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Microelectronics Reliability, Volume 68

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Volume 68, January 2017

Special Section on Selected papers from the 31st annual JEDEC ROCS Workshop (ROCS 2016)

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Peter Ersland, Roberto Menozzi:
Editorial. 1
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Alexander Pooth, Johan Bergsten, Niklas Rorsman, Hassan Hirshy, R. Perks, Paul J. Tasker, Trevor Martin, Richard F. Webster, Dave Cherns, Michael J. Uren, Martin Kuball:
Morphological and electrical comparison of Ti and Ta based ohmic contacts for AlGaN/GaN-on-SiC HFETs. 2-4
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Charles S. Whitman, Michael G. Meeder, Peter J. Zampardi:
Determination of safe reliability region over temperature and current density for through wafer vias. 5-12
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Brian S. Poling, Glen David Via, Ken D. Bole, E. E. Johnson, J. M. McDermott:
Commercial-off-the-shelf algan/gan hemt device reliability study after exposure to heavy ion radiation. 13-20

Regular Papers

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Eleni Chatzikyriakou, William Redman-White, C. H. De Groot:
Total Ionizing Dose, Random Dopant Fluctuations, and its combined effect in the 45 nm PDSOI node. 21-29
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Xiuqin Xu, Jiongjiong Mo, Wei Chen, Zhiyu Wang, Yong-Heng Shang, Yang Wang, Qin Zheng, Liping Wang, Zheng-Liang Huang, Fa-Xin Yu:
A new meshing criterion for the equivalent thermal analysis of GaAs PHEMT MMICs. 30-38
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Shaker Farid Sufian, Mohd Zulkifly Abdullah:
Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink. 39-50
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Wenyi Zhu, Binghan Li, Tao Yu, Weiran Kong, Shichang Zou:
Investigation of read disturb in split-gate memory and its feasible solution. 51-56
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Nikolaos Eftaxiopoulos, Nicholas Axelos, Kiamal Z. Pekmestzi:
DIRT latch: A novel low cost double node upset tolerant latch. 57-68
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Zhongmin Lai, Xinda Kong, Qingrong You, Xiubin Cao:
Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint. 69-76
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Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise:
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. 77-85
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Akito Sasaki, Hideyuki Oozu, Miho Nakamura, Katsuaki Aoki, Yoshinori Kataoka, Syuichi Saito, Kumpei Kobayashi, Wei Li, Kuniyuki Kakushima, Kazuo Tsutsui, Hiroshi Iwai:
Durability evaluation of hexagonal WO₃ electrode for lithium ion secondary batteries. 86-90
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Joseph B. Bernstein, Alain Bensoussan, Emmanuel Bender:
Reliability prediction with MTOL. 91-97

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