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WO2003067951A8 - Dispositif et procede de montage de piece electronique - Google Patents

Dispositif et procede de montage de piece electronique

Info

Publication number
WO2003067951A8
WO2003067951A8 PCT/JP2003/001216 JP0301216W WO03067951A8 WO 2003067951 A8 WO2003067951 A8 WO 2003067951A8 JP 0301216 W JP0301216 W JP 0301216W WO 03067951 A8 WO03067951 A8 WO 03067951A8
Authority
WO
WIPO (PCT)
Prior art keywords
electronic part
mounting device
electronic
shortened
controller
Prior art date
Application number
PCT/JP2003/001216
Other languages
English (en)
French (fr)
Other versions
WO2003067951A1 (fr
Inventor
Naoto Mimura
Izumi Miura
Hirofumi Obara
Hiroshi Uchiyama
Nobuyuki Kakita
Kazunori Kanai
Osamu Okuda
Akira Kabeshita
Original Assignee
Matsushita Electric Ind Co Ltd
Naoto Mimura
Izumi Miura
Hirofumi Obara
Hiroshi Uchiyama
Nobuyuki Kakita
Kazunori Kanai
Osamu Okuda
Akira Kabeshita
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, Naoto Mimura, Izumi Miura, Hirofumi Obara, Hiroshi Uchiyama, Nobuyuki Kakita, Kazunori Kanai, Osamu Okuda, Akira Kabeshita filed Critical Matsushita Electric Ind Co Ltd
Priority to US10/503,497 priority Critical patent/US7003872B2/en
Priority to EP03706922A priority patent/EP1476006A4/en
Publication of WO2003067951A1 publication Critical patent/WO2003067951A1/ja
Publication of WO2003067951A8 publication Critical patent/WO2003067951A8/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
PCT/JP2003/001216 2002-02-07 2003-02-06 Dispositif et procede de montage de piece electronique WO2003067951A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/503,497 US7003872B2 (en) 2002-02-07 2003-02-06 Electronic component mounting apparatus and method
EP03706922A EP1476006A4 (en) 2002-02-07 2003-02-06 Electronic part mounting device and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002-030930 2002-02-07
JP2002030930A JP3973439B2 (ja) 2002-02-07 2002-02-07 電子部品実装装置及び方法

Publications (2)

Publication Number Publication Date
WO2003067951A1 WO2003067951A1 (fr) 2003-08-14
WO2003067951A8 true WO2003067951A8 (fr) 2004-01-15

Family

ID=27677919

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/001216 WO2003067951A1 (fr) 2002-02-07 2003-02-06 Dispositif et procede de montage de piece electronique

Country Status (4)

Country Link
US (1) US7003872B2 (ja)
EP (1) EP1476006A4 (ja)
JP (1) JP3973439B2 (ja)
WO (1) WO2003067951A1 (ja)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1250063C (zh) * 2000-08-22 2006-04-05 松下电器产业株式会社 零件安装装置及其方法
JP4044017B2 (ja) * 2003-04-22 2008-02-06 松下電器産業株式会社 部品実装装置及びその方法
EP1605744B1 (en) * 2004-06-11 2018-12-05 Assembléon B.V. Component placement apparatus, component feeding apparatus and method
JP4353156B2 (ja) * 2005-08-19 2009-10-28 パナソニック株式会社 電子部品実装方法
JP4811073B2 (ja) * 2006-03-22 2011-11-09 パナソニック株式会社 電子部品実装装置および電子部品実装方法
JP4792346B2 (ja) * 2006-07-28 2011-10-12 株式会社日立ハイテクインスツルメンツ 電子部品装着装置及び電子部品装着方法
CN101496463B (zh) * 2006-07-31 2011-06-22 松下电器产业株式会社 组件安装条件确定方法
JP2008060336A (ja) * 2006-08-31 2008-03-13 Hitachi High-Tech Instruments Co Ltd 電子部品の装着装置及び装着方法
JP4580972B2 (ja) * 2006-11-09 2010-11-17 パナソニック株式会社 部品実装方法
DE102007007819A1 (de) * 2007-02-16 2008-08-21 Siemens Ag Modulare Flächenmagazin-Bereitstellungsvorrichtung für Bestücksysteme
JP4840422B2 (ja) * 2008-09-04 2011-12-21 パナソニック株式会社 電子部品実装用装置及び電子部品実装用装置による作業方法
JP2010073924A (ja) * 2008-09-19 2010-04-02 Panasonic Corp 部品実装装置
JP4658235B2 (ja) * 2009-01-08 2011-03-23 パナソニック株式会社 部品実装装置及びその方法
JP5246064B2 (ja) * 2009-06-29 2013-07-24 パナソニック株式会社 電子部品実装方法
JP5440483B2 (ja) * 2010-12-09 2014-03-12 パナソニック株式会社 電子部品実装システムおよび電子部品実装方法
JP5408148B2 (ja) * 2011-02-07 2014-02-05 パナソニック株式会社 部品実装装置及び部品実装方法
JP5686321B2 (ja) * 2011-03-31 2015-03-18 Ｊｕｋｉオートメーションシステムズ株式会社 実装装置、電子部品の実装方法及び基板の製造方法
JP5613692B2 (ja) 2012-01-12 2014-10-29 ヤマハ発動機株式会社 表面実装機
JP5898547B2 (ja) * 2012-03-28 2016-04-06 富士機械製造株式会社 実装機
US9966247B2 (en) 2012-09-06 2018-05-08 Fuji Machine Mfg. Co., Ltd. Control system and control method for component mounting machine
WO2015097865A1 (ja) * 2013-12-27 2015-07-02 ヤマハ発動機株式会社 部品実装装置、部品実装方法
JP6646802B2 (ja) * 2015-07-15 2020-02-14 パナソニックＩｐマネジメント株式会社 部品供給装置および部品実装システムならびに部品実装方法
JP6547128B2 (ja) * 2015-07-15 2019-07-24 パナソニックＩｐマネジメント株式会社 部品供給装置および部品実装システムならびに部品実装方法
JP6458247B2 (ja) * 2015-07-15 2019-01-30 パナソニックＩｐマネジメント株式会社 部品供給装置および部品実装システムならびに部品実装方法
WO2017069832A2 (en) * 2015-08-03 2017-04-27 Made In Space, Inc. In-space manufacturing and assembly of spacecraft device and techniques
JP6606668B2 (ja) * 2016-10-27 2019-11-20 パナソニックＩｐマネジメント株式会社 部品実装方法
JP7050219B2 (ja) * 2017-09-25 2022-04-08 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法
US11778797B2 (en) 2018-05-30 2023-10-03 Yamaha Hatsudoki Kabushiki Kaisha Component replenishment management system and component mounting system
CN113808067B (zh) * 2020-06-11 2024-07-05 广东美的白色家电技术创新中心有限公司 电路板检测方法、视觉检测设备及具有存储功能的装置
JPWO2023021577A1 (ja) * 2021-08-17 2023-02-23

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04291795A (ja) * 1991-03-20 1992-10-15 Matsushita Electric Ind Co Ltd 電子部品装着装置
JP2554431B2 (ja) * 1992-11-05 1996-11-13 ヤマハ発動機株式会社 実装機の部品吸着状態検出装置
JPH07193397A (ja) * 1993-12-27 1995-07-28 Yamaha Motor Co Ltd 実装機の吸着ポイント補正装置
US6789310B1 (en) * 1995-11-06 2004-09-14 Matsushita Electric Industrial Co., Ltd. Component mounting apparatus
JPH09130084A (ja) * 1995-11-06 1997-05-16 Matsushita Electric Ind Co Ltd 部品実装装置および部品実装設備
SG52900A1 (en) * 1996-01-08 1998-09-28 Matsushita Electric Ind Co Ltd Mounting apparatus of electronic components and mounting methods of the same
JP3459533B2 (ja) * 1997-02-28 2003-10-20 株式会社日立ハイテクインスツルメンツ 電子部品装着装置
JP3459534B2 (ja) * 1997-03-27 2003-10-20 株式会社日立ハイテクインスツルメンツ 電子部品装着装置における部品供給装置
JPH10270864A (ja) * 1997-03-28 1998-10-09 Matsushita Electric Ind Co Ltd 電子機器

Also Published As

Publication number Publication date
US7003872B2 (en) 2006-02-28
EP1476006A4 (en) 2007-03-21
US20050125998A1 (en) 2005-06-16
WO2003067951A1 (fr) 2003-08-14
EP1476006A1 (en) 2004-11-10
JP2003234597A (ja) 2003-08-22
JP3973439B2 (ja) 2007-09-12

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