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WO2018147398A1 - Inducteur intégré dans un substrat - Google Patents

Inducteur intégré dans un substrat Download PDF

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Publication number
WO2018147398A1
WO2018147398A1 PCT/JP2018/004507 JP2018004507W WO2018147398A1 WO 2018147398 A1 WO2018147398 A1 WO 2018147398A1 JP 2018004507 W JP2018004507 W JP 2018004507W WO 2018147398 A1 WO2018147398 A1 WO 2018147398A1
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WO
WIPO (PCT)
Prior art keywords
gap
magnetic body
magnetic
substrate
multilayer substrate
Prior art date
Application number
PCT/JP2018/004507
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English (en)
Japanese (ja)
Inventor
武志 東
修平 安嶋
明石　裕樹
石井　卓也
Original Assignee
パナソニックＩｐマネジメント株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックＩｐマネジメント株式会社 filed Critical パナソニックＩｐマネジメント株式会社
Publication of WO2018147398A1 publication Critical patent/WO2018147398A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/24—Magnetic cores

Definitions

  • This disclosure relates to a substrate built-in type inductor such as a transformer and a coil incorporated in a multilayer substrate.
  • Inductors with built-in substrates such as transformers and coils built into a multilayer board have windings built into the multilayer board, so high frequency of several hundred kHz to several MHz, for example, to reduce the size and increase the efficiency of power supply modules It is used as a thin coil or thin transformer that operates in
  • FIG. 9 is a cross-sectional view of the substrate built-in type inductor described in Patent Document 1.
  • a multilayer substrate 901 includes a substrate 901a having winding patterns 905b and 905c printed on both sides surrounding the positions of the core insertion holes 902, 903, a substrate 901b having a winding pattern 905a printed on the lower surface, and an upper surface.
  • a substrate 901c printed with a winding pattern 905d is stacked and bonded.
  • the core 907 includes a U-shaped core 907a having magnetic legs to be inserted into the core insertion holes 902 and 903 and an I-shaped core 907b that connects the magnetic legs to each other, and is fixed by a core clamp 908.
  • the winding patterns of the respective layers are connected through vias.
  • inductors such as coils and transformers are provided with a gap in the core for preventing magnetic saturation and adjusting the inductance value.
  • the U-type core 907a and the I-type core 907b are not in close contact with each other, and a gap is provided at the junction.
  • an eddy current is generated in the winding pattern. This eddy current is larger as the operating frequency is higher and the distance between the gap and the winding pattern is shorter, which causes heat generation and efficiency deterioration of the winding.
  • the present disclosure is intended to provide a highly efficient substrate-embedded inductor that suppresses heat generation and efficiency deterioration of the winding due to eddy currents caused by leakage magnetic flux from the gap.
  • a substrate-embedded inductor has a plurality of core insertion holes, and is a multilayer substrate composed of a plurality of insulating layers in which a winding pattern is installed around at least one core insertion hole. And a core made of at least a first magnetic body and a second magnetic body, which constitutes a closed magnetic circuit with the multilayer substrate interposed therebetween via the core insertion hole, and the first magnetic body and the second magnetic body These magnetic bodies are opposed to each other with a gap having a predetermined length, and the shortest spatial distance between the gap and the winding pattern is not less than a predetermined value.
  • the leakage magnetic flux generated from the core gap and intermingled with the winding pattern is reduced, so that eddy current is reduced, and heat generation and efficiency deterioration can be suppressed.
  • FIG. 1 is a cross-sectional view illustrating a configuration example of a substrate-embedded inductor according to the first embodiment.
  • FIG. 2 is a diagram illustrating simulation results of the distance from the center of the multilayer substrate to the gap and eddy current loss.
  • FIG. 3 is an enlarged view of the vicinity of the gap in the broken line frame A1 of FIG.
  • FIG. 4 is a cross-sectional view of the substrate built-in inductor according to the second embodiment.
  • FIG. 5 is a cross-sectional view of the substrate-embedded inductor according to the third embodiment.
  • FIG. 6 is a cross-sectional view of another substrate-embedded inductor according to the third embodiment.
  • FIG. 7 is a cross-sectional view of the substrate built-in type inductor according to the fourth embodiment.
  • FIG. 8A is a cross-sectional view of a board built-in inductor according to a first modification of the fourth embodiment.
  • FIG. 8B is a cross-sectional view of the board built-in inductor according to the second modification of the fourth embodiment.
  • FIG. 8C is a cross-sectional view of the board built-in inductor according to the third modification of the fourth embodiment.
  • FIG. 8D is a cross-sectional view of the substrate built-in inductor according to the fourth modification example of the fourth embodiment.
  • FIG. 8E is a cross-sectional view of the substrate built-in inductor according to the fifth modification example of the fourth embodiment.
  • FIG. 9 is a cross-sectional view of the substrate built-in inductor described in Patent Document 1. In FIG.
  • FIG. 1 is a cross-sectional view showing a configuration example of a substrate built-in inductor according to the first embodiment.
  • 1 includes a multilayer substrate 1, core insertion holes 2 and 3 provided in the multilayer substrate 1, and a core 7.
  • the multilayer substrate 1 a plurality of substrate layers on which wiring conductors 5 are printed are stacked on an insulating plate 4.
  • One of the outermost layers (here, the lowermost layer) has wiring conductors 5 printed on both surfaces of the insulating plate 4.
  • the printed wiring conductor 5 layer is referred to as a wiring layer.
  • the multilayer substrate 1 basically has a laminated structure of wiring layer (layer of wiring conductor 5) -insulating plate 4-wiring layer --- insulating plate 4-wiring layer.
  • the multilayer substrate 1 has one or more insulating plates 4 and two or more wiring layers.
  • the core insertion holes 2 and 3 hold the core 7 inserted in the multilayer substrate 1.
  • the core 7 is made of a ferromagnetic material and includes at least a first magnetic material 7a and a second magnetic material 7b, and constitutes a closed magnetic circuit with the multilayer substrate 1 interposed therebetween.
  • the first magnetic body 7a is a U-shaped ferromagnetic body having two magnetic legs.
  • the second magnetic body 7b is an I-type ferromagnetic body.
  • Both magnetic legs of the first magnetic body 7a are inserted into the core insertion hole 2 and the core insertion hole 3 from the upper surface of the multilayer substrate 1 and held.
  • an I-type second magnetic body 7b is provided on the lower surface side of the multilayer substrate 1.
  • the first magnetic body 7a and the second magnetic body 7b are combined to constitute the core 7.
  • the I-type second magnetic body 7b can be replaced with a U-type magnetic body.
  • the wiring conductor 5 provided surrounding the positions of the core insertion holes 2 and 3 and generating a magnetic flux in the core 7 when current flows is distinguished from other wiring conductors for electrical connection and is referred to as a winding pattern. I will decide.
  • the winding pattern provided on a part or all of the layers of the multilayer substrate 1 is connected via the vias between the wiring layers, and constitutes the winding of the substrate built-in type inductor.
  • the first magnetic body 7a and the second magnetic body 7b are not in close contact with each other, and a gap 9a is provided at the junction.
  • the gap 9a is provided to prevent magnetic saturation and to adjust the inductance value.
  • insulating paper or the like is sandwiched between the gaps 9a.
  • the present inventors have analyzed the relationship between the distance between the gap 9a and the winding pattern and the loss due to eddy current for the substrate built-in type inductor designed under specific conditions by electromagnetic field simulation.
  • FIG. 2 is a diagram showing a simulation result of the distance from the center of the multilayer substrate 1 to the gap 9a and the eddy current loss.
  • the multilayer substrate 1 is provided with a winding pattern on all layers, a pair of U-shaped cores is used, the thickness of the gap 9a is fixed to 0.7 mm, and both magnetic legs are changed to change the position of the gap 9a. Changed.
  • the horizontal axis indicates the distance X from the center of the multilayer substrate 1 to the gap 9a.
  • the vertical axis shows the ratio of eddy current loss to the maximum value of eddy current loss.
  • FIG. 3 is an enlarged view of the vicinity of the gap 9a in the broken line frame A1 of FIG.
  • the winding pattern has a distance of 0.5 mm from the core insertion hole 3, and the spatial distance to the gap 9a is about 0.7 mm, which is the same as the length of the gap 9a.
  • the shortest spatial distance between the winding pattern and the gap 9a is set to be equal to or longer than the length of the gap 9a, whereby the winding is caused by the leakage magnetic flux from the gap 9a.
  • the eddy current generated in the pattern can be suppressed, and the eddy current loss can be reduced to a level where there is no problem in actual use.
  • a gap 9a is provided at a position away from the lower surface of the multilayer substrate 1, and the vertical distance from the lower surface to the gap 9a is set to be equal to or greater than the thickness of the gap 9a. That's fine.
  • the length of both magnetic legs of the first magnetic body 7a may be equal to or greater than the sum of the thickness of the multilayer substrate 1 and the length of the gap 9a.
  • the substrate-embedded inductor according to the first embodiment has a plurality of core insertion holes 2 and 3, and a plurality of winding patterns installed around at least one core insertion hole 2 or 3.
  • the first magnetic body 7a and the second magnetic body 7b are opposed to each other with a gap 9a, and the shortest spatial distance between the gap 9a and the winding pattern is equal to or greater than a predetermined value.
  • the magnetic flux intermingled with the winding pattern is reduced, leading to a reduction in eddy currents generated on the winding pattern, and suppressing heat generation and efficiency deterioration.
  • each of the first magnetic body 7a and the second magnetic body 7b has a facing surface parallel to the multilayer substrate 1, and a gap is formed between the facing surfaces. It may be a length.
  • the loss due to eddy current can be reduced by 30% or more with respect to the maximum loss.
  • the first magnetic body 7a is a U-type having two magnetic legs inserted into the plurality of core insertion holes 2, 3, and the second magnetic body 7b is an I-type or two magnetic legs.
  • the length of the two magnetic legs of the first magnetic body 7a may be equal to or greater than the sum of the thickness of the multilayer substrate 1 and the length of the gap.
  • the shortest spatial distance between the winding pattern and the gap 9a can be easily ensured to be equal to or longer than the length of the gap 9a.
  • FIG. 4 is a cross-sectional view of the substrate built-in inductor according to the second embodiment.
  • the substrate-embedded inductor of the second embodiment differs from the configuration of the substrate-embedded inductor of FIG. 1 in that the length of both magnetic legs of the first magnetic body 7a is shorter than the thickness of the multilayer substrate 1, and the position of the gap 9a Are above the lower surface of the multilayer substrate 1, that is, inside the multilayer substrate 1, and a predetermined number of layers from the lower surface of the multilayer substrate 1 have a wiring layer without a winding pattern.
  • the eddy current loss can be suppressed by setting the shortest spatial distance between the winding pattern and the gap 9a to be equal to or greater than the thickness of the gap 9a.
  • the wiring layer in contact with the upper and lower surfaces of the lowermost insulating plate does not have a winding pattern. Note that the wiring layer in contact with the upper surface of the lowermost insulating plate and the wiring layer in contact with the lower surface may each have wiring other than the winding pattern.
  • the length of both magnetic legs of the U-shaped core is shorter than the thickness of the multilayer substrate 1 by the thickness of the gap 9 a, and the second magnetic body 7 b is set to be extremely close to the lower surface of the multilayer substrate 1. It has become.
  • the layer without the winding pattern is approximately twice as long as the thickness of the gap 9a from the lower surface.
  • the distance from the gap 9a may be provided in the horizontal direction with respect to the multilayer substrate 1.
  • the winding pattern is used as the core in the layer extending from the lower surface of the multilayer substrate 1 to twice the thickness of the gap 9a. You may arrange
  • the second magnetic body 7b is in close contact with the lower surface of the multilayer substrate 1, no winding pattern is provided on the lower surface, or a separate insulating film is provided between the lower surface and the second magnetic body 7b. It is necessary to provide insulation means such as applying.
  • the first magnetic body 7a is a U-type having two magnetic legs inserted into the plurality of core insertion holes 2 and 3
  • the second magnetic body 7b is I-type or U-shaped having two magnetic legs, and the length of the magnetic legs of the first magnetic body 7a is equal to or less than the thickness of the multilayer substrate 1, and the gap 9a and the winding pattern
  • the multilayer substrate 1 has a wiring layer without a winding pattern in order to secure the shortest spatial distance more than the gap length.
  • the wiring layer without the winding pattern is a wiring layer in contact with the upper surface of the lowermost insulating plate and a wiring layer in contact with the lower surface of the lowermost insulating plate.
  • the shortest spatial distance between the winding pattern and the gap 9a can be easily ensured to be equal to or longer than the length of the gap, and the first magnetic body 7a Insulating paper or the like sandwiched between the second magnetic bodies 7b becomes unnecessary.
  • the opposing surfaces of the first magnetic body 7a and the second magnetic body 7b forming the gap 9a are substantially parallel to the multilayer substrate 1, but in this case, the gap surface (opposing The leakage flux generated from the outer periphery (four sides if rectangular) is equidistant from the winding pattern.
  • the gap surface and the multilayer substrate 1 are provided with an angle, for example, perpendicular, so that most of the leakage magnetic flux generation portion is kept away from the winding pattern.
  • FIG. 5 is a cross-sectional view of the substrate built-in type inductor according to the third embodiment.
  • the substrate-embedded inductor of the third embodiment is different from the substrate-embedded inductor of FIG. 1 in that both magnetic legs of the first magnetic body 7a are longer than the substrate thickness and the second magnetic body 7b is shortened.
  • the gap 9b has a thickness between both the magnetic legs of the first magnetic body 7a.
  • the shortest distance from the winding pattern is only one side of the rectangular gap surface, and the shortest spatial distance between the winding pattern and the gap 9b is the same as in the first embodiment.
  • the leakage magnetic flux interlinking with the winding pattern can be almost halved as compared with the first embodiment. That is, since eddy currents generated on the winding pattern are also suppressed, eddy current loss is also reduced. If the eddy current loss corresponding to the first embodiment is used, the shortest spatial distance between the winding pattern and the gap 9b can be halved compared to the first embodiment in which the thickness is equal to or greater than the thickness of the gap 9b.
  • the structure used as the gap 9c which has an oblique angle like FIG. 6, for example may be sufficient. Strictly different from the vertical case, such as the appearance of leakage magnetic flux and the effect on eddy current loss, the same effect can be obtained.
  • the first magnetic body 7a is a U-type having two magnetic legs inserted into the plurality of core insertion holes 2 and 3
  • the second magnetic body 7b is I-type, the length of the two magnetic legs of the first magnetic body 7a is longer than the thickness of the multilayer substrate 1, and the second magnetic body 7b has a gap 9b between the two magnetic legs. Sandwiched between.
  • the end of the two magnetic legs of the first magnetic body 7a and the both ends of the second magnetic body 7b form a gap 9c by opposing surfaces having an angle of 90 degrees with respect to the longitudinal direction of the multilayer substrate. May be.
  • the end portions of the two magnetic legs of the first magnetic body 7a and the both end portions of the second magnetic body 7b may form a gap 9c by a surface obliquely opposed to the multilayer substrate.
  • the leakage magnetic flux intermingled with the winding pattern can be maintained at about one half, and an effect of suppressing heat generation and efficiency deterioration can be obtained.
  • the predetermined value may be (0.5 ⁇ gap length).
  • the shortest spatial distance between the winding pattern and the gap 9b or 9c can be minimized while maintaining efficiency, and the substrate-embedded inductor can be further miniaturized.
  • FIG. 7 is a cross-sectional view of the substrate built-in inductor according to the fourth embodiment.
  • the substrate-embedded inductor according to the fourth embodiment is different from the substrate-embedded inductor shown in FIG. 1 in that a gap is provided between the upper surface of the multilayer substrate 1 and the first magnetic body 7a.
  • the length of the gap that is, the distance d1 between the upper surface of the multilayer substrate 1 and the first magnetic body 7a is a predetermined spatial distance.
  • the predetermined spatial distance may be the same as the length of the gap 9a, for example.
  • Embodiments 1 and 3 have described the configuration in which a distance corresponding to the thickness of the gap 9a is provided between the lower surface of the multilayer substrate 1 and the second magnetic body 7b.
  • the purpose of this is to suppress the eddy current generated in the winding pattern by interlinking with the leakage magnetic flux and its influence by setting the distance between the gap 9a and the winding pattern to a predetermined value or more.
  • the substrate built-in type inductor according to the fourth embodiment has a configuration in which a gap is provided on both the upper and lower surfaces of the multilayer substrate 1 with a distance from the core 7 as shown in FIG.
  • FIGS. 8A to 8E structural examples in which a gap is provided between the multilayer substrate 1 and the first magnetic body 7a are shown in FIGS. 8A to 8E, which will be described below.
  • FIG. 8A shows the first magnetic body from the upper surface of the multilayer substrate 1 by attaching a fixture 11 having a thickness corresponding to a predetermined spatial distance and a shape surrounding the magnetic legs of the first magnetic body 7a to both magnetic legs.
  • gap distance to 7a is shown.
  • the material of the fixture 11 is preferably an insulator.
  • 8B to 8D show configuration examples in which a part of the shape of the U-shaped core is changed.
  • FIG. 8B has a step 12 corresponding to the thickness of the gap 9a inside the base of both magnetic legs.
  • FIG. 8C has a step 13 outside as opposed to FIG. 8B.
  • FIG. 8D shows a configuration example having a protrusion 15 corresponding to the thickness of the gap 9a on the multilayer substrate 1 side above the first magnetic body 7a.
  • one protrusion 15 is provided at the center, but a plurality of protrusions 16 may be arranged in a balanced manner on the multilayer substrate 1 side above the first magnetic body 7a as shown in FIG. 8E.
  • the substrate-embedded inductor according to the fourth embodiment has a predetermined spatial distance d1 between the magnetic body portion excluding the two magnetic legs of the first magnetic body 7a and the multilayer substrate 1. .
  • the present disclosure is useful for a substrate-embedded inductor provided on a multilayer substrate used for miniaturization of various electronic devices.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Selon l'invention, un inducteur intégré dans un substrat comprend : un substrat multicouche (1) qui a une pluralité de trous d'insertion de noyau (2 et 3) et comprend un stratifié d'une pluralité de couches isolantes (4), avec des motifs de bobine (5) disposés autour d'au moins un trou d'insertion de noyau (2 ou 3) ; et un noyau (7) qui est constitué d'au moins un premier corps magnétique (7a) et un deuxième corps magnétique (7b) et forme un trajet magnétique fermé qui prend en sandwich le substrat multicouche (1) par un trou d'insertion de noyau (2 ou 3). Le premier corps magnétique (7a) et le deuxième corps magnétique (7b) se font face avec un entrefer prédéterminé (9a) entre eux, et la distance spatiale la plus courte entre l'entrefer (9a) et les motifs de bobine (5) est supérieure ou égale à une valeur prédéterminée.
PCT/JP2018/004507 2017-02-10 2018-02-09 Inducteur intégré dans un substrat WO2018147398A1 (fr)

Applications Claiming Priority (2)

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US201762457540P 2017-02-10 2017-02-10
US62/457540 2017-02-10

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WO2018147398A1 true WO2018147398A1 (fr) 2018-08-16

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0520310U (ja) * 1991-08-26 1993-03-12 松下電工株式会社 電磁装置
JPH0855723A (ja) * 1994-08-10 1996-02-27 Taiyo Yuden Co Ltd 積層型電子部品
JP2005228758A (ja) * 2004-02-10 2005-08-25 Yokogawa Electric Corp プリントコイルトランス及びプリント基板
JP2013175654A (ja) * 2012-02-27 2013-09-05 Shindengen Electric Mfg Co Ltd 薄型トランス
JP2013175657A (ja) * 2012-02-27 2013-09-05 Shindengen Electric Mfg Co Ltd 薄型コアコイルおよび薄型トランス

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0520310U (ja) * 1991-08-26 1993-03-12 松下電工株式会社 電磁装置
JPH0855723A (ja) * 1994-08-10 1996-02-27 Taiyo Yuden Co Ltd 積層型電子部品
JP2005228758A (ja) * 2004-02-10 2005-08-25 Yokogawa Electric Corp プリントコイルトランス及びプリント基板
JP2013175654A (ja) * 2012-02-27 2013-09-05 Shindengen Electric Mfg Co Ltd 薄型トランス
JP2013175657A (ja) * 2012-02-27 2013-09-05 Shindengen Electric Mfg Co Ltd 薄型コアコイルおよび薄型トランス

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