Stieglitz et al., 2002 - Google Patents
Encapsulation of flexible biomedical microimplants with parylene CStieglitz et al., 2002
View PDF- Document ID
- 9616383194918106361
- Author
- Stieglitz T
- Kammer S
- Koch K
- Wien S
- Robitzki A
- Publication year
- Publication venue
- IFESS 2002
External Links
Snippet
Parylene has been used as encapsulation material since several decades, eg for wires, needles and pacemaker coatings. Within this paper, its use as insulation and protection layer for flexible biomedical microimplants is described. Investigations on the deposition …
- 238000005538 encapsulation 0 title abstract description 8
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