US20170333700A1 - Method of manufacturing an implantable neural electrode interface platform - Google Patents
Method of manufacturing an implantable neural electrode interface platform Download PDFInfo
- Publication number
- US20170333700A1 US20170333700A1 US15/439,419 US201715439419A US2017333700A1 US 20170333700 A1 US20170333700 A1 US 20170333700A1 US 201715439419 A US201715439419 A US 201715439419A US 2017333700 A1 US2017333700 A1 US 2017333700A1
- Authority
- US
- United States
- Prior art keywords
- silicone
- layer
- silicone layer
- electrode
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 230000001537 neural effect Effects 0.000 title claims abstract description 10
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 139
- 229910052751 metal Inorganic materials 0.000 claims abstract description 81
- 239000002184 metal Substances 0.000 claims abstract description 81
- 238000000034 method Methods 0.000 claims abstract description 30
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 238000000608 laser ablation Methods 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims description 8
- 238000003490 calendering Methods 0.000 claims description 7
- 238000010345 tape casting Methods 0.000 claims description 7
- 230000007704 transition Effects 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 210000005036 nerve Anatomy 0.000 description 19
- 210000003323 beak Anatomy 0.000 description 17
- 210000001519 tissue Anatomy 0.000 description 8
- 210000000578 peripheral nerve Anatomy 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 230000000638 stimulation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 210000004126 nerve fiber Anatomy 0.000 description 4
- 230000007383 nerve stimulation Effects 0.000 description 4
- 210000004556 brain Anatomy 0.000 description 3
- 230000001054 cortical effect Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 210000003169 central nervous system Anatomy 0.000 description 2
- 210000003618 cortical neuron Anatomy 0.000 description 2
- 210000005257 cortical tissue Anatomy 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 210000002569 neuron Anatomy 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 208000000094 Chronic Pain Diseases 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 208000002193 Pain Diseases 0.000 description 1
- 208000018737 Parkinson disease Diseases 0.000 description 1
- 229910000566 Platinum-iridium alloy Inorganic materials 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 201000010099 disease Diseases 0.000 description 1
- 208000037265 diseases, disorders, signs and symptoms Diseases 0.000 description 1
- 210000003414 extremity Anatomy 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 206010027599 migraine Diseases 0.000 description 1
- 210000000944 nerve tissue Anatomy 0.000 description 1
- 230000008904 neural response Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- HWLDNSXPUQTBOD-UHFFFAOYSA-N platinum-iridium alloy Chemical class [Ir].[Pt] HWLDNSXPUQTBOD-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 210000000278 spinal cord Anatomy 0.000 description 1
- 230000004936 stimulating effect Effects 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0529—Electrodes for brain stimulation
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0551—Spinal or peripheral nerve electrodes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/316—Modalities, i.e. specific diagnostic methods
- A61B5/388—Nerve conduction study, e.g. detecting action potential of peripheral nerves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/40—Detecting, measuring or recording for evaluating the nervous system
- A61B5/4029—Detecting, measuring or recording for evaluating the nervous system for evaluating the peripheral nervous systems
- A61B5/4041—Evaluating nerves condition
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/48—Other medical applications
- A61B5/4887—Locating particular structures in or on the body
- A61B5/4893—Nerves
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
- A61B5/6867—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive specially adapted to be attached or implanted in a specific body part
- A61B5/6877—Nerve
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/0404—Electrodes for external use
- A61N1/0472—Structure-related aspects
- A61N1/048—Electrodes characterised by a specific connection between lead and electrode
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0529—Electrodes for brain stimulation
- A61N1/0534—Electrodes for deep brain stimulation
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0529—Electrodes for brain stimulation
- A61N1/0539—Anchoring of brain electrode systems, e.g. within burr hole
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
- A61N1/36128—Control systems
- A61N1/36146—Control systems specified by the stimulation parameters
- A61N1/36182—Direction of the electrical field, e.g. with sleeve around stimulating electrode
- A61N1/36185—Selection of the electrode configuration
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
- A61B2018/00434—Neural system
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
- A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
-
- A61B5/04001—
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/0404—Electrodes for external use
- A61N1/0472—Structure-related aspects
- A61N1/0492—Patch electrodes
Definitions
- Peripheral nerves are the nerves outside the central nervous system (e.g., the brain and spinal cord). They serve as a relay, connecting the central nervous system to the limbs and organs.
- Peripheral and cortical nerve stimulation are increasingly popular disease treatments. These techniques function by delivering an electrical stimulation pulse to a targeted area in order to create a neural response. Peripheral nerve stimulation has been used to treat chronic pain and migraines. Cortical neural stimulation can be used to treat Parkinson's disease and depression.
- a method of manufacturing an implantable neural electrode interface platform may include cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces.
- the metal layer is between about 5 ⁇ m and about 25 ⁇ m thick.
- the metal traces connect one or more electrode sites to one or more contact pads.
- a first silicone layer is formed by knife-coating a polymer mesh with silicone and cured.
- the first silicone layer is between about 50 ⁇ m and about 100 ⁇ m thick.
- the metal layer is coupled to the first silicone layer.
- a second silicone layer is formed by calendaring silicone to a thickness between about 50 ⁇ m and about 100 ⁇ m.
- the first silicone layer is laminated to the second silicone layer.
- the metal layer is positioned between the first silicone layer and the second silicone layer.
- a first set of holes are formed in the first or second silicone layers to expose one or more electrode sites.
- a second set of holes are formed in the first or second silicone layer to expose one or more contact pads in the metal layer. Wires are welded to the exposed contact pads.
- a third silicone layer is overmolded over the contact pads and a portion of the wires.
- a release tape is applied to the metal layer before cutting the metal layer.
- the release tape may be removed from the metal layer after coupling the cut metal layer to the first silicone layer.
- the release tape can be removed by heating the release tape, dissolving the release tape in a solvent or exposing the release tape to ultraviolet light.
- the metal layer is cleaned with oxygen plasma before laminating the first silicone layer to the second silicone layer.
- a primer is deposited on the metal layer after cleaning the metal layer with oxygen plasma.
- laser ablation is used to cut the metal layer and form the first and second sets of holes.
- a picosecond pulsed laser may be used for the laser ablation.
- the mesh includes nylon, polyamide, or polyester fibers.
- the mesh may include an open area between 40% and 50% of the total area of the mesh.
- Each fiber of the mesh may have a diameter between about 30 ⁇ m and about 50 ⁇ m.
- the mesh fibers may be spaced about 60 ⁇ m and about 70 ⁇ m apart.
- the mesh may be between about 40 ⁇ m and 50 ⁇ m thick.
- forming the first silicone layer comprises knife-coating the mesh such that the first silicone layer is between about 60 ⁇ m and about 90 ⁇ m thick and forming the second silicone layer comprises calendaring the second layer of silicone to be between about 60 ⁇ m and about 90 ⁇ m thick.
- forming the first silicone layer comprises knife-coating the mesh such that the first silicone layer is between about 70 ⁇ m and about 80 ⁇ m thick and forming the second silicone layer comprises calendaring the second silicone layer to be between about 70 ⁇ m and about 80 ⁇ m thick.
- resistance welding or laser welding may be used for the welding the wires to the exposed contact pads.
- the overmolding achieves a gradual transition between the first or second silicone layer and the third silicone layer.
- the first and second sets of holes are both formed in the first silicone layer. In other implementations, the first and second sets of holes are both formed in the second silicone layer. In some implementations, the first set of holes may be formed in a different layer of silicone than the layer of silicone in which the second set of holes is formed.
- FIG. 1 illustrates a system for peripheral nerve stimulation and recording.
- FIG. 2 illustrates a top view of an example electrode for use in the system illustrated in FIG. 1 .
- FIG. 3 illustrates another example electrode for use with the system illustrated in FIG. 1 .
- FIGS. 4A-4K illustrate cross-sectional views of a method for manufacturing an example electrode for use with the system illustrated in FIG. 1 .
- FIGS. 5A-5D illustrate cross-sectional views of example electrodes manufactured by the method illustrated in FIGS. 4A-4K
- FIG. 6 illustrates a scanning electron micrograph of the coupling of the needle to an electrode for use with the system illustrated in FIG. 1 .
- the present disclosure discusses electrodes and the manufacture thereof.
- the electrodes are configured to be implanted within (or adjacent to) neural tissue, such as a peripheral nerve.
- the electrodes are then secured to the nerve fascicle to form an interface between the nerve fibers of the nerve fascicle and a neural stimulator or recording device.
- the electrodes include a metal layer laminated between adhesive silicone layers.
- One or more of the silicone layers can include a mesh layer for improved handling and structural integrity.
- the electrodes can also include a detachable needle that enables insertion of the electrode directly into a nerve fascicle, bundle of nerve fibers, or other tissue. The electrode's insertion into a nerve fiber enables stimulation of the central regions of a nerve.
- FIG. 1 illustrates a system 100 for peripheral nerve stimulation and recording. While the system 100 can be implanted anywhere in the body, FIG. 1 illustrates the system 100 implanted into the right arm 102 of a patient.
- the enlarged portion 104 illustrates that two satellites 106 are coupled to a controller hub via a connector 108 .
- the second enlarged portion 110 illustrates that two electrodes 112 are coupled one of the satellites 106 .
- Each of the electrodes 112 are coupled to a peripheral nerve fascicle 114 in the wrist of the arm 102 .
- the system 100 includes a central controller hub (not illustrated) that is implanted into central location, such as in a surgically created sub-dermal pocket in the upper arm or chest.
- the satellites 106 are coupled to the controller hub and implanted near the regions of interest.
- the satellites 106 interface with the electrodes 112 .
- Power is provided to the satellites 106 and electrodes 112 by the controller hub.
- the satellites 106 enable the electrodes 112 to be configured in real-time for recording or stimulation.
- the satellites 106 also include a neural amplifier with an embedded analog to digital converter that enables recording and digital transmission of neural signals captured by the electrodes 112 .
- the hub or satellite 106 includes stimulation channels for stimulating target tissue via the electrodes 112 , one or more processors for adaptive closed-loop control, bidirectional wireless data telemetry for communication with an external base station, and a wirelessly rechargeable lithium battery for power.
- the system 100 includes one or more electrodes 112 coupled to each of the satellites 106 .
- the electrodes 112 provide the interface between the system 100 and the patient.
- the electrodes 112 are configured to be directly secured to a patient's nerve fascicle 114 or other tissue.
- the electrode 112 includes a plurality of electrode sites along a rostrum.
- the rostrum is an elongated extension that projects from the body of the electrode 112 .
- the rostrum is configured for implantation through a nerve fascicle to record from (and/or stimulate) one or more of the nerve fibers within the nerve fascicle.
- the electrode 112 is described further in relation to FIGS. 4A-4K and FIGS. 5A-5D .
- FIG. 2 illustrates a top view of an example electrode 112 .
- the electrode 112 includes a rostrum 114 , a tab 116 projecting from the central body of the electrode 112 , and a connector pad 118 .
- the rostrum 114 includes a needle 120 and a plurality of electrode sites 122 .
- the tabs 116 also include a plurality of electrode sites 122 .
- the connector pad 118 includes a plurality of contact pads 124 .
- the electrode 112 is a multi-layer device that includes one or more metal layers sandwiched between silicone layers.
- the electrode sites 122 , the traces 128 , and the contact pads 124 are formed from the metal layer.
- the silicone layers insulate the metal layer and form the body of the electrode 112 .
- the rostrum 114 of the electrode 112 includes the needle 120 and a plurality of electrode sites 122 .
- the tabs 116 also include electrode sites 122 .
- the rostrum 114 is configured for insertion into nervous tissue, such as a peripheral nerve.
- the needle 120 enables the rostrum 114 to be threaded through a nerve fascicle or other tissue.
- the needle 120 is manufactured from a material that does not substantially bend when inserted into a target tissue.
- the needle 120 can be substantially rigid while the rest of the electrode 112 is substantially flexible.
- the needle 120 can include stainless steel, platinum, or another medical grade metal.
- the needle 120 is detachable from the remainder of the rostrum 114 and electrode 112 .
- a gap 126 in the metal layer between the electrode sites 122 and the needle 120 is manufactured in the rostrum 114 .
- the gap 126 can include materials, such as the silicone layers, that are easy to cut.
- a surgeon may use surgical scissors to cut through the gap 126 and sever the needle 120 from the electrode 112 .
- the needle 120 had an outer diameter between about 75 ⁇ m and about 200 ⁇ m, between about 100 ⁇ m and about 175 ⁇ m, or between about 125 ⁇ m and about 150 ⁇ m.
- the rostrum 114 also includes a plurality of electrode sites 122 .
- the electrode sites 122 are disposed on the rostrum 114 towards the ends of the traces 128 .
- each electrode site 122 is an exposed area of the trace 128 .
- the trace 128 is a portion of a metal layer encapsulated within the silicone layers. A portion of the silicone layer above the trace 128 can be laser ablated to expose a portion of the metal layer—forming the electrode site 122 .
- each of the electrode sites 122 are spaced between about 100 ⁇ m and about 700 ⁇ m, between about 200 ⁇ m and about 600 ⁇ m, or between about 300 ⁇ m and about 500 ⁇ m apart along the rostrum's length. In some implementations, each of the electrode site 122 have a diameter between about 50 ⁇ m and about 300 ⁇ m, between about 50 ⁇ m and about 200 ⁇ m, or between about 50 ⁇ m and about 100 ⁇ m.
- Each of the traces 128 terminate at a contact pad 124 on the connector pad 118 .
- each of the traces 128 terminate at a different contact pad 124 , making each of the electrode sites 122 individually addressable.
- one or more of the traces 128 terminate at the same contact pad 124 .
- Wires of a flexible cable are welded to each of the contact pads 124 to couple the electrode 112 to the satellite 106 .
- each of the contact pads 124 have a length between about 200 ⁇ m and about 500 ⁇ m, between about 200 ⁇ m and about 400 ⁇ m, or between about 200 ⁇ m and about 300 ⁇ m.
- the tabs 116 are used to secure the electrode 112 to the nerve fascicle or other target site.
- the tabs 116 are flexible and include one or more layers of silicone. In some implementations, additional electrode sites 122 are distributed along the length of the tabs 116 .
- the tabs 116 are configured to wrap around the nerve fascicle. Once wrapped around the nerve fascicle the tabs 116 can be coupled together to secure the electrode 112 to the nerve fascicle. For example, the ends of the tabs 116 can be sutured together to secure the electrode 112 to the nerve fascicle without having to suture directly to the nerve fascicle.
- FIG. 3 illustrates another example electrode 200 for use with the system 100 discussed above.
- the electrode 200 is configured for electrocorticographic (ECoG) recordings.
- EoG electrocorticographic
- the electrode 200 is configured for placement on the cortical tissue of a patient's brain to record (or stimulate) populations of cortical neurons.
- the electrode 200 includes 32 electrode sites 202 .
- Each of the electrode sites 202 are coupled by traces 128 to a different contact pad 124 .
- the electrode 200 includes between about 2 and about 128, between about 2 and about 64, or between about 2 and 32 electrode sites 202 .
- the electrode sites 202 of the electrode 200 are configured to have greater relative surface area compared to the electrode sites 122 discussed above. For example, the larger surface area enables the electrode sites 202 to receive electrical signals form a greater number of neurons.
- FIGS. 4A-4K illustrate cross-sectional views of a method for manufacturing the electrodes described herein. The cross-sectional views are taken along the line A-A′ shown in FIG. 2 .
- FIG. 4A illustrates a cross-sectional view of the first step in manufacturing the electrodes described herein.
- a metal layer 402 is applied to a release tape 404 .
- the metal layer 402 includes stainless steel or a platinum iridium alloy.
- the metal layer 402 may be a metal foil that is between about 10 ⁇ m and about 30 ⁇ m, between about 10 ⁇ m and about 15 ⁇ m, or between about 10 ⁇ m and about 12.5 ⁇ m thick.
- the release tape 404 is a thermal release tape or a UV release tape. In other implementations, the release tape 204 can be dissolved using a solvent.
- FIG. 4B illustrates a cross-sectional view of the electrode during the second stage of the manufacturing process.
- the metal layer 402 is cut to form the electrode sites, traces, contact pads of the electrode, and any other element of the metal layer.
- Laser ablation is used to form cuts 403 in the metal layer or metal foil 402 .
- the laser may be a picosecond pulsed laser operating at a wavelength between about 245 nanometers and about ⁇ 2000 nanometers and configured with a pulse width between about 40 picoseconds and about 500 picoseconds.
- the laser may be a nanosecond pulsed laser and/or a femtosecond pulsed laser.
- FIG. 4C illustrates a cross-sectional view of the electrode after the excess metal is removed from the release tape 404 .
- the relatively larger portions of the metal layer 402 that do not form a portion of the electrode sites, traces, and contact pads can be peeled off from the release tape 404 to leave just the desired portions of the portions of the metal layer 402 forming the electrode sites, traces, and contract pads coupled to the release tape 404 .
- relatively smaller portions of the metal layer 402 are entirely removed through laser ablation.
- the portion of the metal layer 402 between two neighboring traces may be removed through laser ablation.
- the remaining metal is cleaned using pure oxygen plasma to remove any residual organic material and to improve adhesion to the silicone layer described in FIG. 4D .
- FIG. 4D illustrates a cross-sectional view of a first silicone layer 406 that is formed separately from the metal layer 402 and the release tape 404 .
- the first silicone layer 406 may include an implantable grade silicone substrate specifically designed for implantation within the body of a human or an animal.
- the first silicone layer 406 may include a nylon, polyamide, polyester mesh.
- the mesh is impregnated with liquid silicone, which is then cured, to form the first silicone layer 406 .
- the first silicone layer 406 is formed by knife-coating the mesh with uncured silicone, for example MED 4850 or MED 4250 silicone manufactured by NuSilTM of Carpinteria, Calif.
- the mesh is a MEDIFAB® mesh (part number 07-64/45) made available by SEFAR AG of Thal, Switzerland.
- the mesh is between about 40 ⁇ m and about 50 ⁇ m thick. In other implementations, the mesh is about 75 ⁇ m thick.
- the mesh can include an open area of between about 40% and about 50%.
- the diameter of each mesh fiber is between about 30 ⁇ m and about 50 ⁇ m and the fibers are spaced between about 60 ⁇ m and about 70 ⁇ m apart.
- the mesh can be knife-coated with silicone, which is then cured, and then, additionally, or alternatively, be calendared (e.g., heat pressed) to achieve a desired thickness.
- the mesh can reinforce the first silicone layer 406 to improve the longevity of the electrode, ease the handling of the electrode, and provide structural integrity to the electrode.
- the improved structural integrity of the first silicone layer 406 reduces the likelihood that the metal layer 402 will separate from the first silicone layer 406 in subsequent steps or during the handling of the completed electrode.
- the first silicone layer 406 is between about 50 ⁇ m and about 100 ⁇ m, between about 60 ⁇ m and about 90 ⁇ m, or between about 70 ⁇ m and about 80 ⁇ m thick.
- FIG. 4E illustrates a cross-sectional view of the next step in manufacturing the electrodes described herein.
- a glue layer 408 is applied to the first silicone substrate 406 .
- the glue layer 408 is applied to the top surface of the first silicone layer 406 to help hold the additional layers of material to the first silicone layer 406 .
- FIG. 4F illustrates a cross-sectional view of the sixth step in manufacturing the electrodes described herein.
- the metal layer 402 and release tape 404 are inverted and coupled to the glue layer 408 (from FIG. 4E ).
- the glue layer 408 is then cured to permanently fix the metal layer 402 to the first silicone layer 406 .
- FIG. 4G illustrates a cross-sectional view of the seventh step in manufacturing the electrodes described herein.
- FIG. 4H illustrates the next step in manufacturing the electrodes described herein.
- the exposed metal layer 402 is cleaned using oxygen plasma and a primer 410 is applied to the exposed metal layer 402 .
- a silicone primer such as MED6-161 manufactured by NuSilTM of Carpinteria, Calif. may be used to increase the adhesion of the metal layer 402 to a second layer of silicone.
- FIG. 4I illustrates a cross-sectional view of the ninth stage of manufacturing the electrodes described herein.
- the second silicone layer 412 may include a calendared layer of silicone.
- the second silicone layer 412 may be produced by calendaring or applying heat and mechanical force to create the second silicone layer 412 at a desired thickness.
- the second silicone layer 412 may be as thin as 50 ⁇ m.
- the second silicone layer 412 is between about 50 ⁇ m and 100 ⁇ m thick.
- the second silicone layer 412 is similar to the first silicone layer 406 .
- the second silicone layer 412 can be impregnated with a mesh.
- the second silicone layer 412 is not impregnated with a mesh, but may be about the same thickness as the first silicone layer 406 .
- FIG. 4J illustrates a cross-sectional view of the tenth stage of manufacturing the electrodes described herein.
- a thin layer of silicone is intentionally left in the openings 414 (e.g., the openings over the contact pads and/or the electrode sites) prior to the aforementioned cleaning process to prevent the laser from damaging the contact pads or electrode sites.
- the electrode sites may be located on the same side of the electrode as the contact pads. In some implementations, the electrode sites may be located on the opposite side of the electrode as the contact pads.
- the first and second silicone layers 406 and 412 are larger than the total shape of the electrode.
- the metal layer 402 defining a plurality of electrodes can be laminated between large, single first and second silicone layers 406 and 412 .
- each of the electrodes are cut from the first silicone layer 406 and the second silicone layer 412 by laser cutting the shape of each electrode body from the first silicone layer 406 and the second silicone layer 412 .
- the edges of the formed electrodes may be cleaned by plasma cleaning.
- FIG. 4K illustrates a cross-sectional view of the next stage of manufacturing the electrodes described herein.
- the wires 416 are coupled to each of the exposed metal areas that form the contact pads.
- the wires 416 are welded to the exposed metal layer 402 .
- the wires are resistance welded to the exposed metal layer 402 .
- the wires are laser welded to the exposed metal layer 402 .
- the wires 416 couple the contact pads (and ultimately, the electrode sites) to the satellites described above.
- a third silicone layer 418 is applied as an overmold over the openings 414 , (e.g., the one or more contact pad openings).
- the openings that are formed over the electrode sites are not covered with the third silicone layer, e.g., the overmold 418 , so that the metal layer is exposed and can record and stimulate the neural tissue.
- the third silicone layer 418 is overmolded onto the first or second silicone layer to achieve a gradual transition between the first or second silicone layer and the third silicone layer.
- the gradual transition between the first or second silicone layer and the third silicone layer is substantially smooth, for example, such that is does not possess sharp angles, abrupt changes and/or discontinuities in the gradient of the slope of the overmolded third silicone layer.
- the manufacturing method illustrated in FIGS. 4A-4K continues with the coupling of a needle to the electrode's formed body.
- the electrode does not include a needle and the manufacturing method ends at the step illustrated in FIG. 4K .
- the needle is coupled to the electrode with a biocompatible glue.
- the transition between the needle and the electrode is configured to be substantially smooth such that the transition does not cause damage when the rostrum is pulled through a nerve fascicle.
- the end of the needle coupled to the electrode is first thinned, such that the combination of the needle material and the electrode does not form a bulge along the electrode's rostrum.
- the needle can be thinned by grinding down a portion of the needle.
- FIGS. 5A-5D illustrate cross-sectional views of example electrodes manufactured by the method illustrated in FIGS. 4A-4K .
- the cross-sectional views are taken along the line B-B′ shown in FIG. 2 .
- a variety of electrode shapes and formations may be enabled by this method of manufacturing.
- the method of manufacture described herein may be used, but is not limited to, the manufacture of electrocorticographic (ECoG) electrodes, micro-electrocorticographic electrodes, longitudinal intra-fascicular electrodes, cuff electrodes, transverse intra-fascicular electrodes, and surface electrodes.
- EoG electrocorticographic
- micro-electrocorticographic electrodes micro-electrocorticographic electrodes
- longitudinal intra-fascicular electrodes cuff electrodes
- transverse intra-fascicular electrodes and surface electrodes.
- the arrangement of electrode sites and contact pads may vary based on the nerve size, nerve location or area of nerve tissue to be stimulated or from which signals
- a larger electrode surface area may include more electrode sites enabling the electrode to receive electrical signals form a greater number of neurons.
- an electrode may be configured for electrocorticographic (ECoG) recordings.
- the electrode may be placed on the cortical tissue of a patient's brain to record (or stimulate) populations of cortical neurons.
- the electrode may include between about 2 and about 128, between about 2 and about 64, or between about 2 and 32 electrode sites.
- each of the electrode sites 122 are spaced between about 100 ⁇ m and about 700 ⁇ m, between about 200 ⁇ m and about 600 ⁇ m, or between about 300 ⁇ m and about 500 ⁇ m apart from each other.
- each of the traces terminates at a contact pad corresponding to a specific electrode site, making each of the electrode sites individually addressable. In other implementations, each of the traces terminates at a different contact pad. In some implementations, one or more of the traces terminate at the same contact pad. In some implementations, each of the contact pads has a length between about 200 ⁇ m and about 500 ⁇ m, between about 200 ⁇ m and about 400 ⁇ m, or between about 200 ⁇ m and about 300 ⁇ m.
- FIG. 5A illustrates a cross-sectional view of an electrode where the electrode site opening 512 and the contact pad opening 514 are formed on the same side of the electrode. As shown in FIG. 5A , the electrode site opening 512 and the contact pad opening 514 are formed in the second silicone layer 508 . One or more traces 513 connect the electrode site to the contact pad. A wire 516 is welded to the contact pad and an overmold 518 is applied over the contact pad opening 514 .
- FIG. 5B illustrates a cross-sectional view of an electrode where the electrode site opening 512 and the contact pad opening 514 are also formed on the same side of the electrode. As shown in FIG. 5B , the electrode site opening 512 and the contact pad opening 514 are formed in the second silicone layer 506 . One or more traces 513 connect the electrode site to the contact pad. A wire 516 is welded to the contact pad and an overmold 518 is applied over the contact pad opening 514 .
- FIG. 5C illustrates a cross-sectional view of an electrode where the electrode site opening 512 and the contact pad opening 514 are formed on opposite sides of the electrode.
- the electrode site opening 512 is formed in the first silicone layer 506 and the contact pad opening 514 is formed in the second silicone layer 508 .
- One or more traces 513 connect the electrode site to the contact pad.
- a wire 516 is welded to the contact pad and an overmold 518 is applied over the contact pad opening 514 .
- FIG. 5D illustrates a cross-sectional view of an electrode where the electrode site opening 512 and the contact pad opening 514 are also formed on opposite sides of the electrode.
- the electrode site opening 512 is formed in the second silicone layer 508 and the contact pad opening 514 is formed in the first silicone layer 506 .
- One or more traces 513 connect the electrode site to the contact pad.
- a wire 516 is welded to the contact pad and an overmold 518 is applied over the contact pad opening 514 .
- FIG. 6 illustrates a scanning electron micrograph of the coupling between the needle and the electrode formed using the above described manufacturing method.
- FIG. 6 illustrates that the needle 120 is thinned from its initial thickness 602 to a thinned thickness 604 that is about half the thickness of the initial thickness 602 .
- the initial thickness 602 is about 350 ⁇ m and the thinned thickness 604 is about 175 ⁇ m.
- Thinning the needle 120 exposes the needle's inner lumen 606 and forms a trough 608 .
- the portion 610 of the rostrum 114 that couples to the needle 120 is sized to fit into the trough 608 .
- the portion 610 can then be glued to the trough 608 .
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Neurology (AREA)
- General Health & Medical Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- Veterinary Medicine (AREA)
- Public Health (AREA)
- Neurosurgery (AREA)
- Heart & Thoracic Surgery (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Psychology (AREA)
- Cardiology (AREA)
- Physics & Mathematics (AREA)
- Biophysics (AREA)
- Pathology (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Orthopedic Medicine & Surgery (AREA)
- Physiology (AREA)
- Electrotherapy Devices (AREA)
Abstract
Description
- The present application claims priority to the U.S. Provisional Application No. 62/298,272 filed on Feb. 22, 2016, and titled “LONGITUDINAL INTRA-FASCICULAR ELECTRODE,” which is herein incorporated by reference in its entirety.
- Peripheral nerves are the nerves outside the central nervous system (e.g., the brain and spinal cord). They serve as a relay, connecting the central nervous system to the limbs and organs.
- Peripheral and cortical nerve stimulation are increasingly popular disease treatments. These techniques function by delivering an electrical stimulation pulse to a targeted area in order to create a neural response. Peripheral nerve stimulation has been used to treat chronic pain and migraines. Cortical neural stimulation can be used to treat Parkinson's disease and depression.
- According to one aspect of the disclosure, a method of manufacturing an implantable neural electrode interface platform may include cutting a metal layer to form a plurality of electrode sites, contact pads and metal traces. The metal layer is between about 5 μm and about 25 μm thick. The metal traces connect one or more electrode sites to one or more contact pads. A first silicone layer is formed by knife-coating a polymer mesh with silicone and cured. The first silicone layer is between about 50 μm and about 100 μm thick. The metal layer is coupled to the first silicone layer. A second silicone layer is formed by calendaring silicone to a thickness between about 50 μm and about 100 μm. The first silicone layer is laminated to the second silicone layer. The metal layer is positioned between the first silicone layer and the second silicone layer. A first set of holes are formed in the first or second silicone layers to expose one or more electrode sites. A second set of holes are formed in the first or second silicone layer to expose one or more contact pads in the metal layer. Wires are welded to the exposed contact pads. A third silicone layer is overmolded over the contact pads and a portion of the wires.
- In some implementations, a release tape is applied to the metal layer before cutting the metal layer. The release tape may be removed from the metal layer after coupling the cut metal layer to the first silicone layer. The release tape can be removed by heating the release tape, dissolving the release tape in a solvent or exposing the release tape to ultraviolet light.
- In some implementations, the metal layer is cleaned with oxygen plasma before laminating the first silicone layer to the second silicone layer. A primer is deposited on the metal layer after cleaning the metal layer with oxygen plasma. In some implementations, laser ablation is used to cut the metal layer and form the first and second sets of holes. A picosecond pulsed laser may be used for the laser ablation.
- In some implementations, the mesh includes nylon, polyamide, or polyester fibers. The mesh may include an open area between 40% and 50% of the total area of the mesh. Each fiber of the mesh may have a diameter between about 30 μm and about 50 μm. The mesh fibers may be spaced about 60 μm and about 70 μm apart. The mesh may be between about 40 μm and 50 μm thick. In some implementations, forming the first silicone layer comprises knife-coating the mesh such that the first silicone layer is between about 60 μm and about 90 μm thick and forming the second silicone layer comprises calendaring the second layer of silicone to be between about 60 μm and about 90 μm thick. In some implementations, forming the first silicone layer comprises knife-coating the mesh such that the first silicone layer is between about 70 μm and about 80 μm thick and forming the second silicone layer comprises calendaring the second silicone layer to be between about 70 μm and about 80 μm thick.
- In some implementations, resistance welding or laser welding may be used for the welding the wires to the exposed contact pads.
- In some implementations, the overmolding achieves a gradual transition between the first or second silicone layer and the third silicone layer.
- In some implementations, the first and second sets of holes are both formed in the first silicone layer. In other implementations, the first and second sets of holes are both formed in the second silicone layer. In some implementations, the first set of holes may be formed in a different layer of silicone than the layer of silicone in which the second set of holes is formed.
- The foregoing general description and following description of the drawings and detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. Other objects, advantages, and novel features will be readily apparent to those skilled in the art from the following brief description of the drawings and detailed description of the invention.
- The skilled artisan will understand that the figures, described herein, are for illustration purposes only. It is to be understood that in some instances various aspects of the described implementations may be shown exaggerated or enlarged to facilitate an understanding of the described implementations. In the drawings, like reference characters generally refer to like features, functionally similar and/or structurally similar elements throughout the various drawings. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the teachings. The drawings are not intended to limit the scope of the present teachings in any way. The system and method may be better understood from the following illustrative description with reference to the following drawings in which:
-
FIG. 1 illustrates a system for peripheral nerve stimulation and recording. -
FIG. 2 illustrates a top view of an example electrode for use in the system illustrated inFIG. 1 . -
FIG. 3 illustrates another example electrode for use with the system illustrated inFIG. 1 . -
FIGS. 4A-4K illustrate cross-sectional views of a method for manufacturing an example electrode for use with the system illustrated inFIG. 1 . -
FIGS. 5A-5D illustrate cross-sectional views of example electrodes manufactured by the method illustrated inFIGS. 4A-4K -
FIG. 6 illustrates a scanning electron micrograph of the coupling of the needle to an electrode for use with the system illustrated inFIG. 1 . - The various concepts introduced above and discussed in greater detail below may be implemented in any of numerous ways, as the described concepts are not limited to any particular manner of implementation. Examples of specific implementations and applications are provided primarily for illustrative purposes.
- The present disclosure discusses electrodes and the manufacture thereof. The electrodes are configured to be implanted within (or adjacent to) neural tissue, such as a peripheral nerve. The electrodes are then secured to the nerve fascicle to form an interface between the nerve fibers of the nerve fascicle and a neural stimulator or recording device. The electrodes include a metal layer laminated between adhesive silicone layers. One or more of the silicone layers can include a mesh layer for improved handling and structural integrity. The electrodes can also include a detachable needle that enables insertion of the electrode directly into a nerve fascicle, bundle of nerve fibers, or other tissue. The electrode's insertion into a nerve fiber enables stimulation of the central regions of a nerve.
-
FIG. 1 illustrates asystem 100 for peripheral nerve stimulation and recording. While thesystem 100 can be implanted anywhere in the body,FIG. 1 illustrates thesystem 100 implanted into theright arm 102 of a patient. Theenlarged portion 104 illustrates that twosatellites 106 are coupled to a controller hub via aconnector 108. The secondenlarged portion 110 illustrates that twoelectrodes 112 are coupled one of thesatellites 106. Each of theelectrodes 112 are coupled to aperipheral nerve fascicle 114 in the wrist of thearm 102. - As an overview of the system architecture, The
system 100 includes a central controller hub (not illustrated) that is implanted into central location, such as in a surgically created sub-dermal pocket in the upper arm or chest. Thesatellites 106 are coupled to the controller hub and implanted near the regions of interest. Thesatellites 106 interface with theelectrodes 112. Power is provided to thesatellites 106 andelectrodes 112 by the controller hub. Thesatellites 106 enable theelectrodes 112 to be configured in real-time for recording or stimulation. Thesatellites 106 also include a neural amplifier with an embedded analog to digital converter that enables recording and digital transmission of neural signals captured by theelectrodes 112. The hub orsatellite 106 includes stimulation channels for stimulating target tissue via theelectrodes 112, one or more processors for adaptive closed-loop control, bidirectional wireless data telemetry for communication with an external base station, and a wirelessly rechargeable lithium battery for power. - The
system 100 includes one ormore electrodes 112 coupled to each of thesatellites 106. Theelectrodes 112 provide the interface between thesystem 100 and the patient. Theelectrodes 112 are configured to be directly secured to a patient'snerve fascicle 114 or other tissue. Theelectrode 112 includes a plurality of electrode sites along a rostrum. The rostrum is an elongated extension that projects from the body of theelectrode 112. In some implementations, the rostrum is configured for implantation through a nerve fascicle to record from (and/or stimulate) one or more of the nerve fibers within the nerve fascicle. Theelectrode 112 is described further in relation toFIGS. 4A-4K andFIGS. 5A-5D . -
FIG. 2 illustrates a top view of anexample electrode 112. Theelectrode 112 includes arostrum 114, atab 116 projecting from the central body of theelectrode 112, and aconnector pad 118. Therostrum 114 includes aneedle 120 and a plurality ofelectrode sites 122. Thetabs 116 also include a plurality ofelectrode sites 122. Theconnector pad 118 includes a plurality ofcontact pads 124. - As described in relation to
FIG. 4A-4K , theelectrode 112 is a multi-layer device that includes one or more metal layers sandwiched between silicone layers. Theelectrode sites 122, thetraces 128, and thecontact pads 124 are formed from the metal layer. The silicone layers insulate the metal layer and form the body of theelectrode 112. - The
rostrum 114 of theelectrode 112 includes theneedle 120 and a plurality ofelectrode sites 122. In some implementations, thetabs 116 also includeelectrode sites 122. Therostrum 114 is configured for insertion into nervous tissue, such as a peripheral nerve. Theneedle 120 enables therostrum 114 to be threaded through a nerve fascicle or other tissue. In some implementations, theneedle 120 is manufactured from a material that does not substantially bend when inserted into a target tissue. Theneedle 120 can be substantially rigid while the rest of theelectrode 112 is substantially flexible. Theneedle 120 can include stainless steel, platinum, or another medical grade metal. Theneedle 120 is detachable from the remainder of therostrum 114 andelectrode 112. For example, agap 126 in the metal layer between theelectrode sites 122 and theneedle 120 is manufactured in therostrum 114. Thegap 126 can include materials, such as the silicone layers, that are easy to cut. After threading therostrum 114 into the patient's nerve fascicle, a surgeon may use surgical scissors to cut through thegap 126 and sever theneedle 120 from theelectrode 112. In some implementations, theneedle 120 had an outer diameter between about 75 μm and about 200 μm, between about 100 μm and about 175 μm, or between about 125 μm and about 150 μm. - The
rostrum 114 also includes a plurality ofelectrode sites 122. Theelectrode sites 122 are disposed on therostrum 114 towards the ends of thetraces 128. In some implementations, eachelectrode site 122 is an exposed area of thetrace 128. For example, thetrace 128 is a portion of a metal layer encapsulated within the silicone layers. A portion of the silicone layer above thetrace 128 can be laser ablated to expose a portion of the metal layer—forming theelectrode site 122. In some implementations, each of theelectrode sites 122 are spaced between about 100 μm and about 700 μm, between about 200 μm and about 600 μm, or between about 300 μm and about 500 μm apart along the rostrum's length. In some implementations, each of theelectrode site 122 have a diameter between about 50 μm and about 300 μm, between about 50 μm and about 200 μm, or between about 50 μm and about 100 μm. - Each of the
traces 128 terminate at acontact pad 124 on theconnector pad 118. In some implementations, each of thetraces 128 terminate at adifferent contact pad 124, making each of theelectrode sites 122 individually addressable. In other implementations, one or more of thetraces 128 terminate at thesame contact pad 124. Wires of a flexible cable are welded to each of thecontact pads 124 to couple theelectrode 112 to thesatellite 106. In some implementations, each of thecontact pads 124 have a length between about 200 μm and about 500 μm, between about 200 μm and about 400 μm, or between about 200 μm and about 300 μm. - The
tabs 116 are used to secure theelectrode 112 to the nerve fascicle or other target site. Thetabs 116 are flexible and include one or more layers of silicone. In some implementations,additional electrode sites 122 are distributed along the length of thetabs 116. Thetabs 116 are configured to wrap around the nerve fascicle. Once wrapped around the nerve fascicle thetabs 116 can be coupled together to secure theelectrode 112 to the nerve fascicle. For example, the ends of thetabs 116 can be sutured together to secure theelectrode 112 to the nerve fascicle without having to suture directly to the nerve fascicle. -
FIG. 3 illustrates anotherexample electrode 200 for use with thesystem 100 discussed above. Theelectrode 200 is configured for electrocorticographic (ECoG) recordings. In this configuration theelectrode 200 is configured for placement on the cortical tissue of a patient's brain to record (or stimulate) populations of cortical neurons. As illustrated, theelectrode 200 includes 32electrode sites 202. Each of theelectrode sites 202 are coupled bytraces 128 to adifferent contact pad 124. In some implementations, theelectrode 200 includes between about 2 and about 128, between about 2 and about 64, or between about 2 and 32electrode sites 202. - The
electrode sites 202 of theelectrode 200 are configured to have greater relative surface area compared to theelectrode sites 122 discussed above. For example, the larger surface area enables theelectrode sites 202 to receive electrical signals form a greater number of neurons. -
FIGS. 4A-4K illustrate cross-sectional views of a method for manufacturing the electrodes described herein. The cross-sectional views are taken along the line A-A′ shown inFIG. 2 .FIG. 4A illustrates a cross-sectional view of the first step in manufacturing the electrodes described herein. In the first step, ametal layer 402 is applied to arelease tape 404. In some implementations, themetal layer 402 includes stainless steel or a platinum iridium alloy. In some implementations, themetal layer 402 may be a metal foil that is between about 10 μm and about 30 μm, between about 10 μm and about 15 μm, or between about 10 μm and about 12.5 μm thick. In some implementations, therelease tape 404 is a thermal release tape or a UV release tape. In other implementations, the release tape 204 can be dissolved using a solvent. -
FIG. 4B illustrates a cross-sectional view of the electrode during the second stage of the manufacturing process. Themetal layer 402 is cut to form the electrode sites, traces, contact pads of the electrode, and any other element of the metal layer. Laser ablation is used to formcuts 403 in the metal layer ormetal foil 402. In some implementations, the laser may be a picosecond pulsed laser operating at a wavelength between about 245 nanometers and about −2000 nanometers and configured with a pulse width between about 40 picoseconds and about 500 picoseconds. In other implementations, the laser may be a nanosecond pulsed laser and/or a femtosecond pulsed laser. -
FIG. 4C illustrates a cross-sectional view of the electrode after the excess metal is removed from therelease tape 404. The relatively larger portions of themetal layer 402 that do not form a portion of the electrode sites, traces, and contact pads can be peeled off from therelease tape 404 to leave just the desired portions of the portions of themetal layer 402 forming the electrode sites, traces, and contract pads coupled to therelease tape 404. In other implementations, relatively smaller portions of themetal layer 402 are entirely removed through laser ablation. For example, the portion of themetal layer 402 between two neighboring traces may be removed through laser ablation. After removing therelease tape 404 from themetal layer 402, the remaining metal is cleaned using pure oxygen plasma to remove any residual organic material and to improve adhesion to the silicone layer described inFIG. 4D . -
FIG. 4D illustrates a cross-sectional view of afirst silicone layer 406 that is formed separately from themetal layer 402 and therelease tape 404. Thefirst silicone layer 406 may include an implantable grade silicone substrate specifically designed for implantation within the body of a human or an animal. Thefirst silicone layer 406 may include a nylon, polyamide, polyester mesh. The mesh is impregnated with liquid silicone, which is then cured, to form thefirst silicone layer 406. In some implementations, thefirst silicone layer 406 is formed by knife-coating the mesh with uncured silicone, for example MED 4850 or MED 4250 silicone manufactured by NuSil™ of Carpinteria, Calif. In some implementations, the mesh is a MEDIFAB® mesh (part number 07-64/45) made available by SEFAR AG of Thal, Switzerland. In some implementations, the mesh is between about 40 μm and about 50 μm thick. In other implementations, the mesh is about 75 μm thick. The mesh can include an open area of between about 40% and about 50%. In some implementations, the diameter of each mesh fiber is between about 30 μm and about 50 μm and the fibers are spaced between about 60 μm and about 70 μm apart. For example, the mesh can be knife-coated with silicone, which is then cured, and then, additionally, or alternatively, be calendared (e.g., heat pressed) to achieve a desired thickness. The mesh can reinforce thefirst silicone layer 406 to improve the longevity of the electrode, ease the handling of the electrode, and provide structural integrity to the electrode. In some implementations, the improved structural integrity of thefirst silicone layer 406 reduces the likelihood that themetal layer 402 will separate from thefirst silicone layer 406 in subsequent steps or during the handling of the completed electrode. In some implementations, thefirst silicone layer 406 is between about 50 μm and about 100 μm, between about 60 μm and about 90 μm, or between about 70 μm and about 80 μm thick. -
FIG. 4E illustrates a cross-sectional view of the next step in manufacturing the electrodes described herein. In this step, aglue layer 408 is applied to thefirst silicone substrate 406. Theglue layer 408 is applied to the top surface of thefirst silicone layer 406 to help hold the additional layers of material to thefirst silicone layer 406. -
FIG. 4F illustrates a cross-sectional view of the sixth step in manufacturing the electrodes described herein. As illustrated inFIG. 4F , themetal layer 402 and release tape 404 (fromFIG. 4C ) are inverted and coupled to the glue layer 408 (fromFIG. 4E ). Theglue layer 408 is then cured to permanently fix themetal layer 402 to thefirst silicone layer 406. -
FIG. 4G illustrates a cross-sectional view of the seventh step in manufacturing the electrodes described herein. Once themetal layer 402 is coupled to theglue layer 408, therelease tape 404 is removed from themetal layer 402. In some implementations, therelease tape 404 is removed by heating therelease tape 404 to a predetermined temperature, which causes therelease tape 404 to release (or dissolve) from themetal layer 402. In other implementations, therelease tape 404 can be dissolved with a solvent or exposed to UV light to cause therelease tape 404 to release from themetal layer 402. -
FIG. 4H illustrates the next step in manufacturing the electrodes described herein. Once therelease tape 404 is removed, the exposedmetal layer 402 is cleaned using oxygen plasma and aprimer 410 is applied to the exposedmetal layer 402. For example, a silicone primer such as MED6-161 manufactured by NuSil™ of Carpinteria, Calif. may be used to increase the adhesion of themetal layer 402 to a second layer of silicone. -
FIG. 4I illustrates a cross-sectional view of the ninth stage of manufacturing the electrodes described herein. Once theprimer 410 has been applied to the exposedmetal layer 402, themetal layer 402 is encapsulated with asecond silicone layer 412. Thesecond silicone layer 412 may include a calendared layer of silicone. For example, thesecond silicone layer 412 may be produced by calendaring or applying heat and mechanical force to create thesecond silicone layer 412 at a desired thickness. Using this technique, thesecond silicone layer 412 may be as thin as 50 μm. In some implementations, thesecond silicone layer 412 is between about 50 μm and 100 μm thick. In other implementations, thesecond silicone layer 412 is similar to thefirst silicone layer 406. For example, thesecond silicone layer 412 can be impregnated with a mesh. In other implementations, thesecond silicone layer 412 is not impregnated with a mesh, but may be about the same thickness as thefirst silicone layer 406. -
FIG. 4J illustrates a cross-sectional view of the tenth stage of manufacturing the electrodes described herein. Once the metal layer is encapsulated with thesecond silicone layer 412, one or more sets of holes oropenings 414 are formed in thesecond silicone layer 412. The sets ofholes 414 expose a portion of themetal layer 402. The openings or sets ofholes 414 are formed over the portions of themetal layer 402 that form electrode sites and the contact pads. Theopenings 414 may be created using laser ablation. After the sets of holes oropenings 414 have been created, the exposed metal layer is cleaned using oxygen plasma mixed with tetrafluoromethane gas to remove any residual silicone that may remain on the contact pads or electrode sites following the laser ablation. In some implementations, a thin layer of silicone is intentionally left in the openings 414 (e.g., the openings over the contact pads and/or the electrode sites) prior to the aforementioned cleaning process to prevent the laser from damaging the contact pads or electrode sites. In some implementations, the electrode sites may be located on the same side of the electrode as the contact pads. In some implementations, the electrode sites may be located on the opposite side of the electrode as the contact pads. - In some implementations, the first and second silicone layers 406 and 412 are larger than the total shape of the electrode. For example, the
metal layer 402 defining a plurality of electrodes can be laminated between large, single first and second silicone layers 406 and 412. In these implementations, after forming the sets of holes oropenings 414 for each respective electrode site and contact pad, each of the electrodes are cut from thefirst silicone layer 406 and thesecond silicone layer 412 by laser cutting the shape of each electrode body from thefirst silicone layer 406 and thesecond silicone layer 412. The edges of the formed electrodes may be cleaned by plasma cleaning. -
FIG. 4K illustrates a cross-sectional view of the next stage of manufacturing the electrodes described herein. As shown inFIG. 4K , where theopenings 414 are formed over the contact pads, thewires 416 are coupled to each of the exposed metal areas that form the contact pads. Thewires 416 are welded to the exposedmetal layer 402. In some implementations, the wires are resistance welded to the exposedmetal layer 402. In other implementations, the wires are laser welded to the exposedmetal layer 402. Thewires 416 couple the contact pads (and ultimately, the electrode sites) to the satellites described above. To protect the weld between thewires 416 and metal layer 402 (e.g., at the location of each contact pad), athird silicone layer 418 is applied as an overmold over theopenings 414, (e.g., the one or more contact pad openings). The openings that are formed over the electrode sites are not covered with the third silicone layer, e.g., theovermold 418, so that the metal layer is exposed and can record and stimulate the neural tissue. Thethird silicone layer 418 is overmolded onto the first or second silicone layer to achieve a gradual transition between the first or second silicone layer and the third silicone layer. The gradual transition between the first or second silicone layer and the third silicone layer is substantially smooth, for example, such that is does not possess sharp angles, abrupt changes and/or discontinuities in the gradient of the slope of the overmolded third silicone layer. - In some implementations, such for the manufacture of an intra-fascicular electrode similar to the
electrode 112 illustrated inFIGS. 1 and 2 , the manufacturing method illustrated inFIGS. 4A-4K continues with the coupling of a needle to the electrode's formed body. In some implementations, such as when the electrode is configured for cortical recordings and stimulation, the electrode does not include a needle and the manufacturing method ends at the step illustrated inFIG. 4K . In some implementations, the needle is coupled to the electrode with a biocompatible glue. In some implementations, the transition between the needle and the electrode is configured to be substantially smooth such that the transition does not cause damage when the rostrum is pulled through a nerve fascicle. In some implementations, the end of the needle coupled to the electrode is first thinned, such that the combination of the needle material and the electrode does not form a bulge along the electrode's rostrum. The needle can be thinned by grinding down a portion of the needle. -
FIGS. 5A-5D illustrate cross-sectional views of example electrodes manufactured by the method illustrated inFIGS. 4A-4K . The cross-sectional views are taken along the line B-B′ shown inFIG. 2 . A variety of electrode shapes and formations may be enabled by this method of manufacturing. For example, the method of manufacture described herein may be used, but is not limited to, the manufacture of electrocorticographic (ECoG) electrodes, micro-electrocorticographic electrodes, longitudinal intra-fascicular electrodes, cuff electrodes, transverse intra-fascicular electrodes, and surface electrodes. The arrangement of electrode sites and contact pads may vary based on the nerve size, nerve location or area of nerve tissue to be stimulated or from which signals are to be recorded. A larger electrode surface area may include more electrode sites enabling the electrode to receive electrical signals form a greater number of neurons. For example, an electrode may be configured for electrocorticographic (ECoG) recordings. The electrode may be placed on the cortical tissue of a patient's brain to record (or stimulate) populations of cortical neurons. The electrode may include between about 2 and about 128, between about 2 and about 64, or between about 2 and 32 electrode sites. In some implementations, each of theelectrode sites 122 are spaced between about 100 μm and about 700 μm, between about 200 μm and about 600 μm, or between about 300 μm and about 500 μm apart from each other. - The arrangement of the contact pads and traces connecting the electrode site to the contact pad may also vary. In some implementations, each of the traces terminates at a contact pad corresponding to a specific electrode site, making each of the electrode sites individually addressable. In other implementations, each of the traces terminates at a different contact pad. In some implementations, one or more of the traces terminate at the same contact pad. In some implementations, each of the contact pads has a length between about 200 μm and about 500 μm, between about 200 μm and about 400 μm, or between about 200 μm and about 300 μm.
-
FIG. 5A illustrates a cross-sectional view of an electrode where theelectrode site opening 512 and thecontact pad opening 514 are formed on the same side of the electrode. As shown inFIG. 5A , theelectrode site opening 512 and thecontact pad opening 514 are formed in thesecond silicone layer 508. One ormore traces 513 connect the electrode site to the contact pad. Awire 516 is welded to the contact pad and anovermold 518 is applied over thecontact pad opening 514. -
FIG. 5B illustrates a cross-sectional view of an electrode where theelectrode site opening 512 and thecontact pad opening 514 are also formed on the same side of the electrode. As shown inFIG. 5B , theelectrode site opening 512 and thecontact pad opening 514 are formed in thesecond silicone layer 506. One ormore traces 513 connect the electrode site to the contact pad. Awire 516 is welded to the contact pad and anovermold 518 is applied over thecontact pad opening 514. -
FIG. 5C illustrates a cross-sectional view of an electrode where theelectrode site opening 512 and thecontact pad opening 514 are formed on opposite sides of the electrode. As shown inFIG. 5C , theelectrode site opening 512 is formed in thefirst silicone layer 506 and thecontact pad opening 514 is formed in thesecond silicone layer 508. One ormore traces 513 connect the electrode site to the contact pad. Awire 516 is welded to the contact pad and anovermold 518 is applied over thecontact pad opening 514. -
FIG. 5D illustrates a cross-sectional view of an electrode where theelectrode site opening 512 and thecontact pad opening 514 are also formed on opposite sides of the electrode. As shown inFIG. 5D , theelectrode site opening 512 is formed in thesecond silicone layer 508 and thecontact pad opening 514 is formed in thefirst silicone layer 506. One ormore traces 513 connect the electrode site to the contact pad. Awire 516 is welded to the contact pad and anovermold 518 is applied over thecontact pad opening 514. -
FIG. 6 illustrates a scanning electron micrograph of the coupling between the needle and the electrode formed using the above described manufacturing method.FIG. 6 illustrates that theneedle 120 is thinned from itsinitial thickness 602 to a thinnedthickness 604 that is about half the thickness of theinitial thickness 602. In the example illustrated inFIG. 6 , theinitial thickness 602 is about 350 μm and the thinnedthickness 604 is about 175 μm. Thinning theneedle 120 exposes the needle'sinner lumen 606 and forms atrough 608. Theportion 610 of therostrum 114 that couples to theneedle 120 is sized to fit into thetrough 608. Theportion 610 can then be glued to thetrough 608. - The disclosed methods may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The forgoing implementations are therefore to be considered in all respects illustrative, rather than limiting of the invention.
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/439,419 US20170333700A1 (en) | 2016-02-22 | 2017-02-22 | Method of manufacturing an implantable neural electrode interface platform |
US16/921,486 US11938314B2 (en) | 2016-02-22 | 2020-07-06 | Method of manufacturing an implantable neural electrode interface platform |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662298272P | 2016-02-22 | 2016-02-22 | |
US15/439,419 US20170333700A1 (en) | 2016-02-22 | 2017-02-22 | Method of manufacturing an implantable neural electrode interface platform |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/921,486 Continuation US11938314B2 (en) | 2016-02-22 | 2020-07-06 | Method of manufacturing an implantable neural electrode interface platform |
Publications (1)
Publication Number | Publication Date |
---|---|
US20170333700A1 true US20170333700A1 (en) | 2017-11-23 |
Family
ID=58489756
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/439,419 Abandoned US20170333700A1 (en) | 2016-02-22 | 2017-02-22 | Method of manufacturing an implantable neural electrode interface platform |
US16/921,486 Active 2039-03-16 US11938314B2 (en) | 2016-02-22 | 2020-07-06 | Method of manufacturing an implantable neural electrode interface platform |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/921,486 Active 2039-03-16 US11938314B2 (en) | 2016-02-22 | 2020-07-06 | Method of manufacturing an implantable neural electrode interface platform |
Country Status (6)
Country | Link |
---|---|
US (2) | US20170333700A1 (en) |
EP (1) | EP3419713B1 (en) |
JP (1) | JP2019506953A (en) |
AU (1) | AU2017222514A1 (en) |
CA (1) | CA3014910A1 (en) |
WO (1) | WO2017147151A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108577827A (en) * | 2018-04-10 | 2018-09-28 | 军事科学院军事医学研究院环境医学与作业医学研究所 | A kind of nerve electrode and preparation method thereof |
US20180338544A1 (en) * | 2017-05-26 | 2018-11-29 | Taiwan Textile Research Institute | Fabric module and smart fabric using the same |
US20200245881A1 (en) * | 2017-08-23 | 2020-08-06 | Atatürk Üniversitesi Bilimsel Arastirma Projeleri Birimi | Biocompatible microelectrode |
US20240017059A1 (en) * | 2018-04-27 | 2024-01-18 | Precisis Ag | Electrode body of an electrode assembly and electrode assembly for electrical stimulation, and method for producing an electrode assembly |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA3014910A1 (en) * | 2016-02-22 | 2017-08-31 | The Charles Stark Draper Laboratory, Inc. | Method of manufacturing an implantable neural electrode interface platform |
EP3535018A4 (en) | 2016-11-07 | 2020-07-01 | Micro-Leads, Inc. | MULTI-ELECTRODE ARRANGEMENT WITH ONE UNIT BODY |
US11395924B2 (en) | 2019-01-07 | 2022-07-26 | Micro-Leads, Inc. | Implantable devices with welded multi-contact electrodes and continuous conductive elements |
WO2020231729A1 (en) * | 2019-05-10 | 2020-11-19 | Galvani Bioelectronics Limited | Methods to reduce flashes on electrodes |
KR102556314B1 (en) * | 2022-08-08 | 2023-07-17 | 주식회사 셀리코 | A method for manufacturing a contact lens having a coil wire capable of ocular nerve stimulation |
Citations (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4969468A (en) * | 1986-06-17 | 1990-11-13 | Alfred E. Mann Foundation For Scientific Research | Electrode array for use in connection with a living body and method of manufacture |
US20010042291A1 (en) * | 2000-05-18 | 2001-11-22 | Olympus Optical Co., Ltd | Method of working piezoelectric substance and method of manufacturing composite piezoelectric substance |
US20020111658A1 (en) * | 2001-02-13 | 2002-08-15 | Greenberg Robert J. | Implantable retinal electrode array configuration for minimal retinal damage and method of reducing retinal stress |
US20030045919A1 (en) * | 2001-08-31 | 2003-03-06 | Swoyer John Matthew | Implantable medical electrical stimulation lead fixation method and apparatus |
US20030195601A1 (en) * | 2001-05-01 | 2003-10-16 | Andy Hung | High-density array of micro-machined electrodes for neural stimulation |
US20030233134A1 (en) * | 2002-04-11 | 2003-12-18 | Greenberg Robert J. | Biocompatible bonding method and electronics package suitable for implantation |
US20040082875A1 (en) * | 2002-10-24 | 2004-04-29 | Brown University Research Foundation | Microstructured arrays for cortex interaction and related methods of manufacture and use |
US20040154163A1 (en) * | 2003-02-06 | 2004-08-12 | Shinichi Miyazaki | Method of forming a connecting conductor and wirings of a semiconductor chip |
US20060225274A1 (en) * | 2002-08-09 | 2006-10-12 | Robert Greenberg | Insulated implantable electrical circuit |
US20060264897A1 (en) * | 2005-01-24 | 2006-11-23 | Neurosystec Corporation | Apparatus and method for delivering therapeutic and/or other agents to the inner ear and to other tissues |
US20070282411A1 (en) * | 2006-03-31 | 2007-12-06 | Brian Franz | Compliant electrical stimulation leads and methods of fabrication |
US20070293749A1 (en) * | 2006-06-19 | 2007-12-20 | Zhou Dao M | Electrode with increased stability and method of manufacturing the same |
US20080027524A1 (en) * | 2006-07-26 | 2008-01-31 | Maschino Steven E | Multi-electrode assembly for an implantable medical device |
US20080046051A1 (en) * | 2006-08-21 | 2008-02-21 | Skubitz Sean P | Novel features for routing conductors in medical electrical lead electrode assemblies |
US20080086107A1 (en) * | 2004-07-19 | 2008-04-10 | Broncus Technologies, Inc. | Devices for delivering substances through an extra-anatomic opening created in an airway |
US20080191335A1 (en) * | 2007-02-08 | 2008-08-14 | Advanced Chip Engineering Technology Inc. | Cmos image sensor chip scale package with die receiving opening and method of the same |
US7467003B2 (en) * | 2003-12-05 | 2008-12-16 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
US20090025961A1 (en) * | 2007-07-25 | 2009-01-29 | Tdk Corporation | Electronic component-embedded board and method of manufacturing the same |
US20100003904A1 (en) * | 2000-11-17 | 2010-01-07 | Duescher Wayne O | High speed flat lapping platen, raised islands and abrasive beads |
US20100134951A1 (en) * | 2008-11-12 | 2010-06-03 | Greatbatch Ltd. | Electromagnetic interference filter and method for attaching a lead and/or a ferrule to capacitor electrodes |
US7877866B1 (en) * | 2005-10-26 | 2011-02-01 | Second Sight Medical Products, Inc. | Flexible circuit electrode array and method of manufacturing the same |
US20110092842A1 (en) * | 2009-10-18 | 2011-04-21 | I2S Micro Implantable Systems, Llc | Implantable neural signal acquistion apparatus |
US20110093052A1 (en) * | 2009-10-16 | 2011-04-21 | Anderson David J | Neural interface system |
US20120319150A1 (en) * | 2011-06-17 | 2012-12-20 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method for manufacturing the same |
US20130008026A1 (en) * | 2006-12-12 | 2013-01-10 | Boston Scientific Neuromodulation Corporation | Electrode arrangements for tissue stimulation and methods of use and manufacture |
US20130053935A1 (en) * | 2008-10-22 | 2013-02-28 | John Swanson | Method for processing electrodes for stimulation lead |
US20130187190A1 (en) * | 2012-01-25 | 2013-07-25 | Shinko Electric Industries Co., Ltd. | Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
US20130192880A1 (en) * | 2012-01-30 | 2013-08-01 | Shinko Electric Industries Co., Ltd. | Printed wiring board and method of manufacturing printed wiring board |
US20130223034A1 (en) * | 2009-06-02 | 2013-08-29 | Hsio Technologies, Llc | High performance electrical circuit structure |
US20130313130A1 (en) * | 2012-05-25 | 2013-11-28 | Medtronic Minimed, Inc. | Foldover sensors and methods for making and using them |
US8700114B2 (en) * | 2008-07-31 | 2014-04-15 | Medtronic Minmed, Inc. | Analyte sensor apparatuses comprising multiple implantable sensor elements and methods for making and using them |
US9215995B2 (en) * | 2010-06-23 | 2015-12-22 | Medtronic Minimed, Inc. | Sensor systems having multiple probes and electrode arrays |
US20160059016A1 (en) * | 2014-08-27 | 2016-03-03 | Aleva Neurotherapeutics | Leadless neurostimulator |
US20160355951A1 (en) * | 2013-03-15 | 2016-12-08 | Arsenal Medical, Inc. | Core-sheath fibers and methods of making and using same |
US9795326B2 (en) * | 2009-07-23 | 2017-10-24 | Abbott Diabetes Care Inc. | Continuous analyte measurement systems and systems and methods for implanting them |
US20180001081A1 (en) * | 2015-01-08 | 2018-01-04 | Ecole Polytechnique Federale De Lausanne (Epfl) | Synthetic skin for recording and modulating physiological activities |
US10052476B2 (en) * | 2011-09-14 | 2018-08-21 | Neuronexus Technologies, Inc. | Methods for forming an electrode device with reduced impedance |
US10219384B2 (en) * | 2013-11-27 | 2019-02-26 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board structure |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3244174A (en) | 1964-01-31 | 1966-04-05 | Gen Electric | Body implantable conductor |
JPS58219022A (en) | 1982-06-16 | 1983-12-20 | Toray Silicone Co Ltd | Method for manufacturing silicone elastomer thin film |
US7003336B2 (en) * | 2000-02-10 | 2006-02-21 | Medtronic Minimed, Inc. | Analyte sensor method of making the same |
US8256091B2 (en) | 2000-11-17 | 2012-09-04 | Duescher Wayne O | Equal sized spherical beads |
US20060111626A1 (en) * | 2003-03-27 | 2006-05-25 | Cvrx, Inc. | Electrode structures having anti-inflammatory properties and methods of use |
WO2005065079A2 (en) | 2003-11-10 | 2005-07-21 | Angiotech International Ag | Medical implants and fibrosis-inducing agents |
US20050210789A1 (en) | 2004-02-09 | 2005-09-29 | Marian Anghel | Polyurethane molded roofing structures |
US7955543B2 (en) * | 2004-04-30 | 2011-06-07 | Medtronic, Inc. | Method of overmolding a substrate |
US7972688B2 (en) | 2005-02-01 | 2011-07-05 | Letts John B | High density polyurethane and polyisocyanurate construction boards and composite boards |
US20070123963A1 (en) * | 2005-11-29 | 2007-05-31 | Peter Krulevitch | Method for producing flexible, stretchable, and implantable high-density microelectrode arrays |
JP2008136684A (en) * | 2006-12-01 | 2008-06-19 | Tohoku Univ | Method for producing polymer-coated electrode |
EP2126239A4 (en) | 2007-01-30 | 2011-03-02 | Firestone Building Products Llc | High density polyurethane and polyisocyanurate construction boards and composite boards |
WO2009052429A1 (en) * | 2007-10-19 | 2009-04-23 | Jarrell John D | Novel compositions and related methods, coatings, and articles |
US20110143617A1 (en) | 2009-12-11 | 2011-06-16 | De La Vega Ii Daniel | Reinforced liquid silicone rubber sheeting and method for its manufacture |
CN103037911B (en) | 2010-04-08 | 2015-07-15 | 矽瑞奥科技公司 | Implantable medical devices having microporous surface layers and method for reducing foreign body response to the same |
WO2012140262A1 (en) * | 2011-04-15 | 2012-10-18 | Cortec Gmbh | Neural electrode and method for fabricating the same |
US20130144145A1 (en) * | 2011-12-05 | 2013-06-06 | University Of Southern California | Implantable neural tissue reporting probe and methods of manufacturing and implanting same |
US8751017B2 (en) | 2011-12-12 | 2014-06-10 | Neurostream Technologies G.P. | Reinforced, compliant electrode assembly |
US20160141065A1 (en) * | 2013-03-28 | 2016-05-19 | Tohoku University | Porous substrate electrode body and method for producing same |
EP3038702B1 (en) * | 2013-08-27 | 2019-02-27 | Advanced Bionics AG | Thermoformed electrode arrays |
US9949376B2 (en) * | 2013-12-06 | 2018-04-17 | Second Sight Medical Products, Inc. | Cortical implant system for brain stimulation and recording |
AU2015236516A1 (en) | 2014-03-26 | 2016-09-22 | St. Jude Medical, Cardiology Division, Inc. | Transcatheter mitral valve stent frames |
TWI696448B (en) * | 2014-11-11 | 2020-06-21 | 芬蘭商腦部關懷公司 | An implantable electrode device and a method for manufacturing thereof |
CA3014910A1 (en) * | 2016-02-22 | 2017-08-31 | The Charles Stark Draper Laboratory, Inc. | Method of manufacturing an implantable neural electrode interface platform |
-
2017
- 2017-02-22 CA CA3014910A patent/CA3014910A1/en not_active Abandoned
- 2017-02-22 US US15/439,419 patent/US20170333700A1/en not_active Abandoned
- 2017-02-22 AU AU2017222514A patent/AU2017222514A1/en not_active Abandoned
- 2017-02-22 JP JP2018544167A patent/JP2019506953A/en active Pending
- 2017-02-22 EP EP17716020.7A patent/EP3419713B1/en active Active
- 2017-02-22 WO PCT/US2017/018875 patent/WO2017147151A1/en active Application Filing
-
2020
- 2020-07-06 US US16/921,486 patent/US11938314B2/en active Active
Patent Citations (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4969468A (en) * | 1986-06-17 | 1990-11-13 | Alfred E. Mann Foundation For Scientific Research | Electrode array for use in connection with a living body and method of manufacture |
US20010042291A1 (en) * | 2000-05-18 | 2001-11-22 | Olympus Optical Co., Ltd | Method of working piezoelectric substance and method of manufacturing composite piezoelectric substance |
US20100003904A1 (en) * | 2000-11-17 | 2010-01-07 | Duescher Wayne O | High speed flat lapping platen, raised islands and abrasive beads |
US20020111658A1 (en) * | 2001-02-13 | 2002-08-15 | Greenberg Robert J. | Implantable retinal electrode array configuration for minimal retinal damage and method of reducing retinal stress |
US20030195601A1 (en) * | 2001-05-01 | 2003-10-16 | Andy Hung | High-density array of micro-machined electrodes for neural stimulation |
US20030045919A1 (en) * | 2001-08-31 | 2003-03-06 | Swoyer John Matthew | Implantable medical electrical stimulation lead fixation method and apparatus |
US20030233134A1 (en) * | 2002-04-11 | 2003-12-18 | Greenberg Robert J. | Biocompatible bonding method and electronics package suitable for implantation |
US20060225274A1 (en) * | 2002-08-09 | 2006-10-12 | Robert Greenberg | Insulated implantable electrical circuit |
US7212851B2 (en) * | 2002-10-24 | 2007-05-01 | Brown University Research Foundation | Microstructured arrays for cortex interaction and related methods of manufacture and use |
US20040082875A1 (en) * | 2002-10-24 | 2004-04-29 | Brown University Research Foundation | Microstructured arrays for cortex interaction and related methods of manufacture and use |
US20040154163A1 (en) * | 2003-02-06 | 2004-08-12 | Shinichi Miyazaki | Method of forming a connecting conductor and wirings of a semiconductor chip |
US7467003B2 (en) * | 2003-12-05 | 2008-12-16 | Dexcom, Inc. | Dual electrode system for a continuous analyte sensor |
US20080086107A1 (en) * | 2004-07-19 | 2008-04-10 | Broncus Technologies, Inc. | Devices for delivering substances through an extra-anatomic opening created in an airway |
US20060264897A1 (en) * | 2005-01-24 | 2006-11-23 | Neurosystec Corporation | Apparatus and method for delivering therapeutic and/or other agents to the inner ear and to other tissues |
US7877866B1 (en) * | 2005-10-26 | 2011-02-01 | Second Sight Medical Products, Inc. | Flexible circuit electrode array and method of manufacturing the same |
US20070282411A1 (en) * | 2006-03-31 | 2007-12-06 | Brian Franz | Compliant electrical stimulation leads and methods of fabrication |
US20070293749A1 (en) * | 2006-06-19 | 2007-12-20 | Zhou Dao M | Electrode with increased stability and method of manufacturing the same |
US20080027524A1 (en) * | 2006-07-26 | 2008-01-31 | Maschino Steven E | Multi-electrode assembly for an implantable medical device |
US20080046051A1 (en) * | 2006-08-21 | 2008-02-21 | Skubitz Sean P | Novel features for routing conductors in medical electrical lead electrode assemblies |
US20130008026A1 (en) * | 2006-12-12 | 2013-01-10 | Boston Scientific Neuromodulation Corporation | Electrode arrangements for tissue stimulation and methods of use and manufacture |
US20080191335A1 (en) * | 2007-02-08 | 2008-08-14 | Advanced Chip Engineering Technology Inc. | Cmos image sensor chip scale package with die receiving opening and method of the same |
US20090025961A1 (en) * | 2007-07-25 | 2009-01-29 | Tdk Corporation | Electronic component-embedded board and method of manufacturing the same |
US8700114B2 (en) * | 2008-07-31 | 2014-04-15 | Medtronic Minmed, Inc. | Analyte sensor apparatuses comprising multiple implantable sensor elements and methods for making and using them |
US20130053935A1 (en) * | 2008-10-22 | 2013-02-28 | John Swanson | Method for processing electrodes for stimulation lead |
US20100134951A1 (en) * | 2008-11-12 | 2010-06-03 | Greatbatch Ltd. | Electromagnetic interference filter and method for attaching a lead and/or a ferrule to capacitor electrodes |
US20130223034A1 (en) * | 2009-06-02 | 2013-08-29 | Hsio Technologies, Llc | High performance electrical circuit structure |
US9795326B2 (en) * | 2009-07-23 | 2017-10-24 | Abbott Diabetes Care Inc. | Continuous analyte measurement systems and systems and methods for implanting them |
US20110093052A1 (en) * | 2009-10-16 | 2011-04-21 | Anderson David J | Neural interface system |
US20110092842A1 (en) * | 2009-10-18 | 2011-04-21 | I2S Micro Implantable Systems, Llc | Implantable neural signal acquistion apparatus |
US9215995B2 (en) * | 2010-06-23 | 2015-12-22 | Medtronic Minimed, Inc. | Sensor systems having multiple probes and electrode arrays |
US20120319150A1 (en) * | 2011-06-17 | 2012-12-20 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device and method for manufacturing the same |
US10052476B2 (en) * | 2011-09-14 | 2018-08-21 | Neuronexus Technologies, Inc. | Methods for forming an electrode device with reduced impedance |
US20130187190A1 (en) * | 2012-01-25 | 2013-07-25 | Shinko Electric Industries Co., Ltd. | Wiring substrate, light emitting device, and manufacturing method of wiring substrate |
US20130192880A1 (en) * | 2012-01-30 | 2013-08-01 | Shinko Electric Industries Co., Ltd. | Printed wiring board and method of manufacturing printed wiring board |
US20130313130A1 (en) * | 2012-05-25 | 2013-11-28 | Medtronic Minimed, Inc. | Foldover sensors and methods for making and using them |
US20160355951A1 (en) * | 2013-03-15 | 2016-12-08 | Arsenal Medical, Inc. | Core-sheath fibers and methods of making and using same |
US10219384B2 (en) * | 2013-11-27 | 2019-02-26 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Circuit board structure |
US20160059016A1 (en) * | 2014-08-27 | 2016-03-03 | Aleva Neurotherapeutics | Leadless neurostimulator |
US20180001081A1 (en) * | 2015-01-08 | 2018-01-04 | Ecole Polytechnique Federale De Lausanne (Epfl) | Synthetic skin for recording and modulating physiological activities |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20180338544A1 (en) * | 2017-05-26 | 2018-11-29 | Taiwan Textile Research Institute | Fabric module and smart fabric using the same |
US20200245881A1 (en) * | 2017-08-23 | 2020-08-06 | Atatürk Üniversitesi Bilimsel Arastirma Projeleri Birimi | Biocompatible microelectrode |
CN108577827A (en) * | 2018-04-10 | 2018-09-28 | 军事科学院军事医学研究院环境医学与作业医学研究所 | A kind of nerve electrode and preparation method thereof |
US20240017059A1 (en) * | 2018-04-27 | 2024-01-18 | Precisis Ag | Electrode body of an electrode assembly and electrode assembly for electrical stimulation, and method for producing an electrode assembly |
Also Published As
Publication number | Publication date |
---|---|
US11938314B2 (en) | 2024-03-26 |
EP3419713A1 (en) | 2019-01-02 |
EP3419713B1 (en) | 2020-04-29 |
WO2017147151A1 (en) | 2017-08-31 |
US20210121687A1 (en) | 2021-04-29 |
CA3014910A1 (en) | 2017-08-31 |
JP2019506953A (en) | 2019-03-14 |
AU2017222514A1 (en) | 2018-08-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11938314B2 (en) | Method of manufacturing an implantable neural electrode interface platform | |
JP6925467B2 (en) | Deep brain stimulation lead | |
US11938016B2 (en) | Endovascular device for sensing and or stimulating tissue | |
US7555349B2 (en) | Lead body and method of lead body construction | |
US8538554B2 (en) | Implantable electrode, insertion tool for use therewith, and insertion method | |
EP2709716B1 (en) | Cortical interface with an electrode array divided into separate fingers and/or with a wireless transceiver | |
US10384057B2 (en) | Multi-lead multi-electrode management system | |
US20130123891A1 (en) | High density terminal contacts for stimulation lead and stimulation system employing the same, and method of stimulation lead fabrication | |
JP7279048B2 (en) | Nerve cuff deployment device | |
US9044589B2 (en) | Electrode constructions and methods for making the same | |
EP3463554B1 (en) | Endoluminal nerve modulation device | |
JP2017525545A (en) | Leadless nerve stimulator | |
CN101316553A (en) | Electrode bundle | |
JPH10502552A (en) | Soft artificial neural plate | |
CN102793592A (en) | Optic nerve implantable neural interface device with fan-shaped attaching function | |
ES2842186T3 (en) | Medical device to detect and / or stimulate tissue | |
Jeong et al. | Advancements in fabrication process of microelectrode array for a retinal prosthesis using liquid crystal polymer (LCP) | |
US20240207034A1 (en) | Methods of transmitting neural activity | |
Meyer et al. | Biomedical microdevices for neural interfaces | |
US11883651B2 (en) | Lead for the temporary stimulation of a peripheral nerve | |
US8784714B2 (en) | Steroid eluting collar undermold | |
US20240216675A1 (en) | Lead for the temporary stimulation of a peripheral nerve |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NOTICE OF ALLOWANCE MAILED -- APPLICATION RECEIVED IN OFFICE OF PUBLICATIONS |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO PAY ISSUE FEE |