default search action

combined dblp search
author search
venue search
publication search

ask others

Google
Google Scholar
Semantic Scholar
Internet Archive Scholar
CiteSeerX
ORCID

"A High Level Approach to Co-Designing 3D ICs."

Daniel Xing, Ankur Srivastava (2024)

> Home

Details and statistics

DOI: 10.1145/3649329.3658268

access: closed

type: Conference or Workshop Paper

metadata version: 2024-11-30

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/dac/Xing024
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/dac/Xing024
Daniel Xing, Ankur Srivastava:
A High Level Approach to Co-Designing 3D ICs. DAC 2024: 328:1-328:6

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.