US20180190344A1 - Six-transistor static random access memory cell and operation method thereof - Google Patents
Six-transistor static random access memory cell and operation method thereof Download PDFInfo
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- US20180190344A1 US20180190344A1 US15/413,436 US201715413436A US2018190344A1 US 20180190344 A1 US20180190344 A1 US 20180190344A1 US 201715413436 A US201715413436 A US 201715413436A US 2018190344 A1 US2018190344 A1 US 2018190344A1
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
- G11C11/417—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
- G11C11/419—Read-write [R-W] circuits
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
- G11C11/417—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
- G11C11/418—Address circuits
Definitions
- the present invention relates to a static random access memory (SRAM), and more particularly to a six transistors static random access memory (6T-SRAM) cell with increased stability and increased writing speed.
- SRAM static random access memory
- 6T-SRAM six transistors static random access memory
- SRAM embedded static random access memory
- DRAM dynamic random access memory
- FIG. 1 illustrates a circuit diagram of a conventional six-transistor SRAM (6T-SRAM) cell.
- the device includes at least one SRAM cell, each SRAM cell including a six-transistor SRAM (6T-SRAM) cell 10 .
- Each 6T-SRAM cell 10 is composed of a first pull-up transistor 12 , a second pull-up transistor 14 , and a first pull-down transistor 16 , a second pull-down transistor 18 , a first access transistor 20 and a second access transistor 21 .
- These six devices constitute a set of flip-flops.
- the first and the second pull-up transistors 12 and 14 , and the first and the second pull-down transistors 16 and 18 constitute a latch circuit 22 that stores data in the storage nodes 24 and 26 . Since the first and the second pull-up transistors 12 and 14 act as power load devices, they can be replaced by resistors. Under this circumstance, the static random access memory becomes a four-transistor SRAM (4T-SRAM).
- first and the second pull-up transistors 12 and 14 preferably share a source/drain region and electrically connect to a voltage source (voltage node) Vcc, and the first and the second pull-down transistors 16 and 18 share a source/drain region and electrically connect to a voltage source (voltage node) Vss.
- the first and the second pull-up transistors 12 and 14 of the 6T-SRAM cell 10 are composed of p-type metal oxide semiconductor (PMOS) transistors, and the first and the second pull-down transistors 16 and 18 , the first access transistors 20 and the second access transistors 21 are composed of n-type metal oxide semiconductor (NMOS) transistors.
- the first pull-up transistor 12 and the first pull-down transistor 16 constitute an inverter, which further form a series circuit 28 .
- One end of the series circuit 28 is connected to a voltage source Vcc and the other end of the series circuit 28 is connected to a voltage source Vss.
- the second pull-up transistor 14 and the second pull-down transistor 18 constitute another inverter and a series circuit 30 .
- One end of the series circuit 30 is connected to the voltage source Vcc and the other end of the series circuit 30 is connected to the voltage source Vss.
- the two inverters are cross-coupled to each other to store data.
- the storage node 24 is connected to the respective gates of the second pull-down transistor 18 and the second pull-up transistor 14 .
- the storage node 24 is also connected to the drains of the first pull-down transistor 16 , the first pull-up transistor 12 and the first access transistor 20 .
- the storage node 26 is connected to the respective gates of the first pull-down transistor 16 and first the pull-up transistor 12 .
- the storage node 26 is also connected to the drains of the second pull-down transistor 18 , the second pull-up transistor 14 and the second access transistor 21 .
- the gates of the first access transistor 20 and the second access transistor 21 are respectively coupled to one word line 32 ; the sources of the first access transistor 20 and the second access transistor 21 are respectively coupled to a first bit line 34 and a second bit line 36 .
- the present invention provides a six transistor static random-access memory (6T SRAM) cell.
- the 6T SRAM cell comprises a first inverter comprising a first pull-up transistor and a first pull-down transistor, and a first storage node, a second inverter comprising a second pull-up transistor, a second pull-down transistor, and a second storage node, wherein the first storage node is coupled to gates of the second pull-up transistor and the second pull-down transistor, a switch transistor configured to couple the second storage node to gates of the first pull-up transistor and the first pull-down transistor, and an access transistor coupled to gates of the first pull-up transistor and the first pull-down transistor.
- the present invention further provides method of operating a six transistor static random access memory (6T SRAM) cell, the method comprising: first, a six transistor static random-access memory (6T SRAM) cell is provided, and the 6T SRAM cell comprises a first inverter comprising a first pull-up transistor and a first pull-down transistor, and a first storage node, a second inverter comprising a second pull-up transistor, a second pull-down transistor, and a second storage node, wherein the first storage node is coupled to gates of the second pull-up transistor and the second pull-down transistor, a switch transistor configured to couple the second storage node to gates of the first pull-up transistor and the first pull-down transistor, and an access transistor coupled to gates of the first pull-up transistor and the first pull-down transistor.
- the switch transistor is deactivated during a write operation, a data value is written in the second storage node through the access transistor, and the switch transistor is activated after the data value is written in the second storage.
- the key feature of the present invention is that one 6T-SRAM only comprises one single access transistor and one single switch, and the two transistors are connected to an independent word line and mode line respectively.
- this will maintain or cut the latch state of the 6T-SRAM cell.
- the 6T-SRAM cell is in the latch state, it has higher stability, and when the latching state of the 6T-SRAM cell is cut off, values can be easily written to the 6T-SRAM cell. Therefore, depending on the requirement to turning on or turning off the switch transistor, it can improve the overall stability and writing speed of the SRAM memory.
- FIG. 1 illustrates a circuit diagram of a conventional six-transistor SRAM (6T-SRAM) cell.
- FIG. 2 generally illustrates a schematic of a six transistor cell according to the first preferred embodiment of the present invention.
- FIG. 3 generally illustrates the 6T-SRAM cell of the present invention in a standby mode.
- FIG. 4 generally illustrates the 6T-SRAM cell of the present invention in a reading mode.
- FIG. 5 generally illustrates the 6T-SRAM cell of the present invention in a writing mode.
- FIG. 6 depicts a timing diagram of the 6T-SRAM cell according to the present invention in a writing step.
- FIG. 7 illustrates the schematic diagram of the 6T-SRAM cell of the present invention additional connects two transistors, so as to form an 8-transistor register file SRAM (8TRF-SRAM).
- FIG. 2 generally illustrates a schematic of a memory cell (such as a six transistor cell) 100 according to the first preferred embodiment of the present invention.
- one memory device may comprise a plurality of 6T-SRAM cells 100 arranged in matrix.
- Each 6T-SRAM cell 100 comprises a first inverter comprising a first storage node 124 lying between a first pull-up (such as a PMOS) transistor 112 and a first pull-down (such as a NMOS) transistor 116 , and a second inverter comprising a second storage node 126 lying between a second pull-up (such as a PMOS) transistor 114 and a second pull-down (such as a NMOS) transistor 118 .
- first inverter comprising a first storage node 124 lying between a first pull-up (such as a PMOS) transistor 112 and a first pull-down (such as a NMOS) transistor 116
- a second inverter comprising a second storage node
- a gate of an access transistor 120 (such as a NMOS) coupled to a word line (WL) 132 . Therefore, the access transistor 120 can be activated (turned “on”) or deactivated (turned “off”) through the word line 132 .
- a source of the access transistor 120 coupled to a bit line 134 , and a drain of the access transistor 120 coupled to gates of the first pull-up transistor 112 and the first pull-down transistor 116 , as shown in node 127 of FIG. 2 .
- the sources of the first pull-up transistor 112 and the second pull-up transistor 114 are connected to a voltage source Vcc, and the drains of the first pull-down transistor 116 and the second pull-down transistor 118 are connected to a voltage source Vss (or ground).
- the gates of the second pull-up transistor 114 and the second pull-down transistor 118 are coupled to one another, and electrically connected to the first storage node 124 .
- the gates of the first pull-up transistor 112 and the first pull-down transistor 116 are coupled to one another, but not directly coupled to second storage node 126 .
- a switch transistor 123 is electrically connected to the gates the first pull-up transistor 112 and the first pull-down transistor 116 , and also electrically connected to the second storage node 126 .
- the node 127 is coupled to the second storage node 126 via the switch transistor 123 .
- the gate of the switch transistor 123 is coupled to a mode line (ML) 140 , and the mode line transfers independent signals from a controller (not shown) to control the switch transistor 123 . Therefore, the switch transistor 123 can be independently activated (turned “on”) or deactivated (turned “off”).
- the 6T-SRAM cell 100 of the present invention by transferring different signals (logical “0” or “1”) via the word line 132 , the bit line 134 and the mode line 140 , the access transistor 120 and the switch transistor 123 can be independently activated or deactivated.
- the 6T-SRAM cell 100 comprises a standby mode, a reading mode and a writing mode.
- FIG. 3 generally illustrates the 6T-SRAM cell of the present invention 100 in a standby mode.
- the word line 132 is set to “0” (it means the word line 132 transfers logical 0 signal to the switch transistor 123 ), and the mode line 140 is set to “1” (it means the mode line 140 transfers logical 1 signal to the switch transistor 123 ). Therefore, the access transistor 120 is in an “off” configuration, but the switch transistor 123 is in an “on” configuration. As a result, the current can flow freely between first storage node 124 and the second storage node 126 .
- the operation of the 6T-SRAM cell of the present invention is similar to the operation of conventional 6T SRAM cell 100 .
- the two inverters are cross-coupled to each other.
- the first storage node 124 couples to the gates of the second pull-up transistor 114 and the second pull-down transistor 118
- the second storage node 126 couples to the gates of the first pull-up transistor 112 and the first pull-down transistor 116 , to ensure that the data stored at first storage node 124 and second storage node 126 is maintained.
- the 6T-SRAM cell 100 only includes a single bit line 134 . Therefore, the amount of bit line leakage is reduced, and less power is consumed during the standby mode.
- FIG. 4 generally illustrates the 6T-SRAM cell of the present invention 100 in a reading mode.
- the word line 132 is set to “1” (it means the word line 132 transfers logical 1 signal to the switch transistor 123 )
- the mode line 140 is set to “1” (it means the mode line 140 transfers logical 1 signal to the switch transistor 123 )
- the bit line 134 is pre-charged (it can be deemed as logical 1). Therefore, the access transistor 120 is in an “on” configuration, and the switch transistor 123 is also in an “on” configuration.
- the second storage node 126 Take the second storage node 126 storing a logical 0 value as an example, since the electric potential at the second storage node 126 is lower than the electric potential at the bit line 134 , the current will flow along the path P 1 , from the bit line 134 , passing through the access transistor 120 , the switch transistor 123 , and the second pull-down transistor 118 to the voltage source Vss (or grounded). Therefore, if the detected voltage value of the bit line 134 is lower than a predetermined value in a period, that means the second storage node 126 stores logical “0”. Otherwise, the second storage node 126 stores logical “1”. Using the method mentioned above, it is possible to determine the value stored in the 6T-SRAM cell 100 .
- the switch transistor 123 since the switch transistor 123 is in the “on” configuration, so the 6T-SRAM cell 100 is in a latch configuration, the two inverters are cross-coupled to each other. In this state, the 6T-SRAM cell 100 has high stability and is less susceptible to changing the data stored in the 6T-SRAM cell 100 due to the influence of the external voltage.
- FIG. 5 generally illustrates the 6T-SRAM cell of the present invention 100 in a writing mode.
- the word line 132 is set to “1” (it means the word line 132 transfers logical 1 signal to the switch transistor 123 ), and the mode line 140 is set to “0” (it means the mode line 140 transfers logical 0 signal to the switch transistor 123 ).
- the potential of the bit line 134 is changed depending on the value to be written. For example, when the value to be written to the second storage node 126 is 1, the bit line 134 is pre-charged to a high potential (which may be deemed as logical 1).
- the access transistor 120 is in an “on” configuration, but the switch transistor 123 is in an “off” configuration.
- the switch transistor 123 since the switch transistor 123 is deactivated, the path from the node 127 to the second storage node 126 is cut, and FIG. 5 shows the cut path in dashed lines.
- the current (which is regarded as a logical signal 1 ) will pass from the bit line 134 along the path P 2 , after accessing the transistor 120 , to the gate of the first pull-up transistor 112 and the first pull-down transistor 116 respectively, so as to deactivate the first pull-up transistor 112 , and to activate the first pull-down transistor 116 , so that the first storage node 124 and the voltage source Vss are equipotential (or grounded).
- the value stored in the first storage node 124 will become logical 0. Since the values stored in the first storage node 124 and in the second storage node 126 are necessarily complementary, the value stored in the second storage node 126 will become logical 1 to reach the purpose of writing the logical value 1 to the second storage node 126 .
- a complete writing step of the 6T-SRAM cell 100 of the present invention comprises: (1) switching to the writing mode, and the value is stored in the second storage node 126 , and (2) performing a saving step, switching back to the standby mode again. In other words, activating the switching transistor 123 , and then the access transistor 120 is deactivated to return the latch state of the 6T-SRAM cell 100 , and stably store the written value.
- FIG. 6 depicts a timing diagram of the 6T-SRAM cell according to the present invention in a writing step.
- the changing of the logical value of the bit line (BL) and the mode line (ML) are shown.
- the horizontal axis represents time and the vertical axis represents the logic potential variation of the bit line (BL) and the mode line (ML).
- the logical value of the mode line ML is decreased to 0, it means the switch transistor 123 will be turned off to enter the writing mode, and the 6T-SRAM cell 100 will temporarily not be latched.
- the logical value of the word line WL is increased from 0 to 1, it represents the access transistor 120 is turned on, and the value is written in the 6T-SRAM cell 100 .
- a saving step should be performed. More precisely, the logical value of the mode line ML is increased to 1, and the logical value of the word line WL is then decreased to 0, so as to turn off the access transistor 120 , and makes the 6T-SRAM cell 100 return to the latch state.
- the turning off/turning on step of the mode line ML will be before the turning off/turning on step of the word line.
- the 6T-SRAM cell of the present invention only comprises 6 transistors, including the first pull-up transistor, the first pull-down transistor, the second pull-up transistor, the second pull-down transistor, the access transistor and the switch transistor mentioned above.
- the access transistor and the switch transistor can be independently activated or deactivated by the word line and the mode line.
- the present invention may comprise a plurality of SRAM cells, but each 6T-SRAM cell does not include more than 6 transistors.
- an 8TRF-SRAM 200 comprises all elements mentioned in the 6T-SRAM cell 100 , and further comprises two read transistors RPG and RPD connected in series with each other.
- the gate of the read transistor RPG is electrically connected to a read word line RWL
- the source of the read transistor RPG is electrically connected to a read bit line RBL
- the gate of the read transistor RPD is electrically connected to the latch circuit of the 6T-SRAM cell 100
- the drain of the read transistor RPD is electrically connected to the voltage Vss or grounded.
- more transistors can be connected to the 6T-SRAM, for example, four transistors are additionally connected to the 6T-SRAM cell, to become the 10TRF-SRAM cell, or to form others SRAM devices, and this should also be within the scope of the present invention.
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Abstract
Description
- The present invention relates to a static random access memory (SRAM), and more particularly to a six transistors static random access memory (6T-SRAM) cell with increased stability and increased writing speed.
- An embedded static random access memory (SRAM) comprises a logic circuit and a static random access memory connected to the logic circuit. SRAM is a kind of volatile memory cell, which means it preserves data only while power is continuously applied. SRAM is built of cross-coupled inverters that store data during the time that power remains applied, unlike dynamic random access memory (DRAM) that needs to be periodically refreshed. Because of its high access speed, SRAM is also used in computer systems as a cache memory.
- Referring to
FIG. 1 ,FIG. 1 illustrates a circuit diagram of a conventional six-transistor SRAM (6T-SRAM) cell. The device includes at least one SRAM cell, each SRAM cell including a six-transistor SRAM (6T-SRAM)cell 10. - Each 6T-
SRAM cell 10 is composed of a first pull-up transistor 12, a second pull-up transistor 14, and a first pull-down transistor 16, a second pull-down transistor 18, afirst access transistor 20 and asecond access transistor 21. These six devices (transistors) constitute a set of flip-flops. The first and the second pull-up transistors 12 and 14, and the first and the second pull-down transistors latch circuit 22 that stores data in thestorage nodes up transistors 12 and 14 act as power load devices, they can be replaced by resistors. Under this circumstance, the static random access memory becomes a four-transistor SRAM (4T-SRAM). In addition, the first and the second pull-up transistors 12 and 14 preferably share a source/drain region and electrically connect to a voltage source (voltage node) Vcc, and the first and the second pull-down transistors - Preferably, the first and the second pull-
up transistors 12 and 14 of the 6T-SRAM cell 10 are composed of p-type metal oxide semiconductor (PMOS) transistors, and the first and the second pull-down transistors first access transistors 20 and thesecond access transistors 21 are composed of n-type metal oxide semiconductor (NMOS) transistors. The first pull-up transistor 12 and the first pull-down transistor 16 constitute an inverter, which further form aseries circuit 28. One end of theseries circuit 28 is connected to a voltage source Vcc and the other end of theseries circuit 28 is connected to a voltage source Vss. Similarly, the second pull-up transistor 14 and the second pull-down transistor 18 constitute another inverter and aseries circuit 30. One end of theseries circuit 30 is connected to the voltage source Vcc and the other end of theseries circuit 30 is connected to the voltage source Vss. The two inverters are cross-coupled to each other to store data. - The
storage node 24 is connected to the respective gates of the second pull-downtransistor 18 and the second pull-up transistor 14. Thestorage node 24 is also connected to the drains of the first pull-down transistor 16, the first pull-up transistor 12 and thefirst access transistor 20. Similarly, thestorage node 26 is connected to the respective gates of the first pull-down transistor 16 and first the pull-up transistor 12. Thestorage node 26 is also connected to the drains of the second pull-down transistor 18, the second pull-up transistor 14 and thesecond access transistor 21. The gates of thefirst access transistor 20 and thesecond access transistor 21 are respectively coupled to oneword line 32; the sources of thefirst access transistor 20 and thesecond access transistor 21 are respectively coupled to afirst bit line 34 and asecond bit line 36. - The present invention provides a six transistor static random-access memory (6T SRAM) cell. The 6T SRAM cell comprises a first inverter comprising a first pull-up transistor and a first pull-down transistor, and a first storage node, a second inverter comprising a second pull-up transistor, a second pull-down transistor, and a second storage node, wherein the first storage node is coupled to gates of the second pull-up transistor and the second pull-down transistor, a switch transistor configured to couple the second storage node to gates of the first pull-up transistor and the first pull-down transistor, and an access transistor coupled to gates of the first pull-up transistor and the first pull-down transistor.
- The present invention further provides method of operating a six transistor static random access memory (6T SRAM) cell, the method comprising: first, a six transistor static random-access memory (6T SRAM) cell is provided, and the 6T SRAM cell comprises a first inverter comprising a first pull-up transistor and a first pull-down transistor, and a first storage node, a second inverter comprising a second pull-up transistor, a second pull-down transistor, and a second storage node, wherein the first storage node is coupled to gates of the second pull-up transistor and the second pull-down transistor, a switch transistor configured to couple the second storage node to gates of the first pull-up transistor and the first pull-down transistor, and an access transistor coupled to gates of the first pull-up transistor and the first pull-down transistor. Next, the switch transistor is deactivated during a write operation, a data value is written in the second storage node through the access transistor, and the switch transistor is activated after the data value is written in the second storage.
- In summary, the key feature of the present invention is that one 6T-SRAM only comprises one single access transistor and one single switch, and the two transistors are connected to an independent word line and mode line respectively. By turning on or turning off the switch transistor, this will maintain or cut the latch state of the 6T-SRAM cell. When the 6T-SRAM cell is in the latch state, it has higher stability, and when the latching state of the 6T-SRAM cell is cut off, values can be easily written to the 6T-SRAM cell. Therefore, depending on the requirement to turning on or turning off the switch transistor, it can improve the overall stability and writing speed of the SRAM memory.
- These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
-
FIG. 1 illustrates a circuit diagram of a conventional six-transistor SRAM (6T-SRAM) cell. -
FIG. 2 generally illustrates a schematic of a six transistor cell according to the first preferred embodiment of the present invention. -
FIG. 3 generally illustrates the 6T-SRAM cell of the present invention in a standby mode. -
FIG. 4 generally illustrates the 6T-SRAM cell of the present invention in a reading mode. -
FIG. 5 generally illustrates the 6T-SRAM cell of the present invention in a writing mode. -
FIG. 6 depicts a timing diagram of the 6T-SRAM cell according to the present invention in a writing step. -
FIG. 7 illustrates the schematic diagram of the 6T-SRAM cell of the present invention additional connects two transistors, so as to form an 8-transistor register file SRAM (8TRF-SRAM). - To provide a better understanding of the present invention to users skilled in the technology of the present invention, preferred embodiments are detailed as follows. The preferred embodiments of the present invention are illustrated in the accompanying drawings with numbered elements to clarify the contents and the effects to be achieved.
- Please note that the figures are only for illustration and the figures may not be to scale. The scale may be further modified according to different design considerations. When referring to the words “up” or “down” that describe the relationship between components in the text, it is well known in the art and should be clearly understood that these words refer to relative positions that can be inverted to obtain a similar structure, and these structures should therefore not be precluded from the scope of the claims in the present invention.
-
FIG. 2 generally illustrates a schematic of a memory cell (such as a six transistor cell) 100 according to the first preferred embodiment of the present invention. For example, one memory device may comprise a plurality of 6T-SRAM cells 100 arranged in matrix. Each 6T-SRAM cell 100 comprises a first inverter comprising afirst storage node 124 lying between a first pull-up (such as a PMOS)transistor 112 and a first pull-down (such as a NMOS)transistor 116, and a second inverter comprising asecond storage node 126 lying between a second pull-up (such as a PMOS)transistor 114 and a second pull-down (such as a NMOS)transistor 118. A gate of an access transistor 120 (such as a NMOS) coupled to a word line (WL) 132. Therefore, theaccess transistor 120 can be activated (turned “on”) or deactivated (turned “off”) through theword line 132. A source of theaccess transistor 120 coupled to abit line 134, and a drain of theaccess transistor 120 coupled to gates of the first pull-up transistor 112 and the first pull-down transistor 116, as shown innode 127 ofFIG. 2 . Besides, the sources of the first pull-up transistor 112 and the second pull-up transistor 114 are connected to a voltage source Vcc, and the drains of the first pull-down transistor 116 and the second pull-down transistor 118 are connected to a voltage source Vss (or ground). - In the 6T-
SRAM cell 100, the gates of the second pull-up transistor 114 and the second pull-down transistor 118 are coupled to one another, and electrically connected to thefirst storage node 124. The gates of the first pull-up transistor 112 and the first pull-down transistor 116 are coupled to one another, but not directly coupled tosecond storage node 126. Instead, aswitch transistor 123 is electrically connected to the gates the first pull-up transistor 112 and the first pull-down transistor 116, and also electrically connected to thesecond storage node 126. In other words, thenode 127 is coupled to thesecond storage node 126 via theswitch transistor 123. For theswitch transistor 123 such as an NMOS, the gate of theswitch transistor 123 is coupled to a mode line (ML) 140, and the mode line transfers independent signals from a controller (not shown) to control theswitch transistor 123. Therefore, theswitch transistor 123 can be independently activated (turned “on”) or deactivated (turned “off”). - More precisely, in the 6T-
SRAM cell 100 of the present invention, by transferring different signals (logical “0” or “1”) via theword line 132, thebit line 134 and themode line 140, theaccess transistor 120 and theswitch transistor 123 can be independently activated or deactivated. Generally, the 6T-SRAM cell 100 comprises a standby mode, a reading mode and a writing mode. - Firstly, please refer to
FIG. 3 .FIG. 3 generally illustrates the 6T-SRAM cell of thepresent invention 100 in a standby mode. In the standby mode, theword line 132 is set to “0” (it means theword line 132 transfers logical 0 signal to the switch transistor 123), and themode line 140 is set to “1” (it means themode line 140 transfers logical 1 signal to the switch transistor 123). Therefore, theaccess transistor 120 is in an “off” configuration, but theswitch transistor 123 is in an “on” configuration. As a result, the current can flow freely betweenfirst storage node 124 and thesecond storage node 126. Furthermore, in the standby mode, the operation of the 6T-SRAM cell of the present invention is similar to the operation of conventional6T SRAM cell 100. In particular, the two inverters are cross-coupled to each other. Thefirst storage node 124 couples to the gates of the second pull-uptransistor 114 and the second pull-down transistor 118, and thesecond storage node 126 couples to the gates of the first pull-uptransistor 112 and the first pull-down transistor 116, to ensure that the data stored atfirst storage node 124 andsecond storage node 126 is maintained. Compared with a conventional 6T-SRAM cell, the 6T-SRAM cell 100 only includes asingle bit line 134. Therefore, the amount of bit line leakage is reduced, and less power is consumed during the standby mode. - Next, please refer to
FIG. 4 .FIG. 4 generally illustrates the 6T-SRAM cell of thepresent invention 100 in a reading mode. In the standby mode, theword line 132 is set to “1” (it means theword line 132 transfers logical 1 signal to the switch transistor 123), themode line 140 is set to “1” (it means themode line 140 transfers logical 1 signal to the switch transistor 123), in addition, thebit line 134 is pre-charged (it can be deemed as logical 1). Therefore, theaccess transistor 120 is in an “on” configuration, and theswitch transistor 123 is also in an “on” configuration. Take thesecond storage node 126 storing a logical 0 value as an example, since the electric potential at thesecond storage node 126 is lower than the electric potential at thebit line 134, the current will flow along the path P1, from thebit line 134, passing through theaccess transistor 120, theswitch transistor 123, and the second pull-down transistor 118 to the voltage source Vss (or grounded). Therefore, if the detected voltage value of thebit line 134 is lower than a predetermined value in a period, that means thesecond storage node 126 stores logical “0”. Otherwise, thesecond storage node 126 stores logical “1”. Using the method mentioned above, it is possible to determine the value stored in the 6T-SRAM cell 100. - In the reading mode mentioned above, since the
switch transistor 123 is in the “on” configuration, so the 6T-SRAM cell 100 is in a latch configuration, the two inverters are cross-coupled to each other. In this state, the 6T-SRAM cell 100 has high stability and is less susceptible to changing the data stored in the 6T-SRAM cell 100 due to the influence of the external voltage. - Please refer to
FIG. 5 .FIG. 5 generally illustrates the 6T-SRAM cell of thepresent invention 100 in a writing mode. In the standby mode, theword line 132 is set to “1” (it means theword line 132 transfers logical 1 signal to the switch transistor 123), and themode line 140 is set to “0” (it means themode line 140 transfers logical 0 signal to the switch transistor 123). In addition, the potential of thebit line 134 is changed depending on the value to be written. For example, when the value to be written to thesecond storage node 126 is 1, thebit line 134 is pre-charged to a high potential (which may be deemed as logical 1). Therefore, in the writing mode, theaccess transistor 120 is in an “on” configuration, but theswitch transistor 123 is in an “off” configuration. As shown inFIG. 5 , since theswitch transistor 123 is deactivated, the path from thenode 127 to thesecond storage node 126 is cut, andFIG. 5 shows the cut path in dashed lines. The current (which is regarded as a logical signal 1) will pass from thebit line 134 along the path P2, after accessing thetransistor 120, to the gate of the first pull-uptransistor 112 and the first pull-down transistor 116 respectively, so as to deactivate the first pull-uptransistor 112, and to activate the first pull-down transistor 116, so that thefirst storage node 124 and the voltage source Vss are equipotential (or grounded). In other words, the value stored in thefirst storage node 124 will become logical 0. Since the values stored in thefirst storage node 124 and in thesecond storage node 126 are necessarily complementary, the value stored in thesecond storage node 126 will become logical 1 to reach the purpose of writing thelogical value 1 to thesecond storage node 126. - It is noteworthy that during the writing mode, since the
switch transistor 123 is temporarily deactivated, so the 6T-SRAM cell 100 is not in the latched state. In this state, the external value will be easily written and stored in the storage node, but the stored value in thefirst storage node 124 or in thesecond storage node 126 cannot be stably maintained. Therefore, a complete writing step of the 6T-SRAM cell 100 of the present invention comprises: (1) switching to the writing mode, and the value is stored in thesecond storage node 126, and (2) performing a saving step, switching back to the standby mode again. In other words, activating the switchingtransistor 123, and then theaccess transistor 120 is deactivated to return the latch state of the 6T-SRAM cell 100, and stably store the written value. - Please refer to
FIG. 6 , which depicts a timing diagram of the 6T-SRAM cell according to the present invention in a writing step. In particular, the changing of the logical value of the bit line (BL) and the mode line (ML) are shown. The horizontal axis represents time and the vertical axis represents the logic potential variation of the bit line (BL) and the mode line (ML). As shown inFIG. 6 and also referringFIGS. 3-5 mentioned above, during a writing step, the logical value of the mode line ML is decreased to 0, it means theswitch transistor 123 will be turned off to enter the writing mode, and the 6T-SRAM cell 100 will temporarily not be latched. Next, the logical value of the word line WL is increased from 0 to 1, it represents theaccess transistor 120 is turned on, and the value is written in the 6T-SRAM cell 100. After the value is written in the 6T-SRAM cell 100, a saving step should be performed. More precisely, the logical value of the mode line ML is increased to 1, and the logical value of the word line WL is then decreased to 0, so as to turn off theaccess transistor 120, and makes the 6T-SRAM cell 100 return to the latch state. In summary, in a writing step, the turning off/turning on step of the mode line ML will be before the turning off/turning on step of the word line. - It is noteworthy that the 6T-SRAM cell of the present invention only comprises 6 transistors, including the first pull-up transistor, the first pull-down transistor, the second pull-up transistor, the second pull-down transistor, the access transistor and the switch transistor mentioned above. The access transistor and the switch transistor can be independently activated or deactivated by the word line and the mode line. In other words, the present invention may comprise a plurality of SRAM cells, but each 6T-SRAM cell does not include more than 6 transistors.
- However, with the main structure of the 6T-SRAM cell of the present invention, it is possible to additionally connect other transistors to increase the reading speed. For example, please refer to
FIG. 7 , which illustrates the schematic diagram of the 6T-SRAM cell of the present invention additional connects two transistors, so as to form an 8-transistor register file SRAM (8TRF-SRAM). As shown inFIG. 7 , an 8TRF-SRAM 200 comprises all elements mentioned in the 6T-SRAM cell 100, and further comprises two read transistors RPG and RPD connected in series with each other. The gate of the read transistor RPG is electrically connected to a read word line RWL, the source of the read transistor RPG is electrically connected to a read bit line RBL, the gate of the read transistor RPD is electrically connected to the latch circuit of the 6T-SRAM cell 100, and the drain of the read transistor RPD is electrically connected to the voltage Vss or grounded. - In this embodiment, the 6T-SRAM cell (please refer to
FIG. 2 ) is used as the main structure, and two transistors are additionally connected to the 6T-SRAM cell, to become the 8TRF-SRAM cell 200. Therefore, the reading speed of the SRAM can be further increased. Even though this embodiment includes eight transistors, the 6T-SRAM cell still includes only six transistors, and only one access transistor and one switch transistor are included in the 6T-SRAM cell, so this embodiment still be within the scope of the present invention. Of course, in other embodiments, more transistors can be connected to the 6T-SRAM, for example, four transistors are additionally connected to the 6T-SRAM cell, to become the 10TRF-SRAM cell, or to form others SRAM devices, and this should also be within the scope of the present invention. - In summary, the key feature of the present invention is that one 6T-SRAM only comprises one single access transistor and one single switch, and the two transistors are connected to an independent word line and mode line respectively. By turning on or turning off the switch transistor, this will maintain or cut the latch state of the 6T-SRAM cell. When the 6T-SRAM cell is in the latch state, it has higher stability, and when the latching state of the 6T-SRAM cell is cut off, values can be easily written to the 6T-SRAM cell. Therefore, depending on the requirement to turning on or turning off the switch transistor, it can improve the overall stability and writing speed of the SRAM memory.
- Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
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US11552052B2 (en) * | 2020-03-17 | 2023-01-10 | United Microelectronics Corp. | Static random access memory (SRAM) and method for fabricating the same |
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TWI719536B (en) * | 2018-07-16 | 2021-02-21 | 台灣積體電路製造股份有限公司 | Latch circuit, integrated circuit, and method of forming latch circuit |
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