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Tsai et al., 2018 - Google Patents

Bridging the gap between big data system software stack and applications: The case of semiconductor wafer fabrication foundries

Tsai et al., 2018

Document ID
7332149889566945665
Author
Tsai C
Hsiao H
Chao Y
Hsu M
Chang A
Publication year
Publication venue
2018 IEEE International Conference on Big Data (Big Data)

External Links

Snippet

We present in this paper two novel infrastructural services based on Hadoop for big data storage and computing in a Taiwan's semiconductor wafer fabrication foundry. The two services include Hadoop data service (HDS) and distributed R language computing service …
Continue reading at ieeexplore.ieee.org (other versions)

Classifications

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