US20180284605A1 - Acid-cleavable monomer and polymers including the same - Google Patents
Acid-cleavable monomer and polymers including the same Download PDFInfo
- Publication number
- US20180284605A1 US20180284605A1 US15/475,630 US201715475630A US2018284605A1 US 20180284605 A1 US20180284605 A1 US 20180284605A1 US 201715475630 A US201715475630 A US 201715475630A US 2018284605 A1 US2018284605 A1 US 2018284605A1
- Authority
- US
- United States
- Prior art keywords
- group
- unsubstituted
- substituted
- monomer
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000178 monomer Substances 0.000 title claims abstract description 70
- 229920000642 polymer Polymers 0.000 title description 11
- 229920002120 photoresistant polymer Polymers 0.000 claims description 47
- 239000000203 mixture Substances 0.000 claims description 39
- 125000003118 aryl group Chemical group 0.000 claims description 35
- 229920001577 copolymer Polymers 0.000 claims description 29
- 125000000217 alkyl group Chemical group 0.000 claims description 24
- 150000002148 esters Chemical group 0.000 claims description 24
- 239000002904 solvent Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 21
- 125000002950 monocyclic group Chemical group 0.000 claims description 20
- 125000003367 polycyclic group Chemical group 0.000 claims description 20
- 125000000732 arylene group Chemical group 0.000 claims description 19
- 229910052740 iodine Inorganic materials 0.000 claims description 16
- 229910052731 fluorine Inorganic materials 0.000 claims description 15
- 125000003709 fluoroalkyl group Chemical group 0.000 claims description 15
- 150000002596 lactones Chemical class 0.000 claims description 15
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims description 14
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- 229910052717 sulfur Inorganic materials 0.000 claims description 14
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 claims description 11
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 10
- 125000001153 fluoro group Chemical group F* 0.000 claims description 10
- 125000005549 heteroarylene group Chemical group 0.000 claims description 10
- 239000011630 iodine Substances 0.000 claims description 9
- 125000005647 linker group Chemical group 0.000 claims description 9
- 230000005855 radiation Effects 0.000 claims description 9
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 229910052760 oxygen Inorganic materials 0.000 claims description 8
- 125000000923 (C1-C30) alkyl group Chemical group 0.000 claims description 7
- 230000003213 activating effect Effects 0.000 claims description 6
- 125000004946 alkenylalkyl group Chemical group 0.000 claims description 6
- 125000005038 alkynylalkyl group Chemical group 0.000 claims description 6
- 125000004429 atom Chemical group 0.000 claims description 6
- 125000006376 (C3-C10) cycloalkyl group Chemical group 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 5
- JHRWWRDRBPCWTF-OLQVQODUSA-N captafol Chemical compound C1C=CC[C@H]2C(=O)N(SC(Cl)(Cl)C(Cl)Cl)C(=O)[C@H]21 JHRWWRDRBPCWTF-OLQVQODUSA-N 0.000 claims description 5
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims description 4
- 125000006651 (C3-C20) cycloalkyl group Chemical group 0.000 claims description 4
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 150000001450 anions Chemical class 0.000 claims description 4
- 125000002619 bicyclic group Chemical group 0.000 claims description 4
- 125000006347 bis(trifluoromethyl)hydroxymethyl group Chemical group [H]OC(*)(C(F)(F)F)C(F)(F)F 0.000 claims description 4
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 4
- 125000004428 fluoroalkoxy group Chemical group 0.000 claims description 4
- 150000002825 nitriles Chemical class 0.000 claims description 4
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims description 4
- 125000005085 alkoxycarbonylalkoxy group Chemical group 0.000 claims description 3
- 125000005078 alkoxycarbonylalkyl group Chemical group 0.000 claims description 3
- 125000004104 aryloxy group Chemical group 0.000 claims description 3
- 125000000000 cycloalkoxy group Chemical group 0.000 claims description 3
- 125000004407 fluoroaryl group Chemical group 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 150000002891 organic anions Chemical class 0.000 claims description 3
- 125000004036 acetal group Chemical group 0.000 claims description 2
- 125000000129 anionic group Chemical group 0.000 claims description 2
- 125000005348 fluorocycloalkyl group Chemical group 0.000 claims description 2
- 229910052736 halogen Inorganic materials 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- 125000004356 hydroxy functional group Chemical group O* 0.000 claims description 2
- 229940124530 sulfonamide Drugs 0.000 claims description 2
- 150000003456 sulfonamides Chemical class 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 36
- 0 CC.[1*]C([2*])(C)OC(=O)C(=C)C Chemical compound CC.[1*]C([2*])(C)OC(=O)C(=C)C 0.000 description 17
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 16
- 239000000243 solution Substances 0.000 description 15
- 239000000047 product Substances 0.000 description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 10
- 239000002253 acid Substances 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 8
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- -1 heteroaromatic hydrocarbon Chemical class 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000009102 absorption Effects 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 239000012074 organic phase Substances 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 4
- 125000002733 (C1-C6) fluoroalkyl group Chemical group 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KOWXKIHEBFTVRU-UHFFFAOYSA-N CC.CC Chemical compound CC.CC KOWXKIHEBFTVRU-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 4
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 4
- YQHHCMVUMULAPZ-UHFFFAOYSA-N [CH2+]C Chemical compound [CH2+]C YQHHCMVUMULAPZ-UHFFFAOYSA-N 0.000 description 4
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 4
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 4
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 4
- 229960004592 isopropanol Drugs 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000012299 nitrogen atmosphere Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- MLRVZFYXUZQSRU-UHFFFAOYSA-N 1-chlorohexane Chemical compound CCCCCCCl MLRVZFYXUZQSRU-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- IJXOXCPWYPPKOC-UHFFFAOYSA-N 2-(3-iodophenyl)propan-2-ol Chemical compound CC(C)(O)C1=CC=CC(I)=C1 IJXOXCPWYPPKOC-UHFFFAOYSA-N 0.000 description 2
- CCWAZPWWLAITNK-UHFFFAOYSA-N 2-(4-iodophenyl)butan-2-ol Chemical compound CCC(C)(O)C1=CC=C(I)C=C1 CCWAZPWWLAITNK-UHFFFAOYSA-N 0.000 description 2
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- 239000007818 Grignard reagent Substances 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- TUVYSBJZBYRDHP-UHFFFAOYSA-N acetic acid;methoxymethane Chemical compound COC.CC(O)=O TUVYSBJZBYRDHP-UHFFFAOYSA-N 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 235000019270 ammonium chloride Nutrition 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012230 colorless oil Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 239000012527 feed solution Substances 0.000 description 2
- 150000004795 grignard reagents Chemical class 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 125000001072 heteroaryl group Chemical group 0.000 description 2
- 125000000592 heterocycloalkyl group Chemical group 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 2
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 2
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 2
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 125000001624 naphthyl group Chemical group 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000000746 purification Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229960001866 silicon dioxide Drugs 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229920001897 terpolymer Polymers 0.000 description 2
- 238000004809 thin layer chromatography Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- OCAJMURFVZWFPX-UHFFFAOYSA-N (4-iodophenyl)-phenylmethanone Chemical compound C1=CC(I)=CC=C1C(=O)C1=CC=CC=C1 OCAJMURFVZWFPX-UHFFFAOYSA-N 0.000 description 1
- SKYXLDSRLNRAPS-UHFFFAOYSA-N 1,2,4-trifluoro-5-methoxybenzene Chemical compound COC1=CC(F)=C(F)C=C1F SKYXLDSRLNRAPS-UHFFFAOYSA-N 0.000 description 1
- 125000002030 1,2-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([*:2])C([H])=C1[H] 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- SPSPIUSUWPLVKD-UHFFFAOYSA-N 2,3-dibutyl-6-methylphenol Chemical compound CCCCC1=CC=C(C)C(O)=C1CCCC SPSPIUSUWPLVKD-UHFFFAOYSA-N 0.000 description 1
- PGYJSURPYAAOMM-UHFFFAOYSA-N 2-ethenoxy-2-methylpropane Chemical compound CC(C)(C)OC=C PGYJSURPYAAOMM-UHFFFAOYSA-N 0.000 description 1
- WKLPCKJCKWZSTF-UHFFFAOYSA-N 3-ethenoxy-1-naphthalen-2-ylpropan-1-one Chemical compound C1=CC=CC2=CC(C(=O)CCOC=C)=CC=C21 WKLPCKJCKWZSTF-UHFFFAOYSA-N 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- KZUFEAUMQSHPAX-UHFFFAOYSA-N C.C.C.C.C1=CC=C([SH](C2=CC=CC=C2)C2=CC=CC=C2)C=C1.C1=CC=C([SH](C2=CC=CC=C2)C2=CC=CC=C2)C=C1.C1=CC=C([SH]2C3=C(C=CC=C3)C3=C2C=CC=C3)C=C1.C1=CC=C([SH]2C3=C(C=CC=C3)C3=C2C=CC=C3)C=C1.CC.CC.CC.CC.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1=CC=C(O)C=C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1=CC=C(O)C=C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1 Chemical compound C.C.C.C.C1=CC=C([SH](C2=CC=CC=C2)C2=CC=CC=C2)C=C1.C1=CC=C([SH](C2=CC=CC=C2)C2=CC=CC=C2)C=C1.C1=CC=C([SH]2C3=C(C=CC=C3)C3=C2C=CC=C3)C=C1.C1=CC=C([SH]2C3=C(C=CC=C3)C3=C2C=CC=C3)C=C1.CC.CC.CC.CC.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1=CC=C(O)C=C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1=CC=C(O)C=C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1 KZUFEAUMQSHPAX-UHFFFAOYSA-N 0.000 description 1
- XWMCCTDGFVUEAX-UHFFFAOYSA-N C.C.C.C.CC.CC.CC.CC.CC(C(=O)OC1=CC=C(O)C=C1)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C(=O)OC1CCOC1=O)C(C)(C)C(=O)OC(C)(C)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C)C(=O)OC1=CC=C(O)C=C1)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C)C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C1=CC=CC=C1.CC(C1=CC=CC=C1)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C(=O)OC1CCOC1=O)C(C)(C)C(=O)OC(C)(C)C1=CC=CC=C1 Chemical compound C.C.C.C.CC.CC.CC.CC.CC(C(=O)OC1=CC=C(O)C=C1)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C(=O)OC1CCOC1=O)C(C)(C)C(=O)OC(C)(C)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C)C(=O)OC1=CC=C(O)C=C1)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C)C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C1=CC=CC=C1.CC(C1=CC=CC=C1)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C(=O)OC1CCOC1=O)C(C)(C)C(=O)OC(C)(C)C1=CC=CC=C1 XWMCCTDGFVUEAX-UHFFFAOYSA-N 0.000 description 1
- AJQXBNCNXIOXCF-UHFFFAOYSA-N C.C.C.C.CC.CC.CC.CC.CC(C)(C)C1=CC=C([SH]2C3=C(C=CC=C3)C3=C2C=CC=C3)C=C1.CC(C)(C)C1=CC=C([SH]2C3=C(C=CC=C3)C3=C2C=CC=C3)C=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1=CC=C(O)C=C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1=CC=C(O)C=C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CCC1(OC(=O)COC2=C(C)C=C([SH]3C4=C(C=CC=C4)C4=C3C=CC=C4)C=C2C)CCCC1.CCC1(OC(=O)COC2=C(C)C=C([SH]3C4=C(C=CC=C4)C4=C3C=CC=C4)C=C2C)CCCC1 Chemical compound C.C.C.C.CC.CC.CC.CC.CC(C)(C)C1=CC=C([SH]2C3=C(C=CC=C3)C3=C2C=CC=C3)C=C1.CC(C)(C)C1=CC=C([SH]2C3=C(C=CC=C3)C3=C2C=CC=C3)C=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1=CC=C(O)C=C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1=CC=C(O)C=C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CC(C)(OC(=O)C(C)(C)C(C)(C(=O)OC1CCOC1=O)C(C)(C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1)C(C)(C)C(=O)OCC(F)(F)S(=O)(=O)O)C1=CC=CC=C1.CCC1(OC(=O)COC2=C(C)C=C([SH]3C4=C(C=CC=C4)C4=C3C=CC=C4)C=C2C)CCCC1.CCC1(OC(=O)COC2=C(C)C=C([SH]3C4=C(C=CC=C4)C4=C3C=CC=C4)C=C2C)CCCC1 AJQXBNCNXIOXCF-UHFFFAOYSA-N 0.000 description 1
- DVZKVBCOGFVKAJ-UHFFFAOYSA-M C.C=C(C)C(=O)OCC(F)(F)S(=O)(=O)[O-].CCC1(OC(=O)COC2=C(C)C=C([SH]3C4=C(C=CC=C4)C4=C3/C=C\C=C/4)C=C2C)CCCC1 Chemical compound C.C=C(C)C(=O)OCC(F)(F)S(=O)(=O)[O-].CCC1(OC(=O)COC2=C(C)C=C([SH]3C4=C(C=CC=C4)C4=C3/C=C\C=C/4)C=C2C)CCCC1 DVZKVBCOGFVKAJ-UHFFFAOYSA-M 0.000 description 1
- NPBSECKVKKURGK-UHFFFAOYSA-N C1=CC=C([S+]2C3=CC=CC=C3C3=C2C=CC=C3)C=C1.CC.CC.CC Chemical compound C1=CC=C([S+]2C3=CC=CC=C3C3=C2C=CC=C3)C=C1.CC.CC.CC NPBSECKVKKURGK-UHFFFAOYSA-N 0.000 description 1
- HFMQNXIZICESPK-UHFFFAOYSA-N C1=CC=C([S+]2C3=CC=CC=C3C3=C2C=CC=C3)C=C1.CC.CC.CC.CC.C[C+](C)C.[CH2+]C1=CC=CC=C1 Chemical compound C1=CC=C([S+]2C3=CC=CC=C3C3=C2C=CC=C3)C=C1.CC.CC.CC.CC.C[C+](C)C.[CH2+]C1=CC=CC=C1 HFMQNXIZICESPK-UHFFFAOYSA-N 0.000 description 1
- CNBOOHSCFIQUDR-UHFFFAOYSA-M C1CCOC1.C=C(C)C(=O)Cl.C=C(C)C(=O)OC(C)(C)C1=CC(I)=CC=C1.CC(C)(O)C1=CC(I)=CC=C1.CCN(CC)CC.COC(=O)C1=CC(I)=CC=C1.C[Mg]Br Chemical compound C1CCOC1.C=C(C)C(=O)Cl.C=C(C)C(=O)OC(C)(C)C1=CC(I)=CC=C1.CC(C)(O)C1=CC(I)=CC=C1.CCN(CC)CC.COC(=O)C1=CC(I)=CC=C1.C[Mg]Br CNBOOHSCFIQUDR-UHFFFAOYSA-M 0.000 description 1
- DVOLWSGSBRJYST-UHFFFAOYSA-M C1CCOC1.C=C(C)C(=O)Cl.C=C(C)C(=O)OC(C)(CC)C1=CC=C(I)C=C1.CC(=O)C1=CC=C(I)C=C1.CCC(C)(O)C1=CC=C(I)C=C1.CCN(CC)CC.CC[Mg]Br Chemical compound C1CCOC1.C=C(C)C(=O)Cl.C=C(C)C(=O)OC(C)(CC)C1=CC=C(I)C=C1.CC(=O)C1=CC=C(I)C=C1.CCC(C)(O)C1=CC=C(I)C=C1.CCN(CC)CC.CC[Mg]Br DVOLWSGSBRJYST-UHFFFAOYSA-M 0.000 description 1
- ZJBRSBIRIKEVCQ-UHFFFAOYSA-N C=C(C)C(=O)OC(C)(C)C1=C(I)C=CC=C1I.C=C(C)C(=O)OC(C)(C)C1=CC(I)=C(I)C(I)=C1.C=C(C)C(=O)OC(C)(C)C1=CC(I)=CC(I)=C1.C=C(C)C(=O)OC(C)(C)C1=CC=C(I)C=C1.C=C(C)C(=O)OC(C)(CC)C1=C(I)C=CC=C1I.C=C(C)C(=O)OC(C)(CC)C1=CC(I)=C(I)C(I)=C1.C=C(C)C(=O)OC(C)(CC)C1=CC(I)=CC(I)=C1.C=C(C)C(=O)OC(C)(CC)C1=CC=C(I)C=C1.C=C(C)C(=O)OC(C)(CCC(F)(F)F)C1=C(I)C=CC=C1I.C=C(C)C(=O)OC(C)(CCC(F)(F)F)C1=CC(I)=C(I)C(I)=C1.C=C(C)C(=O)OC(C)(CCC(F)(F)F)C1=CC(I)=CC(I)=C1.C=C(C)C(=O)OC(C)(CCC(F)(F)F)C1=CC=C(I)C=C1 Chemical compound C=C(C)C(=O)OC(C)(C)C1=C(I)C=CC=C1I.C=C(C)C(=O)OC(C)(C)C1=CC(I)=C(I)C(I)=C1.C=C(C)C(=O)OC(C)(C)C1=CC(I)=CC(I)=C1.C=C(C)C(=O)OC(C)(C)C1=CC=C(I)C=C1.C=C(C)C(=O)OC(C)(CC)C1=C(I)C=CC=C1I.C=C(C)C(=O)OC(C)(CC)C1=CC(I)=C(I)C(I)=C1.C=C(C)C(=O)OC(C)(CC)C1=CC(I)=CC(I)=C1.C=C(C)C(=O)OC(C)(CC)C1=CC=C(I)C=C1.C=C(C)C(=O)OC(C)(CCC(F)(F)F)C1=C(I)C=CC=C1I.C=C(C)C(=O)OC(C)(CCC(F)(F)F)C1=CC(I)=C(I)C(I)=C1.C=C(C)C(=O)OC(C)(CCC(F)(F)F)C1=CC(I)=CC(I)=C1.C=C(C)C(=O)OC(C)(CCC(F)(F)F)C1=CC=C(I)C=C1 ZJBRSBIRIKEVCQ-UHFFFAOYSA-N 0.000 description 1
- PPXAHQRRLKQYTG-UHFFFAOYSA-N C=C(C)C(=O)OC(C)(C)C1=CC=CC=C1 Chemical compound C=C(C)C(=O)OC(C)(C)C1=CC=CC=C1 PPXAHQRRLKQYTG-UHFFFAOYSA-N 0.000 description 1
- LGXAHUGTDYIECK-UHFFFAOYSA-N C=C(C)C(=O)OC.CC.O=C1CCCO1 Chemical compound C=C(C)C(=O)OC.CC.O=C1CCCO1 LGXAHUGTDYIECK-UHFFFAOYSA-N 0.000 description 1
- FSUGPWNNWXNJDM-UHFFFAOYSA-N C=C(C)C(=O)OC1=CC(C(C)(O)C(F)(F)F)=CC(C(C)(O)C(F)(F)F)=C1.C=C(C)C(=O)OC1=CC=C(O)C(C(C)(O)C(F)(F)F)=C1.C=C(C)C(=O)OC1=CC=C(O)C=C1.C=C(C)C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(C)(O)C(F)(F)F)C1.C=C(C)C(=O)OC1CCC(O)C(C(C)(O)C(F)(F)F)C1.C=C(C)C(=O)OCC1=CC=C2C=CC=CC2=C1.C=CC1=CC(C(C)(O)C(F)(F)F)=CC(C(C)(O)C(F)(F)F)=C1.C=CC1=CC=C(C(C)(O)C(F)(F)F)C=C1.C=CC1=CC=C2C=C(O)C=CC2=C1.CO Chemical compound C=C(C)C(=O)OC1=CC(C(C)(O)C(F)(F)F)=CC(C(C)(O)C(F)(F)F)=C1.C=C(C)C(=O)OC1=CC=C(O)C(C(C)(O)C(F)(F)F)=C1.C=C(C)C(=O)OC1=CC=C(O)C=C1.C=C(C)C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(C)(O)C(F)(F)F)C1.C=C(C)C(=O)OC1CCC(O)C(C(C)(O)C(F)(F)F)C1.C=C(C)C(=O)OCC1=CC=C2C=CC=CC2=C1.C=CC1=CC(C(C)(O)C(F)(F)F)=CC(C(C)(O)C(F)(F)F)=C1.C=CC1=CC=C(C(C)(O)C(F)(F)F)C=C1.C=CC1=CC=C2C=C(O)C=CC2=C1.CO FSUGPWNNWXNJDM-UHFFFAOYSA-N 0.000 description 1
- UQKRHMAMQARXQO-UHFFFAOYSA-N C=C(C)C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1 Chemical compound C=C(C)C(=O)OC1CC(C(C)(O)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1 UQKRHMAMQARXQO-UHFFFAOYSA-N 0.000 description 1
- SEKPHIMZHWLWHO-UHFFFAOYSA-N C=C(C)C(=O)OC1CC2OC1C1C(=C)OCC21.C=C(C)C(=O)OC1CCCC1=O.C=C(C)C(=O)OCC(=O)OC1C2CC3C(=O)OC1C3C2.C=C1CC(OC(=O)C(=C)C)CO1 Chemical compound C=C(C)C(=O)OC1CC2OC1C1C(=C)OCC21.C=C(C)C(=O)OC1CCCC1=O.C=C(C)C(=O)OCC(=O)OC1C2CC3C(=O)OC1C3C2.C=C1CC(OC(=O)C(=C)C)CO1 SEKPHIMZHWLWHO-UHFFFAOYSA-N 0.000 description 1
- QSUJHKWXLIQKEY-UHFFFAOYSA-N C=C(C)C(=O)OC1CCOC1=O Chemical compound C=C(C)C(=O)OC1CCOC1=O QSUJHKWXLIQKEY-UHFFFAOYSA-N 0.000 description 1
- MHNNAWXXUZQSNM-UHFFFAOYSA-N C=C(C)CC Chemical compound C=C(C)CC MHNNAWXXUZQSNM-UHFFFAOYSA-N 0.000 description 1
- OVKGQDODLCXITH-UHFFFAOYSA-N CC(F)(F)C(F)(F)CCOC(=O)C12CC3CC(CC(O)(C3)C1)C2.CCC1(OC(=O)COC2=C(C)C=C([SH]3C4=C(C=CC=C4)C4=C3C=CC=C4)C=C2C)CCCC1 Chemical compound CC(F)(F)C(F)(F)CCOC(=O)C12CC3CC(CC(O)(C3)C1)C2.CCC1(OC(=O)COC2=C(C)C=C([SH]3C4=C(C=CC=C4)C4=C3C=CC=C4)C=C2C)CCCC1 OVKGQDODLCXITH-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000007877 V-601 Substances 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 125000002777 acetyl group Chemical class [H]C([H])([H])C(*)=O 0.000 description 1
- JIMXXGFJRDUSRO-UHFFFAOYSA-N adamantane-1-carboxylic acid Chemical compound C1C(C2)CC3CC2CC1(C(=O)O)C3 JIMXXGFJRDUSRO-UHFFFAOYSA-N 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000005577 anthracene group Chemical group 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013058 crude material Substances 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 229910000449 hafnium oxide Inorganic materials 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 125000002346 iodo group Chemical group I* 0.000 description 1
- 125000000686 lactone group Chemical group 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- NXPHGHWWQRMDIA-UHFFFAOYSA-M magnesium;carbanide;bromide Chemical compound [CH3-].[Mg+2].[Br-] NXPHGHWWQRMDIA-UHFFFAOYSA-M 0.000 description 1
- FRIJBUGBVQZNTB-UHFFFAOYSA-M magnesium;ethane;bromide Chemical compound [Mg+2].[Br-].[CH2-]C FRIJBUGBVQZNTB-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VHRYZQNGTZXDNX-UHFFFAOYSA-N methacryloyl chloride Chemical compound CC(=C)C(Cl)=O VHRYZQNGTZXDNX-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- NPXOIGSBRLCOSD-UHFFFAOYSA-N methyl 3-iodobenzoate Chemical compound COC(=O)C1=CC=CC(I)=C1 NPXOIGSBRLCOSD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 1
- 125000001792 phenanthrenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C=CC12)* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 125000006836 terphenylene group Chemical group 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/52—Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
- C07C69/533—Monocarboxylic acid esters having only one carbon-to-carbon double bond
- C07C69/54—Acrylic acid esters; Methacrylic acid esters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/62—Halogen-containing esters
- C07C69/65—Halogen-containing esters of unsaturated acids
- C07C69/653—Acrylic acid esters; Methacrylic acid esters; Haloacrylic acid esters; Halomethacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/22—Esters containing halogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/28—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
- C08F220/283—Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F220/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
- G03F7/327—Non-aqueous alkaline compositions, e.g. anhydrous quaternary ammonium salts
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/38—Treatment before imagewise removal, e.g. prebaking
-
- C08F2220/283—
Definitions
- the present disclosure generally relates to polymer compositions including a photoacid generator. Specifically, the disclosure provides copolymers derived from an iodine-containing monomer.
- EUVL Extreme ultraviolet lithography
- the extremely short wavelength (13.4 nm) is a key enabling factor for high resolution required at multiple technology generations.
- EUVL consists of resist technology, exposure tool technology, and mask technology.
- the key challenges are EUV source power and throughput. Any improvement in EUV power source will directly impact the currently strict resist sensitivity specification.
- EUV light absorption cross-section and secondary electron generation yield are critical factors for EUV sensitivity.
- One way to increase EUV photoresist sensitivity is by increasing its absorption cross-section at 13.5 nm, which is an atomic property of the material that can be theoretically calculated using known atomic absorptions.
- Typical atoms that make up resist materials, such as carbon, oxygen, hydrogen, and nitrogen possess very weak absorption at 13.5 nm.
- a fluorine atom has slightly higher absorption and has been used in the search for high EUV absorbing photoresist.
- Iodine has remarkably high absorption cross-section at EUV radiation.
- Recent patent application JP 2015-161823 discloses iodine-containing monomers and corresponding polymers useful for lithographic processing. However, none of these monomers could be readily cleaved by acid. Thus, there remains a need in new iodine-containing high absorbing monomers to produce iodine-containing polymer which can be useful for lithographic processing.
- An embodiment provides a monomer having formula (I):
- R a is H, F, —CN, C 1-10 alkyl group, or C 1-10 fluoroalkyl group;
- R 1 and R 2 are each independently an unsubstituted or substituted C 1-10 linear or branched alkyl group, an unsubstituted or substituted C 3-10 cycloalkyl group, an unsubstituted or substituted C 3-10 alkenylalkyl group, an unsubstituted or substituted C 3-10 alkynylalkyl group, or an unsubstituted or substituted C 6-30 aryl group, wherein R 1 and R 2 optionally include at least one linking group selected from O and S, and wherein R 1 and R 2 together optionally form a ring;
- n 1, 2, 3, 4, 5, 6, 7, 8, and 9.
- Another embodiment provides a copolymer including a polymerized product of the monomer having formula (I) and at least one unsaturated monomer which is different from the monomer having formula (I).
- Yet another embodiment provides a copolymer including a polymerized product of a photoacid generator monomer including a polymerizable group and the monomer having formula (I).
- first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings of the present embodiments.
- “About” or “approximately” as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “about” can mean within one or more standard deviations, or within ⁇ 30%, 20%, 10%, 5% of the stated value.
- alkyl group refers to a group derived from a straight or branched chain saturated aliphatic hydrocarbon having the specified number of carbon atoms and having a valence of at least one.
- fluoroalkyl group refers to an alkyl group in which one or more hydrogen atoms are replaced with fluorine atoms.
- alkoxy group refers to “alkyl-O—”, wherein the term “alkyl” has the same meaning as described above.
- fluoroalkoxy group refers to an alkoxy group in which one or more hydrogen atoms are replaced with fluorine atoms.
- cycloalkyl group refers to a monovalent group having one or more saturated rings in which all ring members are carbon.
- alkenyl group refers to a straight or branched chain, monovalent hydrocarbon group having at least one carbon-carbon double bond.
- alkenylalkyl group refers to “alkenyl-alkyl-”, wherein the terms “alkenyl” and “alkyl” have the same meaning as described above.
- alkynyl group refers to a straight or branched chain, monovalent hydrocarbon group having at least one carbon-carbon triple bond.
- alkynylalkyl group refers to “alkynyl-alkyl-”, wherein the terms “alkynyl” and “alkyl” have the same meaning as described above.
- aryl refers to an aromatic or heteroaromatic hydrocarbon containing at least one ring and having the specified number of carbon atoms.
- aryl may be construed as including a group with an aromatic or heteroaromatic ring fused to at least one cycloalkyl or heterocycloalkyl ring.
- the “aryl” group may include one or more heteroatom(s) independently selected from nitrogen (N), oxygen (O), P (phosphorus), and sulfur (S).
- aryloxy group refers to “aryl-O—”, wherein the term “aryl” has the same meaning as described above.
- aralkyl group refers to a substituted or unsubstituted aryl group covalently linked to an alkyl group that is linked to a compound.
- alkylene group refers to a straight or branched saturated aliphatic hydrocarbon group having a valence of at least two, optionally substituted with one or more substituents where indicated, provided that the valence of the alkylene group is not exceeded.
- cycloalkylene group refers to a cyclic hydrocarbon group having a valence of at least two, optionally substituted with one or more substituents where indicated, provided that the valence of the cycloalkylene group is not exceeded.
- arylene group refers to a functional group having a valence of at least two obtained by removal of two hydrogens in an aromatic ring, optionally substituted with one or more substituents where indicated, provided that the valence of the arylene group is not exceeded.
- aralkylene group refers to a functional group having a valence of at least two obtained by removal of two hydrogens from the alkyl-substituted aromatic compound, optionally substituted with one or more substituents where indicated, provided that the valence of the aralkylene group is not exceeded.
- heteroarylene group refers to a functional group having a valence of at least two obtained by removal of two hydrogens in a heteroaromatic ring, optionally substituted with one or more substituents where indicated, provided that the valence of the heteroarylene group is not exceeded.
- An embodiment of the present disclosure provides a monomer having formula (I):
- R a may be H, F, —CN, C 1-10 alkyl group, or C 1-10 fluoroalkyl group;
- R 1 and R 2 may be each independently an unsubstituted or substituted C 1-10 linear or branched alkyl group, an unsubstituted or substituted C 3-10 cycloalkyl group, an unsubstituted or substituted C 3-10 alkenylalkyl group, an unsubstituted or substituted C 3-10 alkynylalkyl group, or an unsubstituted or substituted C 6-30 aryl group, wherein R 1 and R 2 optionally include at least one linking group selected from O and S, and wherein R 1 and R 2 may together optionally form a ring;
- n may be 1, 2, 3, 4, 5, 6, 7, 8, and 9.
- the C 6-30 arylene group may be a monocyclic C 6-30 arylene group, a fused bicyclic C 6-30 arylene group, or a singly bonded C 6-30 arylene group.
- the C 6-30 arylene group may be a 1,2-phenylene group, a 1,3-phenylene group, and a 1,4-phenylene group.
- the fused bicyclic C 6-30 arylene group may be a disubstituted naphthalene group, a disubstituted anthracene group, or a disubstituted phenanthrene group.
- the singly bonded C 6-30 arylene group may be a disubstituted biphenylene group or a disubstituted terphenylene group.
- the C 3-30 heteroarylene group may be a monocyclic C 3-30 heteroarylene group, a fused bicyclic C 3-30 heteroarylene group, or a singly bonded C 3-30 heteroarylene group.
- each of R 1 and R 2 may be an unsubstituted or substituted C 1-10 linear or branched alkyl groups.
- both R 1 and R 2 may be an unsubstituted or substituted linear C 1-10 alkyl group
- one of R 1 and R 2 may be an unsubstituted or substituted linear C 1-10 alkyl group
- the other one of R 1 and R 2 may be an unsubstituted or substituted branched C 1-10 alkyl group
- both R 1 and R 2 may be an unsubstituted or substituted branched C 1-10 alkyl group.
- one of R 1 and R 2 may be an unsubstituted C 1-10 linear or branched alkyl group and the other one of R 1 and R 2 may be a C 1-10 linear or branched alkyl group substituted with at least one fluorine atom.
- Each of R 1 and R 2 may include a linking group selected from O and S.
- the linking group may be present either inside of R 1 and R 2 or at the site of their connection to a neighboring group.
- groups R 1 and R 2 when the linking group is present inside are CH 3 OCH 2 —, CH 3 OCH 2 CH 2 —, CH 3 CH 2 OCH 2 —.
- Examples of R 1 and R 2 when the linking group is present at the site of their connection are CH 3 O—, CH 3 CH 2 O—, and CH 3 CH 2 CH 2 O—.
- groups R 1 and R 2 may together optionally form a ring.
- R 1 and R 2 may form a cyclopentane ring.
- R 1 and R 2 may form a cyclohexane ring.
- n represents a number of iodine atoms attached to the divalent group
- n may vary depending on the nature of this group and may be 1, 2, 3, 4, 5, 6, 7, 8, or 9.
- n may be 1, 2, or 3.
- Another embodiment provides a copolymer including a polymerized product of the monomer having formula (I) and at least one unsaturated monomer which is different from the monomer having formula (I):
- the unsaturated monomer which is different from the monomer having formula (I) may be a base-soluble monomer, a lactone-containing monomer, or a combination thereof.
- the unsaturated monomer may be a base-soluble monomer of formula (II):
- Q 1 may be an ester-containing or non-ester containing group selected from C 1-20 alkyl, C 3-20 cycloalkyl, C 6-20 aryl, and C 7-20 aralkyl group. In an embodiment, where an ester is included, the ester may form a connective link between Q 1 and the point of attachment to the double bond. In this way, where Q 1 is an ester group, formula (II) may be a (meth)acrylate monomer. In another embodiment, where an ester is not included, Q 1 may be aromatic, so that formula (II) may be, for example, a styrenic monomer or vinyl naphthoic monomer. Q 1 may be fluorinated or non-fluorinated. Further in formula (II), a may be an integer of 1 to 3, for example, a may be 1 or 2.
- W may be a base-reactive group including —C( ⁇ O)—OH; —C(CF 3 ) 2 OH; —NH—SO 2 —Y 1 where Y 1 is F or C 1-4 perfluoroalkyl; an aromatic —OH; or an adduct of any of the foregoing with a vinyl ether.
- Q is non-aromatic (e.g., where formula (II) includes a (meth)acrylate structure having an ester linked alkyl or cycloalkyl group Q)
- W may be —C(CF 3 ) 2 OH.
- W may be OH or —C(CF 3 ) 2 OH.
- any of the base-reactive groups may further be protected by an acid decomposable acetal leaving group (e.g., having a generic structure —O—CH(R′)—O—R′′ where R′ may be a methyl, ethyl, or other alkyl group)
- an acid decomposable acetal leaving group e.g., having a generic structure —O—CH(R′)—O—R′′ where R′ may be a methyl, ethyl, or other alkyl group
- Such groups are adducts of a vinyl ether, such as, for example, ethyl vinyl ether, propyl vinyl ether, t-butyl vinyl ether, cyclohexylvinyl ether, the 2-vinyloxyethyl ester of 1-adamantane carboxylic acid, 2-naphthoyl ethyl vinyl ether, or other such vinyl ethers.
- W may be a base reactive group including a fluorinated ester of the form —C( ⁇ O)—OCF 2 R or —OC( ⁇ O)CF 2 R, wherein R is a C 1-10 alkyl group or a C 1-10 fluoroalkyl group.
- Exemplary base-soluble monomers having formula (II) may include:
- R a is H, F, C 1-6 alkyl, or C 1-6 fluoroalkyl.
- the unsaturated monomer may also be a lactone-containing monomer of formula (III):
- L may be a monocyclic, polycyclic, or fused polycyclic C 4-20 lactone-containing group. Such lactone groups may be included to improve both adhesion of the polymer to a substrate, and to moderate the dissolution of the polymer in a base developer.
- L may be a monocyclic C 4-6 lactone which is attached to a (meth)acrylate moiety through a monocycle ring carbon; or L may be a C 6-10 fused polycyclic lactone based on a norbornane-type structure.
- a lactone-containing monomer may have formula (IIIa):
- R a is H, F, C 1-6 alkyl, or C 1-6 fluoroalkyl, R is a C 1-10 alkyl, cycloalkyl, or heterocycloalkyl, and
- w is an integer of 0 to 6.
- R may be separate or may be attached to the lactone ring and/or one or more R groups, and that the methacrylate moiety may be attached to the lactone ring directly, or indirectly through R.
- Exemplary lactone-containing monomers of formulae (III) and (IIIa) may include:
- R a is H, F, C 1-6 alkyl, or C 1-6 fluoroalkyl.
- the copolymer may include a polymerized product having the following structure:
- k, l, m, and q represent mole fractions of the corresponding repeating units
- variable n is the same as described above.
- Another embodiment further provides a photoresist composition including the above copolymer and a non-polymerizable photoacid generator monomer having formula G + A ⁇ , wherein A ⁇ is a non-polymerizable organic anion and G + has formula (IV):
- X may be S or I
- each R c may be halogenated or non-halogenated, and is independently a C 1-30 alkyl group; a polycyclic or monocyclic C 3-30 cycloalkyl group; a polycyclic or monocyclic C 4-30 aryl group,
- R c groups wherein when X is S, one of the R c groups is optionally attached to one adjacent R c group by a single bond, and z is 2 or 3, and
- cation G + may have formula (V), (VI), or (VII):
- X is I or S
- R h , R i , R j , and R k are unsubstituted or substituted and are each independently hydroxy, nitrile, halogen, C 1-30 alkyl, C 1-30 fluoroalkyl, C 3-30 cycloalkyl, C 1-30 fluorocycloalkyl, C 1-30 alkoxy, C 3-30 alkoxycarbonylalkyl, C 3-30 alkoxycarbonylalkoxy, C 3-30 cycloalkoxy, C 5-30 cycloalkoxycarbonylalkyl, C 5-30 cycloalkoxycarbonylalkoxy, C 1-30 fluoroalkoxy, C 3-30 fluoroalkoxycarbonylalkyl, C 3-30 fluoroalkoxycarbonylalkoxy, C 3-30 fluorocycloalkoxy, C 5-30 fluorocycloalkoxycarbonylalkyl, C 5-30 fluorocycloalkoxycarbonylalkoxy, C 6-30 ary
- Ar 1 and Ar 2 are independently C 10-30 fused or singly bonded polycyclic aryl groups
- R 1 is a lone pair of electrons where X is I, or a C 6-20 aryl group where X is S;
- p is an integer of 2 or 3, wherein when X is I, p is 2, and where X is S, p is 3,
- q and r are each independently an integer from 0 to 5
- s and t are each independently an integer from 0 to 4.
- R h , R i , R j , and R k may be an acid-cleavable group.
- the acid-cleavable group may be (i) a tertiary C 1-30 alkoxy (for example, a tert-butoxy group), a tertiary C 3-30 cycloalkoxy group, a tertiary C 1-30 fluoroalkoxy group, (ii) a tertiary C 3-30 alkoxycarbonylalkyl group, a tertiary C 5-30 cycloalkoxycarbonylalkyl group, a tertiary C 3-30 fluoroalkoxycarbonylalkyl group, (iii) a tertiary C 3-30 alkoxycarbonylalkoxy group, a tertiary C 5-30 cycloalkoxycarbonylalkoxy group, a tertiary C 5-30 cycloalkoxycarbonylalkoxy group
- the photoresist composition including the copolymer and the non-polymerizable photoacid generator monomer as disclosed herein may be used to provide a layer including the photoresist.
- a coated substrate may be formed from the photoresist composition.
- Such a coated substrate includes: (a) a substrate having one or more layers to be patterned on a surface thereof; and (b) a layer of the photoresist composition over the one or more layers to be patterned.
- Substrates may be any dimension and shape, and are preferably those useful for photolithography, such as silicon, silicon dioxide, silicon-on-insulator (SOI), strained silicon, gallium arsenide, coated substrates including those coated with silicon nitride, silicon oxynitride, titanium nitride, tantalum nitride, ultrathin gate oxides such as hafnium oxide, metal or metal coated substrates including those coated with titanium, tantalum, copper, aluminum, tungsten, alloys thereof, and combinations thereof.
- the surfaces of substrates herein include critical dimension layers to be patterned including, for example, one or more gate-level layers or other critical dimension layers on the substrates for semiconductor manufacture.
- Such substrates may preferably include silicon, SOI, strained silicon, and other such substrate materials, formed as circular wafers having dimensions such as, for example, 20 cm, 30 cm, or larger in diameter, or other dimensions useful for wafer fabrication production.
- a method of forming an electronic device includes (a) applying (casting) a layer of the above photoresist composition on a surface of the substrate; (b) pattern-wise exposing the photoresist composition layer to activating radiation; and (c) developing the exposed photoresist composition layer to provide a resist relief image.
- Applying may be accomplished by any suitable method, including spin coating, spray coating, dip coating, doctor blading, or the like. Applying the layer of photoresist is preferably accomplished by spin-coating the photoresist in solvent using a coating track, in which the photoresist is dispensed on a spinning wafer. During dispensing, the wafer may be spun at a speed of up to 4,000 rpm, preferably from about 200 to 3,000 rpm, and more preferably 1,000 to 2,500 rpm. The coated wafer is spun to remove solvent, and baked on a hot plate to remove residual solvent and free volume from the film to make it uniformly dense.
- the casting solvent can be any suitable solvent known to one of ordinary skill in the art.
- the casting solvent can be an aliphatic hydrocarbon (such as hexane, heptane, and the like), an aromatic hydrocarbon (such as toluene, xylene, and the like), a halogenated hydrocarbon (such as dichloromethane, 1,2-dichloroethane, 1-chlorohexane, and the like), an alcohol (such as methanol, ethanol, 1-propanol, iso-propanol, tert-butanol, 2-methyl-2-butanol, 4-methyl-2-pentanol, and the like), water, an ether (such as diethyl ether, tetrahydrofuran, 1,4-dioxane, anisole, and the like), a ketone (such as acetone, methyl ethyl ketone, methyl isobutyl ketone, 2-heptanone, cycl
- Pattern-wise exposure is then carried out using an exposure tool such as a stepper, in which the film is irradiated through a pattern mask and thereby is exposed pattern-wise.
- the method preferably uses advanced exposure tools generating activating radiation at wavelengths capable of high resolution including extreme-ultraviolet (“EUV”) or e-beam radiation.
- EUV extreme-ultraviolet
- e-beam radiation e-beam radiation.
- EUV extreme-ultraviolet
- the resolution of such exposure tools may be less than 30 nm.
- Developing the exposed photoresist layer is then accomplished by treating the exposed layer to a suitable developer capable of selectively removing the exposed portions of the film (where the photoresist is a positive tone) or removing the unexposed portions of the film (where the photoresist is crosslinkable in the exposed regions, i.e., a negative tone).
- the photoresist is a negative tone, based on a polymer having pendant and/or free acid groups or by-products (derived from bound or free PAG following irradiation) that inhibit the dissolution of the nanoparticles, and the developer is preferably solvent based.
- a pattern forms by developing.
- the solvent developer can be any suitable developer known in the art.
- the solvent developer can be an aliphatic hydrocarbon (such as hexane, heptane, and the like), an aromatic hydrocarbon (such as toluene, xylene, and the like), a halogenated hydrocarbon (such as dichloromethane, 1,2-dichloroethane, 1-chlorohexane, and the like), an alcohol (such as methanol, ethanol, 1-propanol, iso-propanol, tert-butanol, 2-methyl-2-butanol, 4-methyl-2-pentanol, and the like), water, an ether (such as diethyl ether, tetrahydrofuran, 1,4-dioxane, anisole, and the like), a ketone (such as acetone, methyl ethyl ketone, methyl isobutyl ketone, 2-heptanone, cyclohexanone, and the like), an ester (such as e
- the solvent developer may be a miscible mixture of solvents, for example, a mixture of an alcohol (iso-propanol) and ketone (acetone).
- solvents for example, a mixture of an alcohol (iso-propanol) and ketone (acetone).
- the choice of the developer solvent depends on a particular photoresist composition and can be readily made by one of ordinary skill in the art based on knowledge and experience.
- the photoresist may, when used in one or more such pattern-forming processes, be used to fabricate electronic and optoelectronic devices such as memory devices, processor chips (CPUs), graphics chips, and other such devices.
- electronic and optoelectronic devices such as memory devices, processor chips (CPUs), graphics chips, and other such devices.
- Yet another embodiment provides a copolymer including a polymerized product of a photoacid generator monomer including a polymerizable group and the monomer having formula (I):
- the photoacid generator monomer including a polymerizable group may be represented by formula (VIII):
- each R a may independently be H, F, C 1-10 alkyl, or C 1-10 fluoroalkyl.
- fluoro or “fluorinated” means that one or more fluorine groups are attached to the associated group.
- fluoroalkyl encompasses monofluoroalkyl, difluoroalkyl, etc., as well as perfluoroalkyl in which substantially all carbon atoms of the alkyl group are substituted with fluorine atoms; similarly, “fluoroaryl” means monofluoroaryl, perfluoroaryl, etc. “Substantially all” in this context means greater than or equal to 90%, preferably greater than or equal to 95%, and still more preferably greater than or equal to 98% of all atoms attached to carbon are fluorine atoms.
- Q 2 is a single bond or an ester-containing or non-ester containing, fluorinated or non-fluorinated group selected from C 1-20 alkyl, C 3-20 cycloalkyl, C 6-20 aryl, and C 7-20 aralkyl.
- an ester is included, the ester forms a connective link between Q 2 and the point of attachment to the double bond.
- formula (VIII) may be a (meth)acrylate monomer.
- Q 2 may be aromatic, so that formula (VIII) may be, for example, a styrenic monomer or vinyl naphthoic monomer.
- A is an ester-containing or non ester-containing, fluorinated or non-fluorinated group selected from C 1-20 alkyl, C 3-20 cycloalkyl, C 6-20 aryl, or C 7-20 aralkyl.
- Useful A groups may include fluorinated aromatic moieties, straight chain fluoroalkyl, or branched fluoroalkyl esters.
- A may be a —[(C(R e ) 2 ) x ( ⁇ O)O] c —(C(R f ) 2 ) y (CF 2 ) z — group, or an o-, m- or p-substituted —C 6 R g 4 — group, where each R e , R f , and R g are each independently H, F, C 1-6 fluoroalkyl, or C 1-6 alkyl, c is 0 or 1, x is an integer of 1 to 10, y and z are independently integers of from 0 to 10, and the sum of y+z is at least 1.
- Z ⁇ is an anionic group including a sulfonate (—SO 3 ⁇ ), the anion of a sulfonamide (—SO 2 (N ⁇ )R′ where R′ is a C 1-10 alkyl or C 6-20 aryl, or the anion of a sulfonimide.
- Z ⁇ is a sulfonimide
- the sulfonimide may be an asymmetric sulfonimide having the general structure A-SO 2 —(N ⁇ )—SO 2 —Y 2 , where A is as described above, and Y 2 is a straight chain or branched C 1-10 fluoroalkyl group.
- the Y 2 group may be a C 1-4 perfluoroalkyl group, which may be derived from the corresponding perfluorinated alkanesulfonic acid, such as trifluoromethanesulfonic acid or perfluorobutanesulfonic acid.
- the monomer of formula (VIII) may have the structure of formula (VIIIa) or (VIIIb):
- G + may have formula (IV):
- the polymerized product may further include a base-soluble monomer, a lactone-containing monomer, or a combination thereof.
- the base-soluble monomer may be represented by formula (II) described above
- the lactone-containing monomer may be represented by formula (III) described above.
- the copolymer may include a polymerized product having any of the following structures:
- k, l, m, and q represent mole fractions of the corresponding repeating units
- variable n is the same as described above.
- a photoresist composition including the above copolymer and a coated substrate including: (a) a substrate having one or more layers to be patterned on a surface thereof; and (b) a layer of the above photoresist composition over the one or more layers to be patterned.
- Yet another embodiment provides a method of forming an electronic device, including:
- a reaction flask was charged with a solution of 2-(3-iodophenyl)propan-2-ol (5, 32 g. 0.115 mol) in 150 mL of methylene chloride. The solution was cooled to 0° C. Methacryloyl chloride (18.0 g, 0.17 mol) and triethylamine (20 g, 0.20 mol) were added to the reaction flask, and the mixture was stirred at room temperature for 16 h. The organic phase was washed with water (3 ⁇ 100 mL), and the solvent was completely removed under reduced pressure.
- the crude material was dissolved in 150 mL of methylene chloride and washed twice with 100 mL of 0.5 M aqueous solution of sodium carbonate.
- the organic phase was concentrated and passed through a short pad of basic aluminum oxide using methylene chloride/heptane as eluent.
- the solvent fractions that contain the product were collected and the solvents were completely removed under reduced pressure to produce the product as colorless oil. Yield: 34 g (90%).
- Copolymer 1 was prepared from the monomers 4-IPBMA, ⁇ -GBLMA, DiHFA, at a molar feed ratio of 38.5/49.5/12.
- a feed solution was made by dissolving 4-IPBMA (7.97 g, 24.13 mmol), ⁇ -GBLMA (5.21 g, 31.0 mmol) and DiHFA (3.32 g, 7.0 mmol in 45.92 g of propylene glycole monomethyl ether acetate (“PGMEA”).
- PGMEA propylene glycole monomethyl ether acetate
- An initiator solution was prepared by dissolving 1.68 g of the azo initiator dimethyl 2,2′-azobis(2-methylpropionate) (obtained as V-601 from Wako Pure Chemical Industries, Ltd.) in 10.8 g of PGMEA.
- the polymerization was carried out in a 3-neck round bottom flask fitted with a water condenser and a thermometer to monitor the reaction in the flask.
- the reactor was charged with 4-IPBMA (0.46 g, 1.40 mmol), ⁇ -GBLMA (0.38 g, 2.23 mmol), DiHFA (0.67 g, 1.33 mmol) and in 17.52 g of propylene glycole monomethyl ether acetate (“PGMEA”), and the contents were heated to 75° C.
- the feed solution and the initiator solution were fed into the reactor using syringe pumps over a 4 h time period. The contents were then stirred for an additional 2 h.
- the contents were cooled to room temperature, diluted with tetrahydrofuran (“THF”) to 25 weight percent, and precipitated into 10-fold (by weight) of a 7:3 (w/w) mixture of heptane and iso-propanol.
- THF tetrahydrofuran
- the resulting copolymer 1 was isolated by filtration and dried under vacuum at 50° C. for 24 h.
- the polymers set forth in Table 2 were prepared using the similar procedure used to make copolymer 1, except using the monomer types and molar feed ratios as specified in Table 2.
- Photoresist compositions containing copolymers 1 to 3 were each independently formulated as summarized in Table 3. Component amounts in Table 3 are based on total solids, excluding solvents.
- the non-polymeric photoacid generator was ECPPDBT AdOH-TFBS, which has the chemical structure:
- the quencher was trioctylamine (TOA).
- the surfactant was a fluorinated surfactant obtained as POLYFOXTM PF-656.
- compositions of two inventive and one comparative photoresist compositions are summarized in Table 3, where component amounts are expressed as weight percent based on total solids, excluding solvents.
- Contrast curve measurements with EUV exposure source (13.5 nm) were obtained using a LithoTech Japan EUVES-9000 flood exposure tool.
- the resist was spin coated onto either an organic underlayer or a silicon wafer and baked at 110° C. for 90 seconds to form a 40-50 nm thick photoresist film.
- the resist was exposed to an increasing dose of 13.5 nm radiation in a step-wise manner, post-exposure baked at 100° C. for 60 seconds, and developed with 0.26 N aqueous tetramethylammonium hydroxide solution for 60 seconds to form a relief image pattern of exposed and non-exposed areas. Thickness was measured at each exposed area using a KLA Thermawave-7 ellipsometer and plotted vs. dose.
- Dose-to-clear values were calculated at 10% or less remaining film thickness.
- photoresists 1 and 2 which contain terpolymer with 4-IPBMA or 3-IPPMA acid cleavable repeat units have higher photospeed under EUV exposure compared to the comparative photoresist 4 which includes terpolymer with “iodo-free” PPMA acid cleavable repeat units.
- Photoresist 3 which contains polymer-bound PAG that includes 3-IPPMA has a higher photospeed under EUV exposure compared to the comparative photoresist 5 which includes polymer-bound PAG that includes “iodo free” PPMA acid cleavable repeat units.
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
- The present disclosure generally relates to polymer compositions including a photoacid generator. Specifically, the disclosure provides copolymers derived from an iodine-containing monomer.
- Extreme ultraviolet lithography (“EUVL”) is one of the leading technologies options to replace optical lithography for volume semiconductor manufacturing at feature sizes <20 nm. The extremely short wavelength (13.4 nm) is a key enabling factor for high resolution required at multiple technology generations. In addition, the overall system concept—scanning exposure, projection optics, mask format, and resist technology—is quite similar to that used for current optical technologies. Like previous lithography generations, EUVL consists of resist technology, exposure tool technology, and mask technology. The key challenges are EUV source power and throughput. Any improvement in EUV power source will directly impact the currently strict resist sensitivity specification. Indeed, a major issue in EUVL imaging is resist sensitivity, the lower the sensitivity, the greater the source power that is needed or the longer the exposure time that is required to fully expose the resist. The lower the power levels, the more noise affects the line edge roughness (LER) of the printed lines.
- Improving EUV sensitivity is a key enabling factor. It has been shown that EUV light absorption cross-section and secondary electron generation yield are critical factors for EUV sensitivity. One way to increase EUV photoresist sensitivity is by increasing its absorption cross-section at 13.5 nm, which is an atomic property of the material that can be theoretically calculated using known atomic absorptions. Typical atoms that make up resist materials, such as carbon, oxygen, hydrogen, and nitrogen possess very weak absorption at 13.5 nm. A fluorine atom has slightly higher absorption and has been used in the search for high EUV absorbing photoresist.
- Iodine has remarkably high absorption cross-section at EUV radiation. Recent patent application JP 2015-161823 discloses iodine-containing monomers and corresponding polymers useful for lithographic processing. However, none of these monomers could be readily cleaved by acid. Thus, there remains a need in new iodine-containing high absorbing monomers to produce iodine-containing polymer which can be useful for lithographic processing.
- An embodiment provides a monomer having formula (I):
- wherein in formula (I):
- Ra is H, F, —CN, C1-10 alkyl group, or C1-10 fluoroalkyl group;
- R1 and R2 are each independently an unsubstituted or substituted C1-10 linear or branched alkyl group, an unsubstituted or substituted C3-10 cycloalkyl group, an unsubstituted or substituted C3-10 alkenylalkyl group, an unsubstituted or substituted C3-10 alkynylalkyl group, or an unsubstituted or substituted C6-30 aryl group, wherein R1 and R2 optionally include at least one linking group selected from O and S, and wherein R1 and R2 together optionally form a ring;
- represents a monocyclic or polycyclic unsubstituted or substituted C6-30 arylene group or a monocyclic or polycyclic unsubstituted or substituted C3-30 heteroarylene group, wherein “*” and “*′” indicate a point of attachment to a neighboring group or atom,
- “I” represents iodine, and
- n is 1, 2, 3, 4, 5, 6, 7, 8, and 9.
- Another embodiment provides a copolymer including a polymerized product of the monomer having formula (I) and at least one unsaturated monomer which is different from the monomer having formula (I).
- Yet another embodiment provides a copolymer including a polymerized product of a photoacid generator monomer including a polymerizable group and the monomer having formula (I).
- Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the present exemplary embodiments may have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the exemplary embodiments are merely described below, by referring to the figures, to explain aspects of the present description. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.
- It will be understood that when an element is referred to as being “on” another element, it can be directly in contact with the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.
- It will be understood that, although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and/or sections, these elements, components, regions, layers, and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings of the present embodiments.
- The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise.
- It will be further understood that the terms “comprises” and/or “comprising,” or “includes” and/or “including” when used in this specification, specify the presence of stated features, regions, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components, and/or groups thereof.
- “About” or “approximately” as used herein is inclusive of the stated value and means within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, considering the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system). For example, “about” can mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value.
- Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
- As used herein, when a definition is not otherwise provided, the term “alkyl group” refers to a group derived from a straight or branched chain saturated aliphatic hydrocarbon having the specified number of carbon atoms and having a valence of at least one.
- As used herein, when a definition is not otherwise provided, the term “fluoroalkyl group” refers to an alkyl group in which one or more hydrogen atoms are replaced with fluorine atoms.
- As used herein, when a definition is not otherwise provided, the term “alkoxy group” refers to “alkyl-O—”, wherein the term “alkyl” has the same meaning as described above.
- As used herein, when a definition is not otherwise provided, the term “fluoroalkoxy group” refers to an alkoxy group in which one or more hydrogen atoms are replaced with fluorine atoms.
- As used herein, when a definition is not otherwise provided, the term “cycloalkyl group” refers to a monovalent group having one or more saturated rings in which all ring members are carbon.
- As used herein, when a definition is not otherwise provided, the term “alkenyl group” refers to a straight or branched chain, monovalent hydrocarbon group having at least one carbon-carbon double bond.
- As used herein, when a definition is not otherwise provided, the term “alkenylalkyl group” refers to “alkenyl-alkyl-”, wherein the terms “alkenyl” and “alkyl” have the same meaning as described above.
- As used herein, when a definition is not otherwise provided, the term “alkynyl group” refers to a straight or branched chain, monovalent hydrocarbon group having at least one carbon-carbon triple bond.
- As used herein, when a definition is not otherwise provided, the term “alkynylalkyl group” refers to “alkynyl-alkyl-”, wherein the terms “alkynyl” and “alkyl” have the same meaning as described above.
- As used herein, when a definition is not otherwise provided, the term “aryl”, which is used alone or in combination, refers to an aromatic or heteroaromatic hydrocarbon containing at least one ring and having the specified number of carbon atoms. The term “aryl” may be construed as including a group with an aromatic or heteroaromatic ring fused to at least one cycloalkyl or heterocycloalkyl ring. The “aryl” group may include one or more heteroatom(s) independently selected from nitrogen (N), oxygen (O), P (phosphorus), and sulfur (S).
- As used herein, when a definition is not otherwise provided, the term “aryloxy group” refers to “aryl-O—”, wherein the term “aryl” has the same meaning as described above.
- As used herein, when a definition is not otherwise provided, the term “aralkyl group” refers to a substituted or unsubstituted aryl group covalently linked to an alkyl group that is linked to a compound.
- As used herein, when a definition is not otherwise provided, the term “alkylene group” refers to a straight or branched saturated aliphatic hydrocarbon group having a valence of at least two, optionally substituted with one or more substituents where indicated, provided that the valence of the alkylene group is not exceeded.
- As used herein, when a definition is not otherwise provided, the term “cycloalkylene group” refers to a cyclic hydrocarbon group having a valence of at least two, optionally substituted with one or more substituents where indicated, provided that the valence of the cycloalkylene group is not exceeded.
- As used herein, when a definition is not otherwise provided, the term “arylene group” refers to a functional group having a valence of at least two obtained by removal of two hydrogens in an aromatic ring, optionally substituted with one or more substituents where indicated, provided that the valence of the arylene group is not exceeded.
- As used herein, when a definition is not otherwise provided, the term “aralkylene group” refers to a functional group having a valence of at least two obtained by removal of two hydrogens from the alkyl-substituted aromatic compound, optionally substituted with one or more substituents where indicated, provided that the valence of the aralkylene group is not exceeded.
- As used herein, when a definition is not otherwise provided, the term “heteroarylene group” refers to a functional group having a valence of at least two obtained by removal of two hydrogens in a heteroaromatic ring, optionally substituted with one or more substituents where indicated, provided that the valence of the heteroarylene group is not exceeded.
- An embodiment of the present disclosure provides a monomer having formula (I):
- In formula (I),
- Ra may be H, F, —CN, C1-10 alkyl group, or C1-10 fluoroalkyl group;
- R1 and R2 may be each independently an unsubstituted or substituted C1-10 linear or branched alkyl group, an unsubstituted or substituted C3-10 cycloalkyl group, an unsubstituted or substituted C3-10 alkenylalkyl group, an unsubstituted or substituted C3-10 alkynylalkyl group, or an unsubstituted or substituted C6-30 aryl group, wherein R1 and R2 optionally include at least one linking group selected from O and S, and wherein R1 and R2 may together optionally form a ring;
- may represent a monocyclic or polycyclic unsubstituted or substituted C6-30 arylene group or a monocyclic or polycyclic unsubstituted or substituted C3-30 heteroarylene group, wherein “*” and “*′” indicate a point of attachment to a neighboring group or atom,
- “I” represents iodine, and
- n may be 1, 2, 3, 4, 5, 6, 7, 8, and 9.
- In the above monomer, the C6-30 arylene group may be a monocyclic C6-30 arylene group, a fused bicyclic C6-30 arylene group, or a singly bonded C6-30 arylene group. The C6-30 arylene group may be a 1,2-phenylene group, a 1,3-phenylene group, and a 1,4-phenylene group. The fused bicyclic C6-30 arylene group may be a disubstituted naphthalene group, a disubstituted anthracene group, or a disubstituted phenanthrene group. The singly bonded C6-30 arylene group may be a disubstituted biphenylene group or a disubstituted terphenylene group. The C3-30 heteroarylene group may be a monocyclic C3-30 heteroarylene group, a fused bicyclic C3-30 heteroarylene group, or a singly bonded C3-30 heteroarylene group.
- In an embodiment, each of R1 and R2 may be an unsubstituted or substituted C1-10 linear or branched alkyl groups. For example, both R1 and R2 may be an unsubstituted or substituted linear C1-10 alkyl group, one of R1 and R2 may be an unsubstituted or substituted linear C1-10 alkyl group and the other one of R1 and R2 may be an unsubstituted or substituted branched C1-10 alkyl group, or both R1 and R2 may be an unsubstituted or substituted branched C1-10 alkyl group. In an example, one of R1 and R2 may be an unsubstituted C1-10 linear or branched alkyl group and the other one of R1 and R2 may be a C1-10 linear or branched alkyl group substituted with at least one fluorine atom.
- Each of R1 and R2 may include a linking group selected from O and S. The linking group may be present either inside of R1 and R2 or at the site of their connection to a neighboring group. Examples of groups R1 and R2 when the linking group is present inside are CH3OCH2—, CH3OCH2CH2—, CH3CH2OCH2—. Examples of R1 and R2 when the linking group is present at the site of their connection are CH3O—, CH3CH2O—, and CH3CH2CH2O—.
- In an embodiment, groups R1 and R2 may together optionally form a ring. For example, when R1 is methyl and R2 is n-propyl, R1 and R2 may form a cyclopentane ring. In another example, when R1 is ethyl and R2 is n-propyl, R1 and R2 may form a cyclohexane ring.
- In formula (I), the variable n represents a number of iodine atoms attached to the divalent group
- The number of iodine atoms n may vary depending on the nature of this group and may be 1, 2, 3, 4, 5, 6, 7, 8, or 9. For example, n may be 1, 2, or 3.
- Specific examples of the monomer having formula (I) may be represented by the following chemical formulae:
- Another embodiment provides a copolymer including a polymerized product of the monomer having formula (I) and at least one unsaturated monomer which is different from the monomer having formula (I):
- In formula (I), Ra, R1, R2,
- “I”, and n are the same as described above.
- The unsaturated monomer which is different from the monomer having formula (I) may be a base-soluble monomer, a lactone-containing monomer, or a combination thereof.
- For example, the unsaturated monomer may be a base-soluble monomer of formula (II):
- In formula (II), Q1 may be an ester-containing or non-ester containing group selected from C1-20 alkyl, C3-20 cycloalkyl, C6-20 aryl, and C7-20 aralkyl group. In an embodiment, where an ester is included, the ester may form a connective link between Q1 and the point of attachment to the double bond. In this way, where Q1 is an ester group, formula (II) may be a (meth)acrylate monomer. In another embodiment, where an ester is not included, Q1 may be aromatic, so that formula (II) may be, for example, a styrenic monomer or vinyl naphthoic monomer. Q1 may be fluorinated or non-fluorinated. Further in formula (II), a may be an integer of 1 to 3, for example, a may be 1 or 2.
- Also in formula (II), W may be a base-reactive group including —C(═O)—OH; —C(CF3)2OH; —NH—SO2—Y1 where Y1 is F or C1-4 perfluoroalkyl; an aromatic —OH; or an adduct of any of the foregoing with a vinyl ether. In an embodiment, where Q is non-aromatic (e.g., where formula (II) includes a (meth)acrylate structure having an ester linked alkyl or cycloalkyl group Q), W may be —C(CF3)2OH. In another embodiment, where Q is aromatic (e.g., where Q is either ester-linked or non-ester linked and is an aromatic group such as phenyl or naphthyl), W may be OH or —C(CF3)2OH. It is contemplated that any of the base-reactive groups may further be protected by an acid decomposable acetal leaving group (e.g., having a generic structure —O—CH(R′)—O—R″ where R′ may be a methyl, ethyl, or other alkyl group) Such groups are adducts of a vinyl ether, such as, for example, ethyl vinyl ether, propyl vinyl ether, t-butyl vinyl ether, cyclohexylvinyl ether, the 2-vinyloxyethyl ester of 1-adamantane carboxylic acid, 2-naphthoyl ethyl vinyl ether, or other such vinyl ethers.
- W may be a base reactive group including a fluorinated ester of the form —C(═O)—OCF2R or —OC(═O)CF2R, wherein R is a C1-10 alkyl group or a C1-10 fluoroalkyl group.
- Exemplary base-soluble monomers having formula (II) may include:
- or a combination including at least one of the foregoing, wherein Ra is H, F, C1-6 alkyl, or C1-6 fluoroalkyl.
- The unsaturated monomer may also be a lactone-containing monomer of formula (III):
- In formula (III), L may be a monocyclic, polycyclic, or fused polycyclic C4-20 lactone-containing group. Such lactone groups may be included to improve both adhesion of the polymer to a substrate, and to moderate the dissolution of the polymer in a base developer. In an embodiment, L may be a monocyclic C4-6 lactone which is attached to a (meth)acrylate moiety through a monocycle ring carbon; or L may be a C6-10 fused polycyclic lactone based on a norbornane-type structure.
- In an embodiment, a lactone-containing monomer may have formula (IIIa):
- wherein
- Ra is H, F, C1-6 alkyl, or C1-6 fluoroalkyl, R is a C1-10 alkyl, cycloalkyl, or heterocycloalkyl, and
- w is an integer of 0 to 6.
- It will be appreciated in formula (IIIa) that R may be separate or may be attached to the lactone ring and/or one or more R groups, and that the methacrylate moiety may be attached to the lactone ring directly, or indirectly through R.
- Exemplary lactone-containing monomers of formulae (III) and (IIIa) may include:
- or a combination including at least one of the foregoing, wherein Ra is H, F, C1-6 alkyl, or C1-6 fluoroalkyl.
- In an embodiment, the copolymer may include a polymerized product having the following structure:
- wherein
- k, l, m, and q represent mole fractions of the corresponding repeating units, and
- “I” is iodine and variable n is the same as described above.
- Another embodiment further provides a photoresist composition including the above copolymer and a non-polymerizable photoacid generator monomer having formula G+A−, wherein A− is a non-polymerizable organic anion and G+ has formula (IV):
- In formula (IV),
- X may be S or I,
- each Rc may be halogenated or non-halogenated, and is independently a C1-30 alkyl group; a polycyclic or monocyclic C3-30 cycloalkyl group; a polycyclic or monocyclic C4-30 aryl group,
- wherein when X is S, one of the Rc groups is optionally attached to one adjacent Rc group by a single bond, and z is 2 or 3, and
- wherein when X is I, z is 2, or when X is S, z is 3.
- For example, cation G+ may have formula (V), (VI), or (VII):
- wherein
- X is I or S,
- Rh, Ri, Rj, and Rk are unsubstituted or substituted and are each independently hydroxy, nitrile, halogen, C1-30 alkyl, C1-30 fluoroalkyl, C3-30 cycloalkyl, C1-30 fluorocycloalkyl, C1-30 alkoxy, C3-30 alkoxycarbonylalkyl, C3-30 alkoxycarbonylalkoxy, C3-30 cycloalkoxy, C5-30 cycloalkoxycarbonylalkyl, C5-30 cycloalkoxycarbonylalkoxy, C1-30 fluoroalkoxy, C3-30 fluoroalkoxycarbonylalkyl, C3-30 fluoroalkoxycarbonylalkoxy, C3-30 fluorocycloalkoxy, C5-30 fluorocycloalkoxycarbonylalkyl, C5-30 fluorocycloalkoxycarbonylalkoxy, C6-30 aryl, C6-30 fluoroaryl, C6-30 aryloxy, or C6-30 fluoroaryloxy, each of which is unsubstituted or substituted;
- Ar1 and Ar2 are independently C10-30 fused or singly bonded polycyclic aryl groups;
- R1 is a lone pair of electrons where X is I, or a C6-20 aryl group where X is S;
- p is an integer of 2 or 3, wherein when X is I, p is 2, and where X is S, p is 3,
- q and r are each independently an integer from 0 to 5, and
- s and t are each independently an integer from 0 to 4.
- In formulae (V), (VI), or (VII), at least one of Rh, Ri, Rj, and Rk may be an acid-cleavable group. In an embodiment, the acid-cleavable group may be (i) a tertiary C1-30 alkoxy (for example, a tert-butoxy group), a tertiary C3-30 cycloalkoxy group, a tertiary C1-30 fluoroalkoxy group, (ii) a tertiary C3-30 alkoxycarbonylalkyl group, a tertiary C5-30 cycloalkoxycarbonylalkyl group, a tertiary C3-30 fluoroalkoxycarbonylalkyl group, (iii) a tertiary C3-30 alkoxycarbonylalkoxy group, a tertiary C5-30 cycloalkoxycarbonylalkoxy group, a tertiary C3-30 fluoroalkoxycarbonylalkoxy group, or (iv) a C2-30 acetal group including moiety —O—C(R11R12)—O— (wherein R11R12 are each independently hydrogen or a C1-30 alkyl group).
- The photoresist composition including the copolymer and the non-polymerizable photoacid generator monomer as disclosed herein may be used to provide a layer including the photoresist. A coated substrate may be formed from the photoresist composition. Such a coated substrate includes: (a) a substrate having one or more layers to be patterned on a surface thereof; and (b) a layer of the photoresist composition over the one or more layers to be patterned.
- Substrates may be any dimension and shape, and are preferably those useful for photolithography, such as silicon, silicon dioxide, silicon-on-insulator (SOI), strained silicon, gallium arsenide, coated substrates including those coated with silicon nitride, silicon oxynitride, titanium nitride, tantalum nitride, ultrathin gate oxides such as hafnium oxide, metal or metal coated substrates including those coated with titanium, tantalum, copper, aluminum, tungsten, alloys thereof, and combinations thereof. Preferably, the surfaces of substrates herein include critical dimension layers to be patterned including, for example, one or more gate-level layers or other critical dimension layers on the substrates for semiconductor manufacture. Such substrates may preferably include silicon, SOI, strained silicon, and other such substrate materials, formed as circular wafers having dimensions such as, for example, 20 cm, 30 cm, or larger in diameter, or other dimensions useful for wafer fabrication production.
- Further, a method of forming an electronic device includes (a) applying (casting) a layer of the above photoresist composition on a surface of the substrate; (b) pattern-wise exposing the photoresist composition layer to activating radiation; and (c) developing the exposed photoresist composition layer to provide a resist relief image.
- Applying may be accomplished by any suitable method, including spin coating, spray coating, dip coating, doctor blading, or the like. Applying the layer of photoresist is preferably accomplished by spin-coating the photoresist in solvent using a coating track, in which the photoresist is dispensed on a spinning wafer. During dispensing, the wafer may be spun at a speed of up to 4,000 rpm, preferably from about 200 to 3,000 rpm, and more preferably 1,000 to 2,500 rpm. The coated wafer is spun to remove solvent, and baked on a hot plate to remove residual solvent and free volume from the film to make it uniformly dense.
- The casting solvent can be any suitable solvent known to one of ordinary skill in the art. For example, the casting solvent can be an aliphatic hydrocarbon (such as hexane, heptane, and the like), an aromatic hydrocarbon (such as toluene, xylene, and the like), a halogenated hydrocarbon (such as dichloromethane, 1,2-dichloroethane, 1-chlorohexane, and the like), an alcohol (such as methanol, ethanol, 1-propanol, iso-propanol, tert-butanol, 2-methyl-2-butanol, 4-methyl-2-pentanol, and the like), water, an ether (such as diethyl ether, tetrahydrofuran, 1,4-dioxane, anisole, and the like), a ketone (such as acetone, methyl ethyl ketone, methyl isobutyl ketone, 2-heptanone, cyclohexanone, and the like), an ester (such as ethyl acetate, n-butyl acetate, propylene glycol monomethyl ether acetate (“PGMEA”), ethyl lactate, ethyl acetoacetate, and the like), a lactone (such as γ-butyrolactone, ε-caprolactone, and the like), a nitrile (such as acetonitrile, propionitrile, and the like), an aprotic bipolar solvent (such as dimethylsulfoxide, dimethylformamide, and the like), or a combination thereof. The choice of the casting solvent depends on a particular photoresist composition and can be readily made by one of ordinary skill in the art based on knowledge and experience.
- Pattern-wise exposure is then carried out using an exposure tool such as a stepper, in which the film is irradiated through a pattern mask and thereby is exposed pattern-wise. The method preferably uses advanced exposure tools generating activating radiation at wavelengths capable of high resolution including extreme-ultraviolet (“EUV”) or e-beam radiation. It will be appreciated that exposure using the activating radiation decomposes the PAG in the exposed areas and generates acid and decomposition by-products, and that the acid or the by-products then effectuates a chemical change in the polymer and nanoparticles (deblocking the acid sensitive group to generate a base-soluble group, or alternatively, catalyzing a crosslinking reaction in the exposed areas). The resolution of such exposure tools may be less than 30 nm.
- Developing the exposed photoresist layer is then accomplished by treating the exposed layer to a suitable developer capable of selectively removing the exposed portions of the film (where the photoresist is a positive tone) or removing the unexposed portions of the film (where the photoresist is crosslinkable in the exposed regions, i.e., a negative tone). Preferably, the photoresist is a negative tone, based on a polymer having pendant and/or free acid groups or by-products (derived from bound or free PAG following irradiation) that inhibit the dissolution of the nanoparticles, and the developer is preferably solvent based. A pattern forms by developing. The solvent developer can be any suitable developer known in the art. For example, the solvent developer can be an aliphatic hydrocarbon (such as hexane, heptane, and the like), an aromatic hydrocarbon (such as toluene, xylene, and the like), a halogenated hydrocarbon (such as dichloromethane, 1,2-dichloroethane, 1-chlorohexane, and the like), an alcohol (such as methanol, ethanol, 1-propanol, iso-propanol, tert-butanol, 2-methyl-2-butanol, 4-methyl-2-pentanol, and the like), water, an ether (such as diethyl ether, tetrahydrofuran, 1,4-dioxane, anisole, and the like), a ketone (such as acetone, methyl ethyl ketone, methyl isobutyl ketone, 2-heptanone, cyclohexanone, and the like), an ester (such as ethyl acetate, n-butyl acetate, propylene glycol monomethyl ether acetate (“PGMEA”), ethyl lactate, ethyl acetoacetate, and the like), a lactone (such as γ-butyrolactone, ε-caprolactone, and the like), a nitrile (such as acetonitrile, propionitrile, and the like), an aprotic bipolar solvent (such as dimethylsulfoxide, dimethylformamide, and the like), or a combination thereof. In an embodiment, the solvent developer may be a miscible mixture of solvents, for example, a mixture of an alcohol (iso-propanol) and ketone (acetone). The choice of the developer solvent depends on a particular photoresist composition and can be readily made by one of ordinary skill in the art based on knowledge and experience.
- The photoresist may, when used in one or more such pattern-forming processes, be used to fabricate electronic and optoelectronic devices such as memory devices, processor chips (CPUs), graphics chips, and other such devices.
- Yet another embodiment provides a copolymer including a polymerized product of a photoacid generator monomer including a polymerizable group and the monomer having formula (I):
- In formula (I), Ra, R1, R2,
- “I”, and n are the same as described above.
- The photoacid generator monomer including a polymerizable group may be represented by formula (VIII):
- In formula (VIII), each Ra may independently be H, F, C1-10 alkyl, or C1-10 fluoroalkyl. As used throughout this specification, “fluoro” or “fluorinated” means that one or more fluorine groups are attached to the associated group. For example, by this definition and unless otherwise specified, “fluoroalkyl” encompasses monofluoroalkyl, difluoroalkyl, etc., as well as perfluoroalkyl in which substantially all carbon atoms of the alkyl group are substituted with fluorine atoms; similarly, “fluoroaryl” means monofluoroaryl, perfluoroaryl, etc. “Substantially all” in this context means greater than or equal to 90%, preferably greater than or equal to 95%, and still more preferably greater than or equal to 98% of all atoms attached to carbon are fluorine atoms.
- In formula (VIII), Q2 is a single bond or an ester-containing or non-ester containing, fluorinated or non-fluorinated group selected from C1-20 alkyl, C3-20 cycloalkyl, C6-20 aryl, and C7-20 aralkyl. For example, where an ester is included, the ester forms a connective link between Q2 and the point of attachment to the double bond. In this way, where Q2 is an ester group, formula (VIII) may be a (meth)acrylate monomer. Where an ester is not included, Q2 may be aromatic, so that formula (VIII) may be, for example, a styrenic monomer or vinyl naphthoic monomer.
- Also, in formula (VIII), A is an ester-containing or non ester-containing, fluorinated or non-fluorinated group selected from C1-20 alkyl, C3-20 cycloalkyl, C6-20 aryl, or C7-20 aralkyl. Useful A groups may include fluorinated aromatic moieties, straight chain fluoroalkyl, or branched fluoroalkyl esters. For example, A may be a —[(C(Re)2)x(═O)O]c—(C(Rf)2)y(CF2)z— group, or an o-, m- or p-substituted —C6Rg 4— group, where each Re, Rf, and Rg are each independently H, F, C1-6 fluoroalkyl, or C1-6 alkyl, c is 0 or 1, x is an integer of 1 to 10, y and z are independently integers of from 0 to 10, and the sum of y+z is at least 1.
- Also, in formula (VIII), Z− is an anionic group including a sulfonate (—SO3 −), the anion of a sulfonamide (—SO2(N−)R′ where R′ is a C1-10 alkyl or C6-20 aryl, or the anion of a sulfonimide. Where Z− is a sulfonimide, the sulfonimide may be an asymmetric sulfonimide having the general structure A-SO2—(N−)—SO2—Y2, where A is as described above, and Y2 is a straight chain or branched C1-10 fluoroalkyl group. For example, the Y2 group may be a C1-4 perfluoroalkyl group, which may be derived from the corresponding perfluorinated alkanesulfonic acid, such as trifluoromethanesulfonic acid or perfluorobutanesulfonic acid.
- In an embodiment, the monomer of formula (VIII) may have the structure of formula (VIIIa) or (VIIIb):
- wherein A and Ra are as defined for formula (VIII).
- In formulae (VIII), (VIIIa), and (VIIIb), G+ may have formula (IV):
- wherein X, Rc, and z are the same as described in the embodiments above.
- The polymerized product may further include a base-soluble monomer, a lactone-containing monomer, or a combination thereof. In an embodiment, the base-soluble monomer may be represented by formula (II) described above, and the lactone-containing monomer may be represented by formula (III) described above.
- In an embodiment, the copolymer may include a polymerized product having any of the following structures:
- wherein
- k, l, m, and q represent mole fractions of the corresponding repeating units, and
- “I” is iodine and variable n is the same as described above.
- Another embodiment provides a photoresist composition including the above copolymer and a coated substrate including: (a) a substrate having one or more layers to be patterned on a surface thereof; and (b) a layer of the above photoresist composition over the one or more layers to be patterned.
- Yet another embodiment provides a method of forming an electronic device, including:
- (a) applying a layer of the above photoresist composition on a surface of the substrate;
- (b) pattern-wise exposing the photoresist composition layer to activating radiation; and
- (c) developing the exposed photoresist composition layer to provide a resist relief image.
- Hereinafter, the present disclosure is illustrated in more detail with reference to examples. However, these examples are exemplary, and the present disclosure is not limited thereto.
- The acronyms and chemical structures of monomers used in these examples are presented in Table 1. The synthesis of the monomer designated ECPPDBT F2 is described in U.S. Patent Publication No. 2014/0080058 A1.
- Synthesis of two monomers are described. Grignard reagent solutions used herein were purchased from Aldrich and used as received. The synthetic scheme for the monomer designated 4-IPBMA is summarized in FIG. 1. Under nitrogen atmosphere, an oven dry flask was charged with 100 mL of THF and 100 mL of 0.3 M ethylmagnesium bromide solution in THF. The Grignard solution was cooled to 0° C. and a solution of 4-iodobenzophenone (1, 50.0 g, 0.2 mol) in 200 mL THF was added dropwise under nitrogen atmosphere. The reaction mixture was warmed up to room temperature and stirring was continued for 4 h. An aqueous solution of ammonium chloride (100 mL, 1 M) was added to the reaction mixture. The resulting mixture was extracted twice with 100 mL of methylene chloride. The combined organic phase from the extractions was concentrated under reduced pressure to produce an oily crude product 2-(4-iodophenyl)butan-2-ol (2), which was used in the next step without further purification. Yield: 61 g.
- In the next step, a solution of methacrolyl chloride (6.20 g, 59.3 mol) in 100 mL of methylene chloride was added dropwise to a solution made of 2-(4-iodophenyl)butan-2-ol (15.0 g, 54.2 mol) and triethylamine (6.2 g, 61.3 mol) in 100 mL of methylene chloride at 0° C. After the addition was completed, the mixture was allowed to warm up to room temperature and stirred for 16 h. Thin Layer Chromatography (TLC) test showed incomplete conversion. Additional 0.3 equivalents of methacrolyl chloride and 0.3 equivalents of triethylamine were added, and the mixture was stirred for an additional 12 h. The reaction mixture was washed with water (3×150 mL) and the organic phase was concentrated. The resulting residue was dissolved in 10 mL methylene chloride and passed through a short plug of silica-gel initially using heptane as an eluent followed by methylene chloride to collect fractions containing the product. To the combined fractions of the pure product was added 100 mg of the inhibitor dibutylhydroxytoluene (BHT), and the solvent was fully removed under reduced pressure to produce 10.5 g of the monomer 4-IPBMA (3) and the product was dried. Yield: 10.5 g.
- 1H NMR (CDCl3), δ: 7.75 (d, 2H, ArH), 7.25 (d, 2H, ArH), 6.20 (s, 1H, CH═CH), 5.70 (s, 1H, CH═CH), 2.01 (s, 3H, CH3), 1.84-1.54 (m, 5H, CH3CH2), 0.8 (t, 3H, CH3).
- The synthetic scheme for the monomer designated 3-IPPMA is summarized in FIG. 2.
- To a solution of methyl 3-iodobenzoate (4, 30 g, 0.122 mol) in 250 mL dry THF at 0° C. and under nitrogen atmosphere was slowly added 100 mL of 0.3 M solution of methylmagnesium bromide in ether. After the addition of the Grignard reagent was completed, the mixture was slowly warmed up to room temperature and stirring continued for an additional 3 h. Then, an aqueous solution of ammonium chloride (50 mL, 0.5 M) was added to the reaction mixture. The organic solvent was removed by distillation and the product was extracted with 150 mL methylene chloride. The methylene chloride solution was washed twice with 100 mL of water. The solvent from the organic phase was completely removed by distillation to produce the product 2-(3-iodophenyl)propan-2-ol 5 as colorless oil, which was used in the next step without further purification. Yield: 32 g (95%).
- In the next step, a reaction flask was charged with a solution of 2-(3-iodophenyl)propan-2-ol (5, 32 g. 0.115 mol) in 150 mL of methylene chloride. The solution was cooled to 0° C. Methacryloyl chloride (18.0 g, 0.17 mol) and triethylamine (20 g, 0.20 mol) were added to the reaction flask, and the mixture was stirred at room temperature for 16 h. The organic phase was washed with water (3×100 mL), and the solvent was completely removed under reduced pressure. The crude material was dissolved in 150 mL of methylene chloride and washed twice with 100 mL of 0.5 M aqueous solution of sodium carbonate. The organic phase was concentrated and passed through a short pad of basic aluminum oxide using methylene chloride/heptane as eluent. The solvent fractions that contain the product were collected and the solvents were completely removed under reduced pressure to produce the product as colorless oil. Yield: 34 g (90%).
- 1H NMR (CDCl3), δ: 7.80 (s, 1H, ArH), 7.65 (d, 1H, ArH), 7.46 (d, 1H, ArH), 7.18 (T, 1H, ArH), 6.12 (S, 1H, CH═CH), 5.65 (s, 1H, CH═CH), 2.10 (s, 3H, CH3), 1.70 (s, 6H, 2CH3).
- This example describes the synthesis of three inventive and two comparative copolymers. Copolymer 1 was prepared from the monomers 4-IPBMA, α-GBLMA, DiHFA, at a molar feed ratio of 38.5/49.5/12. A feed solution was made by dissolving 4-IPBMA (7.97 g, 24.13 mmol), α-GBLMA (5.21 g, 31.0 mmol) and DiHFA (3.32 g, 7.0 mmol in 45.92 g of propylene glycole monomethyl ether acetate (“PGMEA”). An initiator solution was prepared by dissolving 1.68 g of the azo initiator dimethyl 2,2′-azobis(2-methylpropionate) (obtained as V-601 from Wako Pure Chemical Industries, Ltd.) in 10.8 g of PGMEA.
- The polymerization was carried out in a 3-neck round bottom flask fitted with a water condenser and a thermometer to monitor the reaction in the flask. The reactor was charged with 4-IPBMA (0.46 g, 1.40 mmol), α-GBLMA (0.38 g, 2.23 mmol), DiHFA (0.67 g, 1.33 mmol) and in 17.52 g of propylene glycole monomethyl ether acetate (“PGMEA”), and the contents were heated to 75° C. The feed solution and the initiator solution were fed into the reactor using syringe pumps over a 4 h time period. The contents were then stirred for an additional 2 h. The contents were cooled to room temperature, diluted with tetrahydrofuran (“THF”) to 25 weight percent, and precipitated into 10-fold (by weight) of a 7:3 (w/w) mixture of heptane and iso-propanol. The resulting copolymer 1 was isolated by filtration and dried under vacuum at 50° C. for 24 h.
- The polymers set forth in Table 2 were prepared using the similar procedure used to make copolymer 1, except using the monomer types and molar feed ratios as specified in Table 2.
-
TABLE 2 Unit 1 Unit 2 Unit 3 Unit 4 Copolymer (mole %) (mole %) (mole %) (mole %) 1 4-IPBMA α-GBLMA DiHFA (38.5) (49.5) (12.0) 2 3-IPPMA α-GBLMA DiHFA (38.5) (49.5) (12) 3 3-IPPMA α-GBLMA DiHFA ECPPDBT F2 (38.0) (46.0) (11) (5.0) 4 (comparative) PPMA α-GBLMA DiHFA (38.5) (49.5) (12) 5 (comparative) PPMA α-GBLMA DiHFA ECPPDBT F2 (38.0) (46.0) (11) (5.0) - Photoresist compositions containing copolymers 1 to 3 were each independently formulated as summarized in Table 3. Component amounts in Table 3 are based on total solids, excluding solvents. The non-polymeric photoacid generator was ECPPDBT AdOH-TFBS, which has the chemical structure:
- The quencher was trioctylamine (TOA). The surfactant was a fluorinated surfactant obtained as POLYFOX™ PF-656.
- Compositions of two inventive and one comparative photoresist compositions are summarized in Table 3, where component amounts are expressed as weight percent based on total solids, excluding solvents.
-
TABLE 3 Photoresist Copolymer PAG Quencher Surfactant 1 65.31% 32.0% ECPPDBT 4% 0.1% Copolymer 1 AdOH-TFBS 2 65.31% 32.0% ECPPDBT 4% 0.1% Copolymer 2 AdOH-TFBS 3 65.31% 32.0% ECPPDBT 4% 0.1 Copolymer 3 AdOH-TFBS 4 65.31% 32.0% ECPPDBT 4% 0.1 (comparative) Copolymer 4 AdOH-TFBS 5 65.31% 32.0% ECPPDBT 4% 0.1% (comparative) Copolymer 4 AdOH-TFBS - All formulations in Table 3 used a propylene glycol monomethyl ether acetate as a solvent. The resists were processed at a soft bake of 110° C. for 90 seconds and a post-exposure base at 100° C. for 60 seconds. Contrast curves at 248 nanometers were generated by coating the resist on a thick organic antireflective layer. The resist was exposed at 248 nanometers on a Canon TELACT tool. After a post-exposure bake, the resists were developed for 60 seconds using 0.26 N tetramethylammonium hydroxide solution. Film thickness values were measured using KLA Tencore OPTIPROBE™ 7341 thermal wave tool. Results from this evaluation are presented in Table 4, where “248 nm E0” is the 248 nanometer exposure dose to clear, expressed in millijoules/centimeter2.
- Contrast curve measurements with EUV exposure source (13.5 nm) were obtained using a LithoTech Japan EUVES-9000 flood exposure tool. The resist was spin coated onto either an organic underlayer or a silicon wafer and baked at 110° C. for 90 seconds to form a 40-50 nm thick photoresist film. The resist was exposed to an increasing dose of 13.5 nm radiation in a step-wise manner, post-exposure baked at 100° C. for 60 seconds, and developed with 0.26 N aqueous tetramethylammonium hydroxide solution for 60 seconds to form a relief image pattern of exposed and non-exposed areas. Thickness was measured at each exposed area using a KLA Thermawave-7 ellipsometer and plotted vs. dose. Dose-to-clear values (E0) were calculated at 10% or less remaining film thickness. As can be seen, photoresists 1 and 2 which contain terpolymer with 4-IPBMA or 3-IPPMA acid cleavable repeat units have higher photospeed under EUV exposure compared to the comparative photoresist 4 which includes terpolymer with “iodo-free” PPMA acid cleavable repeat units. Photoresist 3 which contains polymer-bound PAG that includes 3-IPPMA has a higher photospeed under EUV exposure compared to the comparative photoresist 5 which includes polymer-bound PAG that includes “iodo free” PPMA acid cleavable repeat units.
-
TABLE 4 Photoresist 248 nm E0 (mJ/cm2) EUV E0 (mJ/cm2) 1 9.2 1.7 2 9.4 1.6 3 8.4 1.6 4 (comparative) 7.2 2.1 5 (comparative) 4.8 2.1 - While this disclosure has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (20)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/475,630 US10095109B1 (en) | 2017-03-31 | 2017-03-31 | Acid-cleavable monomer and polymers including the same |
TW107106979A TWI674267B (en) | 2017-03-31 | 2018-03-02 | Acid-cleavable monomer and polymers including the same |
JP2018038262A JP6697498B2 (en) | 2017-03-31 | 2018-03-05 | Acid-cleavable monomer and polymer containing the same |
CN201810184950.2A CN108690164B (en) | 2017-03-31 | 2018-03-07 | Acid-cleavable monomers and polymers comprising the same |
KR1020180030583A KR20180111531A (en) | 2017-03-31 | 2018-03-16 | Acid-cleavable monomer and polymers including the same |
KR1020200032347A KR102162032B1 (en) | 2017-03-31 | 2020-03-17 | Acid-cleavable monomer and polymers including the same |
KR1020200090218A KR20200090702A (en) | 2017-03-31 | 2020-07-21 | Acid-cleavable monomer and polymers including the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/475,630 US10095109B1 (en) | 2017-03-31 | 2017-03-31 | Acid-cleavable monomer and polymers including the same |
Publications (2)
Publication Number | Publication Date |
---|---|
US20180284605A1 true US20180284605A1 (en) | 2018-10-04 |
US10095109B1 US10095109B1 (en) | 2018-10-09 |
Family
ID=63668804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/475,630 Active US10095109B1 (en) | 2017-03-31 | 2017-03-31 | Acid-cleavable monomer and polymers including the same |
Country Status (5)
Country | Link |
---|---|
US (1) | US10095109B1 (en) |
JP (1) | JP6697498B2 (en) |
KR (3) | KR20180111531A (en) |
CN (1) | CN108690164B (en) |
TW (1) | TWI674267B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190094716A1 (en) * | 2017-09-19 | 2019-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Humidity Control in EUV Lithography |
US20210389669A1 (en) * | 2020-06-01 | 2021-12-16 | Sumitomo Chemical Company, Limited | Compound, resin, resist composition and method for producing resist pattern |
US20220119336A1 (en) * | 2018-12-27 | 2022-04-21 | Mitsubishi Gas Chemical Company, Inc. | Compound, (co)polymer, composition, method for forming pattern, and method for producing compound |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021157551A1 (en) * | 2020-02-06 | 2021-08-12 | 三菱瓦斯化学株式会社 | Composition for lithography and pattern-forming method |
JP7509071B2 (en) | 2020-04-28 | 2024-07-02 | 信越化学工業株式会社 | Iodized aromatic carboxylic acid pendant group-containing polymer, resist material, and pattern formation method |
TWI849314B (en) | 2020-06-01 | 2024-07-21 | 日商住友化學股份有限公司 | Compound, resin, anti-corrosion agent composition and method for producing anti-corrosion agent pattern |
JP2023154220A (en) * | 2022-04-06 | 2023-10-19 | 東京応化工業株式会社 | Resist composition and resist pattern forming method |
WO2025084340A1 (en) * | 2023-10-20 | 2025-04-24 | 三菱瓦斯化学株式会社 | Iodine-containing (meth)acrylate compound, iodine-containing (meth)acrylate (co)polymer, lithography composition, resist composition, bottom layer-forming composition, and method for producing iodine-containing (meth)acrylate compound |
WO2025084341A1 (en) * | 2023-10-20 | 2025-04-24 | 三菱瓦斯化学株式会社 | Iodine-containing (meth)acrylate compound, iodine-containing (meth)acrylate (co)polymer, lithography composition, resist composition, underlayer film-forming composition, and method for producing iodine-containing (meth)acrylate compound |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009539501A (en) * | 2006-06-06 | 2009-11-19 | ラトガーズ, ザ ステイト ユニバーシティ オブ ニュー ジャージー | Iodinated polymer |
JP5548487B2 (en) * | 2009-03-25 | 2014-07-16 | 富士フイルム株式会社 | Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern forming method using the composition |
JP5836299B2 (en) * | 2012-08-20 | 2015-12-24 | 富士フイルム株式会社 | PATTERN FORMATION METHOD, ELECTRON-SENSITIVE OR EXTREME UV-SENSITIVE RESIN COMPOSITION, RESIST FILM, AND METHOD FOR PRODUCING ELECTRONIC DEVICE USING THEM |
JP6031420B2 (en) * | 2012-08-31 | 2016-11-24 | ダウ グローバル テクノロジーズ エルエルシー | Polymer containing terminal group containing photoacid generator, photoresist containing said polymer and device manufacturing method |
US8945814B2 (en) | 2012-09-15 | 2015-02-03 | Rohm And Haas Electronic Materials Llc | Acid generators and photoresists comprising same |
JP6118586B2 (en) * | 2013-02-28 | 2017-04-19 | 富士フイルム株式会社 | Pattern forming method and electronic device manufacturing method |
WO2015046021A1 (en) * | 2013-09-26 | 2015-04-02 | Jsr株式会社 | Radiation-sensitive resin composition and resist pattern forming method |
JP6163438B2 (en) | 2014-02-27 | 2017-07-12 | 富士フイルム株式会社 | Pattern forming method, electronic device manufacturing method, electronic device, actinic ray-sensitive or radiation-sensitive resin composition, and resist film |
US9696624B2 (en) * | 2015-07-29 | 2017-07-04 | Rohm And Haas Electronic Materials Llc | Nanoparticle-polymer resists |
-
2017
- 2017-03-31 US US15/475,630 patent/US10095109B1/en active Active
-
2018
- 2018-03-02 TW TW107106979A patent/TWI674267B/en active
- 2018-03-05 JP JP2018038262A patent/JP6697498B2/en active Active
- 2018-03-07 CN CN201810184950.2A patent/CN108690164B/en active Active
- 2018-03-16 KR KR1020180030583A patent/KR20180111531A/en not_active Ceased
-
2020
- 2020-03-17 KR KR1020200032347A patent/KR102162032B1/en active Active
- 2020-07-21 KR KR1020200090218A patent/KR20200090702A/en not_active Ceased
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20190094716A1 (en) * | 2017-09-19 | 2019-03-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Humidity Control in EUV Lithography |
US11307504B2 (en) | 2017-09-19 | 2022-04-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Humidity control in EUV lithography |
US20220119336A1 (en) * | 2018-12-27 | 2022-04-21 | Mitsubishi Gas Chemical Company, Inc. | Compound, (co)polymer, composition, method for forming pattern, and method for producing compound |
US20210389669A1 (en) * | 2020-06-01 | 2021-12-16 | Sumitomo Chemical Company, Limited | Compound, resin, resist composition and method for producing resist pattern |
BE1028306B1 (en) * | 2020-06-01 | 2022-04-19 | Sumitomo Chemical Co | COMPOUND, RESIN, RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN |
US11822244B2 (en) * | 2020-06-01 | 2023-11-21 | Sumitomo Chemical Company, Limited | Compound, resin, resist composition and method for producing resist pattern |
Also Published As
Publication number | Publication date |
---|---|
JP2018172640A (en) | 2018-11-08 |
KR20180111531A (en) | 2018-10-11 |
KR102162032B1 (en) | 2020-10-06 |
KR20200090702A (en) | 2020-07-29 |
TW201837048A (en) | 2018-10-16 |
US10095109B1 (en) | 2018-10-09 |
CN108690164A (en) | 2018-10-23 |
TWI674267B (en) | 2019-10-11 |
KR20200032069A (en) | 2020-03-25 |
CN108690164B (en) | 2021-05-11 |
JP6697498B2 (en) | 2020-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10095109B1 (en) | Acid-cleavable monomer and polymers including the same | |
US10901316B2 (en) | Iodine-containing polymers for chemically amplified resist compositions | |
US10831100B2 (en) | Iodine-containing photoacid generators and compositions comprising the same | |
US10180626B2 (en) | Sulfonium salt, resist composition, and patterning process | |
US10025180B2 (en) | Sulfonium compound, resist composition, and patterning process | |
US8647808B2 (en) | Fluorinated monomer, polymer, resist composition, and patterning process | |
US11215926B2 (en) | Sulfonium compound, resist composition, and patterning process | |
US20130034813A1 (en) | CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION FOR ArF IMMERSION LITHOGRAPHY AND PATTERN FORMING PROCESS | |
US8815492B2 (en) | Chemically amplified positive resist composition for ArF immersion lithography and pattern forming process | |
TWI406094B (en) | Positive resist composition for immersion exposure, method of forming resist pattern, and fluorine-containing polymeric compound | |
US11947258B2 (en) | Photoacid-generating monomer, polymer derived therefrom, photoresist composition including the polymer, and method of forming a photoresist relief image using the photoresist composition | |
TW201339134A (en) | Polymerizable tertiary ester compound, polymer, resist composition, and patterning process | |
US20100167200A1 (en) | (Meth)acrylate compound, photosensitive polymer, and resist composition including the same | |
US20100239985A1 (en) | Method for Using Compositions Containing Fluorocarbinols in Lithographic Processes | |
JP5504892B2 (en) | Novel tricyclodecane derivative and process for producing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ROHM AND HAAS ELECTRONIC MATERIALS LLC, MASSACHUSE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:AQAD, EMAD;THACKERAY, JAMES W;SIGNING DATES FROM 20170405 TO 20170406;REEL/FRAME:041885/0611 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
MAFP | Maintenance fee payment |
Free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY Year of fee payment: 4 |
|
AS | Assignment |
Owner name: DUPONT ELECTRONIC MATERIALS INTERNATIONAL, LLC, MASSACHUSETTS Free format text: CHANGE OF NAME;ASSIGNOR:ROHM & HAAS ELECTRONIC MATERIALS LLC;REEL/FRAME:069272/0383 Effective date: 20240401 |