US2965551A - Metal plating process - Google Patents
Metal plating process Download PDFInfo
- Publication number
- US2965551A US2965551A US676722A US67672257A US2965551A US 2965551 A US2965551 A US 2965551A US 676722 A US676722 A US 676722A US 67672257 A US67672257 A US 67672257A US 2965551 A US2965551 A US 2965551A
- Authority
- US
- United States
- Prior art keywords
- coating
- bath
- metal
- nickel
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 66
- 239000002184 metal Substances 0.000 title claims description 66
- 238000000034 method Methods 0.000 title claims description 30
- 230000008569 process Effects 0.000 title claims description 29
- 238000007747 plating Methods 0.000 title description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 64
- 238000000576 coating method Methods 0.000 claims description 55
- 239000011248 coating agent Substances 0.000 claims description 52
- 229910052759 nickel Inorganic materials 0.000 claims description 32
- 238000007254 oxidation reaction Methods 0.000 claims description 28
- 230000003647 oxidation Effects 0.000 claims description 27
- 239000003638 chemical reducing agent Substances 0.000 claims description 20
- 150000003839 salts Chemical class 0.000 claims description 18
- 230000001590 oxidative effect Effects 0.000 claims description 17
- 150000001875 compounds Chemical group 0.000 claims description 14
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical compound [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 claims description 8
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical compound [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 claims description 8
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 7
- 239000011707 mineral Substances 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 claims 1
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 claims 1
- 229940124024 weight reducing agent Drugs 0.000 description 19
- 150000002739 metals Chemical class 0.000 description 13
- 239000010953 base metal Substances 0.000 description 11
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 10
- 238000011282 treatment Methods 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- GCPXMJHSNVMWNM-UHFFFAOYSA-N arsenous acid Chemical class O[As](O)O GCPXMJHSNVMWNM-UHFFFAOYSA-N 0.000 description 7
- GRWZHXKQBITJKP-UHFFFAOYSA-N dithionous acid Chemical class OS(=O)S(O)=O GRWZHXKQBITJKP-UHFFFAOYSA-N 0.000 description 7
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical class O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 150000004764 thiosulfuric acid derivatives Chemical class 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 6
- 235000010755 mineral Nutrition 0.000 description 6
- 229910000737 Duralumin Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 3
- 229910052770 Uranium Inorganic materials 0.000 description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 3
- 230000001464 adherent effect Effects 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004310 lactic acid Substances 0.000 description 3
- 235000014655 lactic acid Nutrition 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 3
- DNYWZCXLKNTFFI-UHFFFAOYSA-N uranium Chemical compound [U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U] DNYWZCXLKNTFFI-UHFFFAOYSA-N 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229910052790 beryllium Inorganic materials 0.000 description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 238000005234 chemical deposition Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229960000448 lactic acid Drugs 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 235000011121 sodium hydroxide Nutrition 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- 241001460678 Napo <wasp> Species 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000805 Pig iron Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- -1 for instance Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229940093915 gynecological organic acid Drugs 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 159000000001 potassium salts Chemical class 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-L succinate(2-) Chemical compound [O-]C(=O)CCC([O-])=O KDYFGRWQOYBRFD-UHFFFAOYSA-L 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 150000003892 tartrate salts Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1848—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by electrochemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/916—Sequential electrolytic and nonelectrolytic, or nonelectrolytic and electrolytic coating from the same bath
Definitions
- the coating of a metal surface with a cover layer of another metal or other metals is greatly facilitated by the process according to my invention, which comprises the preliminary treatment of the metal surface to be coated prior to plating the same with the desired coating metal or metals by the step of electrolytic oxidation of that surface in the presence of at least one compound of that aforesaid coating metal or metals, and in a medium containing at least one reducing agent.
- the metal surface to becoated is first anodically oxidized and immersed in a solution which contains simultaneously a compound of the desired coating metal or metals, and a. reducing agent. It is preferred to have the base metal connected to the source of electric current at the moment of immersing the base, metal surface into the aforesaid solution, so that current passes through the contact sur face from the very first instant of establishing contact between the metal surface and the solution constituting the oxidation bath.
- This preferably brief step of oxidizing the metal surface to be coated is controlled in such a manner that a thin oxidic layer is formed on the metal surface to be coated.
- the duration of this anodic oxidation step variesbetween a few seconds and up to one minute.
- the oxidic layer is of a thickness below 20 microns, and preferably between 0.1 and 10 microns. Especially favorable results are obtained if oxide layers are allowed to form the thickness of which varies between 0.2 and 2 microns, and, in the case of aluminum and its alloys, more particularly between 0.5 and 1 micron.
- This anodic oxidation step according to my invention can be carried out with the aid of different types of electric current such as direct, alternating or undulatory current at carefully chosen rates of current density and voltage.
- the oxidizing step in the process according to my invention is preferably preceded by conventional cleansing steps such as mechanical polishing, degreasing with organic agents such as trichloroethylene, and/or cathodic cleaning followed by rinsing with distilled water.
- conventional cleansing steps such as mechanical polishing, degreasing with organic agents such as trichloroethylene, and/or cathodic cleaning followed by rinsing with distilled water.
- an oxidation bath Prior to carrying out the step of anodic oxidation, an oxidation bath is prepared, which comprises at least one compound of the desired coating metal or metals and at least one reducing agent, and the pH value of this oxidation bath is adjusted, by a conventional addition of an acidic or basic agent, to a determined optimal pH, which is, by way of example only in the range of preferably 0.5 to 4.8 in the case of aluminum alloys to be coated with nickel.
- the process according to the invention can be used in a variety of applications in the field of metal plating, and particularly in coating metal surfaces with protective, well adherent cover layers of chromium, copper, cadmium, nickel, silver, gold, zinc and others.
- These coating metals may be applied, in acidic or alkaline baths, as the case may be, to a great variety of suitable base metals such as: aluminum, magnesium, titanium, uranium, beryllium, zirconium, iron, copper, zinc, nickel, and their different alloys.
- suitable base metals such as: aluminum, magnesium, titanium, uranium, beryllium, zirconium, iron, copper, zinc, nickel, and their different alloys.
- the bath in which the anodic oxidation step according to my invention is to be carried out should contain simultaneously, at least one compound of the coating metal or metals, and a reducing agent. While it is preferable to have present in the solution a cation of the desired metal, it is also possible to use a solution containing a compound of the coating metal which is little or completely un-ionized. Therefore, salts of the coating metal or metals, such as sulfates, chlorides, fluorides, perchlorates, acetates and the like are suitable, but so are cyano complexes, tartrates and different other organic compounds of the coating metal or metals, contained singly or in combination with each other, in the oxidation bath.
- salts of the coating metal or metals such as sulfates, chlorides, fluorides, perchlorates, acetates and the like are suitable, but so are cyano complexes, tartrates and different other organic compounds of the coating metal or metals, contained singly or in combination with each
- Reducing agents in the oxidation bath which are useful in carrying out my invention in practice, can be of Widely varying nature, depending on the nature of base metals and on the coating metals to be applied thereto.
- reducing salts such as sulfites, thiosulfates, hydrosulfites, arsenites, phosphites or hypophosphites, preferably in the form of their sodium or potassium salts, as well as the salts of metals of less than their maximum valency according to the periodic table can be used.
- ferrous, dior trivalent titanous, cu prous, stannous and the like salts are suitable.
- organic reducing agents may be used either alone or in mixture with eachother and/or with the -inorganic"- reducing agents described above.
- Suitable organic reducing'agents are, for instance, alcohols such as methanol, aldehydes, particularlyformaldehyde, ketones, organic acids in. particular of the hydroxy mono or dicarboxylic type such as lactic or succinic acid either in the form of the free acid or a sodium or potassium salt thereof.
- the anodic oxidation step may be carried out directly in the same bath that is subsequently-used for obtaining the coating metal deposit.
- the duralumin object' is connected prior to immersion to the positive pole of a DC. source, and concurrently with its immersion in the aforesaid oxidation bath, a current of 14 volts' is caused to pass therethrough at a current density of 1.7 amperes per square decimeter treated surface, during 30' seconds.
- the object is coated with oxide layer having a thickness of about 0.8 micron.
- the temperature of the bath during the oxidation step is about 96 C.
- the object re. mains'in the'same bath during approximately one hour at a temperature of 96 to 98 C. Thereby a desired.
- nickel coating having: a thickness of about 22 microns is deposited on the anodically oxidized surface of the ob-' ject. The coated object is then rinsed and dried first in air and then:in an oven at '165 C. for one hour.
- the object is transferred," without rinsing, to an identical bath as described in Example I '(the pH 'value of which has been adjusted to 4.7).
- Example 1 After rinsing and drying in an oven for about one hour. at 165 C., the coating reveals the same advantageous properties asthe' one obtained in Example 1.
- Example III Plates'of aluminum of 99.5% purity are' degreased with trichloroethylene, cleaned "duringone minute at'a" temperature of 70 C. in a solution of caustic soda'hav-- ing aconcentration' of g./1., rinsed, and neutralized,
- the plates are transferred, without rinsing, to a nickel-plating bath similar to that described in Example I.
- the plates remain in this bath for one hour at a temperature of 96 to 98 0., whereby nickel layers of a thickness of 22 microns and excellent adherence to the base metal are.
- Example IV The same treatment as described in Example llliis carried out with an oxidation bath containing 10 g./l
- Example V In the same 'treatment 'as describedin Example 111,
- a process for coating a metal surface with nickel comprising the steps of (a) degreasing and cleaning the surface in a conventional manner, and (b) subjecting the cleaned surface to electrolytic oxidation in a bath capable of providing an oxidizing environment at the anode, said bath containing at least one compound of nickel and at least one reducing agent being a mineral salt selected from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, and (c) coating the oxidic layer thus formed on said surface in a coating bath with a cover layer of nickel.
- a process for coating the metal surface of a body consisting of a metal with nickel comprising the steps of (a) connecting said body in an electrolytic circuit, (b) immersing said body surface into an electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) electrolytically oxidizing said surface by passing current through said circuit, and (d) coating the oxidic layer thus formed on said surface in a coating bath with a cover layer of nickel.
- a process for coating the metal surface of a body consisting of a metal with nickel comprising the steps of (a) connecting said body in an electrolytic circuit, (b) immersing said body surface into an electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) electrolytically oxidizing said surface by passing current through said circuit until an oxidic coating is formed on said body surface which coating is less than 20 microns thick, and (d) coating the oxidic layer thus formed on said surface in a coating bath with a cover layer of nickel.
- a process for coating the metal surface of a body consisting of a metal with nickel comprising the steps of (a) connecting said body in an electrolytic circuit, (b) immersing said body surface into an electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) electrolytically oxidizing said surface by passing current through said circuit until an oxidic coating is formed on said body surface which coating has a thickness between 0.1 and 10 microns, and (d) coating the oxidic layer thus formed on said surface in a coating bath with a cover layer of nickel.
- said reducing agent is a salt of a metal in an inferior valency stage below its full valency according to the Periodic Table, selected from the group consisting of the salts of divalent iron, divalent and trivalent titanium, divalent tin, and monovalent copper.
- a process for plating the metal surface of a body consisting of an easily oxidizable base metal with nickel comprising the steps of successively (a) connecting said body to the anode of the current source of an electrolytic circuit, (b) immersing said metal surface of said body into an aqueous electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt selected from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) anodically oxidizing said surface by passing current through said circuit so as to deposit an oxidic layer on said surface, and (d) coating the oxidic layer on said surface with a cover layer of nickel.
- a process for plating the metal surface of a body consisting of an easily oxidizable base metal with nickel comprising the steps of successively (a) connecting said body to the anode of the current source of an electrolytic circuit, (b) immersing said metal surface of said body into an aqueous electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt selected from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) anodically oxidizing said surface by passing current through said circuit so as to deposit an oxidic layer on said surface, and (d) coating the oxidic layer on said surface in an electrolytic nickel plating bath having a higher pH value than said reducing agent-containing bath with a cover layer of nickel.
- a process for the preliminary treatment of the surface of a body of a metal selected from the group consisting of aluminum and aluminum alloys, prior to the plating of said surface with nickel comprising the steps of (a) connecting said body to the anode of a current source in an electrolytic circuit, (b) immersing said surface into an aqueous bath capable of providing an oxidizing environment at the anode and containing nickel sulfate, an alkali metal hypophosphite, and at least one salt of an organic acid, (0) electrolytically oxidizing said surface by passing current through said circuit until an oxidic coating is formed on said body surface, which coating has a thickness between 0.1 and 10 microns.
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Description
United States Patent 9 2,965,551 METAL PLATING PROCESS Henri Richaud, Chambery, France, assignor to Pechiney Compagnie de Produits Chimiques et Electrometallurgiques, Paris, France Filed Aug. 7, 1957, Ser. No. 676,722 Claims priority, application France Aug. 8, 1956 16 Claims. (Cl. 204-32) This invention relates to a process for preparing a metal surface for applying thereto a metallic coating.
It is an object of my invention to provide a process for the preparation of a metal surface prior to the application thereto of a metallic coating, which process permits to obtain a better adherence and improved decorative effects of the coating to be subsequently applied.
It is another object of my invention to provide improvements in the preparation of metal surfaces as a preliminary treatment to the subsequent coating of these surfaces with metallic coatings, so as to obtain coatings which will adhere better than the conventionally known ones, and which can be deposited, for instance, from baths free from undesirable components liable to contaminate the ultimate metallic deposits.
It is well known in the art of metal plating that, when the surface of a metal object is to be covered or coated with a metallic deposit with the aid of a chemical or electrolytical process, the metal surface must usually be suitably prepared in a preliminary treatment, so as to ensure the formation thereon of a well adherent coating.
This problem of obtaining a properly adherent coating is of particular importance, when chemical deposits are to be made on surfaces where the base metal is highly oxidizable. Often, the known methods of treating metal surfaces in order to improve the adherence of the coating to be applied, are detrimental to other properties of the coating, such as its outer appearance, its resistance to corrosion and the like. In certain cases, the formation of satisfactory chemical or electrolytical deposits may even be made impossible by such preliminary treatments, if the presence of an intermediary metal used in such treatment leads to the pollution of the plating bath containing the desired metal to be deposited.
These drawbacks are avoided, and the coating of a metal surface with a cover layer of another metal or other metals is greatly facilitated by the process according to my invention, which comprises the preliminary treatment of the metal surface to be coated prior to plating the same with the desired coating metal or metals by the step of electrolytic oxidation of that surface in the presence of at least one compound of that aforesaid coating metal or metals, and in a medium containing at least one reducing agent.
According to one important feature of my invention, the metal surface to becoated is first anodically oxidized and immersed in a solution which contains simultaneously a compound of the desired coating metal or metals, and a. reducing agent. It is preferred to have the base metal connected to the source of electric current at the moment of immersing the base, metal surface into the aforesaid solution, so that curent passes through the contact sur face from the very first instant of establishing contact between the metal surface and the solution constituting the oxidation bath.
This preferably brief step of oxidizing the metal surface to be coated is controlled in such a manner that a thin oxidic layer is formed on the metal surface to be coated. In most cases, the duration of this anodic oxidation step variesbetween a few seconds and up to one minute.
-; Lhave found it to be of advantage to control this oxidation step in such a manner that the oxidic layer is of a thickness below 20 microns, and preferably between 0.1 and 10 microns. Especially favorable results are obtained if oxide layers are allowed to form the thickness of which varies between 0.2 and 2 microns, and, in the case of aluminum and its alloys, more particularly between 0.5 and 1 micron.
This anodic oxidation step according to my invention can be carried out with the aid of different types of electric current such as direct, alternating or undulatory current at carefully chosen rates of current density and voltage.
The oxidizing step in the process according to my invention is preferably preceded by conventional cleansing steps such as mechanical polishing, degreasing with organic agents such as trichloroethylene, and/or cathodic cleaning followed by rinsing with distilled water.
Prior to carrying out the step of anodic oxidation, an oxidation bath is prepared, which comprises at least one compound of the desired coating metal or metals and at least one reducing agent, and the pH value of this oxidation bath is adjusted, by a conventional addition of an acidic or basic agent, to a determined optimal pH, which is, by way of example only in the range of preferably 0.5 to 4.8 in the case of aluminum alloys to be coated with nickel.
The process according to the invention can be used in a variety of applications in the field of metal plating, and particularly in coating metal surfaces with protective, well adherent cover layers of chromium, copper, cadmium, nickel, silver, gold, zinc and others. These coating metals may be applied, in acidic or alkaline baths, as the case may be, to a great variety of suitable base metals such as: aluminum, magnesium, titanium, uranium, beryllium, zirconium, iron, copper, zinc, nickel, and their different alloys. Among these, there are steel, cast and pig iron, brass, the various bronzes, duralumin and other aluminum alloys.
I have found that the process according to my inven-- tion gives satisfactory results in all combination of one of the above named base metals with a coating metal as mentioned. It is particularly useful in coating easily oxidizable metals such as, for instance, aluminum, magnesium, titanium, uranium, beryllium, iron, zirconium, and the like metals and their alloys.
The bath in which the anodic oxidation step according to my invention is to be carried out, should contain simultaneously, at least one compound of the coating metal or metals, and a reducing agent. While it is preferable to have present in the solution a cation of the desired metal, it is also possible to use a solution containing a compound of the coating metal which is little or completely un-ionized. Therefore, salts of the coating metal or metals, such as sulfates, chlorides, fluorides, perchlorates, acetates and the like are suitable, but so are cyano complexes, tartrates and different other organic compounds of the coating metal or metals, contained singly or in combination with each other, in the oxidation bath.
. Reducing agents in the oxidation bath which are useful in carrying out my invention in practice, can be of Widely varying nature, depending on the nature of base metals and on the coating metals to be applied thereto. Thus, reducing salts such as sulfites, thiosulfates, hydrosulfites, arsenites, phosphites or hypophosphites, preferably in the form of their sodium or potassium salts, as well as the salts of metals of less than their maximum valency according to the periodic table can be used. In the latter category, ferrous, dior trivalent titanous, cu prous, stannous and the like salts are suitable.
By selecting a salt of inferior valency stage of the coating metal, where such salt is available, it is possible to provide in'the oxidation bath one and the same coin.-
3.. ponent constituting, at the same time, the reducing agent and the donor of cations of the coating metal.
Furthermore, organic reducing agents may be used either alone or in mixture with eachother and/or with the -inorganic"- reducing agents described above. Suitable organic reducing'agents are, for instance, alcohols such as methanol, aldehydes, particularlyformaldehyde, ketones, organic acids in. particular of the hydroxy mono or dicarboxylic type such as lactic or succinic acid either in the form of the free acid or a sodium or potassium salt thereof. I
@Hydrazine, hydroxylamine andsimilar compounds are equally suitable as reducingagents'. for the purpose of my invention. 7
It is often of an advantage to effect the anodic oxidation in a bath .havinga composition similar to the one in which the final step. of depositing the desired metal coating is to'be carried out, while the pH value, rH value (redoxy value), the concentration and the temperature of the bath are selected to be particularly suitable for the anodic oxidation of the base metal surface.
If the presence of a reducing agent required during the anodic oxidation step according to the present invention has no disturbing effects during the ultimate chemical or electrochemical deposition of thedesired metal coating, the anodic oxidation step may be carried out directly in the same bath that is subsequently-used for obtaining the coating metal deposit.
The process according to the invention is further illustrated by a numberofexamples given below which are, however, not meant to be-limitative in any way:
Example] In orderto improve the adhesion to the base metal surface of a nickel"coatings formed lay-chemical deposition' on a duralumin surface, awell knownaluminum alloy, thefollowing treatment is'followed:
The surface to be coated of an object of duralumin is polished mechanically in a conventional manner and degreased first with the aid of trichloroethylene, and then cathodically with an aqueous solution of 100 grams/liter of NaPO 2O grams/liter of Na CO and 5 grams/liter of Na SiO at 12 volts and 5 amperes/square decimeter during two minutes. After rinsing, neutralization with nitric acid and renewed rinsing, the surface of the duralumin object to be coated is immersed in an oxidation bath of thefollowing composition (in grams/liter'=g./l.):
G./l. Crystalline nickel sulfateNiSO .7H O 23 Sodium hypophosphite Na PO 24 Lactic acid 27 Sodium. succinate 20 the pH of which bath is adjusted to 4.7 by conventional addition of either H 804 or NaOH.
The duralumin object'is connected prior to immersion to the positive pole of a DC. source, and concurrently with its immersion in the aforesaid oxidation bath, a current of 14 volts' is caused to pass therethrough at a current density of 1.7 amperes per square decimeter treated surface, during 30' seconds. The object is coated with oxide layer having a thickness of about 0.8 micron. The temperature of the bath during the oxidation step is about 96 C.
After the'current has'been interrupted, the object re. mains'in the'same bath during approximately one hour at a temperature of 96 to 98 C. Thereby a desired.
nickel coating having: a thickness of about 22 microns is deposited on the anodically oxidized surface of the ob-' ject. The coated object is then rinsed and dried first in air and then:in an oven at '165 C. for one hour.
Conventional-tests to -which the coated object is'subjected-reveal that the nickel layer applied by the process according. to'this" invention adheres' much better to. the base metal. thaw-that er. anyyknown. .processs Example II pole of a direct current source and immersed in an oxidation bath containing the same components as in Example I, but the pH value of which has been adjusted to one by a corresponding addition of H Current is" then'passed through' the objectand'bath during 30 seconds at 12 volts and with a current density of 10 amperes per' square decimeter of the'object surface to be oxidized. The bath temperature is C.
After the current has been interrupted, the object is transferred," without rinsing, to an identical bath as described in Example I '(the pH 'value of which has been adjusted to 4.7). The object'remains in this bath for two hours at a temperature of 96 to 98 C. wherebya nickel layer of a thickness of'44'microns is deposited thereon.
After rinsing and drying in an oven for about one hour. at 165 C., the coating reveals the same advantageous properties asthe' one obtained in Example 1.
Example III Plates'of aluminum of 99.5% purity"are' degreased with trichloroethylene, cleaned "duringone minute at'a" temperature of 70 C. in a solution of caustic soda'hav-- ing aconcentration' of g./1., rinsed, and neutralized,
by treatment at room temperature during a few seconds,"
with nitric acidof 40 B.
After renewed rinsing, the plates are'connected to the" positive terminal of a source of 'direct electric current:
and dipped into an aqueous'oxidation'bath having the following composition:
G./l." NiSO -7I-I O 23. HCHO (formaldehyde) 9" Lacticacid 27' Na-succinate' 20" The pH value of the bath is adjusted to one'(pH=1),
and the bath is heated to 95 C., whereupon a current,
of 14 volts and a density of 10 amperes per square decim eter treated surface is passed therethrough during 30 seconds. After'the current has been interrupted, the plates are transferred, without rinsing, to a nickel-plating bath similar to that described in Example I. The plates remain in this bath for one hour at a temperature of 96 to 98 0., whereby nickel layers of a thickness of 22 microns and excellent adherence to the base metal are.
obtained on the plates.
Example IV The same treatment as described in Example llliis carried out with an oxidation bath containing 10 g./l
of ethyl alcohol instead'of formaldehyde in the bath solution.
Example V In the same 'treatment 'as describedin Example 111,
formaldehyde is'replaced'in' the oxidation bath by 56- g./l. of neutral, crystalline sodium sulfite, Na SO -7H O' the-oxidation step istcarried outwith the samecurrent density of lflwamperes per square decimeter'oftreated surface, but at a. highervoltage of 18' volts;
It will be understood that while there have :beenflgivefii hereinzcertainispecific examples I of the praetice of this invention; it isznotrintendedi-thereby to havezthis invenw tion limited to or circumscribed by the specific details of materials, proportions or conditions herein specified, in view of the fact that this invention may be modified according to individual preference or conditions Without necessarily departing from the spirit of this disclosure and the scope of the appended claims.
What I claim is:
1. A process for coating a metal surface with nickel, comprising the steps of (a) degreasing and cleaning the surface in a conventional manner, and (b) subjecting the cleaned surface to electrolytic oxidation in a bath capable of providing an oxidizing environment at the anode, said bath containing at least one compound of nickel and at least one reducing agent being a mineral salt selected from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, and (c) coating the oxidic layer thus formed on said surface in a coating bath with a cover layer of nickel.
2. A process as described in claim 1, characterized in that the bath in which said electrolytic oxidation is carried out, comprises an aqueous solution of a salt of nickel.
3. A process as described in claim 1, characterized in that the bath in which said electrolytic oxidation is carried out, com rises an aqueous solution of a complex compound of nickel.
4. A process for coating the metal surface of a body consisting of a metal with nickel, comprising the steps of (a) connecting said body in an electrolytic circuit, (b) immersing said body surface into an electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) electrolytically oxidizing said surface by passing current through said circuit, and (d) coating the oxidic layer thus formed on said surface in a coating bath with a cover layer of nickel.
5. The process as described in claim 4 characterized in that said current passed through said circuit is a direct current.
6. The process as described in claim 4 characterized in that said current passed through said circuit is an alternating current.
7. The process as described in claim 4 characterized in that said current passed through said circuit is an undulatory current.
8. The process as described in claim 4 characterized in that the duration of electrolytically oxidizing said surface varies from a few seconds to one minute.
9. A process for coating the metal surface of a body consisting of a metal with nickel, comprising the steps of (a) connecting said body in an electrolytic circuit, (b) immersing said body surface into an electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) electrolytically oxidizing said surface by passing current through said circuit until an oxidic coating is formed on said body surface which coating is less than 20 microns thick, and (d) coating the oxidic layer thus formed on said surface in a coating bath with a cover layer of nickel.
10. A process for coating the metal surface of a body consisting of a metal with nickel, comprising the steps of (a) connecting said body in an electrolytic circuit, (b) immersing said body surface into an electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) electrolytically oxidizing said surface by passing current through said circuit until an oxidic coating is formed on said body surface which coating has a thickness between 0.1 and 10 microns, and (d) coating the oxidic layer thus formed on said surface in a coating bath with a cover layer of nickel.
11. The process as described in claim 4, characterized in that said reducing agent is a salt of a metal in an inferior valency stage below its full valency according to the Periodic Table.
12. The process as described in claim 4, characterized in that said reducing agent is a salt of a metal in an inferior valency stage below its full valency according to the Periodic Table, selected from the group consisting of the salts of divalent iron, divalent and trivalent titanium, divalent tin, and monovalent copper.
13. A process for plating the metal surface of a body consisting of an easily oxidizable base metal with nickel, comprising the steps of successively (a) connecting said body to the anode of the current source of an electrolytic circuit, (b) immersing said metal surface of said body into an aqueous electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt selected from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) anodically oxidizing said surface by passing current through said circuit so as to deposit an oxidic layer on said surface, and (d) coating the oxidic layer on said surface with a cover layer of nickel.
14. A process as described in claim 13, characterized in that said easily oxidizable metal is a metal selected from the group consisting of aluminum, magnesium, titanium, uranium, zirconium, iron and their alloys.
15. A process for plating the metal surface of a body consisting of an easily oxidizable base metal with nickel, comprising the steps of successively (a) connecting said body to the anode of the current source of an electrolytic circuit, (b) immersing said metal surface of said body into an aqueous electrolytic bath capable of providing an oxidizing environment at the anode and containing at least one compound of nickel and at least one reducing agent being a mineral salt selected from the group consisting of sulfites, thiosulfates, hydrosulfites, arsenites, phosphites, and hypophosphites, (c) anodically oxidizing said surface by passing current through said circuit so as to deposit an oxidic layer on said surface, and (d) coating the oxidic layer on said surface in an electrolytic nickel plating bath having a higher pH value than said reducing agent-containing bath with a cover layer of nickel.
16. A process for the preliminary treatment of the surface of a body of a metal selected from the group consisting of aluminum and aluminum alloys, prior to the plating of said surface with nickel, comprising the steps of (a) connecting said body to the anode of a current source in an electrolytic circuit, (b) immersing said surface into an aqueous bath capable of providing an oxidizing environment at the anode and containing nickel sulfate, an alkali metal hypophosphite, and at least one salt of an organic acid, (0) electrolytically oxidizing said surface by passing current through said circuit until an oxidic coating is formed on said body surface, which coating has a thickness between 0.1 and 10 microns.
References Cited in the file of this patent UNITED STATES PATENTS 1,947,981 Fischer Feb. 20, 1934 2,231,086 Muller et a1 Feb. 11, 1941 2,473,163 McCoy June 14, 1949 2,495,941 Mondolfo Jan. 31, 1950 FOREIGN PATENTS 515,648 Great Britain Dec. 11, 1939
Claims (1)
1. A PROCESS FOR COATING A METAL SURFACE WITH NICKEL, COMPRISING THE STEPS OF (A) DECREASING AND CLEANING THE SURFACE IN A CONVENTIONAL MANNER, AND (B) SUBJECTING THE CLEANED SURFACE TO ELECTROLYTIC OXIDATION IN A BATH CAPABLE OF PROVIDING AN OXIDIZING ENVIRONMENT AT THE ANODE, SAID BATH CONTAINING AT LEAST ONE COMPOUND OF NICKEL AND AT LEAST ONE REDUCING AGENT BEING A MINERAL SALT SELECTED FROM THE GROUP CONSISTING OF SULFITES, THIOSULFATES, HYDROSULFITES, ARSENITES, PHOSPHITES, AND HYPOPHOSPHITES, AND (C) COATING THE OXIDIC LAYER THUS FORMED ON SAID SURFACE IN COATING BATH WITH A COVER LAYER OF NICKEL.
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US4502924A (en) * | 1981-09-01 | 1985-03-05 | Nippon Steel Corporation | Method for repairing a mold for continuous casting of steel |
US5183500A (en) * | 1991-04-18 | 1993-02-02 | Kosaku & Co., Ltd. | Electroless plating bath composition and method for production thereof |
US5298058A (en) * | 1991-11-28 | 1994-03-29 | C. Uyemura & Co., Ltd. | Electroless copper plating bath |
EP1199385A3 (en) * | 2000-10-19 | 2004-02-04 | CESCOR S.r.l. | Method of coloring titanium and its alloys through anodic oxidation |
CN103898582A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Pretreatment solution for electroplating chromium on surface of magnesium alloy die casting |
CN119056729A (en) * | 2024-11-06 | 2024-12-03 | 泾县信达工贸有限公司 | A method for preparing a special coating for inner cover of an electric rice cooker |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2091934A1 (en) * | 1970-05-15 | 1971-01-21 | Delarue Ets | Treatment of magnesium articles - prior to chrome plating |
JPS5095139A (en) * | 1973-12-27 | 1975-07-29 | ||
DE3124522C2 (en) * | 1981-06-23 | 1983-11-24 | Dornier System Gmbh, 7990 Friedrichshafen | Process for electroless coloring of porous materials |
FR2567913B1 (en) * | 1984-07-18 | 1989-11-10 | Commissariat Energie Atomique | PROCESS FOR PREPARING THE SURFACE OF URANIUM OR ALLOY URANIUM-BASED PARTS |
JPS63140091A (en) * | 1986-12-02 | 1988-06-11 | Kobe Steel Ltd | Improvement of corrosion resistance in electroless ni-p plating substrate for magnetic disk |
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US1947981A (en) * | 1930-11-07 | 1934-02-20 | Siemens Ag | Plating aluminum |
GB515648A (en) * | 1937-10-01 | 1939-12-11 | Ig Farbenindustrie Ag | Improvements in or relating to a method of producing coatings on magnesium or its alloys |
US2231086A (en) * | 1936-04-23 | 1941-02-11 | Sherka Chemical Co Inc | Method of producing oxide coated aluminum and aluminum base alloys and electrolyte therefor |
US2473163A (en) * | 1945-06-25 | 1949-06-14 | Ewald H Mccoy | Plating nickel on aluminum |
US2495941A (en) * | 1946-12-18 | 1950-01-31 | Reynolds Metals Co | Electroplating copper on aluminum |
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DE656663C (en) * | 1936-06-19 | 1938-02-10 | Ver Aluminium Werke Akt Ges | Process for the electrolytic coating of aluminum and aluminum alloys with metals |
US2532283A (en) * | 1947-05-05 | 1950-12-05 | Brenner Abner | Nickel plating by chemical reduction |
NL154931B (en) * | 1949-08-08 | Philips Nv | VACUUM CLEANER UNIT. | |
FR1016580A (en) * | 1950-04-21 | 1952-11-17 | Process of chrome plating aluminum or its alloys | |
US2658839A (en) * | 1951-04-21 | 1953-11-10 | Gen Am Transport | Process of chemical nickel plating |
FR1078895A (en) * | 1952-06-24 | 1954-11-24 | Thomson Houston Comp Francaise | Process for electroplating aluminum |
-
0
- BE BE559886D patent/BE559886A/xx unknown
-
1956
- 1956-08-08 FR FR1157194D patent/FR1157194A/en not_active Expired
-
1957
- 1957-08-06 CH CH4918657A patent/CH363871A/en unknown
- 1957-08-07 GB GB24920/57A patent/GB870060A/en not_active Expired
- 1957-08-07 DE DEP19080A patent/DE1125254B/en active Pending
- 1957-08-07 US US676722A patent/US2965551A/en not_active Expired - Lifetime
Patent Citations (5)
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US1947981A (en) * | 1930-11-07 | 1934-02-20 | Siemens Ag | Plating aluminum |
US2231086A (en) * | 1936-04-23 | 1941-02-11 | Sherka Chemical Co Inc | Method of producing oxide coated aluminum and aluminum base alloys and electrolyte therefor |
GB515648A (en) * | 1937-10-01 | 1939-12-11 | Ig Farbenindustrie Ag | Improvements in or relating to a method of producing coatings on magnesium or its alloys |
US2473163A (en) * | 1945-06-25 | 1949-06-14 | Ewald H Mccoy | Plating nickel on aluminum |
US2495941A (en) * | 1946-12-18 | 1950-01-31 | Reynolds Metals Co | Electroplating copper on aluminum |
Cited By (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3234110A (en) * | 1959-02-06 | 1966-02-08 | Amalgamated Curacao Patents Co | Electrode and method of making same |
US3041259A (en) * | 1959-07-31 | 1962-06-26 | Hanson Van Winkle Munning Co | Cleaning aluminum surfaces |
US3207679A (en) * | 1960-05-03 | 1965-09-21 | American Potash & Chem Corp | Method for electroplating on titanium |
US3309291A (en) * | 1961-07-07 | 1967-03-14 | Lab Dalic | Method of electroplating selected portions of an electrically conductive object |
US3178311A (en) * | 1961-09-25 | 1965-04-13 | Bunker Ramo | Electroless plating process |
US3380151A (en) * | 1962-02-09 | 1968-04-30 | Oakite Prod Inc | Fusion-joining coarse-surfaced high carbon ferrous metals to metals |
US3219557A (en) * | 1962-04-12 | 1965-11-23 | Pacific Scientific Co | Method of producing a rotary coupling |
US3282809A (en) * | 1962-11-07 | 1966-11-01 | Clevite Corp | Iron coating for refractory metal |
US3350285A (en) * | 1963-07-20 | 1967-10-31 | Ngk Insulators Ltd | Method of forming rust-proofing and corrosion-resisting coating on metal surfaces |
US3454473A (en) * | 1963-12-07 | 1969-07-08 | Matsushita Electric Ind Co Ltd | Method for the manufacture of titanium anodic oxidation film capacitors having non-electrolytically plated cathode |
US3340164A (en) * | 1963-12-26 | 1967-09-05 | Sperry Rand Corp | Method of copper plating anodized aluminum |
US3386896A (en) * | 1964-11-05 | 1968-06-04 | Bell Telephone Labor Inc | Electroplasting onto molybdenum surfaces |
US3393134A (en) * | 1965-03-23 | 1968-07-16 | Benno A. Schwartz Jr. | Method of chromium plating |
US3310430A (en) * | 1965-06-30 | 1967-03-21 | Day Company | Electroless copper plating |
US3493474A (en) * | 1966-04-29 | 1970-02-03 | Gen Motors Corp | Aluminum plating process |
US3515650A (en) * | 1966-06-02 | 1970-06-02 | Toyoda Chuo Kenkyusho Kk | Method of electroplating nickel on an aluminum article |
US3533918A (en) * | 1967-04-18 | 1970-10-13 | John C Smith | Method of making electrodes for fuel cells |
US3620777A (en) * | 1968-07-24 | 1971-11-16 | Hooker Chemical Corp | Chromate chemical coating solution for zinc alloy |
US3489657A (en) * | 1968-09-30 | 1970-01-13 | Sylvania Electric Prod | Process for producing solderable aluminum materials |
US3640854A (en) * | 1969-12-10 | 1972-02-08 | Mallory & Co Inc P R | Continuous forming of metal oxides |
US3685582A (en) * | 1971-01-14 | 1972-08-22 | Shell Oil Co | Electroless metal plating techniques for consolidation of incompetent formations |
US4120760A (en) * | 1975-03-20 | 1978-10-17 | Mitsubishi Jukogyo Kabushiki Kaisha | Surface treatment of metals |
US4115211A (en) * | 1975-12-26 | 1978-09-19 | Nihon Kagaku Sangyo Co., Ltd. | Process for metal plating on aluminum and aluminum alloys |
US4293617A (en) * | 1979-12-26 | 1981-10-06 | Gould Inc. | Process for producing strippable copper on an aluminum carrier and the article so obtained |
US4325791A (en) * | 1981-01-07 | 1982-04-20 | The United States Of America As Represented By The United States Department Of Energy | Method for providing uranium articles with a corrosion resistant anodized coating |
US4474651A (en) * | 1981-08-20 | 1984-10-02 | Sumitomo Metal Industries, Ltd. | Oil well casing and tubing joint and production of same |
US4502924A (en) * | 1981-09-01 | 1985-03-05 | Nippon Steel Corporation | Method for repairing a mold for continuous casting of steel |
US5183500A (en) * | 1991-04-18 | 1993-02-02 | Kosaku & Co., Ltd. | Electroless plating bath composition and method for production thereof |
US5298058A (en) * | 1991-11-28 | 1994-03-29 | C. Uyemura & Co., Ltd. | Electroless copper plating bath |
EP1199385A3 (en) * | 2000-10-19 | 2004-02-04 | CESCOR S.r.l. | Method of coloring titanium and its alloys through anodic oxidation |
CN103898582A (en) * | 2013-06-03 | 2014-07-02 | 无锡市锡山区鹅湖镇荡口青荡金属制品厂 | Pretreatment solution for electroplating chromium on surface of magnesium alloy die casting |
CN119056729A (en) * | 2024-11-06 | 2024-12-03 | 泾县信达工贸有限公司 | A method for preparing a special coating for inner cover of an electric rice cooker |
Also Published As
Publication number | Publication date |
---|---|
DE1125254B (en) | 1962-03-08 |
FR1157194A (en) | 1958-05-27 |
CH363871A (en) | 1962-08-15 |
GB870060A (en) | 1961-06-07 |
BE559886A (en) |
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