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WO2018137978A1 - Thermistances à film ultraminces - Google Patents

Thermistances à film ultraminces Download PDF

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Publication number
WO2018137978A1
WO2018137978A1 PCT/EP2018/051052 EP2018051052W WO2018137978A1 WO 2018137978 A1 WO2018137978 A1 WO 2018137978A1 EP 2018051052 W EP2018051052 W EP 2018051052W WO 2018137978 A1 WO2018137978 A1 WO 2018137978A1
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WO
WIPO (PCT)
Prior art keywords
thermistor
carrier film
film
conductor
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2018/051052
Other languages
German (de)
English (en)
Inventor
Peter Spietz
Volodymyr Baturkin
Ingo Wirth
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsches Zentrum fuer Luft und Raumfahrt eV
Original Assignee
Deutsches Zentrum fuer Luft und Raumfahrt eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsches Zentrum fuer Luft und Raumfahrt eV filed Critical Deutsches Zentrum fuer Luft und Raumfahrt eV
Priority to JP2019539760A priority Critical patent/JP2020507918A/ja
Publication of WO2018137978A1 publication Critical patent/WO2018137978A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/183—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer characterised by the use of the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits

Definitions

  • the invention relates to a method for producing a thermistor and a thermistor.
  • Thermistors are resistors whose resistance is particularly dependent on temperature.
  • a common application of thermistors is as a temperature sensor.
  • Thermistors are also used as heating elements, can replace fuses or limit currents, for example.
  • thermistor is particularly thin. This is true for the simple mechanical reason that the thermistor, when thin and flexible, can be more easily brought to hard to reach places, as well as for the reason that a thin thermistor has a low heat capacity. It is therefore particularly suitable for measuring objects that also have a low heat capacity.
  • EP 2 506 269 A1 discloses a film thermistor having a substrate of a flexible material, such as polyethylene terephthalate or polyethylene naphthalate, provided with silver electrodes which are applied to the substrate by printing.
  • a substrate is a 100 ⁇ thick called Mylar ® film.
  • a trace material is printed between the electrodes.
  • Possible trace materials include metal oxides such as zinc oxide or vanadium oxide, semiconductors such as silicon and germanium, eutectic mixtures of indium, tin, silver, bismuth, cadmium, lead and zinc, and further silver and indium tin oxide.
  • the thermistor may be encapsulated in a polymer film or a flexible metal film. After printing, the thermistor is exposed to elevated temperatures - 150 ° C are mentioned as an example - so that the conductor material is melted, dried and tempered. According to EP 2 506 269 A1, the temperatures must not be set too high because, for example, temperatures between 800 ° C. and 1000 ° C., which are used for the production of ordinary thermistors, are impossible for use with film thermistors because they would melt the substrate.
  • US 2008/018201 A1 discloses an ink with metal particles for printing electrical circuits.
  • the ink comprises a first powder having metal particles of a first melting temperature and second powder having particles of a metal or a metal alloy of a second melting temperature, wherein the second melting temperature is higher than the first melting temperature.
  • the ink has a polymer binder and an oxidative environment. After a circuit is printed with the ink, the ink is heat treated. The polymer binder thereby combines with the particles of the first powder and the second powder, whereby the molten particles of the first powder in the oxidative environment become a circuit element of a metal oxide. After the heat treatment, the first and / or second powders thus form the circuit, being enclosed by the polymer.
  • the polymer binder can evaporate during the heat treatment.
  • the heat treatment takes place at temperatures below 500 ° C or below 300 ° C.
  • At least the first powder must therefore have a melting point below these temperatures.
  • Suitable metals include mercury, gallium, cadmium, selenium, polonium, bismuth, thallium, lead, zinc and tellurium or alloys thereof.
  • high melting point metals such as antimony, aluminum, silver, gold, copper, beryllium, nickel, cobalt, yttrium, iron, palladium, titanium, platinum and molybdenum are named.
  • the second metal powder may also contain additives such as hydrogen, carbon, silicon, nitrogen and oxygen.
  • a thermistor As a substrate for printing, glasses, ceramics, silicon and silicon dioxide are mentioned.
  • US 2003/0161959 A1 discloses a method by which a thermistor is manufactured.
  • a substrate which may be, for example, a polymer substrate, a high-viscosity mass of a precursor material is applied, for example by printing, and rendered conductive by heat treatment.
  • the precursor material may contain ligands which escape during the heat treatment so that suitable precursor materials are carboxylates, alkoxides, or mixed metal oxides and react to metals to release carboxylic acid anhydrides, ethers or esters.
  • a preferred metal is called silver.
  • the precursor material can be dissolved in an aqueous or organic solvent and contain additives such as, for example, crystallization inhibitors, thickeners or surface-active substances.
  • the precursor material comprises a powder of an insulating material.
  • US 2009/0226605 A1 discloses a method for producing a circuit by printing a plastic film with a metallic ink with a weight fraction of 0.5% to 35%, preferably 20%, of platinum nanoparticles in a solvent such as alcohol, water, ethylene glycol, Diethylene glycol or propylene glycol.
  • a solvent such as alcohol, water, ethylene glycol, Diethylene glycol or propylene glycol.
  • the solvent is completely removed during a subsequent annealing of the metallic ink.
  • the tempering takes place at less than 200 ° C for 1 to 30 minutes.
  • US 2016/0370210 A1 discloses a modular sensor arrangement. This has, on the one hand, a flexible connecting element and, on the other hand, a flexible or rigid temperature sensor.
  • the connecting element has a carrier material, which is polyimide film with a thickness of less than 100 ⁇ m.
  • the support material is coated with platinum, whereupon the platinum is partially removed by laser ablation to form a trace.
  • the temperature sensor has a ceramic substrate on which a conductor track is sintered.
  • the connecting element and the sensor are preferably manufactured independently of each other and then connected. As a result, the connecting element with the polyimide film does not have to be exposed to the temperatures occurring during sintering of the conductor track of the temperature sensor.
  • EP 0 955 642 A2 discloses a resistor having a carrier film which consists of polyimide and has a layer thickness of less than 10 ⁇ m. By means of chemical vapor deposition is applied to an electrically contacted strip, which consists of 95-99.5% of platinum and is between 40 ⁇ and 50 ⁇ thick.
  • US 2009/0181 177 A1 discloses a method for producing an electronic circuit element by printing a plastic film with an ink with metal nanoparticles. The ink also contains stabilizing substances. After printing, the ink is added to a destabilizing substance, and then the stabilizing substances are removed by washing or heating at temperatures up to 180 ° C.
  • the invention has for its object to provide a simplified method for producing very thin thermistors.
  • the invention relates to a method for producing a thermistor.
  • the process begins with the provision of a carrier sheet.
  • the carrier foil is printed with a metallic ink.
  • the metallic ink printed on the support film is thermally treated, so that the metallic ink is converted to a wiring.
  • the metallic ink has a platinum content of elemental platinum of at least 15% and a low-evaporating portion of a low-volatiles or lower volatiles having a vaporization temperature below 250 ° C of at least 60%.
  • the sum of the platinum content and the low-evaporation content of the metallic ink is at least 99.5%.
  • the sum of the platinum portion and the low evaporating portion of the metallic ink may be at least 99.8% or 99.9% and up to 100%, so that consequently the metallic ink has a platinum content of up to 40%, preferably at least 20% or at least 25%, and a low evaporation content of up to 85%, preferably at least 74%, at least 75%, at least 79% or at least 80%.
  • Additives, as understood here all substances that are neither elemental platinum nor low-evaporating substance make up a total of more than 0.5% of the metallic ink. All percentages above and below are by weight, not by volume.
  • the thermal treatment is or includes sintering at a sintering temperature of 380 ° C to 400 ° C.
  • the low-evaporating substance or the low-evaporating substances evaporate, so that after the sintering, the conductor has a final content of elemental platinum of at least 99%.
  • the additives do not evaporate during sintering and remain in the conductor track.
  • a residual amount of the additives on the conductor can thus be up to about 1%.
  • the residual proportion of the additives is less than 1%.
  • the final level of elemental platinum on the track can be up to 100% if the low evaporator or low volatiles completely evaporate while no additives are present.
  • the sintering therefore has a multiple purpose.
  • the low-evaporating substance or the low-evaporating substances are expelled from the metallic ink. Since elemental platinum and low-evaporating substances add up to at least 99.5% in the metallic ink, almost pure platinum remains after sintering, with the additives making up at most 1% of the conductor track.
  • the low-volatiles that make the particulate elemental platinum a flowable metallic ink are no longer needed after printing and are therefore expelled as completely as possible during sintering.
  • the platinum sinters, so that the platinum particles, which may be nanoparticles in particular, connect to each other and produce a safe, durable conductive connection.
  • the platinum also bonds firmly to the carrier film during sintering. This effect can be additionally supported by slightly melting the carrier foil in the area of the conductor track, so that the platinum is embedded slightly in the carrier foil and thus a firmer connection between the carrier foil and the conductor track is achieved.
  • the sintering temperature can be matched to the carrier film.
  • the sintering temperature may be within the range in which sintering of the Platinum is allowed to be varied so that the carrier film in any case does not completely melt (and not otherwise damaged), but at the most easily melts in the region of the conductor track.
  • the method according to the invention thus advantageously utilizes the fact that sintering temperatures of platinum in the vicinity, normally below and, at best, just below melting points or glass transition temperatures of typical plastic films, thus overcomes the prejudice of the person skilled in the art cited in EP 2 506 269 A1, for example very thin thermistors could not be produced because the temperatures necessary for sintering the track are far above the melting point (or the glass transition temperature) of plastics.
  • thermistors with carrier foils and conductor tracks made of metals with high melting points, such as, for example, platinum.
  • the process according to the invention can even be carried out with carrier films whose melting point or glass transition temperature is below the sintering temperature.
  • a sintering method such as photonic (flash) sintering or laser sintering may be used, in which only the printed metallic ink is locally thermally treated while the support film is not or only slightly heated.
  • the metallic ink according to the invention contains, in addition to at most 0.5% of additives as active ingredients, only elemental platinum and low-evaporating substances which make a flowable ink except platinum particles.
  • the flowable ink is converted to a conductive path only by evaporating the low-volatiles and sintering the platinum. Further complex chemical reactions are not required.
  • the metallic ink need not have a complex composition with multiple reactants that provide, for example, certain, for example, oxidative, chemical conditions for chemical processes that necessarily occur in the metallic ink. For the thermal treatment, no complex process is necessary. In the simplest case, it is sufficient to heat the printed carrier film once to the sintering temperature and then to allow it to cool.
  • platinum has a high long-term stability as a noble metal and is more resistant to corrosion.
  • the tem pe ratu ary neighbors are around Resistance change of platinum in relevant measuring ranges almost linear. Due to these two properties, a temperature behavior of platinum is very well reproducible, so that it is particularly suitable as a material for temperature sensors.
  • platinum has a much higher resistivity than silver, which is known as printed circuit board material, so platinum resistors can be made more compact than silver resistors for the same given resistance.
  • carrier films for thermistors have a thickness in the region of 100 ⁇ m.
  • Mitsubishi Materials Corporation applies a thermistor with a thickness of 70 ⁇ m as the "world's thinnest flexible thermistor sensor.”
  • Thermistor is the printing of films with much lower film thickness possible.
  • the film thickness of the support film may be below 10 ⁇ .
  • the thermistor according to the invention can be produced with very different thermistor areas depending on the requirement area. Due to the high resistivity of platinum, the trace can be made very compact. For example, if the thermistor should have a resistance of 1000 ⁇ , the trace must have a trace length of about 0.9 m, if to be achieved with typical printers trace layer thickness 1 ⁇ and trace width 0.1 mm are selected. If, for example, the strip is printed as a meander with a meander width of 2 cm and a track spacing of 0.1 mm, a meander length of 0.9 cm is sufficient to achieve the resistance of 1000 ⁇ .
  • the thermistor with the platinum conductor can thus be formed not only very thin, but also with a very small area.
  • the thermistor can also be formed with a very large area, if desired.
  • a thermistor having a surface which has a size comparable to the surface of the solar cell and at most the same size as the solar cell so that the temperature over most of the surface of the solar cell or even the entire Area of the solar cell can be measured averaged.
  • Analog can also be a partial area or the entire surface of a solar module of several solar cells be measured averaged.
  • the conductor can be deliberately arranged so that it occupies the largest possible area and the thermistor have an area, for example, of several square centimeters.
  • the thermistor may simply be square or generally rectangular, but any specific geometry needed for a particular requirement may be realized. If, for example, temperatures of solar cells with an education in individual solar cell strips to be measured, then the thermistor can also be formed elongated strip-shaped, so that its surface coincide as closely as possible with the solar cell strip to be measured. The inventive method thus allows a very great flexibility in adapting the Thermistorgeometrie to external requirements.
  • the low-evaporating substances may also comprise a mixture of different low-evaporating substances, wherein the different low-evaporating substances may have different evaporation temperatures.
  • the low-evaporating portion of the metallic ink may consist of at least 80% of substances with an evaporation temperature of at most 100 ° C (at atmospheric pressure). In a simple way, for example, water can be used as a low-evaporating substance.
  • the low-evaporating portion of the metallic ink may also consist of at least 80% of materials with an evaporation temperature below 200 ° C, below 90 ° C or below 80 ° C.
  • a number of alcohols in question such as ethanol with an evaporation temperature of 78 ° C or isopropanol with an evaporation temperature of 83 ° C.
  • other organic solvents such as acetonitrile with an evaporation temperature of 82 ° C.
  • glycols such as ethylene glycol having an evaporation temperature of 197 ° C, propylene glycol having an evaporation temperature of 188 ° C or diethylene glycol having an evaporation temperature of 244 ° C in question.
  • the low-evaporating fraction may be about 20% glycols and about 80% other organic solvents.
  • the carrier film may have a film thickness of at most 10 ⁇ m.
  • the carrier film may also have a film thickness of not more than 8 ⁇ , not more than 7.5 ⁇ or even more than 5 ⁇ . It is a prejudice of the art that film-based thermistors could not be made with such low layer thicknesses because films, especially plastic films, would melt in the processes used to make thermistors according to the prior art.
  • the method according to the invention is extremely gentle on the film, since it is not exposed to any particular mechanical stresses during printing and is only heated to temperatures during the thermal treatment, which can withstand the carrier film without damage, a very thin carrier film can be used according to the invention become.
  • the invention relates to a thermistor with a printed carrier film and a conductor on the carrier film, wherein the carrier film has a film thickness of at most 10 ⁇ and the conductor has an end portion, d. H. has a final elemental platinum content of at least 99%.
  • a thermistor can be made by the methods of the present invention.
  • a material of the carrier film must be able to bring to the desired small layer thickness, have at this small layer thickness sufficient mechanical and chemical stability and can be printed.
  • the carrier film must also be non-conductive. Plastics are therefore suitable for the carrier film. If a sintering process is selected in which the carrier film is not or hardly heated, a suitable plastic is, for example, polyethylene terephthalate, in particular as a biaxially oriented polyester film ("boPET", for example under the trade name Mylar® ) high melting point or high glass transition temperature.
  • the carrier sheet may, for example a polyimide film.
  • polyimide for example, under the trade name Kapton ® is a commercially available film material and is heat resistant up to about 400 ° C.
  • a suitable melting of the polyimide film can not even be beneficial, as it allows the conductive sheet to be particularly well bonded to the backing film by being partially embedded in the polyimide film (eg, UPILEX® VT of the man Llers ÜBE INDUSTRIES, LTD.) which are surface treated and thereby have some thermoplastic surface properties.
  • these polyimide films are suitable for partially embedding the printed conductors.
  • the carrier film can be or printed so that the conductor has a conductor layer thickness of 1 ⁇ and / or a conductor width of 0.1 mm. Both values correspond the possibilities of commercially available 3D printers.
  • the conductor track layer thickness and the track width have a conductor cross-section which is in direct, linear relationship with the resistance of the track.
  • Conductor layer thickness and trace width could therefore be selected as a function of each other and of a desired trace length (and thermistor geometry) such that, given the specific resistivity of platinum, a desired resistance of the thermistor is achieved.
  • the geometry of the conductor track can be adapted in each case according to the individual requirements of the thermistor to be manufactured.
  • the conductor can be printed as a straight line.
  • the thermistor can be printed, for example, with the conductor in a meander shape or. Meandering is understood here to mean that sections of the conductor track are arranged parallel to one another, wherein adjacent sections are alternately connected to each other at their one and the other end by further straight or arcuate sections of the conductor track.
  • the meandering shape also allows in a simple and effective way, to span the entire carrier film of the thermistor with the conductor track, so that the measuring properties of the thermistor are the same over their entire surface.
  • the carrier film can be printed in the meandering form, for example, in such a way that a conductor track spacing corresponds to the conductor track width.
  • a cover layer may or may not be applied to the printed carrier film.
  • the cover layer may consist of any insulating material. For example, silicon oxides (SiOx), quartz, ceramics, oxide ceramics, fused quartz ceramics or polysilazanes come into question, which are commercially available as insulating materials.
  • the cover layer can also be produced with an insulating varnish, as is known from electrical engineering.
  • cover layer may be applied to the printed carrier film, a cover sheet or be.
  • the cover film may be formed of a different material than the carrier film. But the cover sheet may also consist of the same material as the carrier film and in particular be integrally formed therewith.
  • the cover film and the carrier film may also have the same film layer thickness, in particular, of course, if they are formed in one piece. If the cover film and the carrier film are integrally formed, a section of an overall film which is to form the carrier film can first be printed with the conductor track, while a second section, which is to form the cover sheet, remains unprinted. Before or preferably after the thermal treatment, the cover film is folded over the carrier film. Cover film and carrier film can be welded, for example, heat-sealed, or glued, at the edges, so that the conductor between the cover film and the carrier film is firmly enclosed. In the cover layer or cover film, a vent hole may be provided.
  • the cover layer or cover film makes the thermistor more universally applicable.
  • care must be taken when using the thermistor that no other conductor touches the conductor so as not to falsify the measurement or in the worst case to destroy the thermistor, for example by a short circuit.
  • the cover sheet prevents the trace from coming into contact with other conductors.
  • the thermistor can still be very thin with the cover film.
  • carrier film and cover film each have a film thickness of 7.5 ⁇ and the conductor has a conductor layer thickness of 1 ⁇ , even with a comparatively thick adhesive layer, are connected to the carrier film and cover film, with an adhesive layer thickness of 50 ⁇ an entire Thickness of the thermistor 66 ⁇ , which is still thinner than the already cited "world's thinnest" thermistor with a thickness of 70 ⁇ .
  • Decisive factor for the thickness of the thermistor is thus the adhesive layer. If this is chosen thinner, the thermistor can be much thinner even with the cover foil.
  • the thermistor is to be used as a temperature sensor on even very thin measurement objects, it may be more advantageous to bring the conductor into direct contact with the measurement object.
  • the measurement object itself can take over the function of the cover layer or cover sheet.
  • An adhesive can simultaneously be thermally conductive and thus improve a heat conduction within the thermistor.
  • Fig. 1 shows a plan view of a thermistor according to the invention in a first
  • Fig. 2 shows a plan view of a thermistor according to the invention in a second
  • Embodiment. Fig. 3 shows a plan view of a thermistor according to the invention in a third
  • Embodiment in which a cover sheet is simultaneously formed with a carrier film.
  • FIG. 4 shows a flow chart of a method according to the invention.
  • Fig. 1 shows a thermistor 1 according to the invention in a plan view.
  • the thermistor has a carrier foil 2, which is very thin.
  • the carrier film 2 may have a film thickness of not more than 10 ⁇ m.
  • a conductor 3 is printed on the carrier film 2, a conductor 3 is printed.
  • the conductor track 3 has a contact region 4 and a meandering region 5.
  • the conductor 3 has an end portion, i. H. a final proportion of elemental platinum of at least 99%, wherein in a particularly simple manner, the contact region 4 and the meandering region 5 can be formed with identical composition of the conductor 3.
  • the conductor track 3 can however also have a different composition than in the meandering region 5.
  • the contact region 4 is provided for an electrical connection of the thermistor 1.
  • four contact fields 6a-d are formed in the contact region.
  • a current flow takes place between the contact fields 6a, 6b at one end and the contact fields 6c, 6d at the other end of the conductor track 3, wherein the meandering region 5 is traversed along the conductor track 3 twice in opposite directions.
  • the contacts 6a and 6c serve a current flow for a measuring current and the contacts 6b and 6d of a voltage measurement.
  • the meandering region 5 (and the associated section of the carrier film 2) are only partially shown here; the actual number of turns of the track in the meander area can be many times greater.
  • the geometry of the conductor track 3 and in particular of the meandering region 5 is chosen here such that the thermistor 1 has a longitudinal extent 7 which is substantially greater than its transverse extent 8.
  • the thermistor 1 is therefore "long and narrow" or strip-shaped.
  • the thermistor 1 is thus suitable, for example, especially for use as a temperature sensor on components with a strip-shaped structure, for example strip-shaped photovoltaic cells.
  • Each strip-shaped photovoltaic cell in a photovoltaic array can then be assigned directly to such a strip-shaped thermistor 1, wherein the areas of photovoltaic cell and thermistor 1 can correspond.
  • the thermistor 1 according to FIG. 2 has the same basic construction as the thermistor according to FIG. 1. However, the geometry of the meandering region 5 is chosen differently here. The individual turns of the meander are designed with significantly greater width and significantly greater distance, so that the conductor 3 in the meandering region 5 is arranged less densely on the carrier film 2 as shown in FIG. 1. The carrier film 2 is accordingly larger, so that the Thermistor 1 a in relation to its longitudinal extent 7 'much larger transverse extent 8' than the thermistor of FIG. 1.
  • a thermistor according to FIG. 2 is better suited as a thermistor according to FIG. 1 in order, for example, to be used as a temperature sensor for large-area applications.
  • the thermistor according to FIG. 1 can be used as a temperature sensor for a single strip-type photovoltaic cell
  • the thermistor according to FIG. 2 can be used, for example, as a temperature sensor for an entire photovoltaic array.
  • FIGS. 1 and 2 thus illustrate that the thermistor 1 according to the invention can be configured individually for each application range, for example by selecting its longitudinal extension 7, T and its transverse extent 8, 8 'and the geometry of the conductor track 3, in particular in its meandering region 5 , and even a shape of the thermistor itself can be adjusted.
  • the carrier sheet 2 is printed with the conductor 3, this is possible in a particularly simple manner, since not, for example, manufacturing machines must be changed, but only pressure settings are selected accordingly.
  • the carrier film 2 can be brought into any desired shapes and printed accordingly, so that the thermistor can have an unusual and even unique shape, for example, a circular or irregular shape.
  • FIG. 3 shows a thermistor 1 in which the carrier foil 2 simultaneously forms a cover foil 9.
  • the carrier film 2 forms a support region 10, a cover region 11, in the region of which it forms the cover film 9, and a projection region 12.
  • the conductor track 3 is for the most part arranged in the support region 10, wherein a part of the contact region 4 extends into the projection region 12.
  • Supporting area 10 and projection area 12 are arranged on one side of a folding axis 13, while the cover area 11 is arranged on the other side of the folding axis 13.
  • the deck area 1 1 corresponds in its dimensions to the support area 10 and this is arranged across the folding axis 13 across. To the folding axis so the deck area 1 1 can be folded onto the support portion 10.
  • the cover region 1 1 then covers the support region 10 and thus also the largest part of the conductor 3, namely the meander region 5, completely and part of the contact region 4. Only the projection region 12 and thus the part of the contact region 4 arranged in the projection region 12 will not covered by the deck area 1 1. They are exposed, so that the thermistor 1 can be contacted in this area.
  • the support region 10 and the cover region 11, or the carrier film 2 and the cover film 9 can be welded together, for example along their circumference or, for example, along three sides of the cover film 9, wherein along the folding axis 13 is not welded or glued.
  • the carrier film 2 and / or the cover film 9 may also have a vent opening (not shown).
  • the cover sheet 9 prevents a short circuit may occur in a contract of the thermistor 1 with a conductor, in particular a current-carrying conductor, since the conductor can not contact the meandering 5 and a contact can be made only in the contact area 4.
  • 4 shows a flow chart of a method 18 according to the invention for producing a thermistor 1.
  • the carrier film 2 for example a polyimide film and, for example, with a film thickness of not more than 10 ⁇ m, is provided. It may already have a shape that corresponds to that of the thermistor 1. In the simplest case, this can be a rectangle.
  • the carrier film 2 can have a more complex shape.
  • the carrier foil 2 can have any desired shape.
  • the carrier foil 2 is printed with a metallic ink 19.
  • the metallic ink 19 has a platinum content of elemental platinum of at least 15% and a low-evaporating portion of a low-evaporating substance 20 or low-volatiles 20 having an evaporation temperature below 250 ° C of at least 60%, the sum of the platinum content of the elemental Platinum and the low-evaporating portion of the low-evaporating substance 20 or the low-evaporating substances 20 is at least 99.5%.
  • the metallic ink 19 is converted into the wiring 3. This happens, by vaporizing the low-volatiles 20 and sintering the platinum.
  • the conductor track 3 thus has a final elemental platinum content of at least 99%.
  • the carrier film 2 and the conductor 3 thus form the thermistor. 1
  • the thermistor can be provided with a cover layer or covering film 9.
  • a cover layer or covering film 9 can be done by, as explained in connection with FIG. 3, a section of the carrier film 2 as a cover film 9 is folded onto parts of the conductor track 3.
  • a cover layer for example by another film is applied as a cover sheet 9 or by applying a cover layer of any insulating material, such as a paint made of synthetic resin on the conductor 3 and at least parts of the carrier film 2.

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  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

Dans un procédé (18) de fabrication d'une thermistance (1), un film de support (2) est imprimé avec une encre métallique (19), et l'encre métallique (19) imprimée sur le film de support (2) est traitée thermiquement de façon à transformer l'encre métallique (19) en une piste conductrice (3). L'encre métallique (19) a une proportion de platine élémentaire d'au moins 15 % et une proportion à faible évaporation d'au moins une substance à faible évaporation (20) à une température d'évaporation inférieure à 250 °C d'au moins 60 %. La somme de la proportion de platine et de la proportion à faible évaporation de l'encre métallique (19) est d'au moins 99,5%. Le traitement thermique comprend un frittage allant de 380 °C à 400 °C de sorte que chaque matière à faible évaporation (20) se vaporise pendant le frittage et la piste conductrice (3) ait une proportion finale de platine élémentaire d'au moins 99 % après le frittage. Une thermistance (1), pourvue d'un film de support (2) d'une épaisseur de 10 µm maximum et, sur le film support (2), d'une piste conductrice (3) ayant une proportion finale de platine élémentaire d'au moins 99%, peut être fabriquée par ce procédé (18).
PCT/EP2018/051052 2017-01-24 2018-01-17 Thermistances à film ultraminces Ceased WO2018137978A1 (fr)

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DE102017101262.1A DE102017101262A1 (de) 2017-01-24 2017-01-24 Ultradünne Folienthermistoren
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DE102020216542A1 (de) 2020-12-23 2022-06-23 Robert Bosch Gesellschaft mit beschränkter Haftung Membran für eine mikrofluidische Kartusche mit Ausnehmungen für einen Mikrokanal oder ein Sensorelement und Verfahren zur Herstellung einer Membran und einer Kartusche mit Membran
DE102021105532A1 (de) * 2021-03-08 2022-09-08 Innome Gmbh Foliensensor zur Temperaturmessung und Verfahren zur Herstellung desselben
PL243747B1 (pl) * 2021-06-21 2023-10-09 Politechnika Lodzka Sposób wytwarzania organicznego rezystora o wymaganej rezystancji metodą druku atramentowego
DE102024115204A1 (de) * 2024-03-07 2025-09-11 Tdk Electronics Ag Additives Fertigungsverfahren, Verfahren zur Konzeption eines Bauteils und Bauteil

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JP2020507918A (ja) 2020-03-12

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