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WO2008106913A3 - Automation carrier for substrates in particular for wafers for producing silicon-based solar cells - Google Patents

Automation carrier for substrates in particular for wafers for producing silicon-based solar cells Download PDF

Info

Publication number
WO2008106913A3
WO2008106913A3 PCT/DE2008/000083 DE2008000083W WO2008106913A3 WO 2008106913 A3 WO2008106913 A3 WO 2008106913A3 DE 2008000083 W DE2008000083 W DE 2008000083W WO 2008106913 A3 WO2008106913 A3 WO 2008106913A3
Authority
WO
WIPO (PCT)
Prior art keywords
carrier
wafers
loading
walls
opposing
Prior art date
Application number
PCT/DE2008/000083
Other languages
German (de)
French (fr)
Other versions
WO2008106913A4 (en
WO2008106913A2 (en
Inventor
Stefan Jonas
Lutz Redmann
Original Assignee
Jonas & Redmann Automationstec
Stefan Jonas
Lutz Redmann
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jonas & Redmann Automationstec, Stefan Jonas, Lutz Redmann filed Critical Jonas & Redmann Automationstec
Publication of WO2008106913A2 publication Critical patent/WO2008106913A2/en
Publication of WO2008106913A3 publication Critical patent/WO2008106913A3/en
Publication of WO2008106913A4 publication Critical patent/WO2008106913A4/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to an automation carrier (1) for substrates, in particular wafers (10) for producing silicon-based solar cells with two opposing walls (2; 3), a number of connection elements (4), connecting the walls (2; 3) and a retainer structure for retaining the wafers (10) in the carrier (1) in a position oriented perpendicularly to the loading and unloading direction (B and E) and parallel to each other at an even separation. According to the invention, an unloaded retention for various wafer formats on transportation may be achieved, wherein both walls are designed as identical U-shaped base and lid plate profiles (2; 3) detachably connected by means of four columns (4) oriented perpendicular to the loading and unloading direction (E and B) of the carrier (1) and together therewith form a frame (5) for the carrier (1). Between each inner surface(27) of the base pieces (26) of both opposing U-shaped base and lid plate profiles (2 and 3) of the carrier frame (5) there is a stop (28) running perpendicular to the loading and unloading device (B and E) made from two aluminium U-profiles (29) with attached rubber elements (30), on which the wafers (10) come into gentle contact on loading the carrier (11) guided by the lateral edge regions thereof in the opposing serial plates (16) with the front edge (31) thereof facing the stop (28).
PCT/DE2008/000083 2007-03-04 2008-01-15 Automation carrier for substrates in particular for wafers for producing silicon-based solar cells WO2008106913A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200720003416 DE202007003416U1 (en) 2007-03-04 2007-03-04 Automation carrier for substrate e.g. wafer, has stopper, where front edges of wafer facing stopper are guided into ridge plates lying one on another with its side edge areas, during loading of carrier for arrangement
DE202007003416.4 2007-03-04

Publications (3)

Publication Number Publication Date
WO2008106913A2 WO2008106913A2 (en) 2008-09-12
WO2008106913A3 true WO2008106913A3 (en) 2008-11-13
WO2008106913A4 WO2008106913A4 (en) 2009-01-15

Family

ID=38136193

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2008/000083 WO2008106913A2 (en) 2007-03-04 2008-01-15 Automation carrier for substrates in particular for wafers for producing silicon-based solar cells

Country Status (3)

Country Link
DE (1) DE202007003416U1 (en)
TW (1) TWI456678B (en)
WO (1) WO2008106913A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008062123A1 (en) 2008-12-16 2010-06-17 Q-Cells Se Modular carrier
DE102009024239A1 (en) * 2009-05-29 2010-12-02 Schmid Technology Systems Gmbh Apparatus and method for stacking a plurality of flat substrates
DE102013008100A1 (en) 2012-05-15 2013-11-21 Jonas & Redmann Automationstechnik Gmbh Device for changing distances between individual substrates
EP2711979A1 (en) * 2012-09-24 2014-03-26 Meyer Burger AG Wafer cutting system
EP2711978A1 (en) 2012-09-24 2014-03-26 Meyer Burger AG Method of making wafers
EP2720258A1 (en) 2012-10-12 2014-04-16 Meyer Burger AG Wafer handling system
EP2944444A1 (en) 2014-05-16 2015-11-18 Meyer Burger AG Wafer processing method
FR3114437B1 (en) 2020-09-21 2023-03-31 Commissariat Energie Atomique Wafer holding device, wafer processing assembly and related wafer processing method

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153164A (en) * 1978-06-13 1979-05-08 Kasper Instruments, Inc. Carrier for semiconductive wafers
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0100539A2 (en) * 1982-07-30 1984-02-15 Tecnisco Ltd. Assembled device for supporting semiconductor wafers or the like
EP0579099A1 (en) * 1992-07-08 1994-01-19 Daifuku Co., Ltd. Container for plate-like objects
JPH06209036A (en) * 1993-01-11 1994-07-26 Daifuku Co Ltd Article storing container
JPH0853187A (en) * 1994-08-09 1996-02-27 Sony Corp Carrier for storing plate-like article
JPH09129718A (en) * 1995-11-02 1997-05-16 Kawasaki Steel Corp Flat parts housing box
US5782362A (en) * 1995-10-12 1998-07-21 Shin-Etsu Polymer Co., Ltd. Wafer cassette in wafer carrier
DE19918243A1 (en) * 1998-04-22 2000-02-10 Idemitsu Petrochemical Co Styrene resin compositions and semiconductor carrier device
US20030121870A1 (en) * 2001-12-28 2003-07-03 Microtool, Inc. Semiconductor cassette reducer
WO2003085704A2 (en) * 2002-04-05 2003-10-16 Astec Halbleitertechnologie Gmbh Device for accommodating substrates
JP2004095942A (en) * 2002-09-02 2004-03-25 Kokusai Electric Semiconductor Service Inc Wafer cassette
WO2004102626A2 (en) * 2003-05-09 2004-11-25 Entegris, Inc. Component handling device having a film insert molded rfid tag
EP1605496A2 (en) * 2004-06-11 2005-12-14 Shin-Etsu Polymer Co., Ltd. Substrate storage container

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4153164A (en) * 1978-06-13 1979-05-08 Kasper Instruments, Inc. Carrier for semiconductive wafers
US4228902A (en) * 1979-02-21 1980-10-21 Kasper Instruments, Inc. Carrier for semiconductive wafers
EP0100539A2 (en) * 1982-07-30 1984-02-15 Tecnisco Ltd. Assembled device for supporting semiconductor wafers or the like
EP0579099A1 (en) * 1992-07-08 1994-01-19 Daifuku Co., Ltd. Container for plate-like objects
JPH06209036A (en) * 1993-01-11 1994-07-26 Daifuku Co Ltd Article storing container
JPH0853187A (en) * 1994-08-09 1996-02-27 Sony Corp Carrier for storing plate-like article
US5782362A (en) * 1995-10-12 1998-07-21 Shin-Etsu Polymer Co., Ltd. Wafer cassette in wafer carrier
JPH09129718A (en) * 1995-11-02 1997-05-16 Kawasaki Steel Corp Flat parts housing box
DE19918243A1 (en) * 1998-04-22 2000-02-10 Idemitsu Petrochemical Co Styrene resin compositions and semiconductor carrier device
US20030121870A1 (en) * 2001-12-28 2003-07-03 Microtool, Inc. Semiconductor cassette reducer
WO2003085704A2 (en) * 2002-04-05 2003-10-16 Astec Halbleitertechnologie Gmbh Device for accommodating substrates
JP2004095942A (en) * 2002-09-02 2004-03-25 Kokusai Electric Semiconductor Service Inc Wafer cassette
WO2004102626A2 (en) * 2003-05-09 2004-11-25 Entegris, Inc. Component handling device having a film insert molded rfid tag
EP1605496A2 (en) * 2004-06-11 2005-12-14 Shin-Etsu Polymer Co., Ltd. Substrate storage container

Also Published As

Publication number Publication date
WO2008106913A4 (en) 2009-01-15
WO2008106913A2 (en) 2008-09-12
TWI456678B (en) 2014-10-11
TW200847313A (en) 2008-12-01
DE202007003416U1 (en) 2007-05-31

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