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"A 0.22mm2 per Channel Data Link for Reinforced Isolation with ..."

Dongwan Ha, Ruida Yun, Kevin R. Wrenner (2023)

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DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185242

access: closed

type: Conference or Workshop Paper

metadata version: 2023-07-28

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Dongwan Ha, Ruida Yun, Kevin R. Wrenner:
A 0.22mm² per Channel Data Link for Reinforced Isolation with >25kVpk Surge Tolerance and >295kV/μs Common Mode Transient Immunity. VLSI Technology and Circuits 2023: 1-2

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