cooling system and method for high density electronics enclosure

Info

Publication number
AU2001253251A1
AU2001253251A1 AU2001253251A AU5325101A AU2001253251A1 AU 2001253251 A1 AU2001253251 A1 AU 2001253251A1 AU 2001253251 A AU2001253251 A AU 2001253251A AU 5325101 A AU5325101 A AU 5325101A AU 2001253251 A1 AU2001253251 A1 AU 2001253251A1
Authority
AU
Australia
Prior art keywords
high density
cooling system
electronics enclosure
density electronics
enclosure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001253251A
Other languages
English (en)
Inventor
Charles Shao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EINUX Inc
Original Assignee
EINUX Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EINUX Inc filed Critical EINUX Inc
Publication of AU2001253251A1 publication Critical patent/AU2001253251A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU2001253251A 2000-04-05 2001-04-05 Cooling system and method for high density electronics enclosure Abandoned AU2001253251A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US19471900P 2000-04-05 2000-04-05
US60/194,719 2000-04-05
USNOTGIVEN 2001-02-01
US09/827,101 US20020015287A1 (en) 2000-04-05 2001-04-05 Cooling system and method for a high density electronics enclosure
PCT/US2001/011427 WO2001078479A2 (fr) 2000-04-05 2001-04-05 Systeme et procede de refroidissement pour boitiers de composants electronique haute performance

Publications (1)

Publication Number Publication Date
AU2001253251A1 true AU2001253251A1 (en) 2001-10-23

Family

ID=26890326

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001253251A Abandoned AU2001253251A1 (en) 2000-04-05 2001-04-05 Cooling system and method for high density electronics enclosure

Country Status (3)

Country Link
US (1) US20020015287A1 (fr)
AU (1) AU2001253251A1 (fr)
WO (1) WO2001078479A2 (fr)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7245632B2 (en) * 2001-08-10 2007-07-17 Sun Microsystems, Inc. External storage for modular computer systems
US7133283B2 (en) * 2002-01-04 2006-11-07 Intel Corporation Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
JP4334966B2 (ja) * 2002-11-13 2009-09-30 株式会社日立製作所 ディスクモジュール、及びディスクアレイ装置
US6958906B2 (en) * 2003-04-11 2005-10-25 Shan Ping Wu Method and apparatus for cooling a modular computer system with dual path airflow
EP1591871A1 (fr) * 2004-04-29 2005-11-02 Shuttle Inc. Structure de dissipateur de chaleur pour ordinateur
US7289321B2 (en) * 2004-11-16 2007-10-30 Hewlett-Packard Development Company, L.P. Ventilated casing for an electronic device
US7286349B2 (en) * 2004-11-16 2007-10-23 Hewlett-Packard Development Copmpany, L.P. Ventilated casing for an electronic device
US7703291B2 (en) * 2005-04-15 2010-04-27 March Networks Corporation Contained environmental control system for mobile event data recorder
US20070103862A1 (en) * 2005-11-10 2007-05-10 David Costello Chassis with positive pressure
US7483763B2 (en) * 2005-11-17 2009-01-27 Centertrak, Llc System and method for the digital specification of head shape data for use in developing custom hair pieces
US8051897B2 (en) * 2005-11-30 2011-11-08 International Business Machines Corporation Redundant assembly for a liquid and air cooled module
US20070121295A1 (en) * 2005-11-30 2007-05-31 International Business Machines Corporation Hybrid liquid-air cooled module
FR2895209A1 (fr) * 2005-12-16 2007-06-22 Thales Sa Coffret electronique generique pouvant etre ventile par conduction ou par convection
WO2007133797A2 (fr) * 2006-05-15 2007-11-22 Paratek Pharmaceuticals, Inc. Méthodes de régulation de l'expression de gènes ou de produits géniques à l'aide de composés de tétracycline substituée
CA2606637A1 (fr) * 2006-10-16 2008-04-16 Projects Unlimited, Inc. Convertisseur statique avec carter trempe protege contre les contraintes d'ambiance
US20080283080A1 (en) * 2007-05-15 2008-11-20 Masood Habibi Hair styling device
US7813120B2 (en) * 2007-06-13 2010-10-12 Hewlett-Packard Development Company, L.P. Airflow path within an electronic module enclosure
US9681587B2 (en) * 2007-08-30 2017-06-13 Pce, Inc. System and method for cooling electronic equipment
US9072202B2 (en) * 2007-10-12 2015-06-30 Hewlett-Packard Development Company, L.P. Systems and methods for cleaning filters of an electrical device
US9395771B1 (en) 2007-10-26 2016-07-19 Pce, Inc. Plenum pressure control system
US20110228475A1 (en) * 2010-03-17 2011-09-22 International Business Machines Corporation Enclosure with concurrently maintainable field replaceable units
US8472182B2 (en) 2010-07-28 2013-06-25 International Business Machines Corporation Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack
US8248801B2 (en) 2010-07-28 2012-08-21 International Business Machines Corporation Thermoelectric-enhanced, liquid-cooling apparatus and method for facilitating dissipation of heat
DE102011109476B9 (de) * 2011-08-04 2014-04-10 Fujitsu Technology Solutions Intellectual Property Gmbh Server sowie Verfahren zum Kühlen eines Servers
WO2013061409A1 (fr) * 2011-10-25 2013-05-02 富士通株式会社 Appareil de refroidissement par circulation d'eau, appareil électronique équipé d'un appareil de refroidissement par circulation d'eau et procédé de refroidissement par circulation d'eau
JP6088817B2 (ja) * 2012-12-25 2017-03-01 株式会社Kelk 温度制御装置
US20180100515A1 (en) * 2016-10-07 2018-04-12 Anthony R. Woods High Efficiency Fan
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3419688A1 (de) * 1984-05-25 1985-11-28 Siemens AG, 1000 Berlin und 8000 München Entlueftungssystem fuer elektronische bauteile enthaltende schraenke der datentechnik
JPS61216011A (ja) * 1985-02-22 1986-09-25 Fujitsu Ltd 電子装置の冷却系制御装置
JP2934493B2 (ja) * 1990-10-24 1999-08-16 株式会社日立製作所 電子機器の冷却装置
US5438226A (en) * 1992-09-16 1995-08-01 International Business Machines Corporation Apparatus for redundant cooling of electronic devices
US6011689A (en) * 1998-04-27 2000-01-04 Sun Microsystems, Inc. Computer component cooling fan closure device and method thereof
US5949646A (en) * 1998-07-31 1999-09-07 Sun Microsystems, Inc. Compact computer having a redundant air moving system and method thereof

Also Published As

Publication number Publication date
WO2001078479A3 (fr) 2003-01-16
WO2001078479A2 (fr) 2001-10-18
US20020015287A1 (en) 2002-02-07

Similar Documents

Publication Publication Date Title
AU2001253251A1 (en) Cooling system and method for high density electronics enclosure
AU2001249286A1 (en) Method and apparatus for cooling electronic enclosures
IL151394A0 (en) System and method for cooling transformers
GB2347531B (en) Method and apparatus for reducing energy dissipation
WO2002022264A8 (fr) Procede et appareil de generation de gradient
AU2003204199A1 (en) Selective organ cooling apparatus and method
AU7266000A (en) Otoplasty and method for producing an otoplasty
AU2001266295A1 (en) System and method for object access through an access device
AU2000233265A1 (en) Image retrieval/distribution system and image retrieval/distribution method
AU6131599A (en) Method and apparatus for cooling substrates
PL353902A1 (en) Cooling method and system
AU2002223659A1 (en) Method and system for intellectual property management
AU2001247949A1 (en) Method and apparatus for research management
AU2002220406A1 (en) Post mold cooling method and apparatus
AU2001255440A1 (en) Method and apparatus for making density gradients
AU2001261775A1 (en) Apparatus and method for secure object access
AU2001244985A1 (en) Apparatus for cooling electronics
AU2002222338A1 (en) Forced convection cooling system for electronic equipment
AU2001239526A1 (en) Cooling system for an enclosure for heat sensitive components and method
AU2001269659A1 (en) Reconfigurable system and method for cooling heat generating objects
EP1052885B8 (fr) Caisson pour contenir un équipement électronique refroidi par ventilation
GB0121167D0 (en) Method and system for generating performance data
IL152901A0 (en) Method and system for operating an electronic exchange
AU2002316087A1 (en) Method and apparatus for generating thermal neutrons
AU2002222270A1 (en) Magnetic field generating system and method
点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载