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ATE450813T1 - Verfahren zur erzeugung eines musters - Google Patents

Verfahren zur erzeugung eines musters

Info

Publication number
ATE450813T1
ATE450813T1 AT05010007T AT05010007T ATE450813T1 AT E450813 T1 ATE450813 T1 AT E450813T1 AT 05010007 T AT05010007 T AT 05010007T AT 05010007 T AT05010007 T AT 05010007T AT E450813 T1 ATE450813 T1 AT E450813T1
Authority
AT
Austria
Prior art keywords
resist film
pattern
generating
substrate
wet
Prior art date
Application number
AT05010007T
Other languages
English (en)
Inventor
Haruki Inabe
Shinichi Kanna
Hiromi Kanda
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Application granted granted Critical
Publication of ATE450813T1 publication Critical patent/ATE450813T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT05010007T 2004-05-17 2005-05-09 Verfahren zur erzeugung eines musters ATE450813T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004146023 2004-05-17

Publications (1)

Publication Number Publication Date
ATE450813T1 true ATE450813T1 (de) 2009-12-15

Family

ID=34936266

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05010007T ATE450813T1 (de) 2004-05-17 2005-05-09 Verfahren zur erzeugung eines musters

Country Status (4)

Country Link
US (1) US7892722B2 (de)
EP (1) EP1598704B1 (de)
AT (1) ATE450813T1 (de)
DE (1) DE602005017972D1 (de)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
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JP2005353763A (ja) 2004-06-09 2005-12-22 Matsushita Electric Ind Co Ltd 露光装置及びパターン形成方法
US7781141B2 (en) * 2004-07-02 2010-08-24 Rohm And Haas Electronic Materials Llc Compositions and processes for immersion lithography
JP2006032834A (ja) * 2004-07-21 2006-02-02 Matsushita Electric Ind Co Ltd 露光装置、露光方法及び半導体装置の製造方法
US7944599B2 (en) * 2004-09-27 2011-05-17 Qualcomm Mems Technologies, Inc. Electromechanical device with optical function separated from mechanical and electrical function
US20070242248A1 (en) * 2004-10-26 2007-10-18 Nikon Corporation Substrate processing method, exposure apparatus, and method for producing device
CN101044594B (zh) * 2004-10-26 2010-05-12 株式会社尼康 衬底处理方法、曝光装置及器件制造方法
EP1816671A4 (de) 2004-11-11 2010-01-13 Nikon Corp Belichtungsverfahren, bauelementeherstellungsverfahren und substrat
JP5203575B2 (ja) * 2005-05-04 2013-06-05 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． コーティング組成物
US7927779B2 (en) 2005-06-30 2011-04-19 Taiwan Semiconductor Manufacturing Companym, Ltd. Water mark defect prevention for immersion lithography
US20070002296A1 (en) * 2005-06-30 2007-01-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography defect reduction
US8383322B2 (en) * 2005-08-05 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography watermark reduction
JP4566861B2 (ja) * 2005-08-23 2010-10-20 富士通株式会社 レジスト組成物、レジストパターンの形成方法、半導体装置及びその製造方法
US7993808B2 (en) 2005-09-30 2011-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. TARC material for immersion watermark reduction
JP5114022B2 (ja) * 2006-01-23 2013-01-09 富士フイルム株式会社 パターン形成方法
JP5114021B2 (ja) 2006-01-23 2013-01-09 富士フイルム株式会社 パターン形成方法
US20080050679A1 (en) * 2006-02-22 2008-02-28 Sokudo Co., Ltd. Methods and systems for performing immersion processing during lithography
CN100507723C (zh) * 2006-04-10 2009-07-01 联华电子股份有限公司 浸润式光刻技术的方法
US8518628B2 (en) 2006-09-22 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Surface switchable photoresist
EP1975714A1 (de) 2007-03-28 2008-10-01 FUJIFILM Corporation Positive Resistzusammensetzung und Verfahren zur Strukturformung
US9455139B2 (en) 2009-06-17 2016-09-27 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US20100320081A1 (en) 2009-06-17 2010-12-23 Mayer Steven T Apparatus for wetting pretreatment for enhanced damascene metal filling
US9677188B2 (en) 2009-06-17 2017-06-13 Novellus Systems, Inc. Electrofill vacuum plating cell
US9138784B1 (en) 2009-12-18 2015-09-22 Novellus Systems, Inc. Deionized water conditioning system and methods
US9613833B2 (en) 2013-02-20 2017-04-04 Novellus Systems, Inc. Methods and apparatus for wetting pretreatment for through resist metal plating
US9435049B2 (en) 2013-11-20 2016-09-06 Lam Research Corporation Alkaline pretreatment for electroplating
US9481942B2 (en) 2015-02-03 2016-11-01 Lam Research Corporation Geometry and process optimization for ultra-high RPM plating
US9617648B2 (en) 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias

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US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS57153433A (en) 1981-03-18 1982-09-22 Hitachi Ltd Manufacturing device for semiconductor
JPS63229452A (ja) * 1987-03-18 1988-09-26 Nec Corp レジストの現像方法
JPH06124873A (ja) 1992-10-09 1994-05-06 Canon Inc 液浸式投影露光装置
JPH07220990A (ja) 1994-01-28 1995-08-18 Hitachi Ltd パターン形成方法及びその露光装置
JP2896870B2 (ja) 1995-05-19 1999-05-31 サンケン電気株式会社 レジストパタ−ンの形成方法
JP3747566B2 (ja) 1997-04-23 2006-02-22 株式会社ニコン 液浸型露光装置
US6062240A (en) * 1998-03-06 2000-05-16 Tokyo Electron Limited Treatment device
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US6929896B2 (en) * 2000-12-04 2005-08-16 Ciba Specialty Chemicals Corporation Onium salts and the use therof as latent acids
JP2002324745A (ja) * 2001-04-25 2002-11-08 Tokyo Ohka Kogyo Co Ltd レジスト膜形成方法
JP4230130B2 (ja) * 2001-07-04 2009-02-25 富士フイルム株式会社 感光性平版印刷版用現像液及び平版印刷版の製版方法
US6559072B2 (en) * 2001-08-30 2003-05-06 Micron Technology, Inc. Develop processing method of a resist surface of a substrate for reduced processing time and reduced defect density
JP4018892B2 (ja) * 2001-10-03 2007-12-05 大日本スクリーン製造株式会社 基板処理装置
US6946410B2 (en) * 2002-04-05 2005-09-20 E. I. Du Pont De Nemours And Company Method for providing nano-structures of uniform length
JP4516425B2 (ja) 2002-06-26 2010-08-04 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 放射線感受性組成物
US7022790B2 (en) * 2002-07-03 2006-04-04 Sumitomo Bakelite Company, Ltd. Photosensitive compositions based on polycyclic polymers
US6788477B2 (en) * 2002-10-22 2004-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus for method for immersion lithography
JP2005101498A (ja) * 2003-03-04 2005-04-14 Tokyo Ohka Kogyo Co Ltd 液浸露光プロセス用浸漬液および該浸漬液を用いたレジストパターン形成方法
US20050205108A1 (en) * 2004-03-16 2005-09-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for immersion lithography lens cleaning
JP4220423B2 (ja) * 2004-03-24 2009-02-04 株式会社東芝 レジストパターン形成方法
JP4535489B2 (ja) 2004-03-31 2010-09-01 東京エレクトロン株式会社 塗布・現像装置
JP6349893B2 (ja) 2014-01-23 2018-07-04 株式会社リコー 画像形成装置

Also Published As

Publication number Publication date
EP1598704A2 (de) 2005-11-23
EP1598704B1 (de) 2009-12-02
EP1598704A3 (de) 2008-03-26
US7892722B2 (en) 2011-02-22
DE602005017972D1 (de) 2010-01-14
US20050255414A1 (en) 2005-11-17

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